Lenovo A859 Maintenance Manual v1 0

Lenovo WW Service TS
Service Manual of
Lenovo A859 Mobile
Phone
LENOVO
Repair Manual of Lenovo S920 Mobile Phone
Document name Service Manual of Lenovo A859Mobile Phone

Version: V100
Date: Dec. 19, 2013
Document No.:
Status:
Preface
This manual is intended for online repair guidance and after-sale repair guidance of
Lenovo A859 mobile phone produced by the Company
The content of this manual will be upgraded according to the needs of technology
development.
Copyright
The copyright of this manual belongs to Lenovo Mobile; anyone who reproduces this
manual without written consent of the Company shall bear legal responsibility.
2
Content
1. APPEARANCE .............................................................................................................................. 6
2. LAYOUT OF MAIN BOARD ........................................................................................................ 7
3. BASEBAND ................................................................................................................................... 9
3.1 LCD DISPLAY ......................................................................................................................... 10

3.1.1 No display on screen after power-on ................................................................................. 10
3.1.2 LCD backlight without lighting ......................................................................................... 11
3.2 CAMERA DEFECTS ................................................................................................................... 12
3.2.1 Rear camera defects .......................................................................................................... 12
3.2.2 Front camera defects ......................................................................................................... 13
3.3 RING AND VIBRATION.............................................................................................................. 14
3.3.1 No vibration ....................................................................................................................... 14
3.3.2 No ring ............................................................................................................................... 15
3.4 CHARGING .............................................................................................................................. 16
3.4.1 No charging display after plugging the charger in ............................................................ 16
3.4.2 Charging shown but not full charging ................................................................................ 17
3.5 CTP KEYBOARD...................................................................................................................... 18
3.5.1 Abnormal operation of CTP keyboard ............................................................................... 18
3.6 CALLING ................................................................................................................................. 19
3.6.1 No voice heard from the other side during the call ............................................................ 19
3.6.2 No voice heard from your side during the call ................................................................... 20
3.7 POWER-ON FAILURE ................................................................................................................ 21
3.8 LCD ON WHEN CLOSE TO THE EAR DURING THE CALL; LCD OFF WHEN AWAY FROM THE EAR. 22
4. RADIO FREQUENCY (RF) ........................................................................... !
4.1 SOFTWARE DOWNLOAD FAILURE ..................................................................... !

4.2 PRODUCTION CALIBRATION .............................................................................. !
4.2.1 AFC calibration....................................................................................... !
4.2.2 AGC ......................................................................................................... !
4.2.3 APC ......................................................................................................... !
4.3 FAULT IN COMPLETE SET TEST/ REWORK ........................................................... !
4.3.1 Switch spectrum & PVT template with excessive standard ..................... !
4.3.2 High Frequency Error ............................................................................. !
4.3.3 High Phase Error .................................................................................... !
4.3.4 Power output problems ........................................................................... !
4.4 WCDMA FORECAST......................................................................................... !
4.4.1 RSSI_Cal ................................................................................................. !
4.4.2 TPC_Cal .................................................................................................. !
4.5 WCDMA COMPREHENSIVE TEST ...................................................................... !
4.5.1 ACLR or SEM .......................................................................................... !
4.5.2 ILPC comprehensive test abnormal ........................................................ !
4.5.3 FrequencyErr .......................................................................................... !
3
5. STRUCTURE ASSEMBLY ........................................................................................................ 23
5.1 ASSEMBLY PROCESS SEQUENCE OF LENOVO A859 MAIN BODY ........................ !

5.2 PRECAUTIONS IN LENOVO S820 MAIN BODY ASSEMBLY ................................... !
5.3 PRECAUTIONS IN DISASSEMBLY OF LENOVO A859 MAIN BODY FOR REPAIRING !
4
Prepared/
Version Prepared by/ Reason for
Modified Main changes
No. Modified by change
on
1. Appearance
2. Layout of main board

