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DISSERTATION
By
2010
Dissertation Committee:
John L.Volakis, Co-Adviser
Chi-Chih Chen, Co-Adviser
Joel T. Johnson
ABSTRACT
With space at a premium, there is strong interest to develop a single ultra wide-
electronic warfare and radar functions. However, typical wideband designs transform
into narrowband or multiband apertures when placed over a ground plane. There-
fore, it is not surprising that considerable attention has been devoted to electromag-
netic bandgap (EBG) surfaces to mitigate the ground planes destructive interference.
However, EBGs and other periodic ground planes are narrowband and not suited for
tures, which are concurrently broadband and low-profile over a ground plane, remains
a challenge.
The array design presented herein is based on the infinite current sheet array
(CSA) concept and uses tightly coupled dipole elements for wideband conformal op-
eration. An important aspect of tightly coupled dipole arrays (TCDAs) is the capac-
itive coupling that enables the following: (1) allows field propagation to neighboring
elements, (2) reduces dipole resonant frequency, (3) cancels ground plane inductance,
yielding a low-profile, ultra wideband phased array aperture without using lossy ma-
terials or EBGs on the ground plane. The latter, is of course, critical for retaining
ii
This dissertation focuses on the realization of wideband phased array apertures
using tightly coupled dipole arrays. A methodology for designing planar apertures is
conversion for wideband feeding. Multiple solutions and practical design examples are
presented to increase bandwidth, reduce height, avoid common mode excitation and
retain low-cost planar PCB manufacturability. Using one of these designs, a 64 ele-
ment low-profile X-band array prototype is fabricated and measured. The conformal
The active VSWR is less than 2 from 8 to 12.5 GHz (1.6:1) and the array height is
only /7 at the lowest frequency of operation. A unique feature of the proposed array
used for the aperture while another supports all associated baluns and matching net-
works. Good agreement between simulations and measurements confirm the proposed
concepts.
iii
Dedicated to my family.
iv
ACKNOWLEDGMENTS
L. Volakis, for his guidance and advice. Not only has he taught me the academic
about what it takes be a successful professional and leader. His guidance and support
led me to present at conferences, publish papers and write proposals. I would also
like to sincerely thank my Co-Advisor Dr. Chi-Chih Chen for interesting discussions
He has been a great friend, mentor and truly is an antenna and electromagnetics
expert. Dr. Chen showed me different ways to approach a research problem and
the steps necessary to accomplish any goal. His honesty, intelligence and open door
policy has made the ElectroScience Lab a wonderful workplace and home for the
last four years. I want to thank the other students in the Volakis antenna group for
their challenging questions, interesting discussions and sharing their research during
our weekly meetings. In addition, I want to specifically thank my colleges and close
friends; Kenneth E. Browne, Mustafa Kuloglu, Brandan T. Strojny and Orbay Tuncay
v
VITA
PUBLICATIONS
Journal Publications
1. Kasemodel, J.A.; Chen, C.-C.; Volakis, J.L., Wideband Planar Array with
Integrated Feed and Matching Network for Wide-Angle Scanning, Under review:
Trans. Antennas and Propagation, IEEE.
2. Kasemodel, J.A.; OBrien, A.; Gupta, I.J.; Chen, C.-C.; Volakis, J.L., Small,
Conformal Adaptive Antenna of Spiral Elements for GNSS Receivers, Under review:
Trans. Antennas and Propagation, IEEE.
3. Kasemodel, J.A.; Volakis, J.L., A Planar Dual Linear Polarized Antenna with
Integrated Balun, To appear in Antennas and Wireless Propagation Letters, IEEE.
4. Kasemodel, J.A.; Chen, C.-C.; Gupta, I.J.; Volakis, J.L., Miniature Continuous
Coverage Antenna Array for GNSS Receivers, Antennas and Wireless Propagation
Letters, IEEE, vol.7, no., pp.592-595, 2008.
vi
Conference Publications
2. Kasemodel, J.A.; Chen, C.-C.; Volakis, J.L., Low-Cost, Planar and Wideband
Phased Array with Integrated Balun and Matching Network for Wide-Angle Scan-
ning, in Proc. Antenna and Propagation International Symposium, IEEE, Toronto,
Ontario, Canada, July 2010.
3. Volakis, J.L.; Kasemodel, J.A.; Chen, C.-C.; Sertel, K.; Tzanidis, I., Wideband
Conformal Metamaterial Apertures, in Proc. Antenna Technology (iWAT), 2010
International Workshop on , vol., no., pp.1-4, 1-3 March 2010.
4. Kasemodel, J.A.; Chen, C.-C.; Volakis, J.L., Wideband Conformal Array with
Integrated Feed and Matching Network for Wide-angle Scanning, in Proc. URSI
National Radio Science Meeting, Boulder, CO, January, 2010.
8. Kasemodel, J.A.; Chen, C.-C.; Gupta, I.J.; Volakis, J.L., Miniature Continu-
ous Coverage Wideband GPS Antenna Array, in Proc. Antennas and Propagation
Society International Symposium, San Diego, CA, July 2008.
9. Kasemodel, J.A.; Chen, C.-C.; Gupta, I.J.; Volakis, J.L., Compact Wideband
Antenna Array for GNSS Receivers, in Proc. Antenna Measurement Technique As-
sociation Symposium, St. Louis, MO, November 2007.
FIELDS OF STUDY
vii
Major Field: Electrical Engineering
Studies in:
Applied Electromagnetics
Antenna Design and Measurement Techniques
viii
TABLE OF CONTENTS
Page
Abstract . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ii
Dedication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iv
Acknowledgments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v
Vita . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vi
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi
Chapters:
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Planar Phased Array Antenna Comparison . . . . . . . . . . . . . . 6
2.2.1 Input Impedance . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2.2 Scan Element Pattern . . . . . . . . . . . . . . . . . . . . . 13
2.3 Equivalent Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.4 Linear and Dual Linear Polarization Properties . . . . . . . . . . . 23
2.5 Feeding Network Consideration . . . . . . . . . . . . . . . . . . . . 27
2.5.1 External 180 Hybrid . . . . . . . . . . . . . . . . . . . . . 29
2.5.2 Low Cost Partially Balanced Coaxial Cable Feed . . . . . . 31
2.5.3 Impedance Matching . . . . . . . . . . . . . . . . . . . . . . 33
2.6 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
ix
3. Broadband Phased Array Antenna Miniaturization . . . . . . . . . . . . 37
3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
3.2 Antenna Miniaturization Concept . . . . . . . . . . . . . . . . . . . 38
3.3 Inductive Loading via Volumetric Meandering . . . . . . . . . . . . 39
3.4 Ferrite Substrate Loading . . . . . . . . . . . . . . . . . . . . . . . 41
3.5 Capacitive Loading using a Non-Symmetric Element . . . . . . . . 45
3.6 Dielectric Superstrate Loading . . . . . . . . . . . . . . . . . . . . 53
3.7 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
4.2 Wideband Balun . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
4.3 Integration of Aperture and Feed . . . . . . . . . . . . . . . . . . . 63
4.4 Single Feed Demonstration . . . . . . . . . . . . . . . . . . . . . . 65
4.5 64 Element Array Demonstration . . . . . . . . . . . . . . . . . . . 71
4.5.1 Scan Element Pattern . . . . . . . . . . . . . . . . . . . . . 71
4.5.2 Mutual Coupling and Scan Impedance . . . . . . . . . . . . 75
4.5.3 Fully Excited Radiation Performance . . . . . . . . . . . . . 83
4.6 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Bibliography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
x
LIST OF TABLES
Table Page
3.3 Dielectric constant for superstrate matching using Rogers TMM series
array PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
xi
LIST OF FIGURES
Figure Page
2.1 (a) Infinite current sheet over a ground plane, (b) tightly coupled dipole
array implementation. . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Planar phased array antenna elements under investigation inside unit
cell; (a) wire or connected dipoles, (b) bowtie, (c) dipole, (d) slot. . . 8
2.3 Active resistance (solid) and reactance (dash) for various antenna ele-
ments in free space scanned to o = 0 . . . . . . . . . . . . . . . . . 9
2.5 Active reflection coefficient for various antenna elements in free space
scanned to o = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.6 Active resistance (solid) and reactance (dash) for various antenna ele-
ments when placed 8 mm over ground plane scanned to o = 0 . . . . 12
2.7 Active reflection coefficient for various antenna elements when placed
8 mm over ground plane scanned to o = 0 . . . . . . . . . . . . . . . 13
2.9 E-Plane scan element pattern for the wire, bowtie, dipole and slot array
when placed 8 mm over ground plane. . . . . . . . . . . . . . . . . . . 16
2.10 H-Plane scan element pattern for the wire, bowtie, dipole and slot
array when placed 8 mm over ground plane. . . . . . . . . . . . . . . 16
xii
2.11 Simulated TCDA and calculated unit cell directivity. . . . . . . . . . 17
2.12 Surface current at 10 GHz; (a) wire, (b) bowtie, (c) dipole, (d) slot. . 18
2.13 Tightly coupled dipole array equivalent circuit in free space scanned
to broadside. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.16 (a) Array impedance transformation for equivalent circuit. (b) Return
loss comparison for the ideal array in free space and with ground plane. 22
2.17 (a) Periodic unit cell dipole geometry. (b) Full wave array simulation
vs. equivalent circuit for different ground plane heights. . . . . . . . . 23
2.18 TCDA active reflection coefficient in free space and when placed 8 mm
over ground plane scanned to o = 0 . . . . . . . . . . . . . . . . . . . 24
2.22 Tightly coupled dipole elements; (a) single polarization, (b) dual po-
larization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.25 Typical planar phased array antenna unit cell depicting the aperture,
interconnects and ground plane. . . . . . . . . . . . . . . . . . . . . . 29
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2.27 (a) Tapered coaxial cable feed with external 180 hybrid (not shown).
