Profibus - Earthing-Shielding 8102 d063 Sep17

Functional Earthing and Shielding of
PROFIBUS and PROFINET
Guideline
for PROFIBUS and PROFINET
Draft in PI Review
Version 0.63 Date September 2017
Order No.: 8.102

Functional Earthing and Shielding Draft 0.63
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Management Summary
This document deals with functional earthing, the shielding of PROFIBUS/PROFINET
networks and with equipotential bonding in the corresponding plants in non-hazardous
areas. The document describes an optimized structure for process automation systems
intended to reduce the effects of electromagnetic interference (EMI) and disturbances
by using equipotential bonding systems. In a tiered approach, the readers are first made
familiar with the technical basics of electromagnetic compatibility (EMC), equipotential
bonding and shielding. In chapter 4, six recommendations for action are developed by
using a plant example.

The recommendations for action are listed in the following table.
Provide both protective equipotential bonding and functional equipotential

R1
bonding through a common bonding network (CBN).
R2 Preferably use a 230/400 V power supply using a TN-S system.
R3 Mesh equipotential bonding systems as finely as possible (MESH-BN).
Provide for the functional earthing of PROFIBUS/PROFINET cable shields at

R4
each cable end by connection to large contact areas (low impedance).
Use shielded motor cables in accordance with the manufacturer specifi-

cations and provide for large-surface earthing of the shield at each end
(low impedance).
R5 Earth the motor.
If not excluded by the manufacturer of the frequency converter, preferably

use symmetrical shielded three-wire motor cables with separate protec-
tive conductor.
Multiple earthing of 24-V-Supply-Circuits has to be avoided.
In order to keep the cables between the power supply unit and the con-
R6
sumer as short as possible, it is recommended to use several smaller
power supplies rather than a single big one.

Content
Disclaimer of Liability ....................................................................................................... 3
Management Summary ................................................................................................... 3
1 Introduction............................................................................................................. 10
1.1 Introduction to the subject/problem ..................................................................... 10

1.2 Aim of this document .......................................................................................... 11
2 EMI fundamentals .................................................................................................. 12
2.1 Couplings ............................................................................................................ 13

2.1.1 Conductive coupling ........................................................................................ 14
2.1.2 Capacitive coupling ......................................................................................... 17
2.1.3 Inductive coupling............................................................................................ 18
2.1.4 Radiated coupling............................................................................................ 18
2.2 Electrostatic discharge ........................................................................................ 19
2.3 Typical sources of disturbance in automation systems ....................................... 20
3 Fundamentals of equipotential bonding and shielding ............................................ 21
3.1 Cable shielding ................................................................................................... 21

3.1.1 Passive shielding............................................................................................. 21
3.1.2 Active shielding ............................................................................................... 22
3.2 Equipotential bonding ......................................................................................... 24
3.2.1 Protective earth conductor (PE) ...................................................................... 24
3.2.2 Protective equipotential bonding ..................................................................... 24
3.2.3 Functional equipotential bonding (FE) ............................................................. 26
4 Recommendations for the design of PROFIBUS and PROFINET networks

with little disturbance .............................................................................................. 27
4.1 Combination of protective and functional equipotential bonding systems ........... 30

4.1.1 Problem description......................................................................................... 30
4.1.2 Solutions from standards and specialist literature ........................................... 31
4.1.3 Recommendations for PROFIBUS and PROFINET ........................................ 31
4.2 Implementation of 230/400V mains supply ......................................................... 32
4.2.1 Problem descriptions ....................................................................................... 34
4.2.1.1 Mains supply network as TN-C system .................................................... 34

4.2.1.2 Mains supply network as TN-C-S system ................................................ 38

4.2.1.3 Mains supply network as TN-S system .................................................... 41
4.2.2 Descriptions in the relevant standards and specialist literature ....................... 45

4.3 Equipotential bonding system ............................................................................. 48
4.3.2 Solutions from standards and technical literature ............................................ 55
4.4 Connection of PROFIBUS/PROFINET cable shields .......................................... 67
4.4.1 Problem description with solutions from standards and technical literature .... 67
4.5 Motor lines .......................................................................................................... 71
4.5.1.1 Capacitive coupling in motor lines ............................................................ 72

4.5.1.2 Inductive coupling in motor lines .............................................................. 73
4.5.2 Solutions from standards and specialist literature ........................................... 75

4.6 Earthing of the negative pole of 24 V power supply ............................................ 79
4.6.1.1 Earthing of 24 V power supply circuits, scenario 1 ................................... 82

4.6.2 Solutions from standards and technical literature ............................................ 84

5 Summary of the recommendations for the design of PROFIBUS and PROFINET

networks
with little disturbance ............................................................................................ 87
6 Suggestions for possible acceptance tests............................................................. 89
7 List of reference documents ................................................................................... 92

List of figures
Figure 1: Evaluation of the assignments of the Field Service Excellence WG from 2009
to 20014 [GH2015]...................................................................................... 10
Figure 2: EMC interfaces of a device according to [RUD2011]...................................... 12
Figure 3: Coupling lines ................................................................................................. 13
Figure 4: Conductive coupling in equipotential bonding system 1 ................................. 14
Figure 8: Capacitive coupling ........................................................................................ 17
Figure 9: Inductive coupling ........................................................................................... 18
Figure 10: Repetition of capacitive coupling .................................................................. 22
Figure 11: Active shielding with one-sided functional earthing ...................................... 22
Figure 12: Induction in the cable shield ......................................................................... 23
Figure 13: Plant example from the process industry...................................................... 28
Figure 14: Plant example from the manufacturing industry ........................................... 29
Figure 15: Network systems .......................................................................................... 32
Figure 16: TN-C-S system as network system .............................................................. 33
Figure 17: TN-C system................................................................................................. 34
Figure 18: TN-C system with load ................................................................................. 35
Figure 19: TN-C system with load and current flow ....................................................... 35
Figure 20: TN-C system with several connections to the equipotential bonding system36
Figure 21: TN-C system with multiple earthing, load and current flow ........................... 37
Figure 22: TN-C-S system ............................................................................................. 38
Figure 23: Current flow in a TN-C-S system .................................................................. 39
Figure 24: Current flow in a TN-C-S system with multiple earthing ............................... 39
Figure 25: Current flow in a TN-C-S system with targeted multiple earthing ................. 40

Figure 26: TN-S system ................................................................................................. 41
Figure 27: TN-S system with load.................................................................................. 42
Figure 28: TN-S system with load and current flow ....................................................... 42
Figure 29: TN-S system with two PEN bridges .............................................................. 43
Figure 30: TN-S system with two PEN bridges, load and current flow........................... 43
Figure 31: Ideal TN-S system ........................................................................................ 46
Figure 32: Star-type equipotential bonding .................................................................... 48
Figure 33: Tree-type equipotential bonding ................................................................... 49
Figure 34: Equipotential bonding system in star topology with PROFIBUS lines........... 50
Figure 35: Equipotential bonding system in star topology with PROFIBUS lines 2........ 51
Figure 36: Equipotential bonding system in star topology with PROFIBUS lines 3........ 51
Figure 37: Meshes in an equipotential bonding system with star topology .................... 52
Figure 38: PROFIBUS lines and equipotential bonding lines......................................... 53
Figure 39: Meshes with PROFIBUS lines and equipotential bonding lines .................... 54
Figure 40: Equipotential bonding systems referring to [DIN-EN 50310] ........................ 55
Figure 41: Meshed equipotential bonding system ......................................................... 56
Figure 42: Improved equipotential bonding systems referring to [DIN-EN 50310] ......... 57
Figure 43: Meshed equipotential bonding ...................................................................... 58
Figure 44: Ring lines in meshed equipotential bonding system ..................................... 59
Figure 45: Stubs of the meshed equipotential bonding system ..................................... 60
Figure 46: Connection blocks (WPAK clamps) (picture from Weidmller, manf.) ......... 61
Figure 47: Stubs from ring line to devices (Picture Weidmller)] ................................... 61
Figure 48: Meshed equipotential bonding via the foundation earth electrode ................ 62
Figure 49: Earthing points [DEH2016] .......................................................................... 63
Figure 50: Mesh formed by a cable shield in a meshed equipotential bonding system . 64
Figure 51: Many small meshes in a meshed equipotential bonding system .................. 65
Figure 52: Example of electrostatic discharge ............................................................... 66

Figure 53: Earthing of the cable shield close to a PROFINET device ............................ 68
Figure 54: Multiple earthing of the cable shield of a PROFIBUS line............................. 68
Figure 55: Additional earthing of the cable shield (Product Indu Sol, Photo Niemann).. 69
Figure 56: Shielded motor line ....................................................................................... 71
Figure 57: Capacitive coupling in shielded motor lines .................................................. 72
Figure 58: Magnetic field lines in a motor line................................................................ 73
Figure 59: Inductive coupling between L1 and L2 ......................................................... 73
Figure 60: Inductive coupling in a motor line ................................................................. 74
Figure 61 Typical installation of a frequency converter from [DAN2015]. ...................... 76
Figure 62: Drive with low voltage power supply from [ABB2005]................................... 77
Figure 63: Symmetrical motor lines as recommended by [SIE2014] ............................. 78
Figure 64: 24 V power supply in a manufacturing plant ................................................. 79
Figure 65: Simplified representation of a 24 V power supply circuit .............................. 80
Figure 66: Multiple earthing in a 24 V power supply circuit ............................................ 81
Figure 67: Earthing of 24 V power supply circuits, scenario 1 ....................................... 82
Figure 70: Optimal earthing of 24 V power supply circuits ............................................. 86
List of tables
Table 1: Frequency spectrum of potential sources of disturbance from [SCH2008] ...... 20
Table 2: Suggestions for possible acceptance tests ..................................................... 90