Front of main board:
7
Back of main board:
8
3. Baseband
Block diagram of hardware system
9
LCD display
3.1.1 No display on screen after power-on
White screen or blank screen without display; backlight

with lighting
Check whether the connection of LCD FPC is Y

good and re-assembled FPC phone is normal OK
Check whether the display is normal after Y

replacing LCD, OK
Check whether the EMI device E1601,E1602, Y

OK
E1603E1608E1611 of LCD circuit on main
board is welded incompletely; re-weld EMI
device
Check whether there is cold solder joint on other

device around LCD and on LCD connector.
10
3.1.2 LCD backlight without lighting
LCD backlight without lighting
Check whether the connection of FPC on

LCD module and connector on main board is Y
OK
good and whether the LCD backlight is
normal after reconnection
Re-verify whether the LCD backlight is Y

OK
normal after replacing LCD.
N
Y
Check whether there are voltages more than If the backlight circuit is
20V between both ends of C1606 when LCD normal, it is the problem
is lit. of LCD
Check the welding condition of U1601

and peripheral devices, including Y
OK
L1601, D1601, C1606,C1604R1606,
R1608R1609R1620,C1607,C1605
11
Camera defects
3.1.3 Rear camera defects
Can not take photos
Check to see whether the camera Y

module is in the right position by OK
disassembling and whether the module
is OK after reassembling module
Whether the camera is OK

Y
after replacing the camera OK
module
Y
Check to see whether the camera
OK
module connector is welded well;
whether the camera is OK after
overlaying welding the connector?
Check to see whether the EMI N

device is complete and welding is Recheck after overlaying welding
in good condition; if not; repair
EMI device
Check to see whether

Y
the front camera is Recheck after replacing front
abnormal camera
Check to see whether the main Re-weld or replace U1201

N
chip U1201 are normally
welded?
12
3.1.4 Front camera defects
Can not take photos
Y
Check to see whether the front
OK
camera is abnormal After
replacing it,
Check whether E1612, Y

E1609 is well welded. OK
N
N Re-weld or replace
Check whether the U1201
U1201 and U1302
and are normally welded?
13
Ring and vibration
3.1.5 No vibration
No vibration
Check whether the motor is interfered by

Y
structure; Recheck whether it is normal after OK
reassembling the phone.
Replace the motor or main FPC

to see whether it is ok? Check to Y
OK
see whether the circuit around the
motor is normal
Replace U1302 chip
14
3.1.6 No ring
No ring
Replace Speaker and recheck whether it is

Y
normal?
OK
Check to see whether the SPK contact
shrapnel is normal?
Replace main FPC and check whether it is OK . Y

Check whether main FPC connector is welded OK
well
Use earphone to test whether there is sound; if

Y
there is sound from earphone, there is audio
signal to input. Check whether U1201 module OK
device is of cold solder joint; recheck whether it
is ok after re-welding,
Check to see whether the main chip U1302 is

damaged. Replace it if damaged.
15
Charging
3.4.1 No charging display after plugging the charger in
No charging display after

plugging the charger in
Y
Check whether the charging is normal
Replace the charger
after replacing the charger.
Y
Replace the battery and see whether the
Replace the battery
charging is normal? Measure the battery
voltage to see whether it is less than 3V
Y
Check to see whether U1301 module
OK
device is well welded? Whether it is
normal after re-welding
N
Y
Replace U1302 OK
16
3.4.2 Charging shown but not full charging
Charging shown but not

full charging
Y
Replace the battery and then check whether it
OK
is fully charged
Check to see whether R1305 is well There is charging

Y
welded. During charging, measure current; go to check the
whether the voltage between both ends battery.
of R1305 is over 68mV
Replace U1301 module device and Y

then recheck OK
N
Y
Replace U1302 OK
17
Keyboard
3.5.1 Abnormal operation of CTP keyboard
CTP keyboard is invalid
Y CTP damaged,
Whether the CTP test is normal?
replace it
Replace one CTP to see whether Y

it is the problem of touch screen Replace CTP
or main board?
It is the problem of CTP connector

J1603or main chip U1201 welding
18
Calling
3.6.1 No voice heard from the other side during the call
No voice heard from the other

side during the call
N
Cold solder joint
Use earphone and hands-free to verify of main chip or
whether there is voice? main chip is
abnormal
Y
Y
Replace the headphones and then OK
rechek whether it is normal
Check whether B1401,B1403 are well Y