(b) Broadside gain and realized gain using external hybrid. . . . . . . 31
2.28 Single coaxial cable balun with integrated matching circuit. The ground
plane and unit cell outline are not shown. . . . . . . . . . . . . . . . . 32
2.29 Single coaxial cable tapered balun active reflection coefficient with and
without ferrite bead choke. Note the common mode at 7.3 GHz. . . . 33
2.30 Single cable tapered balun depicting common mode electric field distri-
bution (left) and common mode suppression using a ferrite bead choke
(right). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
2.32 TCDA matching network example without matching (200 ) and with
matching network connected to a 100 system impedance. . . . . . . 36
3.1 Dipole unit cell with inductive miniaturization implemented using ver-
tical meandering and a 200 system impedance. . . . . . . . . . . . 40
3.2 Dipole unit cell with inductive miniaturization implemented using ver-
tical meandering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
3.3 TCDA ferrite substrate loading; (a) unit cell geometry, (b) active
VSWR, (c) resistance, (d) reactance. . . . . . . . . . . . . . . . . . . 42
3.4 TCDA ferrite substrate loading while maintaining ground plane elec-
trical separation; (a) unit cell geometry depicting reduced thickness
with r = 5, (b) active VSWR, (c) resistance, (d) reactance. . . . . . 44
3.5 Ferrite substrate electric field distribution; (a) rectangular cavity model,
(b) side view in x-z plane. . . . . . . . . . . . . . . . . . . . . . . . . 45
3.6 Dual polarized array with non-symmetric elements; (a) unit cell ge-
ometry, (b) infinite array reflection coefficient, Zo = 200,scanned to
o = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
xiv
3.7 Baseline non-symmetric TCDA; (a) unit cell geometry for parameter
study, (b) input impedance with t1 = 2 mm, t2 = 1 mm, t3 = 0.5 mm,
g = 10 mil, = 180 with the array placed 8 mm above the ground
plane scanned to o = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . 48
3.8 Baseline TCDA scan element pattern; (a) E-plane, (b) H-plane. . . . 48
3.9 Non-symmetric TCDA; (a) geometry with t1 = 2 and 5 mm, (b) input
impedance, (c) corresponding resistance (solid) and reactance (dash)
with t1 varied, t2 = 1 mm, t3 = 0.5 mm, g = 10 mil, = 180 , scanned
to o = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
3.10 Non-symmetric TCDA; (a) geometry with t2 = 0.25 and 3 mm, (b)
input impedance, (c) corresponding resistance (solid) and reactance
(dash) with t1 = t2 + g + 0.25 mm, t2 varied, t3 = 0.5 mm, g = 10
mil, = 180 , scanned to o = 0 . . . . . . . . . . . . . . . . . . . . . 51
3.11 Non-symmetric TCDA; (a) geometry with t3 = 0.5 and 3 mm, (b)
input impedance, (c) corresponding resistance (solid) and reactance
(dash) with t1 = 2 mm, t2 = 1 mm, t3 varied, g = 10 mil, = 180 ,
scanned to o = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
3.12 (a) TCDA input impedance, (b) corresponding resistance (solid) and
reactance (dash) with t1 = 2 mm, t2 = 1 mm, t3 = 0.5 mm, g varied,
= 180 , scanned to o = 0 . . . . . . . . . . . . . . . . . . . . . . . 53
3.14 Ground plane backed TCDA printed on a PCB with a single layer
dielectric superstrate of thickness t1 , and dielectric constant 1 . . . . . 55
3.15 (a) TCDA unit cell geometry printed on 20 mil thick TMM3 . (b)
Input impedance for different ground plane heights. . . . . . . . . . . 57
xv
3.17 TCDA with single dielectric superstrate with 1 = 1.8 of varying thick-
ness, t1 , scanned to o = 0 ; (a) input impedance and (b) corresponding
resistance (solid) and reactance (dash). . . . . . . . . . . . . . . . . . 58
4.1 Proposed wideband microstrip coupled line ring hybrid with balanced
twin-wire output, a = 0.64516 mm, D = 0.88 mm, w1 = 38 mil, w2 =
20 mil, w3 = 17 mil, g2 = 3 mil, d = 5 mm; (a) geometry and (b) S
parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
4.2 Non-symmetric tightly coupled dipole array unit cell with radome, in-
tegrated feed and matching network, the dimensions are: t1 = 1.75
mm, t2 = 0.75 mm, t3 = 1 mm, g = 7 mil, = 85 , a = 0.8128 mm,
D = 1.4 mm, w1 = 30 mil, w2 = 20 mil, w3 = 17 mil, w4 = 24 mil,
g2 = 3 mil, s = 1.7; (a) geometry and (b) active reflection coefficient
at broadside. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
4.3 Performance of the array unit cell in Fig. 4.2(a); (a) broadside radia-
tion, (b) active VSWR over multiple principal plane scan angles. . . . 65
4.6 Array (8x8) broadside gain vs. frequency when the center element is
excited and all others are terminated using 100 resistors; (a) E-plane,
(b) H-plane. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
4.7 Electric field magnitude; (a) probe location with strong coupling and
(b) improved probe location with minimal coupling. . . . . . . . . . . 69
xvi
4.8 Non-symmetric TCDA unit cell geometry with WAIM superstrate, in-
tegrated microstrip balun and twin wire matching network intercon-
nects, t1 = 1.75 mm, t2 = 0.75 mm, t3 = 1 mm, g = 7 mil, = 85 , a
= 0.8128 mm, D = 1.4 mm, w1 = 48 mil, w2 = 20 mil, w3 = 17 mil,
w4 = 14 mil, g2 = 3mil, s = 1.7. . . . . . . . . . . . . . . . . . . . . 70
4.9 Performance of the array unit cell in Fig. 4.8; (a) broadside radiation,
(b) active VSWR over multiple E-plane and H-plane scan angles. . . 70
4.10 X-band 64 element linearly polarized array prototype; (a) with radome,
(b) radome removed, (c) aperture removed displaying balun and twin-
wire interconnects, (d) SMP input connects underneath ground plane. 72
4.12 Finite array broadside realized gain with element 29 excited and re-
maining elements terminated in 50 loads. . . . . . . . . . . . . . . 73
4.13 E-plane scan element pattern at 10 GHz with element 29 excited and
remaining elements terminated in 50 loads. . . . . . . . . . . . . . 74
4.14 H-plane scan element pattern at 10 GHz with element 29 excited and
remaining elements terminated in 50 loads. . . . . . . . . . . . . . 74
4.16 SMA cable assembly with adapters and SMP cable. The original cal-
ibration plane is denoted (I), where the desired calibration plane is
depicted as III. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
4.17 Measured reflection coefficient with the SMP cabled shorted; (a) fre-
quency domain, (b) time-domain, (c) time-gated time-domain. . . . . 78
4.18 Measured reflection coefficient with the SMP cabled shorted; (a) Smith
chart format to manually determine port extension delay, (b) copper
tape short circuited manual amplitude port extension. . . . . . . . . . 80
xvii
4.19 Measured reflection coefficient with the SMP cabled shorted; (a) SMA
calibration, (b) proposed calibration procedure using time-gating and
port extension, (c) 64 element phased array mutual coupling measure-
ment setup. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
4.20 Mutual coupling across aperture with element 29 excited; (a) simulated
8 GHz, (b) measured 8 GHz, (c) simulated 10 GHz, (d) measured 10
GHz, (e) simulated 12.5 GHz, (f) measured at 12.5 GHz. . . . . . . . 84
4.21 Measured and simulated mutual coupling vs. frequency with element
29 excited; (a) element 1 - 4, (b) element 5 - 8, (c) element 9 - 12, (d)
element 13 - 16, (e) element 17 - 20, (f) element 21 - 24. . . . . . . . 85
4.22 Measured and simulated mutual coupling vs. frequency with element
29 excited; (a) element 25 - 28, (b) element 29 - 32, (c) element 33 -
36, (d) element 37 - 40, (e) element 41 - 44, (f) element 45 - 48. . . . 86
4.23 Measured and simulated mutual coupling vs. frequency with element
29 excited; (a) element 49 - 52, (b) element 53 - 56, (c) element 57 -
60, (d) element 61 - 64. . . . . . . . . . . . . . . . . . . . . . . . . . . 87
4.24 Measured and simulated finite array element 29 active reflection coef-
ficient scanned to o = 0 , o = 0 . . . . . . . . . . . . . . . . . . . . 88
4.28 Finite array broadside realized gain as a function of frequency with all
elements excited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
xviii
CHAPTER 1
INTRODUCTION
Traditional phased array designs are based on a single elements isolated perfor-
mance. It is of course well documented that mutual coupling in an array can cause
and undesirable radiation patterns. In fact, mutual coupling is responsible for one
of the more difficult aspects of phased array design, that of uniform scan impedance.
was recently proposed by Munk [2, 3]. Specifically, interelement capacitive mutual
coupling is used to cancel the ground plane inductance enabling wideband perfor-
mance. This is similar to frequency selective surfaces (FSS), another tightly coupled
the traditional approach, an UWB array would require wideband elements such as;
transverse electromagnetic (TEM) horn [5], bunny-ear [6], tapered slot or Vivaldi [7]
and body-of-revolution (BOR) elements [8]. However, all these elements are three-
dimensional and require a large dimension normal to the aperture surface, typically a
1
depth on the order of 0.5 - 2 L , where L is the wavelength at the lowest operational
frequency. Further, due to the three-dimensional nature of these elements, they are
costly and often difficult to fabricate. In addition, depending on the element width,
arraying these elements close together to avoid grating lobes (commonly .5 H where
new conformal array design that has several advantages; (1) inherently low-profile, (2)
conformal mounting on platforms (where a metallic ground plane is used), (3) simple
element geometry for simulation ease and (4) enables significant opportunity for cost
reduction using planar printed circuit board (PCB) technology to fabricate the array
aperture and feed circuitry. We also present practical realization and experimental
capacitive mutual coupling cancels the ground plane inductance and improves
Investigated, for the first time, multiple forms of phased array antenna minia-
2
Designed, fabricated and validated a wideband planar 64 element X-band array
an active voltage standing wave ratio (VSWR) < 2 from 8 - 12.5 GHz. The
operation and fed using a microstrip hybrid. The latter, printed directly on the
ground plane, maintains the arrays low-profile and simple layered planar PCB
construction.
Chapter 2 starts with an introduction to planar phased array antennas and demon-
strates the unique capability of tightly coupled dipole arrays to become increasingly
wideband in the presence of a ground plane. Specifically, we discuss how TCDAs op-
erate and why capacitive mutual coupling is beneficial. This is done using convenient
and easy to understand equivalent circuits validated with full wave simulations. Next,
specific TCDA designs and polarization properties are explored for single and dual
modes.
employed to design a wideband phased array antenna aperture. The specific aperture
additional design degrees of freedom to control mutual coupling. Specifically, each arm
on the dipole is different than the other, or non-symmetric, enabling efficient tuning of
inductance and capacitance, independently. The arms are identical near their center
feed portion, but change towards the ends, forming a ball-and-cup configuration.
3
Additionally, dielectric superstrates and magnetic substrates are presented to further
conversion (while maintaining the arrays low-profile) is designed and integrated with
the antenna aperture. Practical realization challenges are identified and methods to
overcome such issues are proposed and verified experimentally. Agreement between
infinite and finite array simulations are confirmed over multiple scan angles. Indeed,
the wide-angle scanning (up to 70 with a VSWR < 2) over a 1.6:1 bandwidth is a
discusses avenues for future wideband planar phased array antenna research.
4
CHAPTER 2
2.1 Introduction
A motivational concept for planar phased array apertures was first proposed by
Wheeler [1]. Wheeler showed an infinite planar current sheet as a simple phased array
aperture and detailed important phased array quantities such as scan impedance for
both E-plane (plane containing the electric field vector in the direction of maximum
radiation) and H-plane (plane containing the magnetic field vector in the direction
of maximum radiation). However, no specific antenna types were discussed. Fig. 2.1
illustrates the infinite current sheet concept and its implementation using a tightly
an infinite array environment by examining their scan element pattern and input
impedance for free space and ground plane backed or conformal installations. The
dated with full wave simulation. In Section 2.4, the polarization purity of the TCDA
5
(a) (b)
Figure 2.1: (a) Infinite current sheet over a ground plane, (b) tightly coupled dipole
array implementation.
over the complete upper hemisphere is presented. Additionally, linear and dual linear
polarized TCDA apertures are shown to maintain low cross-polarization and high
isolation. Finally, balanced feeding techniques are investigated in Section 2.5 to sup-
In this section, 4 commonly used planar phased array antennas are investigated.
These are:
6
We remark that the tightly coupled dipole array is identical to the wire array, except
for a very small gap (in this case 0.2 mil) separates the elements. An interesting
wideband antenna omitted from this study is the fragmented aperture antenna [26
30]. Fragmented arrays are designed using genetic algorithms and commonly use
material loading to achieve large bandwidths. Instead, our goal here is to develop
also wideband but suffer from element resonances [31, 32]. Therefore, they are not
element software, Ansoft HFSS v11, is used with periodic boundary conditions [3335]
and Floquet ports to simulate an infinite array. A unit cell size of 11.5 mm was
used to suppress grating lobes below 13 GHz (H /2). Each element was modeled
as infinitely thin perfect electric conducting (PEC) sheets (grey) and excited using a
lumped port (red) as depicted in Fig. 2.2. Actual feeding structures will be considered
separately. In addition, the element study was not exhaustive. Specifically, the
The free space infinite array scan impedance at broadside is shown in Fig. 2.3. Scan
are applied to all array elements. Throughout this dissertation, a -10 dB active
fL are the highest and lowest frequencies where the active reflection coefficient is less
7
3 mm
z
y 0.5 mm 0.5 mm
x 1 mm 1 mm
11.5 mm 11.5 mm
Bowtie Dipole
(a) (b)
0.1
0.1mil
mil
3 mm
0.5 mm 0.5 mm
1 mm 1 mm
11.5 mm 11.5 mm
(c) (d)
Figure 2.2: Planar phased array antenna elements under investigation inside unit cell;
(a) wire or connected dipoles, (b) bowtie, (c) dipole, (d) slot.
8
Refereing to Fig. 2.3, we observe that the wire array reactance is inductive at
low frequencies (< 11 GHz) and becomes capacitive for higher frequencies. Also, as
expected, the connected complementary bowtie resistance is constant over the entire
bandwidth and equal to /2 with zero reactance (note that /2 = 60 , i.e. half the
free space wave impedance, ). The dipole array is heavily capacitive, then passes
After resonance, the dipole array is inductive and the resistance increases. In contrast,
the slot array resistance at 1 GHz is /2 with little reactance. For higher frequencies,
the impedance quickly becomes capacitive then passes though resonance and becomes
Free Space
400
350 Wire
Bowtie
300
Dipole
250 Slot
200
Impedance ()
150
100
50
0
50
100
150
200
1 2 4 6 8 10 12 14 16
Frequency (GHz)
Figure 2.3: Active resistance (solid) and reactance (dash) for various antenna elements
in free space scanned to o = 0 .
9
To determine the system impedance (Zo ) that maximizes each elements band-
width, a 2-D representation of the active reflection coefficient (at broadside) is plot-
ted for various system impedances in Fig. 2.4. The system impedances selected to
maximize bandwidth for the wire, bowtie, dipole and slot element was 275 , /2
The corresponding free space active reflection coefficient for each element is shown
in Fig. 2.5. The connected bowtie maintains an impressive reflection coefficient < -20
dB from 1 - 16 GHz. That is, it delivers the very best performance. The wire antenna
maintains a reflection coefficient of -15 dB from 1 - 13 GHz and the slot array operates
from 1 - 9 GHz. The slot array has limited high frequency bandwidth due to excessive
inductance. Also, the dipole array has the smallest usable bandwidth from 5 - 16 GHz.
Concluding, the connected bowtie array has the largest instantaneous bandwidth
and maintains the smallest reflection coefficient of the studied element types and
is clearly the element of choice for free space UWB phased arrays. This is due
independent.
To evaluate the arrays performance over a ground plane, each element was posi-
tioned 8 mm (0.35H ) over a PEC sheet. As Fig. 2.6 depicts, the wire and bowtie re-
sistance peak is above 400 and the reactance changes very rapidly versus frequency.
The slot antenna has little reactance variation over the band, but the resistance ap-
proaches 375 at 4 GHz and drops below 50 above 8 GHz. This is contrary to
the tightly coupled dipole arrays resistance which has less fluctuation. Further, the
TCDA reactance variation is less than the wire or bowtie and oscillates around 0 .
10
(a) (b)
(c) (d)
Figure 2.4: Active reflection coefficient for different system impedances (Zo ) of each
antenna element in free space scanned to o = 0 ; (a) wire or connected dipoles, (b)
bowtie, (c) dipole, (d) slot.
11
0
10
|| (dB)
15
Figure 2.5: Active reflection coefficient for various antenna elements in free space
scanned to o = 0 .
Ground Plane
400
350 Wire
Bowtie
300
Dipole
250 Slot
200
Impedance ()
150
100
50
0
50
100
150
200
1 2 4 6 8 10 12 14 16
Frequency (GHz)
Figure 2.6: Active resistance (solid) and reactance (dash) for various antenna elements
when placed 8 mm over ground plane scanned to o = 0 .
12
The ground-plane-backed reflection coefficient is shown in Fig. 2.7. Again, for
this comparison, the system impedance for the wire, bowtie, dipole and slot array
was selected using Fig. 2.8 to be 275 , 350 , 165 , 310 , respectively. Therefore,
maximizing each elements bandwidth. The wire, bowtie, and slot array bandwidth
are significantly reduced in presence of the ground plane. However, the TCDA perfor-
mance improves when placed over a ground plane and maintains a 4.3:1 bandwidth.
has an instantaneous bandwidth of 6 - 16 GHz (2.7:1), bowtie array 4.2 - 8.9 GHz
(2:1) and the slot array operates from 3.2 - 5.23 GHz (1.6:1).
