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SERVICE MANUAL

FOR THE FUTRONIC GMDSS-AIS TESTBOX


HARDWARE VERSIONS A I
10-07-2012

Fabriksvej 4, DK-9490 Pandrup


Denmark
DANPHONE A/S Tel.: +45 96 44 44 44
Fax: +45 96 44 44 45
E-mail: info@danphone.com
www.danphone.com

1
Introduction
The purpose of this manual is to enable a technician to calibrate the Futronic testbox and
to perform some of the repairs that would otherwise require the testbox to be sent back to
Danphone.

It should also be possible to use the manual to troubleshoot down to PCB level, thus
enabling a service to be limited to the replacement of a PCB instead of returning the whole
testbox to Danphone.

Warning

These servicing instructions are for use by qualified personnel only.


To avoid electrical shock, do not perform any servicing unless you are qualified to do so.

Precautions

When disassembling the testbox take care to avoid destruction of the components by
static electricity.

As a minimum, touch the BNC socket at the front before touching anything else and
always touch the ground area first when handling a PCB.

2
TABLE OF CONTENTS
Introduction ................................................................................................... 2
Warning.......................................................................................................... 2
Precautions ................................................................................................... 2
General description ...................................................................................... 5
Hardware versions ...................................................................................... 5
Blockdiagram 1 v. 3 ...................................................................................... 6
Explanation to Blockdiagram 1 v. 3 ............................................................. 7
RF OUT ................................................................................................... 7
RF IN ....................................................................................................... 7
Blokdiagram1 v. 4 ......................................................................................... 9
Explanation to Blockdiagram 1 v. 4 ........................................................... 10
RF OUT ................................................................................................. 10
RF IN ..................................................................................................... 10
Disassembling the testbox ........................................................................ 12
Calibration ................................................................................................... 14
Measuring 20MHz signal from the OCXO ................................................. 15
Adjusting the OCXO .................................................................................. 16
Calibrating the deviation measurement ..................................................... 17
Calibrating the deviation on channel 70 .................................................... 18
Calibrating the power ................................................................................ 18
Functional testing ....................................................................................... 19
Troubleshooting.......................................................................................... 19
PCBs and internal cabling ......................................................................... 23
Version overview - Print 1 .......................................................................... 24
Ver. A-1 ..................................................................................................... 24
Ver. A-2 ..................................................................................................... 24
Ver. B ........................................................................................................ 24
Ver. C ........................................................................................................ 24
Ver. D ........................................................................................................ 24
Ver. E ........................................................................................................ 24
Ver. F......................................................................................................... 25
Ver. G ........................................................................................................ 25
Ver. H ........................................................................................................ 25
Print 1........................................................................................................... 26
Hardware versions B - C ........................................................................... 26
Hardware versions D I ............................................................................ 27
Print 2........................................................................................................... 28
Hardware versions B - I ............................................................................. 28
Print 3........................................................................................................... 29
Hardware versions B - I ............................................................................. 29

3
Print 4........................................................................................................... 30
Hardware versions B - H ........................................................................... 30
Hardware version I .................................................................................... 31
Power supply............................................................................................... 32
Hardware version G0 ................................................................................ 32
Hardware version G1 ................................................................................ 33
Hardware version G2 ................................................................................ 36
Hardware version G3 ................................................................................ 37
Replacing Eprom ........................................................................................ 38
Replacing display ....................................................................................... 39
Replacing accumulator .............................................................................. 41
Replacing int. battery ................................................................................. 42

4
General description

Hardware versions

The main differences between the various hardware versions are as follows:

Hardware version A
This version is the first version and uses Qualcomm DDS IC and four other ICs in order to
make the DDS signals required (DDS Direct Digital Synthesizer).

Hardware version B
This version uses an improved DDS IC (only one IC required to make the DDS-signal).

Hardware version C
This version uses an improved synthesizer IC requiring no external frequency divider
before the synthesizer IC.

Hardware version D
D: TUA 2019-5X as oscillator on print 1, separate EPIRB RX (as in earlier versions),
separate mixer with AD831. Software 021199D

Hardware version E
E: TUA 2019-5X as mixer/oscillator on print 1. Software 221199E.

Hardware version F
F: TUA 2019-5X as mixer/oscillator on print 1, but with changes in the loop filter .

Hardware version G
New print layout for print 1 mixer/oscillator TUA2019-5X.