OK
welded. Re-weld and test
Replace U1201
19
3.6.2 No voice heard from your side during the call
No voice heard from your side during the call
Check whether MIC and the peripheral devices are Y

well welded; whether it is ok after re-welding? Re-weld
N
Y
Whether it is ok after replacing SUB
board?
N
Y
Whether it is ok after replacing main FPC? OK
Check whether MIC module device is well

Y
welded. Re-welded this device and see whether it
OK
is ok?
Check U1201
20
Power-on failure
Failed to Power-on
Y
Check whether the power key FPC is Re-weld
assembled well , reassembling the
power FPC ?
Power on the phone on separate main Y The main board is damaged;

board , whether there is high current? replace the main board and check
the failure board step by step
N
Check whether the 26MHz on
Re-weld and recheck
U2104 is normal?
Y
N
Check whether X1301, C1336
Re-weld and recheck
and C1337are well welded
Check whether the main power supply of U1302 N Re-weld or

is normal? replace device
VCORE,VAPROC,VDD18,VTCXO,VDD25_ U1302 to
VA1,VDD28,VMC, etc. recheck
Replace the main chip U1201
21
LCD on when close to the ear during the call; LCD off
when away from the ear.
Abnormal display of LCD

during the call.
Y
Check whether P-Sensor related circuit is p-sensorFPC
normal? Or replace p-sensorFPC Problem
N
Y Replace the application
Whether the touch screen is well of gum of touch screen
pasted with the shell and re-paste
Check whether G-SENSOR is normal. If

G-SENSOR , I2C is normal, or else, U1201 is
abnormal..
Check U1201
22
1. Radio frequency (RF)
4.1 Software Download Failure
Faults: Software cant be normally downloaded.

Reason: Baseband chip is oppositely pasted or is in cold solder joint; CRYSTAL is
oppositely pasted (no clock signal) or is in cold solder joint.
Shooting:
Software cant be normally downloaded or the

phone cant Power-onbe turned on.
Whether baseband chip MT6582 Y

U1201 is oppositely pasted Re-weld U1201
Check whether U2101 is Y

Re-weld U2101
in cold solder joint
Check whether TCXO Y

Re-weld U2104
U2104is oppositely pasted?
Separately check whether U2104 is in cold solder joint?
Re-weld the elements in cold solder joint
Re-download software when it is normal after replacing elements,.
23
4.2 Production calibration
4.2.1 AFC calibration
Fault: AFC calibration Fail.

Reason: RF test cable is not connected well during calibration; TCXO is oppositely pasted
or in cold solder joint.
Shooting:
AFC calibration
Fail
Check whether RF cable and

N
fixture is well connected? Reconnect and calibrate
Check whether TCXO Y Re-weld U2104

U2104 is oppositely
pasted?
Check whether TCXO Y Re-weld U2104

U2104 is in cold solder
joint?
N
Check whether there is power Y Replace PAU2102

output from PA (U2102)
Recalibrate
Notes: Remember to recalibrate after replacing elements.
24
4.2.2 AGC
Fault: AGC calibration Fail.

Reason: RF test cable is not connected well during calibration; the devices in receiving
cable are in cold solder joint (such as RF connectors, antenna switch, saw the filter and
the surrounding capacitance).
Shooting
Rx path lo
calibration fails
N Check calibration report to see Y

whether the two frequency
bands fail?
GSM frequency Y Whether C2117,L2101 is Y Re-weld Check whether RF cable

N Reconnect and
band fails? in cold solder joint and fixtures are well
calibrate
N connected?
N
Y
Whether C2130,L2102is in
Y Whether Rx is in cold
Re-weld solder joint? Y Re-weld or Check whether RF
cold solder joint? connector CON2201 is in Y Re-weld
replace
cold solder joint? CON2201
N
N
Whether Rx is in Whether L2104, L2105,L2106 Re-weld or
Y
Re-weld/Replace cold solder joint? Whether R2115,C2131 is
are in cold solder joint? replace Y Re-weld
coupler in cold solder joint?
N
N
Whether differential pathare
Replace the Y
in cold solder joint?
welding
Check the transceiver chip