1 1 Introduction
2 This document deals with functional earthing and shielding of PROFIBUS/PROFINET
3 networks and with equipotential bonding in the corresponding plants in non-hazardous
4 areas. The aim is to provide users and designers with a standardized procedure in order
5 to achieve a disturbance-free structure for automation systems. In addition to the proce-
6 dures described in this document, the applicable standards and guidelines for electrical
7 safety must be observed. The illustrations and symbols used in this document may dif-
8 fer from those in the relevant standards and guidelines.
10 1.1 Introduction to the subject/problem
11 An analysis conducted by the Field Service Excellence work group (WG) of the
12 PROFIBUS User Organization in the years 2009 to 2014 has revealed the error causes
13 that were most frequently identified during PROFIBUS and PROFINET service opera-
14 tions. It should be mentioned in this context that the service assignments of the WG are
15 mainly troubleshooting activities that go far beyond the usual range of requirements on
16 electrically skilled service and maintenance personnel.
17
18 Figure 1: Evaluation of the assignments of the Field Service Excellence WG from 2009 to 20014
19 [GH2015]

20 Figure 1 clearly shows that EMC errors resulting from electromagnetic incompatibility
21 have caused more than half of the service assignments of the companies joining the
22 Field Service Excellence work group. These EMC errors are mainly problems that mani-
23 fest themselves through impermissibly high shield currents, inductances without inter-
24 ference suppression and loads of the equipotential bonding systems.
25
26 1.2 Aim of this document
27 The aim of this document is to provide a basis for the functional earthing and shielding
28 of PROFIBUS and PROFINET bus systems. The focus is not on the design of
29 PROFIBUS/PROFINET devices, but on their correct connection and on the cabling of
30 plants in order to prevent field-based disturbances and disturbances through the equi-
31 potential bonding system.
32 In a tiered approach, the readers are first made familiar with the technical basics of
33 electromagnetic compatibility. Then the document imparts the fundamentals of function-
34 al earthing and shielding in process automation systems. In the next step, six recom-
35 mendations for actions allowing to implement PROFIBUS and PROFINET networks with
36 only little disturbance are given. A list of acceptance criteria completes this document.
37

38 2 EMI fundamentals
39 Electromagnetic interference (EMI) is a phenomenon where devices are affected by
40 electric and magnetic fields. All electrical devices generate magnetic and electric fields,
41 which may disturb the function of other devices. For example, EMI causes potential
42 problems and data loss in communication lines. The counterpart of EMI is electromag-
43 netic compatibility (EMC). A device's EMC must ensure that no field-conducted or line-
44 conducted influences may disturb the device.
45 As can been seen in Figure 2, electrical devices may be affected by fields which have
46 an effect on the PROFIBUS/PROFINET lines, power supply lines, signal/control lines or
47 the functional earthing of the device.
48
49 Figure 2: EMC interfaces of a device according to [RUD2011]
50 Besides the line-conducted disturbances shown in Figure 2, electric, magnetic and/or

51 electromagnetic fields may additionally affect a device. However, these are not further
52 considered here.
53

54 2.1 Couplings
55 A source of disturbance is only capable of disturbing another device if there are cou-
56 pling lines. The coupling lines connect the source to the susceptible device (see Figure
57 3). In this context, the term susceptible device refers to electrical equipment such as
58 PROFIBUS lines or a PROFIBUS device that may be affected by electromagnetic inter-
59 ference (EMI).
60
61 Figure 3: Coupling lines
62 The coupling lines shown in Figure 3 can be assigned to three different groups:
63 1. Line-conducted disturbances are caused by conductive connections between de-

64 vices.
65 2. Nearby disturbances are produced by magnetic or electric fields causing induc-

66 tive or capacitive coupling.
67 3. Emission lets disturbances in the form of electromagnetic waves propagate over

68 long distances and couple into other devices (susceptible devices). This form of
69 coupling is outside the scope of this document.
70

71 2.1.1 Conductive coupling
72 Conductive coupling requires an electrically conductive connection between two current

73 circuits. This connection is also called coupling impedance. The common current flow of
74 the two current circuits causes a voltage drop across the coupling impedance. This volt-
75 age drop produces a potential shift at both consumers (loads). Due to this potential shift,
76 the voltage of the consumers/loads may fall below or exceed their rated voltage.
77 [SCH2008]
78 Conductive coupling is hence a frequent cause of the emergence of potential differ-

79 ences in equipotential bonding systems. The drawings below illustrate the causes of
80 potential differences in equipotential bonding systems.
81
82 Figure 4 shows a single current circuit in which the negative pole of the voltage source
83 (U1) has a functional earthing. Additionally, the line impedances (ZL) and a consumer or
84 load impedance (ZC) are shown. The current I1 flows from the voltage source across a
85 line impedance to the consumer or load and returns via the second line impedance to
86 the voltage source. No current flows through the functional earth connector of the cur-
87 rent circuit, which only has to fulfill a safety function. As a result, conductive coupling
88 into non-system current circuits is impossible.
89
90 Figure 4: Conductive coupling in equipotential bonding system 1
91

92 In Figure 5, you can see another functional earth connector at consumer/load ZC. Due to
93 this second functional earthing, a parallel current circuit is formed (see Figure 6) through
94 the equipotential bonding system. The parallel current circuit is represented in the illus-
95 tration by series-connected earthing or equipotential bonding system impedances (ZE).
96
98
99
101

102 In Figure 7, a measuring instrument is connected to the equipotential bonding system.

103 The measuring instrument indicates a potential difference between two points of the
104 equipotential bonding system emerging due to the current flow through the equipotential
105 bonding system.
106
108 If current circuits are earthed several times, be it intentionally or unintentionally, a part of
109 the current may flow through the equipotential bonding system. As a result, potential
110 differences occur in the equipotential bonding system, despite its low inductance. These
111 potential differences affect, amongst other things, shielded cables that have multiple
112 connections to the equipotential bonding system. As shielded cables are provided with
113 functional earthing at each cable end, currents from the equipotential bonding system
114 may flow through the cable shield of a data line and hence couple disturbances into it.
115

116 2.1.2 Capacitive coupling
117 Capacitive coupling emerges between two conductors that have at least a conductive
118 connection and a potential difference. Figure 8 shows two voltage sources (U1, U2) with
119 different voltages or shifted phases. Moreover, they are connected to the same equipo-
120 tential bonding system. This connection and the different voltages produce an electric
121 field between the cables. In the equivalent circuit diagram, the electric field is represent-
122 ed by a stray capacitance (C1/2) [SCH2008].
123
124 Figure 8: Capacitive coupling
125 The potential difference between two signal cables that have the same reference to
126 earth is a simple example of capacitive coupling. Due to the potential difference be-
127 tween the two cables, an electric field emerges which may cause mutual interference.
128

129 2.1.3 Inductive coupling
130 Inductive coupling results from magnetic fields between two current circuits ( and ).
131 The alternating current (I2) generates a magnetic field, which causes a magnetic flux.
132 The magnetic flux crosses the mesh of the current circuit and induces a voltage in it.
133 The induced voltage generates a current in current circuit which overlays the wanted
134 signal and may impair the function of the current circuit [SCH2008].
135
136 Figure 9: Inductive coupling
137 Inductive coupling is a phenomenon that frequently occurs in practice because it only
138 requires current circuits in which the current changes over the time, such as alternating
139 currents or transient currents in switching actions (on or off) that are located in the vi-
140 cinity of other current circuits. No conductive connection between the two current cir-
141 cuits is needed. Physical proximity suffices to produce a significant common coupling
142 inductance M12.
143
144 2.1.4 Radiated coupling
145 In industrial cables of usually up to 100 m of length, radiated coupling between high-
146 energy disturbers and signal current circuits only occurs at high frequencies (approx. 30
147 MHz and higher). This type of coupling is caused by the electromagnetic field
148 [SCH2008]. PROFIBUS and PROFINET cables are relatively well protected against ra-
149 diated coupling by their high signal level, twisted wires and shielding. Usually, radiated
150 coupling impairs the electronics of the connected devices, for example due to insuffi-
151 ciently shielded device housings or electronics with insufficient EMI shielding. As the
152 design of PROFIBUS/PROFINET devices are beyond the scope of this document and
153 only their cabling is covered here, radiated coupling is not considered any further.
154
155 2.2 Electrostatic discharge
156 Electrostatic charges emerge from major potential differences caused by friction or sep-
157 aration of different materials. Friction of different materials leads to the transfer of elec-
158 trons (charge separation) between the two materials. Due to the electron transfer, one
159 material collects a positive charge and one material a negative charge. Typical exam-
160 ples of electrostatic charges emerging in an industrial environment are charges pro-
161 duced by plastic containers on a conveyor. Filling bulk material or liquids from one ves-
162 sel into another is also likely to produce electrostatic charges. The electrostatic charges
163 are discharged as soon as there is a conductive connection between two materials with
164 a sufficiently high potential difference or a spark is produced because the dielectric
165 strength of the air gap is exceeded. The resulting high current flow may disturb sensors
166 and the related data communication [KLE2016].
167

168 2.3 Typical sources of disturbance in automation systems
169 In industrial environments, there are many potential sources of disturbance that are like-
170 ly to jeopardize the reliable and safe operation of automation systems. Most of the dis-
171 turbances are caused by the types of coupling described in section 2.1. This is why dis-
172 turbing equipment often features high performance and higher frequencies or short
173 switching times. Typical potential sources of disturbance are, for example, frequency
174 converters, welding systems, solenoid valves and switching operations. Table 1 shows
175 the frequency spectrum of these potential sources of disturbance.
176 Table 1: Frequency spectrum of potential sources of disturbance from [SCH2008]
Type of equipment Frequency spectrum
Motor 10 Hz to 50 MHz
Frequency converter 1 Hz to 10 MHz
Switching operations 1 kHz to 200 MHz
Rectifier systems 50 Hz to 5 MHz
Power electronics 100 Hz to 100 MHz
177 Various types of shielding measures and the functional earthing of equipment are used
178 to protect automation systems against typical frequency-dependent sources of disturb-
179 ance. The following section details the fundamentals of functional earthing and shield-
180 ing.