Hardware version H
New print layout for print 1 mixer/oscillator TDA5630.

Hardware version I
New print layout for print 4 with AIS and DDS IC

5
PRINT 4 PRINT 1

FDDS
DDS UNIT ATTENUATOR
PRINT 1
2.LO
RF OUT
COMBINER
PRINT 1 PRINT 1 PRINT 1

1.LO UHF/VHF
ATTENUATOR
PLL AMPL. (MMIC)

20 MHz 1.LO

PRINT 4

OCXO
Blockdiagram 1 v. 3

PRINT 3 PRINT 1 PRINT 2 PRINT 2 PRINT 1 PRINT 1 PRINT 1

2. MIXER/ 0,4 - 30 MHz MIXER/ RF. AMPL. RF IN


CPU DISPLAY IF SWITCH
DEMODULATOR IF AMPL. RF. AMPL. (MMIC)
Hardware version B and C

6.025 MHz
DATA IN
PRINT 1 RSSI PRINT 1 PRINT 1 PRINT 1 PRINT 1
406.025 MHz
AF OUT 400 MHz RF. AMPL.
KEYBOARD X 20 MULT. MIXER
AMPL. (MMIC)

455 KHz
0,4-30MHz/1-26MHz
PRINT 3
1700 Hz PRINT 2
COUNTER 14-28V EXT. DC

6
20 MHz +36V
0,4-30MHz/1-26MHz RF. AMPL. & DC/DC +12V
FILTER COUNVERTER +5V
20 MHz
12V INT. BATT

110/220 V AC
INT. POWER SUPPLY +25V DC

Blokdiagram1 V.3
Explanation to Blockdiagram 1 v. 3

RF OUT
Via the combiner on print 1 the MF/HF/VHF signals with FSK modulation (MF/HF) or
phase modulation (VHF) can be send out trough the BNC connector RF OUT.

MF/HF signals are generated in a DDS unit on print 4 and the VHF signals are generated
by the 1. LO circuit on print 1 and amplified in the UHF/VHF AMPL. on print 1.

In test mode the MF/HF signals has a power of approx. -15 dBm and in distress mode a
power of approx. -60 dBm.

The VHF signals have an amplitude of approx. -41 dBm in both modes.

The accuracy of the transmitted signals is governed by the OCXO circuit on print 4.
This circuit generate a 20 MHz signal with a accuracy of 0.1 ppm, and the transmitted
signals has the same accuracy.

RF IN

MF/HF signals
All input signals are amplified in an input amplifier (MMIC-circuit).

The MF/HF signals (0.4 - 30 MHz) are also amplified in the RF. AMPL. on print 1, after this
amplification the MF/HF signals go via an IF SWITCH on print 1, to print 2 where the
signals in the 2. MIXER are mixed down to 1700 Hz.

The 1700 Hz goes to a counter circuit (COUNTER) on print 3 where the MARK and
SPACE frequencies are measured.

The 1700 Hz signal also goes to a DEMODULATOR where it is converted to a TTL data
signal, this data signal goes to the CPU circuit on print 3 where it is decoded.

VHF Ch 70
The VHF (Ch. 70) signal is mixed in MIXER/RF. AMPL. on print 1 with a signal from 1.
LO.

The Result of this mixing is a signal on 17.25 MHz and this signal goes via an IF SWITCH
on print 1 to 2. MIXER/IF AMPL. on print 2, where it is mixed with a 16.795 MHz signal,
the result of this is a 455 KHz signal.

7
The 455 KHz goes to a counter circuit (COUNTER) on print 3 where the frequency is
being measured. The 455 KHz signal also goes to a DEMODULATOR where it is
converted to a TTL data signal, this data signal goes to the CPU circuit on print 3 where it
is decoded.

From the IF. AMPL. also comes an RSSI-signal (Received Signal Strength Indicator), this
signal is used as a measure of the strength of the received signal and also for driving an
AF OUT AMPL. thus enabling a AF output corresponding to the AM modulation of the
received signal.

When the testbox is measuring frequency the COUNTER circuit on print 3 will receive
signals from print 1 via the RF. AMPL. & FILTER circuit on print 2.

At frequency measurements in the range 0.4 - 30 MHz print 1 only amplifies the received
signal, on all other ranges print 1 will convert the received signal down to a frequency
between 1 and 26 MHz.