MT6166(U2101U601)and
the baseband chip U1201
Notes: Remeber to recalibrate after replacing compements.
25
4.2.3 APC
Fault 1
Fault: APC calibration Fail.
Cause: RF test cable is not connected well during calibration; PA is oppositely pasted; PA
and peripheral circuit are in cold solder joint; The patch of RF input circuit of PA is deviated
with short-circuit shield box.
Shooting:
PCL calibration Fail
N Check calibration report to Y

see whether each frequency
bands fail?
GSM frequency N DCS1800/PCS190 Check whether RF

N Reconnect
fails? 0 frequency fail cable and fixtures are
and calibrate
well connected?
Y Y
Y
PA input PA input R2115,
Re-weld C2131are welded with
Replace
R2115,C2131 are Y Whether RF connector
welded with components Y Re-weld
disconnection CON2201are in cold
disconnection?
solder joint?
N
N
N
Weld PA Y Whether PA is in Whether Y Replace PA
Whether PAU2102is Y Re-weld
U2102 cold solder joint? PA(U2102) is in
in cold solder joint? U2102
cold solder joint?
Notes:Remeber to recalibrate after replacing compements; the problem analysis of PCS

TX APC is the same as DCS.
26
Fault 2:
Fault: The output power of the mobile phone is too high.
Cause: The cable isn't well connected in calibration.
Shooting:
Calibration power is too high
Check RF cable and fixtures to

ensure well connection
Reconnect and calibrate
Fault 3:
Fault: After repeated calibration, the power is still low.
Cause: Some element patches of PA and surrounding VAPC input are displaced or PA is
damaged.
Shooting:
After repeated calibration, the

power is still low.
PAU2102 may be
partially damaged; N Replace Vramp
recalibrate. circuit
27
4.3 Fault in complete set test/ rework
4.3.1 Switch spectrum & PVT template with excessive standard
Fault: The switch spectrum and PVT template of GSM and DCS frequency bands are
excessive.
Cause: The cold solder joint or damage to R2111in V_ramp of PV may result in the
excessive switch spectrum.
Shooting:
Switch spectrum and Ramp

Mask with excessive standard
Measure to see whether the voltage of Pin18 of PA U2102, : ()

is in the normal range (1.8V or less)? : ()
Check whether the input and output

matching is in cold solder joint?
Replace the elements in cold

solder joint
Replace PA if necessary
28
4.3.2 High Frequency Error
Fault: Frequency Error exceeds standard in complete set test.

Cause: There is problem in VAFC input circuit of TCXO.
Shooting:
Excessive Frequency Error
Recalibrate
Check whether U2104 is in cold
solder joint or damaged
Replace the elements in cold solder

joint
4.3.3 High Phase Error
Fault: Phase Error exceeds standard in complete set test.

Cause: The capacitors of power supply part of PA and transceiver are in cold solder joint
or in short circuit with other resistance.
Shooting:
29
Excessive Phase Error
Check the power supply part of PAU2102and transceiver : ()

U2101
Replace the elements in cold

solder joint
4.3.4 Power output problems
Fault: Normally power-on and receive, but when outputting two frequency bands or single
frequency band power, there is no input power or the input power is very low.
Cause: There are many reasons for no output power or very low power, which may be the
results of faults of Transceiver output part, PA input and output circuit, antenna connector
and antenna switch control signal or power supply circuit. Specific circumstances are:
RF connectorCON2101
Checking: Whether RF connector CON2101 and the test probe of RF test cable are well
connected or the patch is oppositely pasted or the antenna connector is damaged.
Shooting: Replace antenna connector and ensure right direction of patch.
RF power amplifier (PA)