181 3 Fundamentals of equipotential bonding and shielding

182 This section deals with protective measures against functional disturbances used in au-
183 tomation systems. The first subsection focuses on cable shielding and the second sub-
184 section considers equipotential bonding.
185 3.1 Cable shielding
186 Cable shields use two different principles to suppress the individual types of disturb-
187 ance. These principles are called active shielding and passive shielding. They are
188 explained in more detail in the following two subsections. Besides these two shielding
189 measures, there are other protective measures such as the twisting of data wires in or-
190 der to ensure undisturbed data communication via PROFINET and PROFIBUS cables.
191 3.1.1 Passive shielding
192 A shielding effect solely achieved by using shielding material of sufficient thickness is
193 referred to as passive shielding. The minimum material thickness required for the
194 shielding effect depends on two factors: firstly, the frequency of the disturbance and,
195 secondly, the magnetic permeability of the material in the presence of magnetic fields. If
196 the shield has a material thickness greater than the minimum required material thick-
197 ness, eddy currents can occur inside the shield. The eddy currents generate a field that
198 is oriented oppositely to the disturbing field. This nearly eliminates the disturbing effect.
199 However, this shielding effect is normally provided by cable shields, as their material
200 thickness is insufficient and instead is usually achieved by metal-type cable ducts with
201 separators and covers or steel tubes.
202

203 3.1.2 Active shielding
204 Due to the low material thickness of cable shields, the active shielding effect is used.
205 However, for active shielding to work, it is necessary to connect the cable shield to earth
206 at several points in order to establish a current circuit [WOL2008].
207 It the cable shield is connected to earth at one point, only, capacitive coupling will occur
208 if there is a potential difference between a cable and the shield. Figure 10 shows a
209 schematic structure of capacitive coupling between two current circuits. This schematic
210 structure can also be applied to active shielding against electric fields (Figure 11).
211
212 Figure 10: Repetition of capacitive coupling
213
214
215 Figure 11: Active shielding with one-sided functional earthing
216
217 Due to one-sided functional earthing of the cable shield (shown in gray color in Figure
218 11), the two stray capacitances C1 and C2 are produced between the current circuits (
219 and ) and the cable shield. These stray capacitances emerge because the cable
220 shield has a 0 V potential resulting from its functional earthing. Coupling disturbances
221 from current circuit into current circuit is hence prevented, because the displace-
222 ment currents (Idisplacement) coupled into the circuit can directly return to the voltage source
223 U2.
224
225 If the cable shield has two or more earth connections, there is an additional shielding
226 effect against magnetic fields called active shielding. When exposed to magnetic
227 fields, a voltage is induced due to multiple functional earthing of the cable shield, and
228 the induced voltage allows a current (Iinduced) to flow in the cable shield (), as shown in
229 Figure 12.
230
231 Figure 12: Induction in the cable shield
232
233 The induced current flow produces a counter-induction with a 180 phase shift to the
234 initial induction of the magnetic field. Inside the cable, the magnetic field of the disturb-
235 ance and the magnetic field of counter-induction overlay each other. This overlay pro-
236 duces an area that is nearly free from any fields in the middle of the cable [WOL2008].

237 For this reason, cable shields should be connected to earth at least at both ends in or-
238 der to achieve a sufficient shielding effect against magnetic fields and alternating elec-
239 tromagnetic fields.
240 3.2 Equipotential bonding
241 Earthing points can be found everywhere in a plant or on plant equipment. A distinction
242 is made between protective earthing (PE) and functional earthing (FE). Protective earth-
243 ing is intended to ensure the safety of humans and to prevent hazardous touch voltages
244 on housings and other conductive parts. Functional earthing, in contrast, serves to
245 achieve electromagnetic compatibility of a plant.
246 3.2.1 Protective earth conductor (PE)
247 The protective earth conductor ensures protection of electrical active devices with the
248 protective measure protective earthing in the event of a fault. It facilitates the protec-
249 tion of persons against electrical shock by indirect contact.
250 Indirect contact is caused by an electrically conductive, usually metallic, object of elec-
251 trical active devices, which may build up an electrical voltage to earth in the event of a
252 fault. Such a fault scenario could be a 230 V cable, which has accidentally come loose
253 and come in to contact with a metal part of the device. Therefore, every electrical device
254 with an operating voltage above 50 VDC or 120 VAC must have a PE-terminal for the
255 protective earth conductor.
256 3.2.2 Protective equipotential bonding
257 A different setting applies for electrically passive, but touchable, conductive parts of the
258 plant, e.g. a handrail, a protective fence or a roller conveyor. Here no PE terminal is
259 present. However, it is recommended to connect those parts of the plant to the protec-
260 tive equipotential bonding system. If a handrail is connected to the protective equipoten-
261 tial bonding system, then - in the case of an error (phase connected to the handrail due
262 to failure of basic and additional insulation) - a fault current can trigger a protective de-
263 vice like a fuse or an RCD and switch off the circuit.
264 As the handrail is connected to the protective equipotential bonding conductor, a fault
265 current of sufficient intensity is produced and triggers a safety device (fuse, fault current
266 circuit breaker) to disconnect the current circuit from mains. If, however, the handrail
267 were not connected to the protective equipotential bonding conductor, a voltage of 230

268 V would be present between the handrail and earth, presenting a danger to the life of
269 humans and (farm) animals that might come into contact with it. It is therefore recom-
270 mended to connect all passive, electrically conductive objects such as pipes, protective
271 fences, ladders, handrails, metal cable ducts or other structural components to the pro-
272 tective equipotential bonding in order to prevent impermissible touch voltages.
273 In this document, the connection of electrical equipment to a protective conductor or

274 protective equipotential bonding is marked by the following symbol:
275
276

277
278 3.2.3 Functional equipotential bonding (FE)
279 The purpose of functional equipotential bonding is the reduction of:
280 - the effects of an insulation fault that may affect operation of a machine;
281 - the effects of electrical disturbances on sensitive electrical equipment that may
282 affect operation of a machine. [DIN-EN 60204-1]
283 This means that functional equipotential bonding does not serve the safety of humans
284 and (farm) animals, but the functional reliability of a plant. Among the objects that are
285 usually connected to the functional equipotential bonding are, for example, motor
286 shields, data cable shields and functional earthing conductors of sensitive component
287 parts.
288 In this document, the connection of electrical equipment to a functional equipotential

289 bonding is marked by the following symbol:
290
291
292
293

294 4 Recommendations for the design of PROFIBUS and

295 PROFINET networks with little disturbance
296 These recommendations provide instructions on how to design systems with only little
297 disturbance. The individual recommendations deal with the following:
298 - Combination of protective and functional equipotential bonding systems to form a

299 common network
300 - Implementation of 230/400 V power supply differentiation between the individual

301 types of earthing for network systems (TN-S, TN-C, TN-C-S, TT and IT)
302 - Minimum distances between power cables and PROFIBUS/PROFINET cables
303 - Setup of the equipotential bonding system
304 - Connection of PROFIBUS/PROFINET cable shields
305 - Peculiarities of motor cables
306 - Functional earthing of the negative pole in a 24 V power supply circuit
307 The following subsections provide general explanations and problem descriptions for all
308 seven topics on the basis of standards and specialist literature. Additionally, a recom-
309 mendation for the functional earthing and shielding of PROFIBUS/PROFINET networks
310 is derived from the standards. The recommendations are applicable for both the manu-
311 facturing industry and the process industry. The only exception is the application in haz-
312 ardous areas where this subject is not covered by these recommendations, as addition-
313 al regulations are valid and must be observed for the functional earthing and shielding
314 of cables in hazardous areas. For bus lines that either leave the building envelope or
315 are laid outdoors the applicable lightning protection directives must also be observed in
316 addition to this document. It is recommended to preferably use fiber optic cables as bus
317 lines that leave buildings or are supplied from different main distributors.
318

319 Figure 13 shows a plant example from the process industry.
320
321 Figure 13: Plant example from the process industry
322 The plant shown in Figure 13 has two vessels that are filled and emptied by pumps
323 and valves . A low voltage main distributor (LVMD) is used for power supply to the
324 plant. It supplies the cabinet that accommodates the frequency converter and the
325 programmable logical controller (PLC). Additionally, the plant comprises two decen-
326 tralized remote I/O units controlling the sensors and actuators. In this plant example,
327 you can see an exemplary presentation of the following problems: Control of
328 drives/actuators, wide-spread plants and automation equipment distributed in the field.
329

330 Figure 14 shows a manufacturing plant. In this plant, robots transport various compo-
331 nents between conveyors and processing tables .
332
333 Figure 14: Plant example from the manufacturing industry
334 Like in the plant example from the process industry described above, the manufacturing
335 plant in this example is supplied via the low voltage main distributor (LVMD); the cab-
336 inet accommodates the programmable logical controller and several frequency con-
337 verters for operating the motors . Some decentralized remote I/O units are locat-
338 ed in the field of the plant. In this plant example, you can see an exemplary presentation
339 of the following problems: Control of drives/actuators, wide-spread plants with convey-
340 ors and connection of robots.
341