EPIRB
When EPIRB-signals are received the 406.025 MHz signal is mixed with a 400 MHz
signal, the difference signal on 6.025 MHz passes through the IF SWITCH to print 2 where
it is mixed with a 6.48 MHz signal, from the DDS UNIT on print 4, so as to give a 455 KHz
signal.

The 455 KHz goes to a counter circuit (COUNTER) on print 3 where the frequency is being
measured. The 455 KHz signal also goes to a DEMODULATOR where it is converted to a
data signal, this data signal goes to the CPU circuit on print 3 where it is decoded.

From the IF. AMPL. also comes an RSSI-signal (Received Signal Strength Indicator), this
signal is used as a measure of the strength of the received signal.

When the 121.5 MHz signal from an EPIRB is received the signal is mixed, in MIXER/RF.
AMPL. on print 1, with a 104.25 MHz signal from 1. LO and the difference frequency on
17.25 MHz goes to 2. MIXER/IF AMPL. on print 2 where it is mixed with a 16.795 MHz
signal from the DDS UNIT on print 4, the result of this is a 455 KHz signal.

The 455 KHz goes to a counter circuit (COUNTER) on print 3, where the frequency is
measured.

From the IF. AMPL. on print 2 also comes an RSSI-signal (Received Signal Strength
Indicator), this signal is used as a measure of the strength of the received signal and also
for driving an AF OUT AMPL. thus enabling an AF output corresponding to the AM
modulation of the received signal.

8
PRINT 4 PRINT 1

FDDS
DDS UNIT ATTENUATOR
PRINT 1
2.LO
RF OUT
COMBINER
PRINT 1 PRINT 1 PRINT 1

1.LO UHF/VHF
ATTENUATOR
PLL AMPL. (MMIC)

20 MHz 1.LO

PRINT 4
Blokdiagram1 v. 4

OCXO

PRINT 3 PRINT 1 PRINT 2 PRINT 2 PRINT 1 PRINT 1 PRINT 1

2. MIXER/ 0,4 - 30 MHz MIXER RF. AMPL. RF IN


CPU DISPLAY RF SWITCH
DEMODULATOR IF AMPL. (MMIC)

DATA IN
PRINT 1 RSSI PRINT 1
Hardware version (F) G and H

AF OUT
KEYBOARD AMPL.

455 KHz
0,4-30MHz/1-26MHz
PRINT 3
1700 Hz PRINT 2
COUNTER 14-28V EXT. DC +36V

9
20 MHz
0,4-30MHz/1-26MHz RF. AMPL. & DC/DC +12V
FILTER COUNVERTER +5V
20 MHz
12V INT. BATT

100-250 V AC
INT. POWER SUPPLY +15V DC

Blokdiagram1 V.4
Explanation to Blockdiagram 1 v. 4

RF OUT
Via the combiner on print 1 the MF/HF/VHF signals with FSK modulation (MF/HF) or
phase modulation (VHF) can be send out trough the BNC connector RF OUT.

MF/HF signals are generated in a DDS unit on print 4 and the VHF signals are generated
by the 1. LO circuit on print 1 and amplified in the UHF/VHF AMPL. on print 1.

In test mode the MF/HF signals has a power of approx. -15 dBm and in distress mode a
power of approx. -60 dBm.

The VHF signals have an amplitude of approx. -41 dBm in both modes.

The accuracy of the transmitted signals is governed by the OCXO circuit on print 4.

This circuit generate a 20 MHz signal with a accuracy of 0.1 ppm, and the transmitted
signals has the same accuracy.

RF IN

MF/HF
All input signals are amplified in an input amplifier (MMIC-circuit).

The MF/HF signals (0.4 - 30 MHz) go via an RF SWITCH on print 1, to print 2 where the
signals in the 2. MIXER are mixed down to 1700 Hz.

The 1700 Hz goes to a counter circuit (COUNTER) on print 3 where the MARK and
SPACE frequencies are measured. The 1700 Hz signal also goes to a DEMODULATOR
where it is converted to a TTL data signal, this data signal goes to the CPU circuit on print
3 where it is decoded.

VHF Ch. 70
The VHF (Ch. 70) signal is mixed in MIXER on print 1 with a signal from 1. LO. The Result
of this mixing is a signal on 17.25 MHz and this signal goes via the RF SWITCH on print 1
to 2. MIXER/IF AMPL. on print 2, where it is mixed with a 16.795 MHz signal, the result of
this is a 455 KHz signal

The 455 KHz goes to a counter circuit (COUNTER) on print 3 where the frequency is being
measured.