10
|| (dB)
15
Figure 2.7: Active reflection coefficient for various antenna elements when placed 8
mm over ground plane scanned to o = 0 .
Having demonstrated that ground plane backed TCDAs provide more than double
13
(a) (b)
(c) (d)
Figure 2.8: Active reflection coefficient for different system impedances (Zo ) of each
antenna element when placed 8 mm over a ground plane scanned to o = 0 ; (a) wire
or connected dipoles, (b) bowtie, (c) dipole, (d) slot.
14
scan element pattern (SEP). Scan element pattern, formally called the active element
pattern [36], is the array pattern when only one element is fed while all others are
terminated in matched loads. The SEP includes the element pattern and all mutual
coupling effects as it was extracted from an infinite array analysis and depicts the
arrays scanning capability. In addition, the SEP is used to determine if the array
has blind spots, i.e. a null in the radiation pattern where the array gain would
drastically drop if scanned to that particular direction in space. The overall array
pattern (ignoring edge effects) can be computed using the scan element pattern and
array factor for a given finite array size and lattice [37].
Arrays operating in free space radiate bidirectionally and therefore have limited
interest and the SEP study was limited to ground plane backed arrays. The conformal
SEP for all elements is depicted in Fig. 2.9 and Fig. 2.10 for the E- and H-plane,
respectively. As each element is small (< H /2), they adequately sample the infinite
current sheet and have identical scan elements patterns. Therefore, no element has a
For simulation verification, we next consider the TCDA broadside directivity and
compare it to the theoretical maximum. Specifically, using (2.1), the maximum di-
the boresight ( = 0 ) SEP to the maximum directivity (D) possible for the given
unit cell area (A), good agreement is observed, implying 100% aperture efficiency, see
Fig. 2.11. Hence, the periodic boundary conditions, radiation boundary and ground
15
EPlane SEP
10
0
Directivity (dBi)
2 GHz
10 4 GHz
6 GHz
8 GHz
15 10 GHz
12 GHz
14 GHz
20
90 60 30 0 30 60 90
Theta (degrees)
Figure 2.9: E-Plane scan element pattern for the wire, bowtie, dipole and slot array
when placed 8 mm over ground plane.
HPlane SEP
10
0
Directivity (dBi)
5
2 GHz
4 GHz
10
6 GHz
8 GHz
15 10 GHz
12 GHz
14 GHz
20
90 60 30 0 30 60 90
Theta (degrees)
Figure 2.10: H-Plane scan element pattern for the wire, bowtie, dipole and slot array
when placed 8 mm over ground plane.
16
6
Theoretical Max
TCDA
4
Gain (dBi)
2
10
12
2 4 6 8 10 12 14
Frequency (GHz)
Given the SEP uniformity among elements, the surface electric current distribu-
tion at 10 GHz is plotted in Fig. 2.12. The x-directed current contributes to radiation
and is similar among elements. The small gap between neighboring dipole elements
has a very strong current concentration and capacitively loads the antenna. As such,
the TCDA impedance is capacitive and cancels the ground planes inductive loading.
This is the key reason for its wideband performance when placed on a ground plane.
As shown in the previous section, TCDAs bandwidth increases when placed above
a ground plane. This is profoundly different than electrically connected arrays whose
bandwidth reduces in the presence of the ground plane. In this section, we explain
the ground plane effect using simple and easy-to-understand equivalent circuits. The
motivating factor for capacitive versus inductive coupling is shown below in Fig. 2.13.
17
(a) (b)
(c) (d)
Figure 2.12: Surface current at 10 GHz; (a) wire, (b) bowtie, (c) dipole, (d) slot.
18
One can think of a wire array as a dipole array connected with infinite capacitance
is a wire array, which are extremely narrowband over a ground plane. Therefore,
planar wideband phased array antennas over a ground plane should be capacitively
R
CMutual
Figure 2.13: Tightly coupled dipole array equivalent circuit in free space scanned to
broadside.
The mutual capacitance (Cmutual ) is parallel to the dipole self tip-to-tip (Ctip )
used to maintain resonance for low frequencies where the dipole wire self inductance
(Lwire ) is small, (2.2). We remark that the radiation resistance (R) was omitted from
19
1
fr = (2.2)
LC
To illustrate the ground planes impedance canceling capabilities, a simple ideal
numerical example is presented using a ground plane backed array equivalent circuit.
To explain the equivalent circuit formulation an array in free space was first exam-
ined, see Fig. 2.14. An ideal array is assumed to operate in free space, meeting all
the criteria in which the equivalent circuit is valid; namely, elements are electrically
small with no grating lobes [2]. The infinite planar 2D periodic array is positioned
between two free space half planes. Each half plane can be represented as a infinite
transmission line with characteristic impedance 2RAo . The input impedance of the
is calculated by the parallel combination of each half space transmission line in series
jXAo
jXAo
Ho Ho 2RAo 2RAo 2RAo 2RAo ZA= RAo+jXAo
Array ZA ZA
The equivalent circuit in Fig. 2.14 was extended to include a ground plane. The
array is positioned a distance (d) above the ground plane as shown in Fig. 2.15. The
20
GHz. Furthermore, the free space array reactance (XAo ) is assumed to vary linearly
from -200j to +200j over the respective frequency range. The array impedance is
an idealized case used for illustrative purposes; however, for tightly coupled dipole
variation is reasonable. The array is positioned /4 above the ground plane at the
center frequency (d = 8.8 mm at 8.5 GHz). The ground plane impedance is cal-
culated using the traditional short circuit transmission line equation, then moved a
distance (d) through a transmission line with characteristic impedance (2RAo ), to the
array plane (Zgp ) becoming parallel to twice the array resistance (2RAo ). The array
reactance (XAo ) is then added in series to obtain the final ground plane compensated
impedance. The ground plane inductive reactance partially cancel the dipole capaci-
tive reactance for frequencies below the center frequency, while for higher frequencies
the capacitive ground plane partially cancel with array inductive reactance. The
to the single free space resonance. The return loss bandwidth improvement is also
illustrated in Fig. 2.16b, the array with ground plane has a 4:1 bandwidth compared
d d d
jXAo
Ho Ho jXAo
2RAo 2RAo 2RAo 2RAo
Array ZA ZA
Figure 2.15: Equivalent circuit for ground plane backed infinite array.
21
j1
Zo= 200, Freq: 116 GHz
Z
gp
j0.5 j2 R
Ao
+ jX
Ao 0
2RAo || Zgp
Free Space: RAo + jXAo, Zo=200
(2R || Z ) + jX
Ao gp Ao
With Ground Plane: (2RAo || Zgp) + jXAo, Zo=210
j0.2 5
|| (dB)
0 10
0.2 0.5 1 2
j0.2 15
j0.5 j2
20
1 2 4 6 8 10 12 14 16
j1 Frequency (GHz)
(a) (b)
Figure 2.16: (a) Array impedance transformation for equivalent circuit. (b) Return
loss comparison for the ideal array in free space and with ground plane.
To verify the equivalent circuit and ground plane impedance compensation ef-
construct the equivalent circuit, the free space array input impedance was first found
using HFSS, for the unit cell dipole geometry in Fig. 2.17(a). The element to el-
ement spacing was 11.5 mm (H /2 at 13 GHz), ensuring no grating lobes and the
dipole length was 11.25 mm, yielding a 0.125 mm gap between adjacent dipoles. The
array was then positioned over a ground plane and simulated while the separation
distance was varied from 4 - 10 mm (in 2 mm steps). The simulated conformal array
seen in Fig. 2.17, the equivalent circuit impedance curves are in good agreement with
full wave simulations (for all ground plane heights). The calculated resistance is typ-
ically lower than that of full wave simulation, but follows the simulated impedance
curves and provides the reader with an intuitive feel for ground plane spacing effects
22
and verifies the equivalent circuit which was introduced to demonstrate impedance
j1
Z = 100, Freq: 116 GHz
o
Sim: R + jX
Ao Ao
j0.5 Calc: d=4mm
j2 Sim: d=4mm
Calc: d=6mm
Sim: d=6mm
Calc: d=8mm
Sim: d=8mm
Calc: d=1cm
Sim: d=1cm
j0.2
0
0.2 0.5 1 2
j0.2
j0.5 j2
j1
(a) (b)
Figure 2.17: (a) Periodic unit cell dipole geometry. (b) Full wave array simulation
vs. equivalent circuit for different ground plane heights.
After verifying the equivalent circuit model, the simulated TCDA (with 8 mm
ground plane separation) reflection coefficient was calculated using a system impedance
of 150 . Fig. 2.18 shows similar conformal performance improvement as the ideal
After analyzing the principal plane SEP and impedance properties of each an-
tightly coupled dipole arrays as they have the largest conformal bandwidth. Using
the antenna in Fig. 2.12(d), we examined the E-, H- and D-plane co-polarization and
23
0
Free Space: Zo=100
With Ground Plane: Zo=150
|| (dB)
10
15
20
1 2 4 6 8 10 12 14 16
Frequency (GHz)
Figure 2.18: TCDA active reflection coefficient in free space and when placed 8 mm
over ground plane scanned to o = 0 .
Ludwig third definition of polarization was used [38], as they are the field components
(Ex ) and cross-polarized component (Ey ) is calculate using (2.3) and (2.4).
From Fig. 2.19, the principal plane cross-polarization level is > 60 dB below the
and the co-polarized directivity is 1 dB, yielding a cross-polarization ratio of -22.5 dB.
24
The cross-polarization level over the complete upper hemisphere at 10 GHz is shown
in Fig. 2.20. Similar to Vivaldi [39, 40] and slot arrays [41], the diagonal plane has
for conical scanning up to 25 and increases quickly outside of the principal planes.
10 GHz SEP
10
10
20
Directivity (dBi)
30 EPlane: CoPol
DPlane: CoPol
40 HPlane: CoPol
EPlane: CrossPol
50 DPlane: CrossPol
HPlane: CrossPol
60
70
80
90 60 30 0 30 60 90
Theta (degrees)
Figure 2.19: Dipole scan element pattern at 10 GHz in the E-Plane ( = 0 ), D-Plane
( = 45 ) and H-Plane ( = 90 ).
as any vertical (or z-directed) currents will typically increase the cross-polarization
level. Furthermore, as no vertical feed lines are used in the simulation, the cross-
We also examined the cross-polarization and mutual coupling for a dual linear po-
larized TCDA with co-incident phase center as depicted in Fig. 2.22. Fig. 2.23 shows
25
Figure 2.20: Dipole cross-polarization ratio over the upper hemisphere at 10 GHz.
= 45
0
2.5 = 30
= 45
5
Crosspolarization ratio (dB)
= 60
7.5
10
12.5
15
17.5
20
22.5
25
1 2 4 6 8 10 12 14 16
Frequency (GHz)
26
the co- and cross-polarization level at boresight for linear and dual linear polarized
TCDAs. As expected, both have identical co-polarized directivity and the cross-
polarization level is minimally effected and greater than 60 dB below the co-polarized
component. Referring to Fig. 2.24, the input refection coefficient |S11 | remains un-
changed and the mutual coupling |S21 | between orthogonal polarizations is less than
-70 dB. Again, we remark that this is an optimistic result, as no balun and feeding
11.5 mm 11.5 mm
(a) (b)
Figure 2.22: Tightly coupled dipole elements; (a) single polarization, (b) dual polar-
ization.
Until now, the phased array antennas under investigation were excited in HFSS
using an ideal lumped port on the aperture surface. This allowed important concepts
27
10
0
10
20
Directivity (dBi)
30
Single: CoPol
40 Single: CrossPol
50 Dual: CoPol
Dual: CrossPol
60
70
80
90
100
1 2 4 6 8 10 12 14 16
Frequency (GHz)
Figure 2.23: Boresight directivity of the single and dual polarized TCDA.
10
20
30
S11
Magnitude (dB)
40
S21
50
60
70
80
90
100
1 2 4 6 8 10 12 14 16
Frequency (GHz)
28
TCDA realization. This is depicted in Fig. 2.25, where a planar phased array antenna
over a ground plane requires interconnects between the aperture and ground plane.
In addition, typical unit cell dimensions are shown with a ground plane separation
< 0.4H . This is necessary to avoid boresight radiation cancelation from the ground
plane image current when a 0.5 ground plane separation is used. A wideband TCDA
this section will present several ways to achieve unbalanced to balanced (balun) feed
conversion for planar phased array antennas. Furthermore, typical TCDAs have an
Figure 2.25: Typical planar phased array antenna unit cell depicting the aperture,
interconnects and ground plane.
29
2.5.1 External 180 Hybrid
A commonly used balun employs a external 180 hybrid where the two outer
coaxial shields are soldered together and the remaining center conductors form a
100 balanced transmission line as shown in Fig. 2.26. The hybrid serves to make
the center conductors of the output cables opposite in polarity whereas the outer
conductor provides a means for shielding. This type of feed arrangement has been
used to feed wideband spiral antennas [42] and for the TCDA prototype development
by Harris et al. [3]. Shielding is critical because an unshielded feed line, such as
twin-wire or co-planar strip can excite a common mode [13, 43] when the feed line
and antenna are 1 long. Common mode excitation and suppression is addressed in
Using a external hybrid, the TCDA antenna can be fed through the ground plane
using coaxial cables as depicted in Fig. 2.27(a). In addition, the coaxial cables were
tapered for improved balun performance. The linear taper controls the current on the
outer conductor by forcing it to flow on one side, thus, canceling the adjacent cable
shield current. Fig. 2.27(b) displays the unit cell realized gain, which is within 0.25
30
dB of the directivity from 5 - 15 GHz, demonstrating a 100 balanced impedance
match. Although the hybrid and coaxial lines are bulky and expensive it serves as a
baseline using commercial off the shelf (COTS) parts. Furthermore, depending on the
frequency range a wideband 180 hybrid with 4:1 or 10:1 bandwidth can be multiple
wavelengths long and therefore troublesome to fit inside the array lattice which is
1.15cm=O/2
Gain
@ 13GHz Realized Gain, Zo=100:
(a) (b)
Figure 2.27: (a) Tapered coaxial cable feed with external 180 hybrid (not shown).