342 4.1 Combination of protective and functional equipotential bonding

343 systems
344 In the manufacturing industry and in the process industry both separate and common
345 protective and functional equipotential bonding systems are used. Separating the two
346 systems is reasonable under the assumption that in this case no currents flowing in the
347 protective equipotential bonding system can couple into the functional equipotential
348 bonding system, causing disturbances. Protective equipotential bonding serves the
349 safety of humans and (farm) animals. Functional equipotential bonding serves to ensure
350 full plant functionality, for example by eliminating disturbances caused by electromag-
351 netic fields. Both equipotential bonding systems are laid out in a star or tree topology
352 distributed over the entire plant area, and they are interconnected at a just one point.
353 Usually, the central protective earth connector (Main Earth Terminal) of the plant is used
354 as the connection point for the protective and the functional equipotential bonding sys-
355 tems.
356 4.1.1 Problem description
357 Nowadays, having completely separated functional equipotential bonding and protective
358 equipotential bonding systems in a plant is no longer practical as there are always sev-
359 eral points in a plant where unwanted connections are likely to occur.
360 For example, the usage of PROFIBUS and PROFINET may result in a connection be-
361 tween the functional and the protective equipotential bonding system. In order to ensure
362 full functionality of PROFIBUS/PROFINET lines, you have to connect each line end to
363 the functional equipotential bonding system (see section 3.1.2).
364 To achieve this, the cable shield has to be connected to a large contact surface on a
365 PROFIBUS/PROFINET connector housing, a separate equipotential bonding bar or a
366 suitable shield connector at the device. This measure already satisfies the requirement
367 to connect the functional and the protective equipotential bonding systems to each oth-
368 er.
369
370

371 4.1.2 Solutions from standards and specialist literature
372 No standard requires a strict separation of the functional and protective equipotential
373 bonding systems. In the standard [DIN-EN 60204-1] you will find an explanation on how
374 to achieve functional equipotential bonding by means of a connection to the protective
375 equipotential bonding system. If, however, the protective equipotential bonding system
376 is heavily loaded by currents, providing a separate functional equipotential bonding sys-
377 tem may become necessary.
378 Hence, when using a common equipotential bonding system it must be ensured that the
379 currents flowing through it are as low as possible.
380 Additionally, the standard [IEC 60364-5-54] requires that common protective and func-
381 tional equipotential bonding conductors always have to meet the requirements on pro-
382 tective conductors. With this, the minimum cross-sectional areas, line impedances, min-
383 imum ampacity and protection against self-loosening of equipotential bonding
384 conductors are clearly defined.
385 4.1.3 Recommendations for PROFIBUS and PROFINET
386 As already stated, a strict separation of functional and protective equipotential bonding
387 systems is not feasible in practice, as unintended connections between the two bonding
388 systems frequently occur. Moreover, attempts to separate the two systems can incur
389 high costs. Common equipotential bonding is therefore recommended. A common equi-
390 potential bonding system of this kind is referred to as Common Bonding Network (CBN).
391 It combines both the protective functions required for triggering circuit breakers in case
392 of a fault and the functional equipotential bonding functions for avoiding electromagnetic
393 interference.
394 In this document, the following symbol is used for marking a CBN connection:
395
396 Please note that this symbol is just used for the purpose of this document. In the rele-
397 vant standards on this subject you can find different symbols for this.
398
399
400 From this section of the document, the first recommendation R1 is derived:
Provide both protective equipotential bonding and functional equipotential bonding

through a common bonding network (CBN)
401
402 4.2 Implementation of 230/400V mains supply
403 This section deals with the reduction of disturbances and loads of the equipotential
404 bonding system by using the appropriate mains supply network systems. The standard
405 [DIN-VDE 0100-100] specifies several mains supply network systems. They are called
406 TN-S, TN-C, TT and IT systems and are shown in Figure 15.
407
408 Figure 15: Network systems
409 In the TN-S, TN-C and TT systems shown in Figure 15, the neutral point of the feeding
410 transformer is connected to protective earth. The neutral point in an IT system is not
411 earthed and a neutral conductor may or may not exist in an IT system.
412 In TN and TT systems, the star point of the transformer is earthed. In TN-S networks the
413 protective earthing of the device takes place via the protective earth conductor, that is
414 grounded at the star point of the transformer. In TN-C networks the protective earthing
415 of the device is performed via the combined Protective / Neutral conductor (PEN). The
416 protective conductor and the neutral conductor in a TN-C system are parts of a common

417 conductor line. In a TN-S system, on the contrary, the protective conductor and the neu-
418 tral conductor are laid separately.
419 The neutral point in an IT system is not earthed.
420 In a TT system, the neutral point of the transformer is earthed. There is no protective
421 conductor connection between the neutral point of the transformer and the connected
422 devices. These are earthed locally. [SCH2008]
423
424 Figure 16: TN-C-S system as network system
425 A TN-C system and a TN-S system can be combined to form a TN-C-S system. Figure
426 16 shows a TN-C-S system. In this TN-C-S system, Device 1 is connected to the TN-C
427 system, whereas Device 2 is connected to the TN-S system. The connection of the sys-
428 tems between the two devices is achieved by separating the previously used PEN con-
429 ductor into a protective conductor and a neutral conductor. It is important not to re-
430 combine the separated N conductor and PE conductor to form a common PEN conduc-
431 tor again.
432 The type of mains supply is defined when deploying the energy supply system. It de-
433 termines whether using a TT system, TN system or IT system is possible or not. Nor-
434 mally, power is supplied via a TN-C system; therefore, the recommendation at the end
435 of this section is based on this system type.
436

437 4.2.1 Problem descriptions
438 4.2.1.1 Mains supply network as TN-C system
439 In Figure 17, a cabinet powered via a low voltage main distributor (LVMD) and a TN-C
440 system is shown. In addition to the three active conductor lines (L1, L2, L3), the LVMD
441 comprises the PEN conductor. This is a typical conductor in a TN-C system and it com-
442 bines the protective conductor and the neutral conductor. In order to simplify the illustra-
443 tion, no fuses, terminals, meters etc. are shown. Nevertheless, they will have to be con-
444 sidered later on in the planning phase of the system. Additionally, an exemplary
445 representation of the central earthing point can be seen in the LVMD. The central earth-
446 ing point connects the foundation earth electrode to the PEN conductor at one point.
447 The low voltage main distributor is powered via a transformer. Figure 17 only shows the
448 secondary circuit of the transformer.
449
450 Figure 17: TN-C system
451

452
453 In the following step, the current flow is considered. For this reason, in Figure 18 a sin-
454 gle-phase motor is connected into the circuit between L1 and PEN as a load.
455
456 Figure 18: TN-C system with load
457 Figure 19 illustrates the current flow generated by the motor that has been connected
458 into the circuit. The current flows from the transformer via L1 to the motor. It returns
459 from the motor via its neutral conductor to the distribution panel in the cabinet and from
460 there via the PEN conductor to the transformer.
461
462 Figure 19: TN-C system with load and current flow
463

464 Problems will occur in the TN-C system as soon as the PEN conductor is connected
465 intendedly or unintendedly to the equipotential bonding system. Such an additional con-
466 nection may occur at the motor shaft or the motor fastening point to a metal support,
467 owing to the construction. In Figure 20, the connection of the motor to the equipotential
468 bonding system is shown under as an example.
469
470 Figure 20: TN-C system with several connections to the equipotential bonding system
471

472 Figure 21 shows another possible current flow than Figure 19, taking into account the
473 potential current flows at the motor and the existing connection to the equipotential
474 bonding system. In this case, the current flows from the motor via the N conductor back
475 to the PEN conductor of the cabinet. The major part of the current will flow via the PEN
476 conductor to the LVMD and to the transformer. A partial current, however, will also flow
477 through the PE conductors to the motor housing and return from there through the equi-
478 potential bonding system to the LVMD earthing point and to the transformer.
479
480 Figure 21: TN-C system with multiple earthing, load and current flow
481
482 A potential difference between the two earthing points emerges due to the current in the
483 equipotential bonding system and to the voltage drop caused by the current flow. This
484 potential difference may be bridged by the cable shields of the motor and data lines, as
485 the cable shields are connected to the equipotential bonding system at several points.
486 However, the cable shields are not designed for carrying operating currents and may be
487 damaged due to excessive current load.
488

489 4.2.1.2 Mains supply network as TN-C-S system
490 The new TN-S system has been developed from the TN-C system, which is rather out-
491 dated seen from the vantage point of the present. In this case, the neutral conductor
492 and the protective conductor are implemented separately. It is, however, also possible
493 to combine both systems. The combination, called TN-C-S system, is shown in Figure
494 22. The system in the LVMD is still a classical TN-C system with a PEN conductor. In
495 the cabinet, the protective conductor and the neutral conductor are separated from each
496 other, making the system a TN-S system. The only connection between these two con-
497 ductors is a PEN bridge.
498
499 Figure 22: TN-C-S system
500 The current flow through the motor connected into the circuit in Figure 22 as an exem-
501 plary load is shown in Figure 23 in red. The current flows from the transformer via the
502 conductor line L1 through the LVMD and the cabinet to the motor. From the motor, it
503 flows via the neutral conductor to the cabinet and returns from there via the PEN con-
504 ductor in the LVMD to the transformer.

