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MINI-Compact System
Model Name : MX-C630D
Model Code : MX-C630D/XER
SERVICE Manual
1. Precaution
2. Product Specification
4. Troubleshooting
6. PCB Diagram
7. Schematic Diagram
MX-C630D
Refer to the service manual in the GSPN (see the rear cover) for the more information.
GSPN (Global Service Partner Network)
Area Web Site
North America service.samsungportal.com
Latin America latin.samsungportal.com
CIS cis.samsungportal.com
Europe europe.samsungportal.com
China china.samsungportal.com
Asia asia.samsungportal.com
Mideast & Africa mea.samsungportal.com
1. Precaution
1-1 Safety Precautions ........................................................................................... 1-1
1-2 Servicing Precautions ......................................................................................1-3
1-3 Precautions for Electrostatically Sensitive Devices (ESDs) .............................1-4
2. Product Specification
2-1 Product Feature ............................................................................................... 2-1
2-2 Specifications ...................................................................................................2-2
2-3 Specifications Analysis .....................................................................................2-3
2-4 Accessories ......................................................................................................2-4
4. Troubleshooting
4-1 Checkpoints by Error Mode..............................................................................4-1
4-2 Measures to be taken when the Protection Circuit operates ...........................4-5
4-3 MICOM, MPEG Initialization & Update ............................................................4-7
4-4 Buyer-Region Code Setting Method ................................................................4-8
6. PCB Diagram
6-1 Wiring Diagram ................................................................................................ 6-1
6-2 FRONT PCB Top ..............................................................................................6-2
6-3 FRONT PCB Bottom ........................................................................................6-4
6-4 MAIN PCB Top .................................................................................................6-5
6-5 MAIN PCB Bottom ........................................................................................... 6-8
6-6 SMPS PCB Top ................................................................................................ 6-9
6-7 SMPS PCB Bottom ..........................................................................................6-10
Contents
7. Schematic Diagram
7-1 Overall Block Diagram .....................................................................................7-1
7-2 FRONT .............................................................................................................7-2
7-3 MAIN_MICOM ..................................................................................................7-3
7-4 MAIN_MPEG....................................................................................................7-4
7-5 MAIN_PWM .....................................................................................................7-5
7-6 MAIN_AMP ......................................................................................................7-6
7-7 SMPS ...............................................................................................................7-7
Precaution
1. Precaution
Follow these safety, servicing and ESD precautions to prevent damage and protect against potential hazards such
as electrical shock and X-rays.
2. When reinstalling the chassis and its assemblies, be sure to restore all protective devices, including control
knobs and compartment covers.
3. Make sure that there are no cabinet openings through which people--particularly children--might insert fingers
and contact dangerous voltages. Such openings include the spacing between the picture tube and the cabinet
mask, excessively wide cabinet ventilation slots, and improperly fitted back covers.
7. Components, parts and wiring that appear to have overheated or that are otherwise damaged should be
replaced with parts that meet the original specifications. Always determine the cause of damage or overheating,
and correct any potential hazards.
8. Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and
especially the AC and high voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring.
Do not change the spacing between components and the printed circuit board. Check the AC power cord for
damage. Make sure that no wires or components touch thermally hot parts.
10. Components that are critical for safety are indicated in the circuit diagram by shading, or . Use
replacement components that have the same ratings, especially for flame resistance and dielectric strength
specifications. A replacement part that does not have the same safety characteristics as the original might
create shock, fire or other hazards.
2. Always unplug the units AC power cord from the AC power source before attempting to: (a) Remove or reinstall
any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a test component in
parallel with an electrolytic capacitor.
3. Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes
used. The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such
elements to their original position.
4. After servicing, always check that the screws, components and wiring have been correctly reinstalled.
Make sure that the portion around the serviced part has not been damaged.
5. Check the insulation between the blades of the AC plug and accessible conductive parts (examples: metal
panels, input terminals and earphone jacks).
6. Insulation Checking Procedure: Disconnect the power cord from the AC source and turn the power switch ON.
Connect an insulation resistance meter (500V) to the blades of the AC plug.
The insulation resistance between each blade of the AC plug and accessible conductive parts (see above)
should be greater than 1 megohm.
7. Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies)
unless all solid-state heat sinks are correctly installed.
8. Always connect a test instruments ground lead to the instrument chassis ground before connecting the positive
lead; always remove the instruments ground lead last.
First read the Safety Precautions section of this manual. If some unforeseen circumstance
creates a conflict between the servicing and safety precautions, always follow the safety
precautions.
1. Some semiconductor (solid state) devices are easily damaged by static electricity.
Such components are called Electrostatically Sensitive Devices (ESDs). Examples include integrated circuits
and some field-effect transistors. The following techniques will reduce the occurrence of component damage
caused by static electricity.
2. Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from
your body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to
remove it prior to applying power--this is an electric shock precaution.)
3. After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent
accumulation of electrostatic charge.
4. Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.
6. Use only an anti-static solder removal device. Many solder removal devices are not rated as anti-static (these
can accumulate sufficient electrical charge to damage ESDs).