The 455 KHz signal also goes to a DEMODULATOR where it is converted to a TTL data
signal, this data signal goes to the CPU circuit on print 3 where it is decoded.

10
From the IF. AMPL. also comes an RSSI-signal (Received Signal Strength Indicator), this
signal is used as a measure of the strength of the received signal and also for driving an
AF OUT AMPL. thus enabling a AF output corresponding to the AM modulation of the
received signal.

When the testbox is measuring frequency the COUNTER circuit on print 3 will receive
signals from print 1 via the RF. AMPL. & FILTER circuit on print 2.

At frequency measurements in the range 0.4 - 30 MHz print 1 only amplifies the received
signal, on all other ranges print 1 will convert the received signal down to a frequency
between 5 and 30 MHz.

EPIRB
When EPIRB-signals are received the 406.025 MHz signal is mixed with a 400 MHz
signal, the difference signal on 6.025 MHz passes through the RF SWITCH to print 2
where it is mixed with a 6.48 MHz signal, from the DDS UNIT on print 4, so as to give a
455 KHz signal.

The 455 KHz goes to a counter circuit (COUNTER) on print 3 where the frequency is being
measured.

The 455 KHz signal also goes to a DEMODULATOR where it is converted to a data
signal, this data signal goes to the CPU circuit on print 3 where it is decoded.
From the IF. AMPL. also comes an RSSI-signal (Received Signal Strength Indicator), this
signal is used as a measure of the strength of the received signal.

When the 121.5 MHz signal from an EPIRB is received the signal is mixed, in the MIXER
on print 1, with a 104.25 MHz signal from 1. LO and the difference frequency on 17.25
MHz goes to 2. MIXER/IF AMPL. on print 2 where it is mixed with a 16.795 MHz signal
from the DDS UNIT on print 4, the result of this is a 455 KHz signal.

The 455 KHz goes to a counter circuit (COUNTER) on print 3, where the frequency is
measured.

From the IF. AMPL. on print 2 also comes an RSSI-signal (Received Signal Strength
Indicator), this signal is used as a measure of the strength of the received signal and also
for driving an AF OUT AMPL. thus enabling an AF output corresponding to the AM
modulation of the received signal.

11
Disassembling the testbox

Hardware versions A I

The following pictures show how to disassemble the testbox.

1) Remove the front and rear plastic bezels (frames) and remove the cover sheet from the
front.

2) Remove the two upper screws in the front panel and rear panel.

12
3) Remove the lid.

4) If necessary, remove the two lower screws in the front panel and place the PCB
assembly beside the cabinet.

Re-assembling

Re-assembling is the reversal of the steps mentioned above. Take care to avoid wiring
being trapped between the front and the cabinet and check that all sockets are properly
inserted.

13
Calibration

Hardware versions B I

After disassembly, connect the testbox to power and have it connected for 24 hours at
normal indoor temperature (20 - 25 deg. C).

Perform calibration, as shown in the pictures on the following pages, using instruments
which are calibrated to a traceable standard and which have a frequency accuracy of at
least ten times the accuracy of the testbox.

When calibrating the power the accuracy of the standard might have to be chosen with
reference to the accuracy needed by the power measurement.

The calibration should consist of the following:

Calibrate 20 MHz OCXO i.e. measure the 20 MHz OCXO signal as shown in the picture
and adjust the multiturn potentiometer until the reading is within 1 Hz of 20 000 000 Hz.

Calibrate the deviation measurement using a reference signal generator adjusted for 156.3
MHz carrier, 5 KHz deviation and 1 KHz modulating signal.

The calibration is performed using the mode FM DEVIATION/CAL as explained in the


manual.

Calibrate the deviation on CH. 70 by measuring the deviation as shown in the picture,
insert a HP-filter between testbox and modulation meter in order not to load the modulation
signal by the input impedance of the modulation meter.

As an alternative use a spectrum analyzer with antenna input i.e. signal coupled through
the air and adjust the modulation until the carrier amplitude (linear display) is slightly less
than the amplitude of the second sideband.

Calibrate the power measurement by placing the reference power meter in series with the
testbox and select wirelength/load so as to give minimum reflection (<0.5W).

With 25 W input check that the testbox indicate a forward power within +/- 2W of the value
given by the reference power meter.