(b) Broadside gain and realized gain using external hybrid.
A first attempt to remove the costly 180 hybrid is shown in Fig. 2.28. It consists of
a single coaxial cable (standard semi-rigid 0.046 diameter) with the outer conductor
linearly tapered forming a narrow strip. The narrow outer strip and center conductor
for impedance matching the antenna to 50 and will be discussed in the next section.
31
(a) Coaxial cable
a Teflon
(b) Outer shield
b removed for 130:
parallel plate line
Figure 2.28: Single coaxial cable balun with integrated matching circuit. The ground
plane and unit cell outline are not shown.
Due to tight size constraints, the tapered section is small (/17 at 4 GHz) ef-
fectively limiting balun performance. For proper operation the taper should be at
in Fig. 2.29 where the unbalanced current forms a common mode at 7.3 GHz. To
circumvent the problem, a lossless ferrite bead with r = 200 was added around the
base of the coaxial cable, effectively choking the unbalanced current. Ferrite beads at
X-band are not currently available, but can be used for TCDA arrays operating at L-
band and below. The reflection coefficient is shown in Fig. 2.29, clearly demonstrating
the ferrite beads effectiveness. In addition, the vector electric field at 7.3 GHz with
and without ferrite bead is shown in Fig. 2.30. We observe that the common mode
(or monopole mode) has a strong electric field between the dipole arms and ground
plane. The common mode frequency occurs when the dipole length (ld ) and round
trip feed length (2lf ) is 1 long (denoted as in Fig. 2.30). Therefore, the common
300 mm
fcm . (2.5)
32
Where is defined as
= ld + 2lf . (2.6)
Substituting (2.6) into (2.5) gives (2.7). Substituting the element geometry and
material parameters, the common mode is predicted at 7.3 GHz. We remark that pcb
is the PCB board permittivity the array is printed on (in this case TMM3, pcb = 3)
and cable is the coaxial cable dielectric constant of 2.4. The taper length and dipole
geometry was not optimized to minimize the reflection coefficient. However, the feed
concept is demonstrated.
300 mm
fcm q 7.3 GHz (2.7)
pcb +1
11.5 mm 2
+ 2(8 mm) cable
5
|| (dB)
10
15
No Ferrite Bead
With Ferrite Bead
20
1 2 4 6 8 10 12 14 16
Frequency (GHz)
Figure 2.29: Single coaxial cable tapered balun active reflection coefficient with and
without ferrite bead choke. Note the common mode at 7.3 GHz.
33
11.5 mm
8 mm
Figure 2.30: Single cable tapered balun depicting common mode electric field distri-
bution (left) and common mode suppression using a ferrite bead choke (right).
Typical TCDAs have a large input impedance (Za 150 - 300 ). As a re-
sult, a matching circuit must be used to connect the array to common 50 system
impedances. A matching circuit for TCDAs is shown in Fig. 2.31, where the antenna
Zm . The matching impedance is bound by the following relationship, Zin < Zm < Za ,
for 50 and 100 system impedances. Concurrently, to maintain the arrays inherent
low-profile, the matching circuit length should approximately equal the array ground
plane separation distance, d. This is critical, as a balun circuit can be printed be-
hind or on the ground plane. Interconnects between the TCDA aperture and balun
circuitry are necessary and can be concurrently used for impedance matching.
34
lm
Zm Za
Zin
Figure 2.31: Wideband impedance matching using a single transmission line with
characteristic impedance Zm of length lm .
The antenna impedance locus is centered around 200 and has an active VSWR <
2 from 3.5 - 13.5 GHz. However, as mentioned earlier, dipole elements are commonly
feed using external commercial of the self (COTS) 180 hybrids having a 100
impedance. Therefore, we used the matching circuit from Fig. 2.31 with lm = 9.25
corresponding VSWR is shown as the red dash trace, demonstrating the TCDA is
2.6 Summary
In this chapter, we presented, for the first time a direct comparison of the scan
element pattern and input impedance of 4 common planar wideband phased array
bowtie and slot array. A unique feature of TCDAs is the capacitive mutual coupling
35
j1 Zo= 100:, Freq: 1-16 GHz 5
Za, no matching, Zo=200:
j0.5 j2 4.5 Zin, with matching, Zo=100:
j0.2
3.5
VSWR
3
0
0.2 0.5 1 2
2.5
2
-j0.2
1.5
-j0.5 -j2 1
1 2 4 6 8 10 12 14 16
Za, no matching
-j1 Frequency (GHz)
Zin, Zoline=145: , l=0.925cm
Figure 2.32: TCDA matching network example without matching (200 ) and with
matching network connected to a 100 system impedance.
which was demonstrated in Section 2.3 to cancel the ground plane inductive loading
using equivalent circuits and full wave simulation. This is contrary to arrays operating
in free space where the dipole antenna has the smallest bandwidth. Connected bowtie
apertures in free space were shown to maintain greater than 16:1 bandwidth with a
reflection coefficient below -20 dB. However, the array became extremely narrowband
erties of conformal linear and dual linear polarized TCDA apertures were shown to
tions such as unbalanced to balanced conversion, shielding for common mode suppres-
sion and impedance matching. The next chapter discusses how antenna miniaturiza-
tion can be used to extend the lower operating frequency and increase instantaneous
bandwidth of TCDAs.
36
CHAPTER 3
3.1 Introduction
phased array antennas. We focus specifically on TCDAs, but the concepts can be
extended to other planar phased array antennas as well. The chapter starts by briefly
present multiple inductive loading techniques and apply them to TCDAs. Initially,
materials between the antenna and ground plane are presented in Section 3.4 to re-
duce height and improved bandwidth. In Section 3.5, capacitive reactive loading is
implemented using a novel element with additional degrees of freedom to cancel the
ground plane inductance and achieve wider bandwidths in conformal settings. Each
dipole arm is different than the other (or non-symmetric), enabling better indepen-
dent control of the elements self inductance and mutual capacitance. As such, input
37
impedance and wave velocity can be controlled independently. To further miniatur-
ize and provide environmental protection, we study single and two-layer dielectric
turization. The basic concept of miniaturization is reducing the phase velocity of the
wave guided by the antenna. The phase velocity vp and characteristic impedance Zo
Where L is the series inductance per unit length, C is the shunt capacitance per
the antenna geometry in such a way that the local stored electric or magnetic energy
be used although they are typically narrowband, lossy and restrict the arrays power
handling capability. The main issue with reactive loading is its implementation and
integration into the antenna structure. For some antennas, it can be very difficult,
38
3.3 Inductive Loading via Volumetric Meandering
ization. Namely, we considered planar [4749] and volumetric meandering [50, 51] to
increase the dipole inductance (Lwire ). However, planar meandering adds minimal in-
ductance, while vertical meandering increases the inductance significantly. Due to the
close proximity to the ground plane and relatively fat dipoles, the majority of electric
field is normal to the printed dipole. This approach is similar to using corrugations
mm as depicted in Fig. 3.1. In this case, the depth was chosen to be equal to the
PCB thickness (standard Rogers 3003 microwave laminate) for easy and low cost
implementation using standard plated via technology. The associated dipole is 1.8
mm wide with nine meander segments (each 0.45 mm long) per arm leaving a 0.2 mm
gap between each dipole. Using more segments provides diminishing returns due to
arrays simulated active VSWR is shown in Fig. 3.2, when the element is positioned
9 mm above a ground plane. As seen, the input impedance is well matched to 200 .
to the CSA demonstrated by Munk [3]. As depicted in Table 3.1, our design shows
operating frequency and ground plane separation. It should be noted that dielectric
sheets (as used in [3]) above the dipole array can further improve scan impedance and
increase impedance bandwidth [24]. This will be considered later in this chapter.
39
Figure 3.1: Dipole unit cell with inductive miniaturization implemented using vertical
meandering and a 200 system impedance.
4.5
3.5
VSWR
2.5
1.5
1
1 2 4 6 8 10 12 14 16
Frequency (GHz)
Figure 3.2: Dipole unit cell with inductive miniaturization implemented using vertical
meandering.
40
Table 3.1: Miniaturized element performance comparison summary
Vertical Meander Munk CSA [3]
VSWR < 3 2.6 - 13.3 GHz (5:1) 4 - 18 GHz (4.5:1)
Element Size fhigh 0.5o 0.65o
Element Size flow 0.1o 0.15o
Ground Plane Separation o /12.8 o /10
considered using ferrites. In this study, we use ideal ferrite materials to demonstrate
frequency and r = 1 are implemented and simulations are used to study the effect
Fig. 3.3 depicts the element geometry and input impedance for broadside scan
while varying the substrate r . We remark that the frequency range and element
such, the frequency range is above current ferrite materials availability. However, the
lowers the frequency of operation and increases the resistance below 4 GHz, however,
several impedance anomalies are observed. Examining the r = 3 case, the instan-
taneous bandwidth is 1.85 - 9.6 GHz (5.2:1). The resistance approaches zero at 10.5
GHz due to the g /2 guided wavelength ground plane separation where the image
41
the cancelation occurs at lower frequencies. In addition, an undesired ferrite material
mode is excited.
5
No ferrite
4.5 =3
r
r=5
Ferrite 4
r=7
3.5
VSWR
3
8 mm 2.5
1.5
1
Ground Plane 11.5 mm 1 2 4 6 8 10 12 14 16
Frequency (GHz)
(a) (b)
500 500
No ferrite No ferrite
450 =3 400
r =3
r
400 =5 300 r=5
r
=7 r=7
350 r 200
Resistance ()
Reactance ()
300 100
250 0
200 100
150 200
100 300
50 400
0 500
1 2 4 6 8 10 12 14 16 1 2 4 6 8 10 12 14 16
Frequency (GHz) Frequency (GHz)
(c) (d)
Figure 3.3: TCDA ferrite substrate loading; (a) unit cell geometry, (b) active VSWR,
(c) resistance, (d) reactance.
To isolate and remove the ground plane cancelation problem, we repeated the
study while maintaining the ferrite electrical thickness. Fig. 3.4 depicts the perfor-
mance when scaling the thickness and subsequent ground plane separation by 1/ r .
42
Significant miniaturization is achieved using r = 3 and the impedance anomaly at
10.5 GHz is removed. The array height is 4.6 mm or L /30 and provides an instan-
taneous bandwidth from 2.2 - 15.7 GHz (7:1). Ferrite loading with r = 5 and 7
provides more miniaturization by reducing the low frequency cutoff to 1.93 and 1.7
GHz, respectively. However, similar to the previous study an undesired ferrite mate-
rial mode is excited. The mode limits the high frequency operation of the array to 12
GHz and 10.3 GHz and thus reduces the bandwidth to 6.2:1 and 5.8:1, respectively.
The electric field inside the ferrite material is shown in Fig. 3.5 and resembles a
TM210 rectangular resonant cavity. As such, the impedance anomaly can be predicted
using rectangular resonant cavity model. The rectangular resonant cavity frequency
directions, the TM210 ferrite mode resonant frequency is determined using the ferrite
s 2
c m 2 n 2 l
fmnl = + + (3.2)
2 r r a b d
s 2
c 2 2
f210 = + . (3.3)
2 r a b
Table 3.2 compares the HFSS simulated impedance anomaly and the predicted
TM210 resonant frequency using (3.3). The calculated resonant frequency is within
6.3% and improves to 1.8% with r = 7. The improved accuracy for higher r is due
lower r values. If the TM210 mode is suppressed, the r = 7 loaded TCDA operates
43
5
No ferrite
4.5 =3
r
r=5
4
r=7
3.5
Pr = 5
VSWR
3
2.5
8 mm
Pr
2
1.5
(a) (b)
500 500
No ferrite No ferrite
450 =3 400
r =3
r
400 =5 300 r=5
r
=7 r=7
350 r 200
Resistance ()
300 Reactance ()
100
250 0
200 100
150 200
100 300
50 400
0 500
1 2 4 6 8 10 12 14 16 1 2 4 6 8 10 12 14 16
Frequency (GHz) Frequency (GHz)
(c) (d)
Figure 3.4: TCDA ferrite substrate loading while maintaining ground plane electrical
separation; (a) unit cell geometry depicting reduced thickness with r = 5, (b) active
VSWR, (c) resistance, (d) reactance.
44
z
z
d
a y
b
x
x y
(a) (b)
Figure 3.5: Ferrite substrate electric field distribution; (a) rectangular cavity model,
(b) side view in x-z plane.
To capacitively miniaturize the dipole antenna for use in tightly coupled arrays,
the dipole tip-to-tip capacitance can be increased to lower the arrays operating fre-
quency. A larger tip capacitance can be realized by enlarging the dipole width near
the end of the element. As the mutual capacitance is in parallel with the dipole tip ca-
pacitance and dominates, one can more effectively miniaturize by increasing Cmutual
SMD capacitors can be used, but insertion loss limits the frequency range and the
increase mutual coupling and control radiation resistance is developed using a novel
Fig. 3.6(a) [56]. Each arm on the dipole is different than the other or non-symmetric.
45
This allows one to better control the elements self inductance and mutual capacitance
independently. In this case, the arms are similar near the center feed portion but
The results shown in Fig. 3.6(b) are a proof of concept. It demonstrates that non-
symmetric elements are broadband and justifies a more rigorous study. In particular,
each elements non-symmetric qualities can be exaggerated for improved UWB perfor-
mance (typically 4:1) or perhaps optimizing the bandwidth for a specific application.