A. Whether the control signal PA_ENABLEPin17of PA is high level (about 2.8V); if it
is low level, there is no output of PA;
B. Check the Pin3 Pin4 of PA power supply part to see whether the power supply voltage
is in the normal range (typically 3.6V ~ 4.2V);
C. Whether the RF input parts of PA are in cold solder joint;
D. Whether the RF output R2115,C2131 of PA is in cold solder joint;
E. Part circuit of V_ramp control signal of PA: if it is in old solder joint or in interruption of
circuit, PA also has no output power.
TransceiverU2101
A. Whether the power supply voltage of TransceiverU2101 is within normal range;
check the power supply voltage between power supply filtration capacitor and U2101
connection and then check whether the surrounding circuit is in cold solder joint.
B. Whether there is cold solder joint or short circuit in Transceiver U2101.
30
If it is possible to repair the complete set, the output power of each module on
transmission channel can be detected through spectrum analyzer probes when keeping the
phone in the constant state of maximum power. Under normal circumstances,
A. About GSM 33dBm and DCS/PCS 30dBm output power can be detected on the
output end of RF connector.
B. About 3dBm output power can be detected on matching circuit
C2102,R2105,C2101,R2102 of PA input end;
C. About 32dBm or 29dBm output power can be respectively detected on pin26
connection of PA output end;
D. About 3dBm output power can be detected on Transceiver (U2101) output end.
4.4 WCDMA forecast
4.4.1 RSSI_Cal
Fault: RSSI fails

Cause: There are problems in receiving channel
Repair manner:
RSSI_cal
RSSI Fail
Whether TX module U2102 Y

and RF connector CON2101 Re-weld
are in cold solder joint?
Check whether Band1 and the

surrounding circuit devices are Y
Re-weld
in cold solder joint or partially
pasted
4.4.2 TPC_Cal
Fault: TPC fails

Cause: There are problems in transmission channel
Repair manner:
31
TPC
Check whether RF cable and fixtures are Y Reconnect and

well connected? calibration
Whether Rf connector CON2101Tx module

U2201 and the surrounding circuit devices are Y Re-weld
in cold solder joint
Whether WCDMA PA
Y Re-weld
U2102 is oppositely pasted
or in cold solder joint?
Whether the duplexer

U2201 through which Y
Re-weld
WCDMA transmission
channel passes is in cold
solder joint?
32
4.5 WCDMA comprehensive test
4.5.1 ACLR or SEM
Fault: ACLR or SEM

Cause: No calibration or WCDMA PAU2202 is in cold solder joint; RF transceiver (U2101) : ()
doesnt work well.
Repair manner:
ACLR or SEM
Whether it is OK after recalibrating WCDMA?
Re-weld PA or replace PA and the devices in

transmission circuit?
Re-weld or replace
transceiver
4.5.2 ILPC comprehensive test abnormal
Fault: ILPC
Cause: No calibration or just passing calibration.
Repair manner: The same as 4.5.1.
4.5.3 FrequencyErr
Fault: FrequencyErr
Cause: No calibration, or suffered outside interference
Repair manner: Recalibrate WCDMA and test; replace U2104.
33
5 Structure assembly
5.1 Assembly
1.main pcb assembly
22.P-sensor Silica gel 20.volume key
11.P-sensor FPC 19.power key 6.0.3M sub camera

4.5M main camera 8.receiver 40.sub camera foam
12.volume key FPC
21.light guidance
18.camera lens
39.earphone mylar
30.bat_cov heat-conductive graphite
16.P-sensor frame
29.LCD heat-conductive
graphite
27.bolts
41.CPU thermally conductive
43.BB thermally conductive
42.PMUthermally conductive
13.RF cable line

