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Question 1
T / F Eliminating the lead and decontamination steps are viable approaches for commercial chips to
battle alpha-particle-induced problems.
Question 2
T / F In newer technologies, there are fewer logic gates in between storage elements as a result logical
masking effects are less.
Question 3
Question 4
T / F If we switch to SOI Technology from Bulk CMOS, the collection volume of MOS transistor reduces.
As a result, we obtain less sensitivity to radiation.
Question 5
The ability of a given test pattern to detect a given fault on the device under test (DUT) is
called_______________
Question 6
In the circuit below, radiation hit occurs at the output of 2nd inverter. Although the input to the very first
inverter is at ground (Vss), due to particle strike a pulse is generated at the output of 2nd inverter and
propagates two more inverters. In the figure, all the transient magnitudes and signals are shown along
with the clock edge being present. When we observe the output of the edge triggered D-type flip flop, we
still observe no change in the logic. What masking effect might be present in this circuit?
Question 7
In the circuit below, radiation hit occurs at the output of 2nd inverter. Although the input to the very first
inverter is at ground (Vss), due to particle strike a pulse is generated at the output of 2nd inverter and
propagates until it arrives at the D-type flip flop input ( Only waveforms after the OR gate are shown with
its magnitudes shown ).
When we observe the output of the edge triggered D-type flip flop, we still observe no change in the
logic. What masking effect(s) might be present in this circuit?
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10/10/2017 Review Test Submission: ACK5 2016 Fall - ELEN 5324_48F...
OK
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