Due to the periodic structure of the array, one can think of the aperture as a trans-
mission line with series inductance and shunt capacitance. The non-symmetric arms
can be used to create radically different designs than the symmetric ones currently
found in literature.
Unit Cell
Figure 3.6: Dual polarized array with non-symmetric elements; (a) unit cell geometry,
(b) infinite array reflection coefficient, Zo = 200,scanned to o = 0 .
46
To characterize the non-symmetric TCDA, it was parameterized with the following
five variables; t1 (cup width), t2 (ball width), t3 (arm width), g (element separation
gap) and (cup opening angle). For conformal realization, the associated array was
placed 8 mm above a ground plane and remains fixed during parametric analysis.
The broadside scan input impedance is shown in Fig. 3.7(b). The corresponding
principal plane scan element pattern is shown in Fig. 3.8. We observe the E-plane
SEP is similar to the H-plane pattern for 45 45 and fairly constant over a
broad range of frequencies. However, at low elevation angles (towards grazing) the E
and H-plane patterns deviate substantially. The E-plane pattern has sharper nulls,
cancelation at horizon from the ground plane image current. Although the element
mutual coupling. For all parameter sweeps, the SEP remains constant (within 1 dB
of Fig. 3.8) and thus are omitted. It is therefore only necessary to study the input
The first parameter studied was t1. As t1 is increased, the resistance is signifi-
cantly reduced, while the low frequency reactance is reduced. Furthermore, the high
frequency reactance increases, effectively shifting the input impedance on the smith
chart and increasing the loop diameter as shown in Fig. 3.9. This is due to an in-
creased tip-to-tip capacitance formed by the large cup size. Frequencies below 5 GHz
To facilitate sweeping t2, while not shorting the element to its neighbor, t1 had
to maintain the same cup trace width, namely, 0.25 mm for all values of t2. As t2
47
j1
Z = 200, Freq: 216 GHz
o
j0.5
t1 j2
g
0.5 mm
j0.2
0.5 mm 0
0.2 0.5 1 2
j0.2
t3
j2
t2 j0.5
11.5 mm
j1
(a) (b)
Figure 3.7: Baseline non-symmetric TCDA; (a) unit cell geometry for parameter
study, (b) input impedance with t1 = 2 mm, t2 = 1 mm, t3 = 0.5 mm, g = 10 mil,
= 180 with the array placed 8 mm above the ground plane scanned to o = 0 .
10 10
5 5
0 0
Gain (dB)
Gain (dB)
5 5
2GHz 2GHz
4GHz 4GHz
6GHz 6GHz
10 8GHz 10 8GHz
10GHz 10GHz
12GHz 12GHz
14GHz 14GHz
15 15
90 75 60 45 30 15 0 15 30 45 60 75 90 90 75 60 45 30 15 0 15 30 45 60 75 90
Theta (degree) Theta (degree)
(a) (b)
Figure 3.8: Baseline TCDA scan element pattern; (a) E-plane, (b) H-plane.
48
j1
Zo= 200, Freq: 216 GHz
t1=2mm
j0.5 j2 t1=3mm
2mm 5mm
t1=4mm
t1=5mm
j0.2
j0.2
0
0.2 0.5 1 2
-j0.2
j0.2
j0.5 j2
j1
(a) (b)
400
300
200
Impdance ()
100
0
t1=2mm
t1=3mm
100 t1=4mm
t1=5mm
200
2 4 6 8 10 12 14 16
Frequency (GHz)
(c)
Figure 3.9: Non-symmetric TCDA; (a) geometry with t1 = 2 and 5 mm, (b) input
impedance, (c) corresponding resistance (solid) and reactance (dash) with t1 varied,
t2 = 1 mm, t3 = 0.5 mm, g = 10 mil, = 180 , scanned to o = 0 .
49
increases, the resistance increases over the entire frequency range. In a similar fashion,
the reactance is substantially reduced for low frequencies, becoming less capacitive.
For a small ball width (t2 = 0.25 mm) the first resonance occurs at 12 GHz, but
for larger sizes the first resonance occurs much lower, for example 2.2 GHz when t2
increased mutual coupling. For larger t2 values, the ball and cup capacitive junction
area increases, resulting in a larger mutual and tip-to-tip capacitance, see Fig. 3.10.
The next parameter studied was the arm width or t3. To accommodate large
size on the smith chart also increases and shifts to the left, implying a reduction of
resistance and a larger reactance variation over the band, see Fig. 3.11. Below 5 GHz
the resistance is constant while for higher frequencies the resistance is halved when
reduction of the wire inductance shown by a increased capacitive reactance over the
The next parameter of interest is the gap separating the ball and cup, g. When
the separation gap is small, a significant increase in mutual coupling effectively minia-
turizes the antenna. This is observed by a resistance increase for all frequencies, while
simultaneously decreasing the low frequency capacitive reactance and high frequency
inductance as shown in Fig. 3.12. The gap separation should be as small as possi-
ble (within manufacturing tolerances) to ensure strong mutual coupling, enabling the
50
0.25mm 3mm j1
Zo= 200, Freq: 216 GHz
t2=0.25mm
j0.5 j2 t2=0.5mm
t2=1mm
t2=2mm
t2=3mm
j0.2
0
0.2 0.5 1 2
j0.2
j0.5 j2
j1
(a) (b)
400
300
200
Impdance ()
t2=0.25mm
100 t2=0.5mm
t2=1mm
t2=2mm
t2=3mm
0
100
200
2 4 6 8 10 12 14 16
Frequency (GHz)
(c)
Figure 3.10: Non-symmetric TCDA; (a) geometry with t2 = 0.25 and 3 mm, (b) input
impedance, (c) corresponding resistance (solid) and reactance (dash) with t1 = t2 +
g + 0.25 mm, t2 varied, t3 = 0.5 mm, g = 10 mil, = 180 , scanned to o = 0 .
51
j1
Zo= 200, Freq: 216 GHz
t3=0.5mm
j0.2
0
0.2 0.5 1 2
j0.2
j0.5 j2
j1
(a) (b)
400
300
200
Impdance ()
100
t3=0.5mm
t3=1mm
100
t3=2mm
t3=3mm
200
2 4 6 8 10 12 14 16
Frequency (GHz)
(c)
Figure 3.11: Non-symmetric TCDA; (a) geometry with t3 = 0.5 and 3 mm, (b) input
impedance, (c) corresponding resistance (solid) and reactance (dash) with t1 = 2 mm,
t2 = 1 mm, t3 varied, g = 10 mil, = 180 , scanned to o = 0 .
52
400
j1
Zo= 200, Freq: 216 GHz
g=5mil
g=15mil
300
j0.5 j2
g=25mil
g=35mil
200
Impdance ()
j0.2
g=5mil
g=15mil
100
g=25mil
0
g=35mil
0.2 0.5 1 2
j0.2
100
j0.5 j2
200
2 4 6 8 10 12 14 16
j1 Frequency (GHz)
(a) (b)
Figure 3.12: (a) TCDA input impedance, (b) corresponding resistance (solid) and
reactance (dash) with t1 = 2 mm, t2 = 1 mm, t3 = 0.5 mm, g varied, = 180 ,
scanned to o = 0 .
The final parameter investigated is the cup opening angle . The values investi-
coupling increases due to a larger capacitive area. For all cases the anti-resonance
point (6.5 GHz) stays the same, while the first resonance point is miniaturized up to
100% when decreases from 275 to 45 . Based on the performance of this novel
element we integrate the antenna with a balun and fabricate a 64 element prototype
determine the superstrate dielectric constant a linearly polarized plane wave at normal
53
j1
Zo= 200, Freq: 216 GHz
=45
j0.5 j2 =105
=165
=225
=275
j0.2
= 45 = 275
0
0.2 0.5 1 2
j0.2
j0.5 j2
j1
(a) (b)
400
300
200
=45
Impdance ()
=105
100 =165
=225
=275
0
100
200
2 4 6 8 10 12 14 16
Frequency (GHz)
(c)
Figure 3.13: Non-symmetric TCDA; (a) geometry with = 45 and = 275 , (b)
input impedance, (c) corresponding resistance (solid) and reactance (dash) with t1 =
2 mm, t2 = 1 mm, t3 = 0.5 mm, g = 10 mil, scanned to o = 0 .
54
with a dielectric constant equal to the array PCB permittivity with thickness h. A
h
t1 d
H1
Superstrate
Array PCB
Figure 3.14: Ground plane backed TCDA printed on a PCB with a single layer
dielectric superstrate of thickness t1 , and dielectric constant 1 .
i i+1
i,i+1 = (3.4)
i + i+1
0
i = . (3.5)
i
To solve for the required superstrate dielectric constant, (3.6) is used to form a sys-
tem of equations to match the PCB dielectric constant to free space using single or
double dielectric superstrate(s). Finding the minimum reflection coefficient and req-
uisite dielectric constants was performed using MATLAB. Table 3.3 summarizes the
55
minimum reflection coefficient (given single and dual layer loading) using commercial
Table 3.3: Dielectric constant for superstrate matching using Rogers TMM series
array PCB
Single Double
PCB P CB i (dB) i i+1 (dB)
TMM3 3.27 1.80 -16.7 2.20 1.48 -20.1
TMM4 4.5 2.12 -14.6 2.73 1.65 -18.1
TMM6 6 2.45 -13.7 3.30 1.82 -16.5
TMM10 9.2 3.03 -11.4 4.39 2.10 -14.8
Based on [2], the superstrate thickness should be c,g /4 at the center frequency
of the operational bandwidth. Assuming the array has constant resistance and the
fc . However, typical TCDAs are generally more capacitive and less inductive as
plane separation as depicted in Fig. 3.16 and not related to the traditional /2 dipole
length.
Due to the ambiguity of resonance, initially c /4 was assumed to equal the ground
c,g c
t= = (3.7)
4 4 r
56
j1
Z = 200, Freq: 116 GHz
o
j0.5 j2
j0.2
0
0.2 0.5 1 2
j0.2
j2 d=4mm
j0.5
d=6mm
d=8mm
j1 d=1cm
(a) (b)
Figure 3.15: (a) TCDA unit cell geometry printed on 20 mil thick TMM3 . (b) Input
impedance for different ground plane heights.
300
d=4mm
d=6mm
200 d=8cm
d=1cm
100
Reactance ()
100
200
300
2 4 6 8 10 12 14 16
Frequency (GHz)
57
j1
Z = 200, Freq: 116 GHz
o
t1=0
j0.5 j2 t1=c,g\10
200
t1=c,g\6
t1=c,g\4 150
t1=c,g\3
j0.2 100
50
Impdance ()
0 0
0.2 0.5 1 2
50
t1=0
j0.2 t = \10
100 1 c,g
t = \6
1 c,g
150 t = \4
1 c,g
j2
t1=c,g\3
j0.5
200
2 4 6 8 10 12 14 16
j1 Frequency (GHz)
(a) (b)
Figure 3.17: TCDA with single dielectric superstrate with 1 = 1.8 of varying thick-
ness, t1 , scanned to o = 0 ; (a) input impedance and (b) corresponding resistance
(solid) and reactance (dash).
When the superstrate thickness increases, the peak resistance is reduced and
shifted from 7 GHz to 4.75 GHz. As the thickness approaches g /4, a second loop on
the smith chart is formed, see Fig. 3.17 which increases the resistance at 12 GHz to
170 from 100 . Furthermore, the reactance increases and remains fairly constant
from 9 - 14 GHz. As the superstrate thickness becomes larger than g /4, the second
high frequency resistance peak increases at the expense of reducing the first resistance
peak at 5 GHz. There is little reactance change below 4 GHz, however, the resistance
erally, as the superstrate thickness increases the high frequency impedance rotates
clockwise on the smith chart as shown in Fig. 3.17(a). When the thickness is approx-
imately g /4 a second loop of similar size is formed. For thicker substrates the low
58
A similar thickness analysis was performed using a two-layer dielectric superstrate.
The same TCDA, PCB, and ground plane separation was used was used as before.
The first superstrate was c,g /4 thick at 9.375 GHz and had 1 = 2.2. The second
superstrate had a dielectric constant (2 ) of 1.4 and thickness (t2 ) was varied from
c,g /10 to c,g /3 (see Fig. 3.18). The second superstrate provides little miniaturiza-
tion, but rather improves the mid band impedance fluctuation. The first resonance
peak frequency is constant for all t2 values while the second peak is reduced and
shifted lower in frequency. For t2 c,g /4, the reactance variation is reduced from 4
- 14 GHz. Given the minor improvements the second superstrate offers, care should
j1
Z = 200, Freq: 116 GHz
o
t2=0
j0.5 j2 t = \10
200
2 c,g
t2=c,g\6
t =
2 c,g
\4 150
t = \3
2 c,g
j0.2 100
50
Impdance ()
0 0
0.2 0.5 1 2
50
t2=0
j0.2 t2=c,g\10
100
t2=c,g\6
150 t = \4
2 c,g
j2
t2=c,g\3
j0.5
200
2 4 6 8 10 12 14 16
j1 Frequency (GHz)
(a) (b)
Figure 3.18: TCDA with two-layer dielectric superstrate with 1 = 2.2 of c,g /4 thick-
ness and 2 = 1.4 of varying thickness, t2 , scanned to o = 0 ; (a) input impedance
and (b) corresponding resistance (solid) and reactance (dash).
59
3.7 Summary
lent transmission line concepts such as phase velocity slow down to describe antenna
inductance and shunt capacitance using reactive and material treatments. Inductive
reactive loading was implemented using volumetric meandering in Section 3.3. The
plated vias and traditional PCB manufacturing maintaining the arrays low-cost and
planar assembly.