505
506 Figure 23: Current flow in a TN-C-S system
507 As the motor may have several intended or unintended conductive connections to the
508 equipotential bonding system, the current flow shown in Figure 24 is also possible. In
509 this example, the current does not only return from the cabinet to the LVMD via the PEN
510 conductor, but also - as a partial current - via the protective conductor of the motor and
511 the equipotential bonding system.
512
513 Figure 24: Current flow in a TN-C-S system with multiple earthing

514 As this current flow may not only cause damage to the equipotential bonding system,
515 but could also affect other components such as motor bearings or gears, it is recom-
516 mended to intentionally implement a second connection between the equipotential
517 bonding system and the protective conductor of the TN-S system in the cabinet. Such a
518 connection is shown in Figure 25. Earthing considerably reduces the current flow
519 through the protective conductor to the motor.
520
521 Figure 25: Current flow in a TN-C-S system with targeted multiple earthing
522 The taken measure, i.e. the connection of the protective conductor to the equipotential
523 bonding system when implementing the TN-S system in the cabinet protects the con-
524 nected loads against operating currents through the protective conductor. However, the
525 current flow through the equipotential bonding system is not prevented. The residual
526 current flow is still capable of damaging the cable shields of data lines.
527
528

529 4.2.1.3 Mains supply network as TN-S system
530 Seen from the vantage point of the present, it is better to have pure TN-S systems or to
531 separate the individual components of the plant's PEN conductor early. The separation
532 is made in the LVMD, as shown in Figure 26.
533
534 Figure 26: TN-S system
535 In Figure 26, the central earthing point of the equipotential bonding system in the LVMD
536 is only connected to the protective conductor. Additionally, a PEN bridge is provided at
537 the central earthing point (CEP) in the LVMD.
538

539 For the purpose of demonstrating the current flow in the TN-S system in Figure 27, a
540 motor is connected into the circuit next to the cabinet as an additional load. Both the
541 cabinet and the motor have other connections to the equipotential bonding system.
542
543 Figure 27: TN-S system with load
544 When considering the (red) current flow in Figure 28, it is noticeable that no current
545 flows through the equipotential bonding system, although the housings of the equipment
546 units feature multiple earthing. The current flows from the transformer across conductor
547 line L1 to the load and returns to the transformer through the neutral conductor. This is
548 the TN-S system's major advantage over the TN-C system.
549
550 Figure 28: TN-S system with load and current flow

551 Figure 29 shows a fault that is often encountered with TN-S system in practice. Besides
552 the necessary PEN bridge in the LVMD, another PEN bridge has been erroneously in-
553 stalled in the cabinet.
554
555 Figure 29: TN-S system with two PEN bridges
556 According to [DIN-EN 60204-1], implementing a second PEN bridge in the cabinet is
557 forbidden. The reason for this is clearly seen in Figure 30.
558
559 Figure 30: TN-S system with two PEN bridges, load and current flow
560
561 The current flow shown in Figure 30 in red first flows from the transformer through L1 to
562 the load, as already discussed above. At this point, however, the current reaches the

563 neutral conductor of the cabinet and flows to the incorrectly installed PEN bridge. At the
564 PEN bridge, the total current is divided into several partial currents. As a result, there is
565 a parallel back current via the equipotential bonding system, the protective conductor
566 and the neutral conductor to the transformer. The current flow in the equipotential bond-
567 ing system causes a potential difference between the two earthing points. This potential
568 difference creates difficulties, as it may cause, among other things, current flows in the
569 cables shields (see section 2.1.1).
570

571 4.2.2 Descriptions in the relevant standards and specialist literature
572 According to [DIN-EN 50310] and [IEC 60364-4-44], TN-C systems are not suitable for
573 installations in buildings with IT equipment, due to non-compliance with EMC require-
574 ments. This is mainly due to the PEN conductor. For operational reasons, the PEN con-
575 ductor leads neutral conductor currents which may cause potential differences in the
576 equipotential bonding system due to multiple connections with it. Moreover, the currents
577 in the equipotential bonding system also flow through the cable shields of motor and
578 data lines which have to be earthed at each end in order to ensure their active shielding
579 effect. The currents flowing in the cable shields cause disturbances in the plant
580 [SCH2008], because they affect the communication between the connected devices.
581 These disturbances may even result in plant down times.
582 For this reason, the designers and constructors of new buildings/plants with IT equip-
583 ment are requested in [DIN-EN 50310] and [IEC 60364-4-44] to use TN-S systems only.
584

586 Due to the advancing digitalization in the process and manufacturing industries, it must
587 be assumed that all buildings in manufacturing plants (will) have IT equipment. To en-
588 sure electromagnetic compatibility, it is recommended to use only TN-S systems, TN-C-
589 S-systems, where the PE and the N conductor are preferably already separated in the
590 LVMD or TT-systems. If a TN-C system exists already for power supply from the energy
591 supply company, it should be converted into a TN-S system in the low voltage main dis-
592 tributor system as early as possible, for EMC reasons. To achieve this, a PEN bridge
593 should be installed close to the central earthing point. In a TN-S system, there may be
594 several parallel connections, for example from the cabinet to the equipotential bonding
595 system, without any operating currents flowing through the equipotential bonding sys-
596 tem.
597 Additionally, current monitoring at the PEN bridge is possible, as shown in Figure 31.
598 For current monitoring, the direct and alternating currents across the PEN bridge are
599 measured and evaluated; the current monitoring equipment should be installed and
600 handled by qualified personnel. Current monitoring allows for early recognition of im-
601 permissible currents. Early recognition facilitates the recognition of currents flowing in
602 the equipotential bonding system as well as impermissible multiple connections be-
603 tween the neutral conductor and the protective conductor.
604
605 Figure 31: Ideal TN-S system
606 When modernizing the power supply equipment in existing buildings, it is often neces-
607 sary to change the TN-C systems used so far into TN-S systems. For this purpose, a
608 new protective conductor is installed and the equipment is connected to it. The previ-
609 ously used PEN conductor can only be re-used as a neutral conductor, provided that it
610 has an appropriate cross sectional area (CSA) and is in a re-usable state. It must be
611 ensured that there is only one connection between the protective conductor and the
612 previously used PEN conductor in the LVMD. Any additional connection must be avoid-
613 ed in the TN-S system [WOL2015].
614 From this section of the document, the second recommendation R2 is derived:
Preferably use a 230/400 V power supply using a TN-S system.
615

616 4.3 Equipotential bonding system
617 A plant example from the manufacturing industry is used here for explanation. Of
618 course, the principles of equipotential bonding are also applicable to plants in the pro-
619 cess industry.
620 At present, equipotential bonding systems are usually implemented in a star or tree to-
621 pology. Figure 32 shows an equipotential bonding system with star topology. The
622 loads/devices in the plant are not only connected to the equipotential bonding system,
623 but also to additional protective conductors in the connection cables of the devices. This
624 is due to the fact that every power cable has a protective conductor which additionally
625 provides for protective earthing of the equipment.
626
627 Figure 32: Star-type equipotential bonding
628

629 It is, however, more cost-saving to implement the equipotential bonding system in a tree
630 topology rather than using a pure star topology (Figure 33). In a tree topology, several
631 neutral points are combined in a central neutral point.
632
633 Figure 33: Tree-type equipotential bonding
635 The problems that may arise due to equipotential bonding are almost the same for star
636 topologies and for tree topologies. Therefore, only star topology equipotential bonding
637 systems will be considered in the following sections.
638

639 In Figure 34, you can see a star topology equipotential bonding system in green and
640 yellow and a PROFIBUS line in violet. The PROFIBUS line in the example could also be
641 replaced with a PROFINET line, as both network types allow for a line-type system
642 structure.
643
644 Figure 34: Equipotential bonding system in star topology with PROFIBUS lines
645 PROFIBUS and PROFINET lines are shielded two-wire, four-wire or in the future
646 eight-wire lines. The Installation Guidelines for Planning require the cable shields to be
647 connected to the equipotential bonding system at both ends. This is important for the
648 protective function of the cable shield in terms of EMC, because cable shields that are
649 not connected to the equipotential bonding system or are only connected at one end do
650 not provide for active shielding against magnetic fields (see section 3.1.2).
651 Figure 35 shows details of the connection between the cable shield and the equipoten-
652 tial bonding system. The green and yellow lines of the equipotential bonding system
653 with saturated colors have direct connections to the cable shields of the PROFIBUS
654 line. The pale-colored lines of the equipotential bonding system have no direct connec-
655 tion to the cable shield and are not relevant for further considerations. As a result, these
656 pale-colored lines are hidden in the following illustrations.

657
658 Figure 35: Equipotential bonding system in star topology with PROFIBUS lines 2
659
660
661 Figure 36: Equipotential bonding system in star topology with PROFIBUS lines 3
662

663 The connections of the equipotential bonding system's neutral points to the cable
664 shields of the PROFIBUS line connected to these points form the meshes shown in red
665 in Figure 37. If the mesh conductors are exposed to magnetic fields, voltages may be
666 inductively coupled into them. Due to the in-coupled voltage, a current flows in the mesh
667 conductors and, hence, through the cable shield of the PROFIBUS line.
668 Additionally, an equipotential bonding system in star topology has long transmission
669 routes. The long transmission routes cause high impedances of the equipotential bond-
670 ing lines. If a current is coupled into the equipotential bonding lines, the resulting current
671 flows through the shield of the PROFIBUS line (see section 2.1.1). The resulting current
672 flowing through the cable shield couples disturbances into the data wires of the
673 PROFIBUS line.
674
675 Figure 37: Meshes in an equipotential bonding system with star topology
676 In the past, it was recommended to use equipotential bonding lines with large cross-
677 sectional area (CSA) and lay them in parallel with the bus line and very close to it and
678 typically connect them only to the devices in order to avoid current flows through the
679 PROFIBUS line shields. These lines are shown in Figure 38.