Adjust the load so as to give a reflected power of 1 2 W and check that the reflected
power is within +/- 0.5 W of the value indicated by the reference power meter, and that the
forward power still is within +/- 2 W of the value given by the reference power meter.

14
Measuring 20MHz signal from the OCXO

Hardware versions B I

15
Adjusting the OCXO

Hardware versions B H

Hardware version I

16
Calibrating the deviation measurement

Hardware versions B I

156.3 MHz, 5 KHz DEV., 1 KHz MOD.FRQ., - 30 dBm

17
Calibrating the deviation on channel 70

Hardware versions B I
4.0 4.2 kHz

HP FILTER (1 nF) in
series with
modulation meter
input

Calibrating the power


POWER METERS
Hardware versions B I

LOAD MISMATCH

POWER
SOURCE

18
Functional testing

Hardware versions B I

The simplest functional testing is done by using the self test function built into the testbox.
The PLL test shows if the oscillator can be locked to the internal reference so as to enable
accurate frequency generation/frequency measurements.

The frequency test shows if the internal MF/HF frequency generation and the MF/HF
frequency counting is functioning.
If an output- or input resistor has been burned due to overload, this will be detected by
the test.

If you have access to another GMDSS testbox or Futronics CALIBRATION TESTBOX


DSC sending and receiving can also be tested, by direct connection between the
testboxes.

Troubleshooting

Based on several years of experience the faults likely to occur (though rarely) are:

1. Resistors at RF OUT or RF IN burned out due to excessive overload.


2. Loose sockets due to excessive vibration during transport.
3. PLL circuit out of lock due to small changes in the oscillator circuit.

Fault type 1 shows up as low sensitivity and/or failure to pass the frequency part of the self
test.

By removing the front plate and looking at/measuring the resistors connected to the BNC
sockets at RF OUT and RF IN it should be possible to detect if a resistor is burned out.
After repair use an oscilloscope to check the amplification in the MMIC connected to RF IN
in order to make sure that the overload has not damaged the MMIC also.

Fault type 2 might show up as a failure to pass the self test or a failure to perform some of
the other functions.

To check for loose sockets disassemble the testbox and check that all sockets are in place
and properly connected.

Check also the coax cabling for correct soldering and check that the coax cabling is free of
damage (the cable might have been caught between chassis parts, or have received
damage due to transport).

19
To check for loose sockets disassemble the testbox and check that all sockets are in place
and properly connected.

Check also the coax cabling for correct soldering and check that the coax cabling is free of
damage (the cable might have been caught between chassis parts, or have received
damage due to transport).

PLL Circuit test points

Hardware versions B

J L

20
PLL Circuit test points

Hardware versions C - I

J L

21
Fault type 3 shows up in the self test and with the information given by the display and the
information given below it should be relatively easy to readjust the coil in question so as to
restore lock.

The PCBs are numbered 1 to 4 counting from the front PCB.

If the oscillator is out of lock one of the coils L3 - L7 (see INTERNAL CABLING) on the
rear of print 1 has to be readjusted.

The coil L3 is an air coil, the other coils have a ferrite core for adjustment.

On the photo of print 1s front is marked an L and a J


.
J marks the point where the voltage to the VCO can be measured and L marks the point
where you can check if the PLL is locked.

The voltage at J has to be between 0,8 and 25 V depending on the chosen frequency.
For testboxes with software from 29.9.98 or older (Hardware versions B), when the
oscillator is locked, the voltage at L will be at a low level, a high level (5V) indicates that
the PLL circuit is not locked.

For testboxes with software from 30.9.99 (Hardware versions C - G), the voltage will be at
a high level when the PLL circuit is locked.

In order to check the voltage at J begin with a frequency self test and at the same time
check, with an oscilloscope (DC, 5V/cm, 1mS/cm) connected between J and ground, that
the voltage from J to ground is within the limits given before.

The INTERNAL CABLING shows the coil numbering.

The table below shows the frequency to be selected and the voltage (at J) the coil should
be adjusted to.

L3 450 - 475 MHz 25 V


L4 225 - 250 MHz 25 V
L5 K15 ATIS 25 V
L6 75 - 100 MHz 5V
L7 30 - 50 MHz 5V

The coils are connected in series so a total adjustment should begin with L3 and perhaps
be repeated one or two times.