7. Do not remove a replacement ESD from its protective package until you are ready to install it.
Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam,
aluminum foil or other conductive materials.
8. Immediately before removing the protective material from the leads of a replacement ESD, touch the protective
material to the chassis or circuit assembly into which the device will be installed.
9. Minimize body motions when handing unpackaged replacement ESDs. Motions such as brushing clothes
together, or lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.
2. Product Specification
2-1 Product Feature
Power
- 2.0 ch: 200W Total RMS / 2200W PMPO
- IR Amp
Connectivity
- USB: To Enlarge the music ripping range
- Portable Audio In (3.5 phi Stereo Jack)
- Compatible: DVD, Divx, MP3, CD / CD-R, RW, WMA, VCD (Regional Option)
Power
- 2.0 ch: 360W Total RMS / 4000W PMPO
- IR Amp
Connectivity
- USB: To Enlarge the music ripping range
- Portable Audio In (3.5 phi Stereo Jack)
- Compatible: DVD, Divx, MP3, CD / CD-R, RW, WMA, VCD (Regional Option)
2-2 Specifications
Basic Specification
Signal/noise ratio 55 dB
RADIO FM Usable sensitivity 12 dB
Total harmonic distortion 0.6 %
Signal/noise ratio 25 dB
RADIO AM Usable sensitivity 70 dB
Total harmonic distortion 2%
Capacity 5 disc
Frequency range 20 Hz - 20 KHz ( 1 dB)
COMPACT
Signal/noise ratio 60 dB (at 1 KHz) with filter
DISC
Distortion 0.3 % (at 1 KHz)
PLAYER
Channel separation 50 dB
Disc sizes Diameter: 120 or 80 mm. Thickness: 1.2 mm
Output power
Front Speaker (4)(MX-C630) 100Watts/CH RMS, IEC (total harmonic distortion: 10 %)
AMPLIFIER Front Speaker (4)(MX-C730) 180Watts/CH RMS, IEC (total harmonic distortion: 10 %)
Channel separation 60 dB
Signal/noise ratio 70 dB
Power Consumption (MX-C630) 60 W
Power Consumption (MX-C730) 70 W
GENERAL
Dimensions 270 (W) x 227 (H) x 230 (D) mm
Weight 3.8 Kg
Photo
OUTPUT
2.0ch 200W 2.0ch 200W 2.0ch 360W 2.0ch 360W 2.0ch 180W
POWER
FRONT DISPLAY VFD VFD VFD VFD VFD
SLEEP
DIMMER
CD/DVD CD DVD CD DVD CD
MP3
USB HOST
CD RIPPING
TAPE X X
(Only KOR)
AUDIO IN
HEADPHONE
FM / RDS FM / AM FM FM / AM FM FM
REMOTE KEY 32 KEY 38 KEY 32 KEY 38 KEY 38 KEY
DUAL VOLTAGE
SPK
4 Ohm 4 Ohm 4 Ohm 4 Ohm 4 Ohm
IMPENDANCE
: application, X: non-application
2-4 Accessories
Samsung Service
Center
FM Antenna AH42-00021A
AH68-02252P
User's Manual
AH68-02252V
- Be careful to follow the disassembly sequence described in the manual. Otherwise, the product
may be damaged.
- Be sure to carefully read and understand the safety instructions before performing any work as
the IC chips on the PCB are vulnerable to static electricity.
- Assemble in the reverse order of disassembly.
2) Unfasten 8 screws.
4 1) Unfasten 9 screws.
5 DECK Reassembly
1) Pay attention to the hook and the rubbers direction.
4. Troubleshooting
4-1 Checkpoints by Error Mode
4-1-1 No Power
No Power
Yes Yes
1
No Check MAIN PCB No
Check MAIN PCB UIC1 Check or replace SMPS.
Pin 14, 40, 55, 89: 5V? CON3 Pin 1: 5.6V?
Yes
Yes
1
1
1
1
UIC1 1
<Fig. 4-1>
4-1-2 No Output
No Output
Yes No
Yes
1
Check MAIN PCB No Check WIC1(9830) signal
WIC1 (9830) and input and input and signal pattern.
output signal?
Yes
WIC1
<Fig. 4-2>
Protection
Location Pin No. Remark
Open Short
+12V (6, 9#) X X
CON3
D5.6V (1~4#) X X
+PVDD (about +38V) C630 about
SMPS PCB X
(1~4#) +27.5V
-PVDD (about -38V) C630 about
CON2 X
(11~14#) -27.5V
+5V (7#) X X
-5V (8#) X X
<Table 4-1>
F/R CH 2k
SUBWOOFER 2k
<Table 4-2>
If Measured Resistance is very different from above numbers. There is a Problem. AMP PART Problem
RIGHT
GND
LEFT
Micom Reset
During STANDBY mode, push the STOP button 5 Second. If VFD blinking, reset is finished.
3. Push the number NEXT for 5 seconds, check the Micom version.
4. Push the number PREVIOUS for 5 seconds, check the MPEG version.
2. Insert USB Memory, and play. Update will be displayed and glisten. Set will be power off on.
3. The disc is automatically ejected. (If you use USB memory, detach USB memory.)
MPEG Reset
1. During No Disc displayed, push the stop button 5 seconds. After displayed INITIALIZE set will power off
automatically.