680
681 Figure 38: PROFIBUS lines and equipotential bonding lines
682 The main idea behind the setup shown in Figure 38 is to make disturbance currents flow
683 through the low-resistance equipotential bonding line rather than through the cable
684 shield of the PROFIBUS line.
685 As the disturbance currents in plants, usually have high frequencies (see Table 1), it is
686 the impedance and not the ohmic resistance that is important for determining the cur-
687 rent distribution in the equipotential bonding system. As the impedance of a cable shield
688 is considerably lower than that of a solid copper conductor the major part of the current
689 potentially occurring in the mesh will flow through the cable shield and not through the
690 equipotential bonding conductor laid in parallel and intended to work as a relief line.
691

692 As can be seen in Figure 39, the additional equipotential bonding lines do not present
693 any improvement regarding the mesh size. The meshes are still big and, thus, sensitive
694 to inductive coupling.
695
696 Figure 39: Meshes with PROFIBUS lines and equipotential bonding lines
697

698 4.3.2 Solutions from standards and technical literature
699 The standards [DIN-EN 50310] and [IEC 60364-4-44] specify the earthing and equipo-
700 tential bonding measures for buildings with IT equipment. The explanations in the fol-
701 lowing section have been derived from these standards. In the [DIN-EN 50310] stand-
702 ard, four different types of equipotential bonding systems are distinguished, which are
703 shown in Figure 40.
704
705 Figure 40: Equipotential bonding systems referring to [DIN-EN 50310]
706 The equipotential bonding system type A has a star topology. Due to the usually long
707 transmission paths this star-topology system features high impedance between two de-
708 vices. The high impedances cause poor discharge of electromagnetic disturbances
709 coupled into the system. Seen under the aspects of EMC, type A systems are the least
710 suitable equipotential bonding systems for buildings with IT equipment, due to their high
711 impedance.
712 The equipotential bonding system type B has a ring topology. Although the ring topology
713 reduces the length of the protective conductors between two devices, the lines may
714 nevertheless feature high impedances, which, again, may affect or even prevent proper
715 discharge of electromagnetic disturbances/coupling.
716 The equipotential bonding system of type C has a locally meshed equipotential bonding
717 line. In the plant area, all metal parts such as cabinets, frames, supports and cable sys-
718 tems are locally meshed. By connecting all metal parts, a meshed equipotential bonding
719 system is formed, which features a low impedance due to its big number of short and

720 parallel transmission routes. A network with this kind of meshing of all conductive ob-
721 jects is called a Bonding Network (BN).
722 The equipotential bonding system of type D has meshed equipotential bonding lines
723 distributed over the entire building. Therefore, a common system should be laid over
724 several levels of the building (see Figure 41).
725
726 Figure 41: Meshed equipotential bonding system
727 The [DIN-EN 50310] recommends to use only meshed equipotential bonding system of
728 type D for newly built IT systems. A meshed equipotential bonding system of this kind is
729 also called a MESH-BN 1 if it is based on a common bonding network (CBN).
730 The goal of using a meshed equipotential bonding system is to reduce the line imped-
731 ance between two devices. For this purpose, as many parallel and electrically conduc-
732 tive connections as possible are needed between the devices of the plant. As this would
733 induce a tremendous cabling effort if only cables were used, the meshing is in parts re-
734 alized by using the metal parts of the plant such as pipes, frames, cabinets and cable
735 ducts. According to the [DIN-EN 62305-4] standard, it is also possible to include the
736 foundation earth electrode and the steel arming on the building floors into the equipo-
737 tential bonding system. In this case, however, the steel arming of the foundation earth
738 electrode must be either welded or permanently connected by other measures in order
739 to ensure electrical conductivity. [DIN 18014]
740 For new or modernized plants, a meshed equipotential bonding system can be easily
741 implemented. For plants with already existing equipotential bonding systems in star or
1
A MESH-BN is a meshed equipotential bonding system in which all supports, cabinets, robots, pipes
and frames of the plant equipment are connected to each other and, at many points, to the equipotential
bonding system (CBN).

742 ring topology there are suggestions for improvement by additional connections. The
743 suggested improvements are shown in Figure 42. On the left-hand side of the image
744 you can see the initial equipotential bonding system, and on the right-hand side the im-
745 proved system. The improvement consists in adding equipotential bonding conductors
746 between the devices, which are represented by thick lines in the drawing.
747
748 Figure 42: Improved equipotential bonding systems referring to [DIN-EN 50310]
749

751 The [DIN-EN 50310] standard is applicable to automation systems with

752 PROFIBUS/PROFINET devices. When constructing or reconstructing such systems, a
753 meshed equipotential bonding system that comprises the entire copper-based
754 PROFIBUS/PROFINET network should be implemented. A meshed equipotential bond-
755 ing system for the manufacturing plant example discussed earlier in this document
756 could look like the example shown in Figure 43. In plants with considerable field loads
757 such as induction furnaces or industrial microwave ovens, additional measures like
758 double shielding or cable laying in metal pipes might be necessary.
759
760 Figure 43: Meshed equipotential bonding
761

762 In the following section, meshed equipotential bonding in accordance with the [DIN-EN
763 50310] will be explained step by step. Lines with ring topology forming big meshes
764 around dedicated plant sections are the basis of this type of equipotential bonding. The
765 meshes are shown in Figure 44.
766
767 Figure 44: Ring lines in meshed equipotential bonding system
768 In order to ensure a low impedance, even at high frequencies, the lines shown in Figure
769 44 should be tin-plated or multi-wire copper lines. Lines of this type are also recom-
770 mended in [DIN-EN 61918].
771
772 In Figure 45 you can see additional lines between the ring lines and the devices of the
773 plant example. These stubs should be as short as possible. Additionally, the devices
774 should be connected to the ring line at several points in order to form many small
775 meshes. And the devices should be conductively interconnected to form a bonding net-
776 work. All connections must comply with the requirements of protective and functional
777 equipotential bonding, i.e. they must feature a low impedance and a sufficient ampacity.
778 And the appropriate measures must be taken to avoid unwanted loosening of the equi-
779 potential bonding points during plant operation.

780
781 Figure 45: Stubs of the meshed equipotential bonding system
782 In order to keep the branching points of the stubs on the ring line as simple and cost-
783 saving as possible, the connection blocks shown in Figure 46 and Figure 47 can be
784 used.
785

786 The connection blocks (Figure 46) are connected to the cable tray and at the same time
787 provide for functional earthing of the cable trays through the connected ring line.
788
789 Figure 46: Connection blocks (WPAK clamps)
790 (picture from Weidmller, manf.)
791
792 Figure 47: Stubs from ring line to devices (Picture Weidmller)]
793 Figure 47 shows the fine-wire ring line of the equipotential bonding system in silver/gray
794 color. It is screwed to the cable tray through bronze-colored connection blocks. The
795 connection block allows connecting stubs to the devices. The connection of the stubs is
796 shown in Figure 47.
797

798 Figure 48 shows the next optimization opportunity offered by a meshed equipotential
799 bonding system. On the ring line, there are additional earthing points which are marked
800 in red in the picture. These earthing points symbolize additional connections with the
801 equipotential bonding system of the building. These additional connections further lower
802 the impedance of the entire equipotential bonding system.
803
804 Figure 48: Meshed equipotential bonding via the foundation earth electrode
805 For the sake of electrical safety, the CBN must be connected to the foundation earth
806 electrode at least at one point. By adding more connection points, the foundation earth
807 electrode can become a part of the CBN and hence improve the local meshing of the
808 equipotential bonding system. Moreover, an equipotential bonding system over several
809 building levels is realized in this way, as the foundation earth electrode is integrated in
810 the supports and columns of the building construction. These additional access points to
811 the foundation earth electrode must be considered already in the early design phase of
812 the building.
813

814 Figure 49 shows how the foundation earth electrode can be integrated: it is grouted into
815 the concrete and can be connected to the equipotential bonding system through a
816 screw if required. [DIN-EN 62305-4]
817
818 Figure 49: Earthing points [DEH2016]
819

820 The following two figures clearly show the big advantage resulting from meshed equipo-
821 tential bonding. Figure 50 shows in red color a mesh formed by the cable shield of the
822 plant's PROFIBUS line connected at each end. The meshes are considerably smaller
823 than those used before in a star-topology equipotential bonding system (Figure 39). As
824 a result, less inductive coupling is likely to occur in the meshes of the equipotential
825 bonding system.
826
827 Figure 50: Mesh formed by a cable shield in a meshed equipotential bonding system
828

829 Additionally, many small meshes instead of few large ones are produced by meshing
830 the equipotential bonding system. They are shown in the example in Figure 51. Due to
831 the smaller meshes the equipotential bonding system has a lower impedance, which
832 prevents potential differences.
833
834 Figure 51: Many small meshes in a meshed equipotential bonding system
835 Besides the lower impedance, smaller meshes provide another benefit with respect to
836 electrostatic discharge. Non-metal conveyors, e.g. made of rubber or plastics, may
837 cause electrostatic charges in a plant.
838

839
840
841 Figure 52: Example of electrostatic discharge
842 Upon electrostatic discharge the generated currents return to their place of origin.
843 Therefore, plant sections where electrostatic discharge is likely to occur should be con-
844 ductively interconnected. A finely meshed equipotential bonding system improves the
845 impedance of such connections along the conveyance path.
846 The statements with respect to a fine granular meshed equipotential bonding system
847 also apply to the interior of cabinets and the interconnection between cabinets. A good
848 potential equalization should be also established inside cabinets. A blank metal mount-
849 ing plate (e.g. a tinned steel sheet) in combination with blank metal DIN-rails can
850 achieve this, for example. The mounting plate shall be tied to the grounding system with
851 low impedance. When using multiple cabinets, strung together, it is recommended to
852 connect the mounting plates of the adjacent cabinets by ground straps.
853
854 From this section of the document, the recommendation R3 is derived:
Use mesh equipotential bonding systems as finely as possible (MESH-BN).
855