So far it has only been necessary to adjust L5 (due to lock failure at ch.70/ATIS ch.15),
and the necessary action was to turn the ferrite core turn CCW in order to reduce the
voltage at J (to 25 V).

22
If a fault seems to relate to a voltage problem look at the picture of the voltage supply
shown in the section POWER SUPPLY and follow the procedure for functional testing
shown there.

Failure to activate Sailor/Skanti VHF RT48xx/VHF10xx might be due to the testboxs


deviation being a little to high, if this is the case adjust the smd trimmer potentiometer on
print 1 for less deviation (CW). Deviation should be adjusted to 4 - 4.2 KHz when
measured in DSC SEND/TEST/VHF.

PCBs and internal cabling

The following pages show the interconnections between the various PCBs. The PCBs are
numbered print 1 to 4 counting from the front.

Explanation to the text:

RSSI P2 YELLOW/BLACK on print 1 means that the two wires yellow and black are
connected from the position shown on print 1 to print 2.

The corresponding signal on print 2 will be marked RSSI P1 YELLOW/BLACK.

A marking such as RF P2/P4 signifies a coax cable connecting to print 2 and print 4.

The signal wiring uses the black and the green colours for ground connections.

The voltage supply uses the following colours:

Black Ground
Red +5 V
Yellow +12 V
Green +36 V

23
Version overview - Print 1

Ver. A-1

Ver. A-2

Ver. B

Ver. C

Ver. D

Ver. E

24
Ver. F

Ver. G

Ver. H

25
Print 1
Hardware versions B - C

26
Print 1
Hardware versions D I

27
Print 2
Hardware versions B - I

28
Print 3
Hardware versions B - I

29
Print 4
Hardware versions B - H

30
Print 4
Hardware version I

31
Power supply

Hardware version G0

The drawing below shows the interconnections on the rear of the testbox.

GREY (VOLTAGE WARNING)

YELLOW (+12V)

GREEN (+36V)
BLACK (GND)

RED (+5V)
T0.5A
AC FUSE

ACCU.
RED OUTPUT VOLTAGES

INPUT VOLTAGES
Rsw
POWER RED (+12V)
Rsw BLACK (COMMON)
TRANSFORMER
YELLOW (+25V)
F1

F2

SWITCH MODE POWER SUPPLY


(SMPS)
AC INPUT

O
15V AC

VOLTAGE
R B Y
SELECTOR R
Y/B EXT. POWER RS232
AC COMMON

F1 IS FUSE FOR INTERNAL ACCU. Rsw IS RED WIRES GOING TO INT. PWR. SWITCH
F2 IS FUSE FOR EXTERNAL POWER

FUNCTIONAL TESTING

1. CONNECT MAINS AND SET INT. PWR. SWITCH TO ON , MEASURE THE DC


VOLTAGE BETWEEN ACCU. - (COMMON) AND THE YELLOW WIRE GOING TO
THE SMPS (25V NOMINAL).

2. IF NO 25V CHECK AC INPUT, AC FUSE, VOLTAGE SELECTOR, POWER


TRANSFORMER AND THE RECTIFIER CIRCUIT.

3. IF 25V IS OK CHECK OUTPUT VOLTAGES FROM THE SMPS, REMEMBER TO USE


THE SMPS OUTPUT GND I.E. GND ON THE BNC PLUGS OR THE SPACERS
BETWEEN THE PCBS.

32
4. CHECK ACCU VOLTAGE (MIN. 10.7V) AND CHECK CHARGING CURRENT (0 to
250 Ma DEPENDING ON THE ACCU VOLTAGE/CHARGE).

5. WITH THE RED (+) WIRE DISCONNECTED FROM THE ACCU CHECK THE OPEN
CIRCUIT VOLTAGE (14.5 +/- 0.25V).

6. CHECK THE VOLTAGE ON THE RED WIRE GOING INTO THE SMPS WITH MAINS
DISCONNECTED AND INT. PWR. SET TO ON.

Power supply

Hardware version G1

FUNCTIONAL TESTING

1. CONNECT MAINS AND SET INT. PWR. SWITCH TO ON, MEASURE THE DC
VOLTAGE BETWEEN ACCU. - (COMMON) AND THE YELLOW 1 WIRE GOING TO
THE SMPS (15V NOMINAL).