4-4-1 The inserting method of Region Code after replacing the Main PBA
[Reference]
- When replacing the Main PBA and System Micom should be inserted the region code.
- The set is not working properly if you don't insert the region code.
- The region code is inserted by the remote control.
Option Table
<Table 4-3>
T001 W390
T0268
P003
M0014
W391
W390
W390
D001A
W391
AC060 W391
MF01
C0104
AC070
FK08
AK400
F001A
W391
W390
MF02
AK111
FK01 ES04
AC274
FD17
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Exploded View & Part List
Part List
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FM ANT
SPEAKERS
75
OUT(4)
AM
R
Front Front
Speaker (L) Speaker (R)
Part List
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Exploded View & Part List
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Exploded View & Part List
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Exploded View & Part List
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6. PCB Diagram
6-1 Wiring Diagram
TAPE ASS'Y
Tape signal
17P (Ctrl+Signal)
UIC2
UCW1 1
USJ1
UCW2
1 UCW1
To FRONT PCB
UIC2
FIC1
UCW1
USJ1
UCW2
1 PCN3 PCN1 8
IC13
AIC1
TP2
2 TACN1
WIC1
3 MCN2
UCN2
PIC3
UIC1 MIC4
MIC5
MIC3
MIC1 TP1
MIC2
RFIC1
USBW1
RFIC3
24 MIC-SEN 15 CM+(UP)
25 VOL_LED1
26 VOL_LED2
27 VOL_LED3
28 VOL_LED4
29 VOL_LED5
30 VOL_LED6
8 PCN1
TP1
AMP Power
PCN3 PCN1
APIC1
IC7
PIC4
TACN1
AIC3
WIC2
MCN2
UCN2
PIC3
FFON1
UIC2
MCN1
USBW1
RFCN3
OPEN1 UTCN1 RFCN1
CON2 CON3
UM1
UB1
CN1
CON2 CON3
UM1
UB1
CN1
7. Schematic Diagram
7-1 Overall Block Diagram
The Main Micom IC is LC87F5NC8A. Its same as last year. MPEG chip is ES8391SCD. Its upgrade version of
ES8390SCD.
REC SIGNAL
12V (MOTOR)
5.6V(p_sense)
5. 6V(MICOM)
12V (TAPE)
P ON(5V)
VFD VP
+PVDD
+5V
Video signal is come from DVD mecha and go to the MPEG IC. Then MPEG IC decode this signal to real video signal.
PVDD
+VFD
5V
SIGNAL
VFD
Ctrl
PWM_DATA
AUDIO
PWM_CLK
PS_SI
PT6324
Audio signal is come from DVD mecha, TUNER, AUX, MIC. Then MPEG IC decode to digital I2S signal.
VFD VFD_CB PS_CS
DISPLAY VFD VFD_CLK LC87F5NC8A OPEN AMP POWER MAIN POWER
DRIVER VFD_DATA RL+ CLOSE
MICOM RL-
SMPS This signal goto the PS9830(PWM modulator) to convert PWM signal. PWM signal amplified at IR AMP stage and then
8082 8082
M_STB DTF DTF
Low Pass Filtered. This signal is real audio signal.
Ctrl
M_ACK
TM - (CL)
TM+(OP)
CM- (DW)
CM+ (UP)
SIGNAL M_RXD
USB CtrL+SIGNAL M-RESET PRE-AMP
4560
JACK MICOM- UPDATE
MPEG UPDATA
PWM_FL_L+
PWM_FL_L- POWER SPK FL
AUX SIGNAL IRF4019 L SPK
JACK TBCK FL X2
PS 9830 AMP
ESS_P3 TWS PRE-AMP
4560 IRS2053
TSD0
TUNER SIGNAL TSD1 PWM FR
JACK
MPEG TSD2 POWER SPK_FR
IRF4019 R SPK
CtrL+SIGNAL PWM_FR_R+
74LCX04 PWM_FR_R-
X2
Ctrl 12.288 MHz
MIC SIGNAL
PRE-AMP
JACK 4560
DATA Ctrl
5 Tray
H/P Motor Ctrl
DRAM IC AM 5766 MECHA
JACK
H/P SIGNAL
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Schematic Diagram
7-2 FRONT
POWER
AUDIO
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Schematic Diagram
7-3 MAIN_MICOM
POWER
AUDIO
TP1
TP1
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Schematic Diagram
7-4 MAIN_MPEG
POWER
AUDIO
VIDEO
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Schematic Diagram
7-5 MAIN_PWM
POWER
AUDIO
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Schematic Diagram
7-6 MAIN_AMP
TP2
POWER
AUDIO
TP2
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Schematic Diagram
7-7 SMPS
EER4042V L2
EER4215V 2.9uH (0.8)
L3
4,5 6 2.9uH (0.8)
8 7
2 3
EER-2525V
L1
2.9uH
8 7 6 5
D
S G
1 2 3 4
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