856 4.4 Connection of PROFIBUS/PROFINET cable shields
857 The PROFIBUS or PROFINET cable shields are connected through the connector plug.
858 Inside the connector, the cable shield is connected to the connector housing. The con-
859 nector housing is connected to the equipotential bonding system, usually via the con-
860 nector plug and the connected device.
861 4.4.1 Problem description with solutions from standards and technical literature
862 As the cable shield makes use of the active shielding principle, the shield should be
863 connected to the equipotential bonding system at least at each end. Only then the cur-
864 rents generated by electromagnetic interference can flow through the cable shield and
865 generate an opposing field. This opposing field produces a nearly field-free area inside
866 the cable shield. By virtue of the field-free area, no disturbances are coupled into the
867 data wires. Caution: Cables shields connected at both ends of a line may cause prob-
868 lems in hazardous areas, as sparks may be produced when the shield connection is
869 opened. A finely meshed equipotential bonding system in combination with multiple
870 shield contacts can minimize this problem.
871 In order to allow the induced current flow to emerge freely, it is important that the con-
872 nection between the cable shields and the connector housings have a low impedance.
873 For this reason, connector housings that allow for low-impedance connections on a
874 large contact area between the cable shield and the device should be used preferably
875 [NE 98].
876 However, a low-impedance connection between the connector plug and the cable shield
877 does not, on its own, produce a low impedance path for the currents. It will also be nec-
878 essary to ensure that the connected devices (PROFIBUS or PROFINET) have a low-
879 impedance connection between the connector shroud and the functional earth connect-
880 or.
881 Note: Connecting the shield does not serve the purpose of potential equalization
882

883 In case a device does not yield a sufficient contact of the cable shield, an additional
884 shield connection can be established close to the device. Figure 53 shows as an exam-
885 ple of such a cable shield earthing point next to the device.
886
887 Figure 53: Earthing of the cable shield close to a PROFINET device
888 If the environmental conditions allow for additional connections of the cable shield to the
889 equipotential bonding system, these are permitted according to [NE 98].
890
891 Figure 54: Multiple earthing of the cable shield of a PROFIBUS line

892 Figure 54 shows two PROFIBUS lines. The upper line is connected to the common
893 bonding network (CBN) at its ends, only, whereas the lower line has two more connec-
894 tion points. Every supplementary connection of the cable shield of the lower PROFIBUS
895 line shown in Figure 54 with the equipotential bonding system reduces the size of the
896 mesh into which electromagnetic disturbances or fields could be connected. Of course
897 the impedance of the equipotential bonding system is of major importance. For this rea-
898 son, a meshed equipotential bonding system should be set up as described in section
899 4.3. Figure 55 shows an example of such an additional cable shield earthing.
900
901 Figure 55: Additional earthing of the cable shield (Product Indu Sol, Photo Niemann)
902

903
905 For PROFINET and PROFIBUS connections, special attention should be paid to the
906 connector housing which should have a large contact surface for the cable shield. Addi-
907 tionally, the PROFIBUS and PROFINET devices should have a low-impedance connec-
908 tion to the CBN to be able to easily discharge disturbance currents. As already stipulat-
909 ed in the Installation Guidelines for Cabling and Assembly ([PRO2009] und [PRO2015-
910 1]) from the PROFIBUS User Organization, the PROFINET and PROFIBUS lines can
911 also be earthed directly at bus nodes using functional earth clamps. This additional
912 functional earthing through functional earth clamps may bridge high impedances from
913 the connector plugs that may occur.
Provide for functional earthing of PROFIBUS/PROFINET cable shields at each

cable end by connection to big contact surfaces (low impedance).
915
916
917

918 4.5 Motor lines
919 This recommendation intends to reduce electromagnetic interference in a plant. Many

920 vendors of frequency converters recommend using shielded motor lines. Shielding the
921 motor lines avoids the emission of electrical, magnetic and electromagnetic fields by the
922 motor lines. With this, it prevents disturbance coupling into lines laid in parallel with it.
924 As shown in Figure 56, the cable shield is run around the active conductor lines (L1, L2,
925 L3) and the protective earth conductor (PE) of the motor line. The shielding prevents the
926 propagation of electromagnetic interference from inside the lines to other current circuits
927 located near the motor line. Coupling inside the line, however, is not suppressed by the
928 cable shield. This means that disturbances in an internal conductor of the line may be
929 coupled into other internal conductors through electric or magnetic fields.
930
931 Figure 56: Shielded motor line
932

933 4.5.1.1 Capacitive coupling in motor lines
934 Capacitive coupling occurs as soon as there is a potential difference between two paral-
935 lel lines. The potential differences between the three conductor lines L1 to L3 are pro-
936 duced by the 120 phase shift between the individual line voltages. Additionally, the
937 pulse width modulation of the frequency converter causes additional capacitive currents
938 between the individual phases of the protective conductor and the cable shield. As both
939 the shield and the protective conductor are usually voltage-free, additionally potential
940 differences to the conductor lines L1 to L3 occur. As a result, there a various coupling
941 capacitances inside a motor line which are shown in Figure 57.
942
943 Figure 57: Capacitive coupling in shielded motor lines
944

945 4.5.1.2 Inductive coupling in motor lines
946 The current flow in the conductor lines L1 to L3 generates several magnetic fields in the
947 motor line. Therefore, magnetic field lines surround every conductor in Figure 58.
948
949 Figure 58: Magnetic field lines in a motor line
950 The magnetic field lines couple inductive disturbances into the other conductors of the
951 motor line. Figure 59 illustrates this fact for a better understanding.
952
953 Figure 59: Inductive coupling between L1 and L2
954 Figure 59 shows the coupling inductance M12 between the two conductors L1 and L2 of
955 the motor line. There are coupling inductances between all conductors of the motor line,
956 where the intensity of the inductance depends not only on the current and frequency of
957 the conductors, but also on the distance between them.
958

959 As shown in Figure 60, the distance between L2 and the protective conductor is higher
960 than the distance of the other two conductors, the coupling inductance ML2PE is lower
961 than the other two inductances.
962
963 Figure 60: Inductive coupling in a motor line
964 Because the conductors L1, L2 and L3 induce currents of different intensity in the pro-
965 tective conductor -because of their different coupling inductances- the induced voltages
966 do not compensate each other. Instead, they create a common voltage, which appears
967 as a current flow in the protective conductor, as soon as it is connected several times to
968 the equipotential bonding system. The current generated in the protective conductor
969 causes potential differences in the equipotential bonding system. Experience has shown
970 that the current flow may reach up to 10% of the phase currents.
971

972 4.5.2 Solutions from standards and specialist literature
973 As the motor line is an important part for CE certification, the frequency converter doc-
974 umentation usually specifies the cable type. This is, for example, the case in the docu-
975 mentation from Siemens [SIE2014], Danfoss [DAN2015], Lenze [LEN2015] and ABB
976 [ABB2005]. All of these four vendors prescribe shielded motor lines. However, the struc-
977 tures of their motor lines differ in detail. The mentioned vendors are presented here as
978 examples in order to allow for a better understanding. The list does not claim to be ex-
979 haustive. Lenze describes asymmetrical motor lines as shown in Figure 56 in its docu-
980 ments. ABB and Danfoss do not make any statement in their document about the type
981 of motor line. Figure 61 shows an excerpt from the manufacturer documentation from
982 Danfoss [DAN2015]. At you can see the connection line of the motor. It stands out
983 that a separate protective conductor (PE) is to be implemented. At the connection point
984 of the frequency converter, it becomes evident that the motor line has three phase
985 lines and one cable shield only. The motor line in the figure does not have a protective
986 conductor.
987

988
989 Figure 61 Typical installation of a frequency converter from [DAN2015].
990 Figure 62 shows an excerpt from a frequency converter documentation from ABB
991 [ABB2005]. At the drive unit, you can see that a shielded motor cable is to be used
992 for connection. It is, however, noticeable that the protective conductor of the drive unit
993 does not run inside the shielded motor cable. This means a symmetrical motor line with
994 a separate protective conductor is used in this case.

995
996 Figure 62: Drive with low voltage power supply from [ABB2005]
997 For a shielded motor line, a separate protective conductor as shown in Figure 61 and
998 Figure 62 provides the advantage that no disturbances from inside the motor line can be
999 coupled in the protective conductor.
1000 Siemens provides in its document [SIE2014] a detailed description of the possible ef-
1001 fects asymmetrical motor lines may have and recommends to use symmetrical three-
1002 phase current lines in order to ensure a better electromagnetic compatibility. As can be
1003 seen in Figure 63, symmetrical motor lines should have either three protective conduc-
1004 tors inside the motor line or one protective conductor laid separately. When a motor line
1005 with three protective conductors is used, these conductors should be arranged symmet-
1006 rically around the conductor lines L1 to L3. This considerably reduces the total of in-
1007 coupled voltages as the distances between the protective conductors and the corre-
1008 sponding conductor lines are equal.

1009
1010 Figure 63: Symmetrical motor lines as recommended by [SIE2014]
1011 Another measure for the reduction of disturbances when using frequency converters is
1012 the usage of filters. However, the usage of filters is vendor-specific and, therefore not
1013 considered any further in this document.
1015 In order to ensure safe plant operation, the load of the equipotential bonding system
1016 through voltages and currents coupled into it should be kept as low as possible. For this
1017 reason, the vendor instructions on how to connect the motor lines should be strictly ob-
1018 served. Symmetrical motor lines minimize inductive and capacitive coupling into the pro-
1019 tective conductor of the motor line. As, however, coupling cannot be fully prevented, the
1020 motor and the frequency converter should be connected to the equipotential bonding
1021 system with a low-impedance connection. Due to this connection, it is possible that the
1022 currents caused by voltages coupled into the system can flow back via the equipotential
1023 bonding system and do not affect the data transfer via the PROFIBUS/PROFINET line.
1025
Use shielded motor cables in accordance with the manufacturer specifications

and provide for big-surface earthing of the shield at each end (low impedance).
Earth the motor.
If not excluded by the manufacturer of the frequency converter, preferably use

symmetrical shielded three-wire motor cables with separate protective conduc-
tor.
1026
1027