2. IF NO 15V, CHECK AC INPUT AND AC FUSE, AND THE PS CIRCUIT.

3. IF 15V IS OK, CHECK OUTPUT VOLTAGES FROM THE SMPS, REMEMBER TO


USE THE SMPS OUTPUT GND I.E. GND ON THE BNC PLUGS OR THE SPACERS
BETWEEN THE PCBS.

4. CHECK ACCU VOLTAGE (MIN. 10.7V) AND CHECK CHARGING CURRENT (0 to


250 Ma DEPENDING ON THE ACCU VOLTAGE/CHARGE).

5. WITH THE RED (+) WIRE DISCONNECTED FROM THE ACCU CHECK THE OPEN
CIRCUIT VOLTAGE (14.5 +/- 0.25V).

6. CHECK THE VOLTAGE ON THE RED WIRE GOING INTO THE SMPS WITH MAINS
DISCONNECTED AND INT. PWR. (SW1) SET TO ON.

33
Power supply

Hardware version G1

RED

J1
LEAD

SW1 RED SMPS R3


D2
2
1

100K
D1 BYV1040
RED BYV1040
RED D-SUB P.3
T1
R2 D3
SW RED
2K2
BYV1040
R1
BC307 68

BAT1
12V

+15V PS

YELLOW 1 SMPS BLACK

-15V PS BLACK D-SUB P.4/5

VIOLET SMPS

BLACK SMPS

YELLOW 2 SMPS

YELLOW D-SUB P.6/7/8

TITLE: DATE:

CONN PCB SMPS 26/06/00


GMDSS TESTBOX PAGE:

BY: JL REV: G 1/1

34
RED

BLK

YELLOW 1

YELLOW 2

PS +15V - +
CONN. PCB
BATT.
-15V

35
Power supply

Hardware version G2

RED
SMPS

U
VIOLET SMPS CHARGE
VIOLET

RED
U
BAT.

SW1 RED SMPS R3


D1 100K D3
BYV1040
RED BYV1040

D2
SW

ON/OFF SWITCH BYV1040

YELLOW
+ 15 V

BLACK
CONN. PCB GND.

+
BLACK RED
BATTERY
GND. EXT. DC +15V EXT. DC

BLACK RED

CONNECTION PCB

36
Power Supply

Hardware version G3

37
Replacing Eprom

Hardware versions B I

After disassembly use a screwdriver and/or a pincet to remove the old EPROM and then,
using a pincet, place the new EPROM exactly above the socket (notch pointing down)
push gently taking care that all EPROM pins goes into the socket.

38
Replacing display

Hardware versions B F. For hardware version G I, skip 7 9

Remove the front and rear plastic bezels (frames).

Remove the four screws in front and the two upper screws in rear.

Remove the lid.

1. Remove the front plate (by removing the five screws on the front plate).

2. Unsolder the wires going from the print to the display, at the display.

3. Remove the four 2.5 mm nuts that hold the display and remove the display.

4. Cut wire no. 3 of the 6 wires at the right side, counting from the right side (se figure 1).

5. Mount the new display, using isolation washer, 3 mm nut and spring washer, as shown
in fig. 2, connecting the remaining wires straight up, as before. Do not reuse the metal
plate.

6. Connect the trim. potm. as shown in figure 3.

7. With power on adjust the trim. potm. for max. contrast.

8. Repeat step 1 - 4 in reverse order to assemble instrument.

9. Perform self test on the instrument.

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FIGURE 1

Isolation washer if needed

2.5 mm screw

2.5 mm nut

Display

Isolation washer
3 mm nut

Spring washer

PCB

FIGURE 2

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NO WIRE

CONTRAST ADJ.

FIGURE 3

Hardware versions B C

Replacing accumulator

Hardware versions A I

Disassemble the testbox and check the voltage on the accu. If a charge attempt (14V/max.
0.5A, for 24 hours, connected to pin 5(gnd.) and pin 3 (+) of the 15 pin D-sub marked
EXT. POWER) fails then replace the accu. by removing the straps holding the accu. and
mount a new accu. using the original straps or new plastic straps.

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Replacing int. battery

Hardware versions A I

If the testboxs software writes check battery when the testbox is turned on, this is a sign
of the testbox being unable to store data in the memory.

The most obvious cause for this failure is that the battery has been discharged.

Disassemble the testbox and check the voltage on the battery, see photo, and replace the
battery if the voltage is low (lower than approx. 2V).

Replacing the battery requires that the deviation calibration be repeated, as the data
for this is stored in the memory.

42

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