15.battery cover assembly 28. battery film
44.battery
33. LCD elecloth 32.LCD foam 3.LCD
17.rear housing assembly
7. SPK 14.front housing assembly
9.motor
35.spk seal foam
33.LCD elecloth 10.main FPC 5.TP
38.SPK elecloth 2.sub pcb
23.BB shielding
34.sub pcb elecloth
Figure 5-1 Exploded View of LENOVO A859
As the explode drawing 5-1
1Assemble BB shield cover to main PCBA
2Soldering volume key FPC to main PCBA
3Insert ZIF connecting finger of PS/power key FPC to ZIF conn on main
PCBA. Snap BB conn of main camera, sub camera and main FPC to main
PCBA. Snap the plug of RF cable to the socket on main PCBA.
4 Assemble the bracket for PS FPC to main PCB. Assemble PS FPC to
34
the bracket. Assemble PS rubber sleeve onto PS. Snap BB conn of main FPC
to sub PCBA. Snap the plug of RF cable to the socket on sub PCBA.
5Assemble LCD to front housing assembly.
6Assemble TP to front housing assembly.
7Assemble main PCBA and sub PCBA to front housing assembly. Insert
ZIF connecting finger of CTP FPC to ZIF conn on the main PCBA. Snap BB
conn of LCD to the socket on the main PCBA. Put the cable into the slot of
front housing. Fasten 2 screws for the main PCBA. Assemble sub PCBA to
front housing.
8Affix the film for battery cavity onto the sheet metal of front housing.
9Assemble the speaker to rear housing.
10Assemble volume key and power key to front housing.
11Assemble rear housing to front housing, and then fasten 9 screws for
housing.
12Assemble battery cover to the general assembly.
5.2 Attentions in Lenovo A859 assembly
1assemble TP to front housing need to use pressing fixture.
2Main FPC should be matched to the right terminal.
3Sleeve for PS should be assembled with the right orientation.
4Before soldering, volume key FPC should be aligned to the print mark.
35
The FPC should be bended gently when assembling to front housing.
5 Assembly Cable line in right place to prevent rear housing flattening
cable line
6Speaker should be assembled with the right orientation.
36

Lenovo A859 Maintenance Manual v1 0

Încărcat de

Informații document

Drepturi de autor

Formate disponibile

Partajați acest document

Partajați sau inserați document

Opțiuni de partajare

Vi se pare util acest document?

Este necorespunzător acest conținut?

Drepturi de autor:

Formate disponibile

Lenovo A859 Maintenance Manual v1 0

Încărcat de

Drepturi de autor:

Formate disponibile

Lenovo WW Service TS

Document name Service Manual of Lenovo A859Mobile Phone

2. LAYOUT OF MAIN BOARD ........................................................................................................ 7

3.1 LCD DISPLAY ......................................................................................................................... 10

4. RADIO FREQUENCY (RF) ........................................................................... !

4.1 SOFTWARE DOWNLOAD FAILURE ..................................................................... !

5. STRUCTURE ASSEMBLY ........................................................................................................ 23

5.1 ASSEMBLY PROCESS SEQUENCE OF LENOVO A859 MAIN BODY ........................ !

2. Layout of main board

Back of main board:

Block diagram of hardware system

3.1.1 No display on screen after power-on

White screen or blank screen without display; backlight

Check whether the connection of LCD FPC is Y

Check whether the display is normal after Y

Check whether the EMI device E1601,E1602, Y

Check whether there is cold solder joint on other

3.1.2 LCD backlight without lighting

LCD backlight without lighting

Check whether the connection of FPC on

Re-verify whether the LCD backlight is Y

Check the welding condition of U1601

3.1.3 Rear camera defects

Can not take photos

Check to see whether the camera Y

Whether the camera is OK

Check to see whether the EMI N

Check to see whether

Check to see whether the main Re-weld or replace U1201

3.1.4 Front camera defects

Can not take photos

Check whether E1612, Y

Ring and vibration

Check whether the motor is interfered by

Replace the motor or main FPC

Replace U1302 chip

Replace Speaker and recheck whether it is

Replace main FPC and check whether it is OK . Y

Use earphone to test whether there is sound; if

Check to see whether the main chip U1302 is

3.4.1 No charging display after plugging the charger in

No charging display after

3.4.2 Charging shown but not full charging

Charging shown but not

Check to see whether R1305 is well There is charging

Replace U1301 module device and Y

3.5.1 Abnormal operation of CTP keyboard

CTP keyboard is invalid

Replace one CTP to see whether Y

It is the problem of CTP connector

No voice heard from the other

Check whether B1401,B1403 are well Y

3.6.2 No voice heard from your side during the call

No voice heard from your side during the call

Check whether MIC and the peripheral devices are Y

Check whether MIC module device is well

Power on the phone on separate main Y The main board is damaged;

Check whether the main power supply of U1302 N Re-weld or

Replace the main chip U1201

Abnormal display of LCD

Check whether G-SENSOR is normal. If

1. Radio frequency (RF)

4.1 Software Download Failure

Faults: Software cant be normally downloaded.