Inductive material loading using ferrites was presented in Section 3.4 and improves
TCDA bandwidth up to 7:1 while reducing the array thickness to L /30 using an
r = 3. For r > 3 an undesired TM210 ferrite material mode is excited and can
mode results in extremely large bandwidth (8.2:1) and is very low-profile (L /56).
sweeps were presented in Section 3.5 to control input impedance and miniaturize the
symmetric TCDAs while providing the ability to control the elements resistance and
reactance more independently. Finally, single and dual dielectric superstrate loading
was presented in Section 3.6. A guideline for determining the substrate dielectric
constant and thickness was developed and shown to increase low frequency resistance
60
CHAPTER 4
4.1 Introduction
conformal array with integrated balun and matching network. The developed antenna
specific bandwidth using the additional degrees of freedom to cancel the ground plane
inductance. A design example for the latter is developed to operate at X-band (8 - 12.5
GHz). A unique feature of the proposed array is the planar layered PCB construction.
Specifically, a single microwave laminate is used for the array aperture while another
4.2. The balun is printed on the array ground plane and connects to the array
aperture using small twin-wire transmission lines. In Section 4.3, the aperture is
61
shown. Experimental demonstration of a 64 element (8 8) X-band array prototype
with a single driven element is presented in Section 4.4. The prototype is used to
and measured in Section 4.5. Measurements and simulation are in good agreement
this section we propose a modified planar wideband ring hybrid printed on the array
ground plane. The hybrid employs coupled microstrip lines for bandwidth improve-
ment [57]. The required even (Zeven ) and odd (Zodd ) mode coupled line impedances
are 176.2 and 30.2 , respectively. However, the required coupled line separation
g required is < 1 mil for a 25 mil thick Rogers 3206 microwave laminate. The small
coupled line separation is beyond traditional fabrication capabilities and limits re-
necessary for the desired frequency range, the coupled line gap was increased to 3
mil. Using a microstrip trace width (w3) of 15 mil, the corresponding impedances
are Zeven = 104.6 and Zodd = 39.7 . The ring was then optimized to provide a
return loss > 10 dB from 7.5 - 13 GHz or > 15 dB from 9 - 12.8 GHz and maintained
a balanced output transmission |S21 | > -0.75 dB from 8 - 12.5 GHz. See Fig. 4.1
for the final design layout and performance. Concurrently, the insertion loss is <
0.5 dB. The ring hybrid has a 50 SMA coaxial cable input and two output ports
that extend inside the ring, 180 out-of-phase from each other. As a result, the fields
62
add in series forming a 100 balanced line. Unlike the design in [57], the unused
terminated sum (or in-phase) port was removed, reducing complexity and cost. In
D 5
S11
Port 2
5mm S21
|S| (dB)
a
10
w3
25mil
w2 g2
15
Port 1
w1
RO3206
20
Ground Plane 7 8 9 10 11 12 13
Frequency (GHz)
(a) (b)
Figure 4.1: Proposed wideband microstrip coupled line ring hybrid with balanced
twin-wire output, a = 0.64516 mm, D = 0.88 mm, w1 = 38 mil, w2 = 20 mil, w3 =
17 mil, g2 = 3 mil, d = 5 mm; (a) geometry and (b) S parameters.
Due to the large array input resistance (Za 200 to 300 ), the element
cannot be directly connected to the ring hybrid. Instead, a small transmission line
(of characteristic impedance 136 ) is used to match the array to the hybrid. As
mm) was employed. The array and balun is printed on standard Rogers 3203 and
a wider scanning range and provide protection, a 6.35 mm thick wide-angle impedance
63
matching (WAIM) superstrate [58] having a dielectric constant (s ) of 1.7 was added.
The non-symmetric TCDA unit cell with integrated balun and impedance matching
interconnects is shown in Fig. 4.2(a). The broadside active reflection coefficient is <
|| (dB) 10
15
20
7 8 9 10 11 12 13
Frequency (GHz)
(a) (b)
Figure 4.2: Non-symmetric tightly coupled dipole array unit cell with radome, inte-
grated feed and matching network, the dimensions are: t1 = 1.75 mm, t2 = 0.75 mm,
t3 = 1 mm, g = 7 mil, = 85 , a = 0.8128 mm, D = 1.4 mm, w1 = 30 mil, w2 =
20 mil, w3 = 17 mil, w4 = 24 mil, g2 = 3 mil, s = 1.7; (a) geometry and (b) active
reflection coefficient at broadside.
The boresight directivity and realized gain is shown in Fig. 4.3(a). As indicated,
the realized gain approaches the maximum aperture directivity from 8 - 12.5 GHz
(within 0.3 dB). Furthermore, the radiation efficiency is greater than 93% including
all dielectric and copper conductor losses. Of importance is the remarkable scanning
64
performance of this array, as depicted in Fig. 4.3(b). It maintains an active VSWR <
2.5 from 7.5 GHz to 13 GHz for scanning up to 75 in the E-plane and 60 in H-plane.
4 4
Boresight
2 3.5 E30
H30
E60
0 3 H60
E75
VSWR
2
4A/
dBi
2 2.5
Realized Gain
4 2
6 1.5
8 1
7 8 9 10 11 12 13 7 8 9 10 11 12 13
Frequency (GHz) Frequency (GHz)
(a) (b)
Figure 4.3: Performance of the array unit cell in Fig. 4.2(a); (a) broadside radiation,
(b) active VSWR over multiple principal plane scan angles.
To verify the proposed design, a small finite (8 8) array was simulated, fabricated
and measured. For simulation and measurement, the array was mounted on a 12"
square aluminum ground plane. As depicted in Fig. 4.4(a), the array and balun
circuitry are completely planar. A solder mask was employed on the array and balun
PCBs to enable soldering ease. In addition, each board was extended 0.5 around
the array aperture to facilitate 4 nylon bolts. The finite array prototype was also
simulated using HFSS. The simulation mesh is 1.83 million tetrahedral with a memory
usage of 61.1 GB and takes approximately 4 hours for each frequency point using
a Dual Xeon 2.5 GHz Quad Core workstation. We note that the only difference
65
between fabricated and simulated geometries is the solder mask and spray adhesive
for assembly.
Fig. 4.4(b) depicts the reflection coefficient for a single excited element near the
center, while the remaining elements are terminated with 100 resistors at the array
surface. The agreement between simulation and measurement are reasonable and
show similar resonances at 8.75 GHz and 11.5 GHz. Simulations also verified that
the center elements active reflection coefficient (inside the 8 8 array) approaches
that of the infinite array performance at broadside. As a result, we conclude that the
prototype array is large enough to emulate the input impedance of an infinite array
0
Measured: 1 excited
Simulation: 1 excited
Infinite Simulation
5
Simulation: 64 excited
Active || (dB)
10
Excited 15
20
25
7 8 9 10 11 12 13 14
Frequency (GHz)
(a) (b)
Figure 4.4: Non-symmetric tightly coupled dipole array prototype (radome removed);
(a) fabricated 8 8 array, (b) center element reflection coefficient with single and
multiple elements excitations.
Fig. 4.5 shows the E- and H-plane scan element patterns, which are in excellent
agreement with simulation. The main beam 5 dB gain fluctuation is due to finite array
66
truncation and the resistive termination at the array surface. Specifically, the surface
mount 100 resistors are not matched loads to the antenna terminal impedance,
that the E-plane null at = 60 is due to the 12 finite ground plane used in mea-
Further efforts discovered the microstrip probe input was coupling directly to
the ring hybrid and contributed to the cross-polarized field component. The probe
location was then relocated to minimize probe-ring coupling as depicted in Fig. 4.7.
below co-polarized gain in the principal planes. The reduced cross-polarization unit
The boresight directivity and realized gain using the reduced cross-polarization
probe location is shown in Fig. 4.9(a). We observe that the realized gain approaches
the directivity from 8 - 12.5 GHz and cross polarization is < -20 dB, a 10 - 15 dB
improvement over the previous probe location. Furthermore, the realized gain is
within 0.3 dB of the maximum aperture directivity. With reduced probe coupling the
array maintains an active VSWR < 2 for scanning up to 70 in the E-plane and 60 for
H-plane as depicted in Fig. 4.9(b). These results are believed to be the best reported
in terms of array height and wide-angle scanning over a wide bandwidth (1.6:1 with
a VSWR < 2) fed with 50 unbalanced inputs. In contrast, other wideband arrays
can provide more bandwidth (3:1 and higher) but are thick and typically are limited
to 45 scanning [5963].
67
Freq=8 GHz Freq=8 GHz
5 5
0 0
5 5
15 15
20 20
Measured:CoPol Measured:CoPol
25 Measured:CrossPol 25 Measured:CrossPol
Simulated:CoPol Simulated:CoPol
Simulated:CrossPol Simulated:CrossPol
30 30
180 150 120 90 60 30 0 30 60 90 120 150 180 180 150 120 90 60 30 0 30 60 90 120 150 180
Theta (degrees) Theta (degrees)
(a) (b)
Freq=10 GHz Freq=10 GHz
5 5
0 0
5 5
Realized Gain (dBi)
15 15
20 20
Measured:CoPol Measured:CoPol
25 Measured:CrossPol 25 Measured:CrossPol
Simulated:CoPol Simulated:CoPol
Simulated:CrossPol Simulated:CrossPol
30 30
180 150 120 90 60 30 0 30 60 90 120 150 180 180 150 120 90 60 30 0 30 60 90 120 150 180
Theta (degrees) Theta (degrees)
(c) (d)
Freq=12 GHz Freq=12 GHz
5 5
0 0
5 5
Realized Gain (dBi)
10 10
15 15
20 20
Measured:CoPol Measured:CoPol
25 Measured:CrossPol 25 Measured:CrossPol
Simulated:CoPol Simulated:CoPol
Simulated:CrossPol Simulated:CrossPol
30 30
180 150 120 90 60 30 0 30 60 90 120 150 180 180 150 120 90 60 30 0 30 60 90 120 150 180
Theta (degrees) Theta (degrees)
(e) (f)
68
5
15
20
Measured:CoPol
25 Measured:CrossPol
Simulated:CoPol
Simulated:CrossPol
30
7 8 9 10 11 12 13 14
] Frequency (GHz)
Figure 4.6: Array (8x8) broadside gain vs. frequency when the center element is
excited and all others are terminated using 100 resistors; (a) E-plane, (b) H-plane.
(a) (b)
Figure 4.7: Electric field magnitude; (a) probe location with strong coupling and (b)
improved probe location with minimal coupling.
69
Figure 4.8: Non-symmetric TCDA unit cell geometry with WAIM superstrate, in-
tegrated microstrip balun and twin wire matching network interconnects, t1 = 1.75
mm, t2 = 0.75 mm, t3 = 1 mm, g = 7 mil, = 85 , a = 0.8128 mm, D = 1.4 mm,
w1 = 48 mil, w2 = 20 mil, w3 = 17 mil, w4 = 14 mil, g2 = 3mil, s = 1.7.
5 4
Boresight
0
3.5 E45
2 H45
5 4A/ E60
Realized Gain: CoPol 3 H60
Active VSWR
2.5
15
2
20
25 1.5
30 1
7 8 9 10 11 12 13 7 8 9 10 11 12 13
Frequency (GHz) Frequency (GHz)
(a) (b)
Figure 4.9: Performance of the array unit cell in Fig. 4.8; (a) broadside radiation, (b)
active VSWR over multiple E-plane and H-plane scan angles.
70
4.5 64 Element Array Demonstration
verification was developed using the reduced probe coupling feed from Fig. 4.8. The
ground plane size was reduced to 3.5" (the same size as the feed board) removing the
E-plane SEP null using the previous 12 ground plane setup (Fig. 4.5). In addition,
64 SMP (or GPO) connectors were used as the array interface as depicted in Fig. 4.10
compact range as depicted in Fig. 4.11. Fig. 4.12 displays the measured and simulated
realized gain vs. frequency for a single element (number 29) excited with all others
terminated using 50 SMP loads. The measured and simulated results are in good
agreement. Especially considering the finite array simulation size including multiple
The E- and H-plane SEP for element 29 at 10 GHz is shown in Fig. 4.13 and
most of the principal plane scanning range, a 10 dB improvement. Due to the relative
small size of the test array, edge effects dominate. Therefore, the SEP and active
impedance of each element varies considerably [64]. As such, the increased level of
while scanning.
To illustrate the scan element pattern variation from truncation, the measured
average SEP and standard deviation from each element is shown in Fig. 4.15. The
error bars indicate the amount of pattern variation across the aperture and would
71
Element 8 Element 64
z
y
x
Radome
0.5 Array PCB Element 1
Foam
Balun PCB
(a) (b)
(c) (d)
Figure 4.10: X-band 64 element linearly polarized array prototype; (a) with radome,
(b) radome removed, (c) aperture removed displaying balun and twin-wire intercon-
nects, (d) SMP input connects underneath ground plane.
72
y
0
Realized Gain (dBi)
5
Measured:CoPol
10 Measured:CrossPol
Simulated:CoPol
15 Simulated:CrossPol
20
25
30
7 8 9 10 11 12 13 14
Frequency (GHz)
Figure 4.12: Finite array broadside realized gain with element 29 excited and remain-
ing elements terminated in 50 loads.
73
Freq=10 GHz, EPlane
5
10 Measured: CoPol
Measured: CrossPol
Simulated: CoPol
15 Simulated: CrossPol
20
25
30
90 75 60 45 30 15 0 15 30 45 60 75 90
Theta (degrees)
Figure 4.13: E-plane scan element pattern at 10 GHz with element 29 excited and
remaining elements terminated in 50 loads.
0
Realized Gain (dBi)
10 Measured: CoPol
Measured: CrossPol
Simulated: CoPol
15 Simulated: CrossPol
20
25
30
90 75 60 45 30 15 0 15 30 45 60 75 90
Theta (degrees)
Figure 4.14: H-plane scan element pattern at 10 GHz with element 29 excited and
remaining elements terminated in 50 loads.
74
be zero if the array was infinite implying no truncation. As expected, the H-plane
from strong E-plane mutual coupling. This is demonstrated in the next section by
Measuring the scan impedance of a UWB phased array is a challenging and te-
matrix [S], over a large range of frequencies is required with accurate amplitude and
and above) where standard SMA connectors are too large to fit within the array lat-
tice. Therefore, non-SMA connectors, such as SMP or GPO are often used to excite
each antenna. As SMP connectors were used in the array prototype, an in-situ
calibration procedure was developed to accurately measure the mutual coupling be-
tween elements over a large frequency range without an SMP calibration kit. The
calibration plane is determined using a port extension and time gating procedure.
of 10 kHz and 3201 points was used. Fig. 4.16 shows the network analyzer SMA
cable with a SMP semi-rigid cable attached. Initially, calibration was performed at
plane (I) using traditional SMA mechanical calibration standards (open, short, load).
semi-rigid SMP cable to be attached. The SMP connector interface which connects
75
Freq=8 GHz, EPlane Freq=8 GHz, HPlane
5 5
0 0
10 10
15 15
20 20
25 25
30 30
90 75 60 45 30 15 0 15 30 45 60 75 90 90 75 60 45 30 15 0 15 30 45 60 75 90
Theta (degrees) Theta (degrees)
(a) (b)
Freq=10 GHz, EPlane Freq=10 GHz, HPlane
5 5
0 0
Realized Gain (dBi)
10 10
15 15
20 20
25 25
30 30
90 75 60 45 30 15 0 15 30 45 60 75 90 90 75 60 45 30 15 0 15 30 45 60 75 90
Theta (degrees) Theta (degrees)
(c) (d)
Freq=12.5 GHz, EPlane Freq=12.5 GHz, HPlane
5 5
0 0
Realized Gain (dBi)
5 5
10 10
15 15
20 20
25 25
30 30
90 75 60 45 30 15 0 15 30 45 60 75 90 90 75 60 45 30 15 0 15 30 45 60 75 90
Theta (degrees) Theta (degrees)
(e) (f)
and port extension technique was developed to compensate for the loss and electrical
delay in the semi-rigid cable as well as remove reflections from each connector.
III II I
Figure 4.16: SMA cable assembly with adapters and SMP cable. The original cali-
bration plane is denoted (I), where the desired calibration plane is depicted as III.
Fig. 4.17(a) displays the reflection coefficient of the connector assembly in Fig. 4.16
when the end of the SMP cable is shorted using copper tape. The associated time
domain response is shown in Fig. 4.17(b). It is important to note that the proposed
calibration process uses a short circuit at the end of the SMP cable reducing the
potential for spurious radiation. We note that the short circuit was implemented
with copper tape (instead of a SMP short connector) ensuring the correct phase
reference plane.
A 1.25 dB ripple is observed in Fig. 4.17(a). The ripple is due to multiple reflec-
tions seen at planes I, II and III. Each reflection is readily identified in Fig. 4.17(b).
Label A shows the reflections from the SMA bullet connector (plane I and II). Label
B is the desired short circuit reflection seen at the end of the SMP cable (plane III).
Multiple reflections between the SMP cable and SMA connectors are identified as
77
B
A C
D
E F
(c)
(c)
Figure 4.17: Measured reflection coefficient with the SMP cabled shorted; (a) fre-
quency domain, (b) time-domain, (c) time-gated time-domain.
78
shown in Fig. 4.17(c). At this point, the ripples from Fig. 4.17(a) are diminished.
However, the phase delay and insertion loss of the SMP cable and SMA connectors
have not been removed. This is remedied using the network analyzers auto port ex-
tension capability using the copper tape short. The VNA auto port extension yields
a low frequency (4.508 GHz) and high frequency (13.503 GHz) insertion loss of 237.32
mdB and 450.32 mdB, respectively. In addition, the delay through the cable and con-
nectors was determined to be 804.956 psec. The algorithm for auto port extension
by manually adjusting the phase delay to center the trace on the short section of
the Smith chart. An 806.5 psec delay was determined by compressing the impedance
trace as depicted in Fig. 4.18(a). The loss values are also manually fine tuned by
viewing the log-magnitude plot as shown in Fig. 4.18(b). The high and low band
insertion loss values are adjusted such that the short circuited reflection is centered
around the 0 dB line. The final insertion loss values was found to be 260 mdB and
After port extension, the measurement plane has been successfully moved to the
desired SMP interface (plane III). For comparison, the original raw and calibrated
copper tape short circuited |S22 | responses are compared in Fig. 4.19. As shown,
there is a considerable difference between the two sets of data. Using time-gating and
port extension, more accurate measurements can be made at the correct reference
plane. Fig. 4.19(c) shows the application of the calibration procedure to measure the
prototype array mutual coupling. First, a full 2 port SMA calibration was performed.
Then, each port was further calibrated using the procedure outlined above. Finally,
a new time-gate is used to measure the full mutual coupling matrix of the 64 element
79
(a) (a)
(b) (b)
Figure 4.18: Measured reflection coefficient with the SMP cabled shorted; (a) Smith
chart format to manually determine port extension delay, (b) copper tape short cir-
cuited manual amplitude port extension.
80
array when element 29 is excited. The proposed calibration procedure ultimately leads
(c)
(c)
Figure 4.19: Measured reflection coefficient with the SMP cabled shorted; (a) SMA
calibration, (b) proposed calibration procedure using time-gating and port extension,
(c) 64 element phased array mutual coupling measurement setup.
81
Fig. 4.20 shows the simulated and measured mutual coupling across the aperture
with element 29 excited (|Sn,29 |, where n= 1:64) at 10 GHz. The E-plane mutual cou-
The simulated and measured mutual coupling vs. frequency for each element is
shown in Figs. 4.21-4.23. The agreement at 10 GHz is very good but diverges near
the operational band edges. This is explained by examining the driven elements
below simulation at 10 GHz and is larger than predicted over most of the frequency
range. Since the input reflection is larger, less energy is delivered to the antenna
and subsequently the measured mutual coupling is less than simulation. Further
investigations found that excess solder from the manufacturing process coated the
copper twin-wire transmission line near the feed board interface. As a result, a
large capacitance is formed by the enlarged twin-wire diameter which reduces the
characteristic impedance and de-tunes the antenna. We remark that if less solder
and uniform twin-wire separation gap was maintained, the measured impedances
would agree better with simulation. After the full S parameter matrix is known, the
N
X
ii (o , o ) = Sij aj (4.1)
j=1
82
kx = ko sin(o ) cos(o )
ky = ko sin(o ) sin(o ).
As expected, the measured active reflection does not agree with simulation, a direct
over the desired frequency range, the realized gain SEP measurements presented in
the previous section and fully excited beam steering performance in the next section
is minimally affected.
Of particular interest is the fully excited array gain and polarization level while
TCDA prototype, the radiation pattern from each element was combined with uniform
weighting using MATLAB. We note that the simulated realized gain incorporates the
active (or scan) reflection coefficient mismatch for each element where the measured
patterns (and subsequently post-processed combined pattern) uses each elements self
The measured principal plane beam scanning performance at low (8 GHz), middle
(10 GHz) and high (12.5 GHz) frequencies is displayed in Fig. 4.25. The aforemen-
tioned E-plane truncation is evident in Fig. 4.25(a) where the beam splits scanning
the co-polarized component except at 8 GHz in the H-plane, again a result from
truncation. At 12.5 GHz (where the array is electrically larger) both planes show a
83
(a) (b)
(c) (d)
(e) (f)
Figure 4.20: Mutual coupling across aperture with element 29 excited; (a) simulated 8
GHz, (b) measured 8 GHz, (c) simulated 10 GHz, (d) measured 10 GHz, (e) simulated
12.5 GHz, (f) measured at 12.5 GHz.
84
0 0
5 5
Measured S Measured S
10 1,29 10 5,29
Measured S2,29 Measured S6,29
|S| (dB) 15 Measured S3,29 15 Measured S7,29
|S| (dB)
Measured S4,29 Measured S8,29
20 20
Simulated S1,29 Simulated S5,29
25 Simulated S 25 Simulated S
2,29 6,29
Simulated S Simulated S
3,29 7,29
30 Simulated S 30 Simulated S
4,29 8,29
35 35
40 40
8 8.5 9 9.5 10 10.5 11 11.5 12 12.5 8 8.5 9 9.5 10 10.5 11 11.5 12 12.5
Frequency (GHz) Frequency (GHz)
(a) (b)
0 0
5 5
Measured S Measured S
10 9,29 10 13,29
Measured S10,29 Measured S14,29
15 Measured S11,29 15 Measured S15,29
|S| (dB)
|S| (dB)
Measured S Measured S
12,29 16,29
20 20
Simulated S9,29 Simulated S13,29
25 Simulated S 25 Simulated S
10,29 14,29
Simulated S Simulated S
11,29 15,29
30 Simulated S 30 Simulated S
12,29 16,29
35 35
40 40
8 8.5 9 9.5 10 10.5 11 11.5 12 12.5 8 8.5 9 9.5 10 10.5 11 11.5 12 12.5
Frequency (GHz) Frequency (GHz)
(c) (d)
0 0
5 5
Measured S Measured S
10 17,29 10 21,29
Measured S18,29 Measured S22,29
15 Measured S19,29 15 Measured S23,29
|S| (dB)
|S| (dB)
Measured S Measured S
20,29 24,29
20 20
Simulated S17,29 Simulated S21,29
25 Simulated S 25 Simulated S
18,29 22,29
Simulated S Simulated S
19,29 23,29
30 Simulated S 30 Simulated S
20,29 24,29
35 35
40 40
8 8.5 9 9.5 10 10.5 11 11.5 12 12.5 8 8.5 9 9.5 10 10.5 11 11.5 12 12.5
Frequency (GHz) Frequency (GHz)
(e) (f)
Figure 4.21: Measured and simulated mutual coupling vs. frequency with element 29
excited; (a) element 1 - 4, (b) element 5 - 8, (c) element 9 - 12, (d) element 13 - 16,
(e) element 17 - 20, (f) element 21 - 24.
85
0 0
5 5
Measured S Measured S
10 25,29 10 29,29
Measured S26,29 Measured S30,29
|S| (dB) 15 Measured S27,29 15 Measured S31,29
|S| (dB)
Measured S28,29 Measured S32,29
20 20
Simulated S25,29 Simulated S29,29
25 Simulated S 25 Simulated S
26,29 30,29
Simulated S Simulated S
27,29 31,29
30 Simulated S 30 Simulated S
28,29 32,29
35 35
40 40
8 8.5 9 9.5 10 10.5 11 11.5 12 12.5 8 8.5 9 9.5 10 10.5 11 11.5 12 12.5
Frequency (GHz) Frequency (GHz)
(a) (b)
0 0
5 5
Measured S Measured S
10 33,29 10 37,29
Measured S34,29 Measured S38,29
15 Measured S35,29 15 Measured S39,29
|S| (dB)
|S| (dB)
Measured S Measured S
36,29 40,29
20 20
Simulated S33,29 Simulated S37,29
25 Simulated S 25 Simulated S
34,29 38,29
Simulated S Simulated S
35,29 39,29
30 Simulated S 30 Simulated S
36,29 40,29
35 35
40 40
8 8.5 9 9.5 10 10.5 11 11.5 12 12.5 8 8.5 9 9.5 10 10.5 11 11.5 12 12.5
Frequency (GHz) Frequency (GHz)
(c) (d)
0 0
5 5
Measured S Measured S
10 41,29 10 45,29
Measured S42,29 Measured S46,29
15 Measured S43,29 15 Measured S47,29
|S| (dB)
|S| (dB)
Measured S Measured S
44,29 48,29
20 20
Simulated S41,29 Simulated S45,29
25 Simulated S 25 Simulated S
42,29 46,29
Simulated S Simulated S
43,29 47,29
30 Simulated S 30 Simulated S
44,29 48,29
35 35
40 40
8 8.5 9 9.5 10 10.5 11 11.5 12 12.5 8 8.5 9 9.5 10 10.5 11 11.5 12 12.5
Frequency (GHz) Frequency (GHz)
(e) (f)
Figure 4.22: Measured and simulated mutual coupling vs. frequency with element 29
excited; (a) element 25 - 28, (b) element 29 - 32, (c) element 33 - 36, (d) element 37
- 40, (e) element 41 - 44, (f) element 45 - 48.
86
0 0
5 5
Measured S Measured S
10 49,29 10 53,29
Measured S50,29 Measured S54,29
15 Measured S51,29 15 Measured S55,29
|S| (dB)
|S| (dB)
Measured S52,29 Measured S56,29
20 20
Simulated S49,29 Simulated S53,29
25 Simulated S 25 Simulated S
50,29 54,29
Simulated S Simulated S
51,29 55,29
30 Simulated S 30 Simulated S
52,29 56,29
35 35
40 40
8 8.5 9 9.5 10 10.5 11 11.5 12 12.5 8 8.5 9 9.5 10 10.5 11 11.5 12 12.5
Frequency (GHz) Frequency (GHz)
(a) (b)
0 0
5 5
Measured S Measured S
10 57,29 10 61,29
Measured S58,29 Measured S62,29
15 Measured S59,29 15 Measured S63,29
|S| (dB)
|S| (dB)
Measured S Measured S
60,29 64,29
20 20
Simulated S57,29 Simulated S61,29
25 Simulated S 25 Simulated S
58,29 62,29
Simulated S Simulated S
59,29 63,29
30 Simulated S 30 Simulated S
60,29 64,29
35 35
40 40
8 8.5 9 9.5 10 10.5 11 11.5 12 12.5 8 8.5 9 9.5 10 10.5 11 11.5 12 12.5
Frequency (GHz) Frequency (GHz)
(c) (d)
Figure 4.23: Measured and simulated mutual coupling vs. frequency with element 29
excited; (a) element 49 - 52, (b) element 53 - 56, (c) element 57 - 60, (d) element 61
- 64.
87
Element 29, Scanned to = 0, = 0
0
Measured
Simulated
5
Active || (dB)
10
15
20
25
8 8.5 9 9.5 10 10.5 11 11.5 12 12.5
Frequency (GHz)
Figure 4.24: Measured and simulated finite array element 29 active reflection coeffi-
cient scanned to o = 0 , o = 0 .
up to 60 .
The E-plane measured and simulated radiation pattern while scanning to broad-
side, 30 and 60 at 10 GHz is shown in Fig. 4.26. Similarly, the H-plane beam steering
performance is displayed in Fig. 4.27. Good agreement between simulated and mea-
sured scanning patterns in the principal planes and co-polarized and cross-polarized
a result of the fiberglass support which mounts to the H-plane sides (y-axis) of the
88
Freq=8 GHz, EPlane Freq=8 GHz, HPlane
25 25
20 20
15 15
5 5
0 0
5 5
10 10
15 15
20 20
90 75 60 45 30 15 0 15 30 45 60 75 90 90 75 60 45 30 15 0 15 30 45 60 75 90
Theta (degrees) Theta (degrees)
(a) (b)
Freq=10 GHz, EPlane Freq=10 GHz, HPlane
25 25
20 20
15 15
Realized Gain (dBi)
5 5
0 0
5 5
10 10
15 15
20 20
90 75 60 45 30 15 0 15 30 45 60 75 90 90 75 60 45 30 15 0 15 30 45 60 75 90
Theta (degrees) Theta (degrees)
(c) (d)
Freq=12.5 GHz, EPlane Freq=12.5 GHz, HPlane
25 25
20 20
15 15
Realized Gain (dBi)
10 10
5 5
0 0
5 5
10 10
15 15
20 20
90 75 60 45 30 15 0 15 30 45 60 75 90 90 75 60 45 30 15 0 15 30 45 60 75 90
Theta (degrees) Theta (degrees)
(e) (f)
10
10
15
20
90 75 60 45 30 15 0 15 30 45 60 75 90
Theta (degrees)
15
10
10
15
20
90 75 60 45 30 15 0 15 30 45 60 75 90
Theta (degrees)
90
The measured and simulated broadside array gain is compared to the maximum
theoretical directivity in Fig. 4.28. The simulated realized gain is higher than the
theoretical limit above 11 GHz due to the finite ground plane diffraction adding in
phase. Similarly, below 11 GHz the gain is slightly lower than the limit because the
was determined using the TCDA elements physical aperture area and not the PCB
20
15 2
4A/
Realized Gain (dBi)
10 Measured: CoPol
Measured: CrossPol
5 Simulated: CoPol
0 Simulated: CrossPol
10
15
20
7 8 9 10 11 12 13 14
Frequency (GHz)
Figure 4.28: Finite array broadside realized gain as a function of frequency with all
elements excited.
4.6 Summary
A novel non-symmetric tightly coupled dipole array with integrated balun and
matching network was presented. The conformal array is placed /7 over a ground
plane at the lowest frequency of operation (8 GHz). The array relied on a new non-
91
the inductance caused by the ground plane. A wideband ring hybrid was proposed
for unbalanced to balanced conversion and is printed directly on the ground plane,
maintaining the arrays low-profile height and simple layered planar PCB construc-
tion. A impedance matching 136 twin wire transmission line connects the feed and
aperture. We remark that the actual array bandwidth is much larger, and at this time
is limited by the feed design. The developed conformal array is capable of scanning
GHz (1.6:1). A small finite 8 8 array was fabricated and verified experimentally.
Good agreement between simulation and measurement was confirmed over multiple
scan angles.
92
CHAPTER 5
Wideband, low-profile and planar phased arrays have recently been the subject
and demonstrated that TCDAs become increasingly wideband when placed above a
TCDA balun feed arrangements were presented and important design considerations
were discussed such as size restriction, impedance matching, and common mode sup-
pression.
Multiple methods for increasing series inductance and shunt capacitance using
loading was examined using volumetric meandering. Such meandering can be im-
plemented using plated vias and traditional PCB manufacturing, thus maintaining
the arrays low-cost and planar assembly. For additional inductive loading, ferrite
substrates (between the array and ground plane) were examined to improve TCDA
bandwidth (up to 7:1). Concurrently, ferrites reduce array thickness to L /30 with
93
r = 3. However, aggressive miniaturization (r > 3) excites an undesired ferrite
resonant mode. As such, rectangular resonant cavity analysis was used to model and
predict the TM210 ferrite mode frequency. If the mode is suppressed, TCDAs become
extremely wideband (8.2:1) and very low-profile (L /56) using a ferrite substrate with
ment. The additional degrees of freedom provided by the non-symmetric element were
presented to control input impedance and miniaturize the element. For practicality,
we next considered dielectric superstrates for array protection. In doing so, a design
guideline for determining single and dual layer dielectric substrates was developed to
increase low frequency resistance and reduce impedance variation over a broad range
of frequencies.
balun and matching network was presented and verified experimentally. The array is
component over most of the scanning range is also maintained. The conformal array
is placed /7 over a ground plane at the lowest frequency of operation (8 GHz). The
array relied on a new non-symmetric dipole element fed using a modified wideband
ring hybrid. The ring hybrid uses microstrip coupled lines to improve bandwidth and
is printed directly on the ground plane, maintaining the arrays low-profile height and
simple layered planar PCB construction. A small finite 8 8 array was fabricated
94
This dissertation presented conceptually new broadband inductive and capacitive
polarized TCDAs. Further, practical balanced feed approaches were investigated and
a small 64 element X-band array with wide-angle scanning and low cross-polarization
was designed and experimentally demonstrated to verify the presented concepts. The
Demonstrated using equivalent circuits and full wave simulations that tightly
coupled dipole arrays exhibit capacitive mutual coupling that cancels the in-
tion, magnetic and dielectric materials were shown to improve bandwidth and
low-profile.
60 in H-plane with an active VSWR < 2 from 8 - 12.5 GHz (1.6:1 or 44%).
These results are believed to be the best reported in terms of array height and
95
This is a significant achievement compared to other arrays which typically scan
up 45 . The extreme low-profile nature of the proposed array and layered PCB
Continued efforts are necessary for improved performance and functionality. First,
the hybrid ring currently limits the arrays bandwidth and is suitable only for linear
especially if one does not want to increase the array height or limit power handling
PCB fabrication is important to suppress or shift the common mode above the arrays
operating frequency range and maintain low-cost. The array presented in Chapter 4
avoided common modes by reducing the unit cell size to 8 mm or .33H . Therefore,
is increased and subsequently the cost. This is a serious limitation of the current
design and further work is needed to remove common modes while maintaining a
H /2 unit cell size, provide dual linear polarization and retain wide-angle scanning
In this dissertation, the ferrite loading study was not comprehensive in scope or
practicality. Only ideal lossless ferrite material with constant permeability versus
undesired TM210 ferrite resonant cavity mode was not performed. Therefore, a more
rigorous analysis using realistic frequency varying ferrite properties over multiple scan
96
BIBLIOGRAPHY
[2] B. A. Munk, Finite Antenna Arrays and FSS. New York: John Wiley, 2003.
[4] B. A. Munk, Frequency Selective Surfaces: Theory and Design. New York: John
Wiley, 2000.
[5] E. L. Holzman, A wide band tem horn array radiator with a novel microstrip
feed, in Proc. IEEE International Conference on Phased Array Systems and
Technology, 2125 May 2000, pp. 441444.
[9] J. Kasemodel, C.-C. Chen, and J. Volakis, Low-cost, planar and wideband
phased array with integrated balun and matching network for wide-angle scan-
ning, in Antennas and Propagation Society International Symposium, APSURSI
10. IEEE, July 2010, pp. 1 4.
97
[10] R. C. Hansen, Dipole array scan performance over a wide-band, vol. 47, no. 5,
pp. 956957, 1999.
[11] , Dipole arrays with non-foster circuits, in Proc. IEEE Int Phased Array
Systems and Technology Symp, 2003, pp. 4044.
[12] D. Cavallo, A. Neto, and G. Gerini, Connected phased array antennas for ultra-
wide band radar applications, in Proc. IEEE Int. Conf. Microwaves, Commu-
nications, Antennas and Electronic Systems COMCAS 2008, 2008, pp. 110.
[14] Y. Mushiake, Self-complementary antennas, vol. 34, no. 6, pp. 2329, 1992.
[16] X. Dardenne and C. Craeye, Simulation of the effects of a ground plane on the
radiation characteristics of self-complementary arrays, in Proc. IEEE Antennas
and Propagation Society Int. Symp, vol. 1, 2003, pp. 383386.
[18] M. Jones and J. Rawnick, A new approach to broadband array design using
tightly coupled elements, in Proc. IEEE Military Communications Conference
MILCOM 2007, 2931 Oct. 2007, pp. 17.
[19] J. J. Lee, S. Livingston, and R. Koenig, Wide band long slot array antennas,
in Proc. IEEE Antennas and Propagation Society Int. Symp, vol. 2, 2003, pp.
452455.
[20] J. J. Lee, S. Livingston, R. Koenig, D. Nagata, and L. Lai, Long slot arrays -
part 2: ultra wideband test results, in Proc. IEEE Antennas and Propagation
Society Int. Symp, vol. 1, 2005, pp. 586589.
[21] A. Neto and J. J. Lee, Long slot arrays - part 1: theoretical formulation,
in Proc. IEEE Antennas and Propagation Society Int. Symp, vol. 1, 2005, pp.
582585.
[22] , infinite bandwidth long slot array antenna, vol. 4, pp. 7578, 2005.
98
[23] J. J. Lee, S. Livingston, R. Koenig, D. Nagata, and L. L. Lai, Compact light
weight uhf arrays using long slot apertures, vol. 54, no. 7, pp. 20092015, 2006.
[24] A. Neto and J. Lee, Ultrawide-band properties of long slot arrays, Antennas
and Propagation, IEEE Transactions on, vol. 54, no. 2, pp. 534 543, feb. 2006.
[25] J. J. Lee, S. Livingston, and D. Nagata, A low profile 10:1 (2002000 mhz)
wide band long slot array, in Proc. IEEE Antennas and Propagation Society
Int. Symp. AP-S 2008, 2008, pp. 14.
[29] H. Steyskal and D. Hanna, Design aspects of fragmented patch elements for
phased arrays, in Proc. IEEE Antennas and Propagation Society Int. Symp,
2007, pp. 141144.
[32] J. C. West and H. Steyskal, Analysis and feeding of a spiral element used in a
planar array, vol. 57, no. 7, pp. 19311935, 2009.
[34] T. F. Eibert and J. L. Volakis, Fast spectral domain algorithm for hybrid finite
element/boundary integral modelling of doubly periodic structures, IEE Pro-
ceedings -Microwaves, Antennas and Propagation, vol. 147, no. 5, pp. 329334,
2000.
99
[35] S. N. Makarov and A. Puzella, Scan impedance for an infinite dipole array:
Hansens formulas compared with ansoft hfss simulations [em programmers note-
book], vol. 49, no. 4, pp. 143156, 2007.
[36] R. C. Hansen, Phased Array Antennas. New York: John Wiley, 1988.
[37] D. Pozar, The active element pattern, Antennas and Propagation, IEEE Trans-
actions on, vol. 42, no. 8, pp. 1176 1178, aug 1994.
[42] B. A. Kramer, M. Lee, C.-C. Chen, and J. L. Volakis, Design and performance
of an ultrawide-band ceramic-loaded slot spiral, vol. 53, no. 7, pp. 21932199,
2005.
[43] D. Cavallo, A. Neto, and G. Gerini, Pcb slot based transformers to avoid
common-mode resonances in connected arrays of dipoles, Antennas and Prop-
agation, IEEE Transactions on, vol. PP, no. 99, pp. 1 1, 2010.
100
[48] S. R. Best, On the resonant properties of the koch fractal and other wire
monopole antennas, vol. 1, pp. 7476, 2002.
[50] B. A. Kramer, M. Lee, C.-C. Chen, and J. L. Volakis, Miniature uwb confor-
mal aperture with volumetric inductive loading, in Proc. IEEE Antennas and
Propagation Society Int. Symp. 2006, 2006, pp. 36933696.
[52] R. Elliott, On the theory of corrugated plane surfaces, Transactions of the IRE
Professional Group on Antennas and Propagation, vol. 2, no. 2, pp. 7181, 1954.
[55] D. M. Pozar, Microwave Engineering, 3rd ed. John Wiley & Sons Inc., 2005.
[56] J. Kasemodel, C.-C. Chen, and J. Volakis, A novel non-symmetric tightly cou-
pled element for wideband phased array apertures, in Proc. Antennas Applica-
tions Symposium, Sept. 2009, pp. 117129.
[60] T.-H. Chio and D. H. Schaubert, Large wideband dual-polarized array of vivaldi
antennas with radome, in Proc. Asia Pacific Microwave Conf, vol. 1, 1999, pp.
9295.
101
[62] M. W. Elsallal and D. H. Schaubert, Electronically scanned arrays of dual-
polarized, doubly-mirrored balanced antipodal vivaldi antennas (dmbava) based
on modular elements, in Proc. IEEE Antennas and Propagation Society Int.
Symp. 2006, 2006, pp. 887890.
[64] H. Holter and H. Steyskal, On the size requirement for finite phased-array mod-
els, Antennas and Propagation, IEEE Transactions on, vol. 50, no. 6, pp. 836
840, Jun 2002.
102