1028 4.6 Earthing of the negative pole of 24 V power supply
1029 This section deals with the earthing of the negative poles of 24 V power supplies. Such
1030 a 24 V power supply is shown in Figure 64. In addition to the four remote I/O there is
1031 also a power supply unit in the figure.
1032
1033 Figure 64: 24 V power supply in a manufacturing plant
1034
1035 According to the [DIN-EN 60204-1] and [DIN-EN 60950-1] standards there are two per-
1036 missible methods to set up the protective mechanisms in 24 V power supply circuits,
1037 and they are completely different.
1038
1039 The first variant consists in using SELV current circuits 2. In an emergency or in case of
1040 a fault, these current circuits carry only safety extra low voltage. For this reason, SELV
1041 current circuits are insulated from all other current circuits and from the earthing system
1042 of the plant. As a fuse in a SELV current circuit can be triggered only if there is a short-
1043 circuit between the positive and the negative pole, but not if a connection between the
1044 positive pole and earth exists, an insulation monitoring system must be provided to de-
1045 tect the earth connection. Usually, such a monitoring system entails additional expendi-
1046 ture for the monitoring device and is therefore only used for special applications (e.g. in
1047 the oil and gas industry).
1048
2
SELV Safety Extra Low Voltage

1049 More often, however, PELV current circuits 3 are used. Current circuits of this kind also
1050 provide for protection against electrical shock. In this case, however, it is required to
1051 connect the negative pole of the power supply to earth or to the CBN at least at one
1052 point close to the power supply unit. This allows, for example, that in case of an insu-
1053 lation fault the positive pole of the 24 V power supply unit gets in contact with earth,
1054 and a current circuit is formed. The resulting short circuit current triggers the fuse.
1055 The earth connection of the negative pole is shown in Figure 65. This figure is a simpli-
1056 fied representation of the manufacturing plant example in Figure 64 and can also be
1057 applied to the process industry. For the sake of simplicity, details such as fuses or ter-
1058 minals have been deliberately left out.
1059
1060 Figure 65: Simplified representation of a 24 V power supply circuit
1061
3
PELV Protective Extra Low Voltage

1063 Unwanted earthing of the negative pole, hereinafter called multiple earthing, usually
1064 causes problems, related to earthing in the 24 V power supply current circuits. Accord-
1065 ingly designed devices may cause multiple earthing, for example. In the example in Fig-
1066 ure 66, this additional connection to earth is present at the outmost remote I/O. Earth
1067 connections of this kind usually occur when the plant builders earth current circuits of a
1068 plant section without checking if a central earth connection has already been installed.
1069
1070 Figure 66: Multiple earthing in a 24 V power supply circuit
1071 Due to multiple earthing a connection to the equipotential bonding system emerges.
1072 This connection with an undefined resistance is shown in Figure 66. The resistance of
1073 the equipotential bonding system is connected in parallel with the negative line of the 24
1074 V power supply circuit. With this parallel connection, the following scenarios are possi-
1075 ble:
1076 Scenario 1: The resistance of the equipotential bonding system is lower than
1077 the line impedance.
1078 Scenario 2: There is a break in the negative line.
1079 Scenario 3: The resistance of the equipotential bonding system is higher than
1080 the line impedance.
1081 These three scenarios are further discussed in the following subsections.

1082 4.6.1.1 Earthing of 24 V power supply circuits, scenario 1
1083 If the 24 V power supply circuit features multiple earthing, the total current is divided at
1084 the two earthing points according to the Kirchhoff Current Law. This scenario is shown
1085 in Figure 67.
1086
1087 Figure 67: Earthing of 24 V power supply circuits, scenario 1
1088 As, in this case, the resistance of the equipotential bonding system is lower than the
1089 impedance of the negative line, the major part of the total current flows through the
1090 equipotential bonding system. As a result, the equipotential bonding system is loaded
1091 with a direct current that should flow through the negative line of the power supply cir-
1092 cuit. The cable shields of the data and motor lines are also connected to the equipoten-
1093 tial bonding system at several points, so that the currents might also flow through them
1094 and damage them.
1095

1097 If the negative line of the 24 V power supply circuit is interrupted as shown in Figure 68,
1098 the current is not divided at the multiple earthing point at the remote I/O, but completely
1099 returns to the power supply unit through the equipotential bonding system.
1100
1102 If the total current completely returns to the power supply unit through the equipotential
1103 bonding system, this causes an additional load of the equipotential load system. Any
1104 load of the equipotential bonding system, be it direct current or alternating current, re-
1105 sults in voltage drops. Moreover, shielded cables with low line impedance are in the
1106 equipotential bonding system; in order to ensure full functionality, they should be
1107 earthed at several points. As a result, however, current would also flow through the ca-
1108 ble shield. These cable shields do not have high current ratings and are likely to be
1109 damaged by the current.
1110

1112 The third scenario is shown in Figure 69. Here, the resistance between the equipoten-
1113 tial bonding system and the multiple earthing points is higher than the line impedance of
1114 the negative line. As a result, the currents are divided at the earthing points, as already
1115 described for scenario 1. In this case, however, a stray current from the equipotential
1116 bonding system flows through the 24 V power supply circuit. The reason why there is a
1117 stray current in the equipotential bonding system is further described in section 4.2.1.
1118
1120 The voltage drops produced by the stray current in the equipotential bonding system
1121 result in potential differences in the negative line. The consequence of these potential
1122 differences may be that the remote I/O unit is no longer supplied with the required
1123 mains voltage and fails. Furthermore, the stray current may be either a direct current or
1124 an alternating current, and this may cause various disturbance reactions.
1125 4.6.2 Solutions from standards and technical literature
1126 In the [DIN-EN 60204-1], the different types of earth connections are specified. A 24 V
1127 power supply circuit has to be earthed at one end or at any point of the current circuit. In
1128 addition, the standard describes how earthing should be done. The earthing point
1129 should be located close to the power supply unit or directly next to, if possible, on the
1130 installation panel; it has to be easily accessible and must be disconnectable to allow for
1131 insulation measurements. If, however, a non-earthed 24 V power supply circuit with
1132 power supply unit is installed, an insulation measurement must be provided in the sec-
1133 ondary circuit according to [DIN-EN 61557-8]. In the event of an alarm, it may be used

1134 either for immediate disconnection or for outputting an optical and/or acoustic signal,
1135 depending on the risk level.
1137 If a PELV current circuit is chosen for 24 V power supply, it should only be connected
1138 once to the functional equipotential bonding system/CBN directly at the power supply
1139 unit and using a disconnect terminal. When commissioning the 24 V power supply cir-
1140 cuit, you can perform an insulation measurement and make sure that there is no addi-
1141 tional connection to the equipotential bonding system. However, if you discover multiple
1142 earthing points during this measurement, you will need to check if it is possible to re-
1143 move them. Multiple earthing points in 24 V power supply circuits have to be avoided,
1144 due to the reasons described in Section 4.6.1.
1145 Devices that have a fixed connection between functional earth and the minus of the 24
1146 V power supply circuit, create multiple earthing of the 24 V power supply circuit. In this
1147 case, the 24 V power supply circuit should have a small size, to limit the impact of a
1148 multiple earthing, described in section 4.6.1. It is also recommended to limit the size of a
1149 24 V power supply circuit to the inner of cabinets or adjacent cabinets. A good equipo-
1150 tential bonding inside the cabinets and between cabinets has to be ensured. In case, 24
1151 V power supply circuits cover larger distances, the effects described in section 4.6.1.
1152 have to be considered. A meshed equipotential bonding system with low impedance, as
1153 described in section 4.3.3. can reduce, but not eliminate, the impact of a multiple earth-
1154 ing.
1155 If the multiple earthing points result from earthing conductors that are an integral part of
1156 the devices, it may be necessary to provide a separate 24 V power supply circuit. Multi-
1157 ple earthing of 24 V power supply circuits has to be avoided. In order to ensure that no
1158 multiple earthing points occur throughout long plant life-cycles, additional current moni-
1159 toring of the earthing (see Figure 70) can be provided. The current monitoring equip-
1160 ment should be capable of measuring both direct currents and alternating current and of
1161 recognizing all potential operating faults that may result from possible future plant en-
1162 hancements or from the replacement of devices.
1163 Besides the grounded operation of 24 V power supply circuits an ungrounded (potential
1164 free) operation is also permissible. In this case, a ground fault monitoring has to be pro-
1165 vided.

1166
1167 Figure 70: Optimal earthing of 24 V power supply circuits
1168
sumer as short as possible, it is recommended to use several smaller pow-
er supplies rather than a single big one.
1170
1171

1172 5 Summary of the recommendations for the design of

1173 PROFIBUS and PROFINET networks with little disturbance
1174 The six recommendations R1 to R6 help avoid disturbances by electromagnetic inter-
1175 ference in a plant with PROFIBUS and PROFINET networks. The measures, proposed
1176 in this document have to be synchronized between planner, installer and operator of the
1177 plan.
Provide both protective equipotential bonding and functional equipotential

R1
bonding through a common bonding network (CBN).
R2 Preferably realize 230/400 V power supply using a TN-S system.
R3 Mesh equipotential bonding systems as finely as possible (MESH-BN).
Provide for functional earthing of PROFIBUS/PROFINET cable shields at

R4
each cable end by connection to big contact areas (low impedance).
Use shielded motor cables in accordance with the manufacturer specifi-

cations and provide for big-surface earthing of the shield at each end (low
impedance).
R5 Earth the motor.
If not excluded by the manufacturer of the frequency converter, preferably

use symmetrical shielded three-wire motor cables with separate protec-
tive conductor.
R6
sumer as short as possible, it is recommended to use several smaller
power supplies rather than a single big one.
1178
1179 When planning a system, be sure to consider all recommendations if possible. Any later
1180 plant adaptation that may become necessary in ongoing operations due to disturbances
1181 caused by electromagnetic interference implies heavy additional expenditure.

1182 Therefore, power supply systems in new or modernized plants should be designed as
1183 TN-S systems only. The TN-S systems prevents operating currents from the neutral
1184 conductor to enter the equipotential bonding system as there is only a connection be-
1185 tween the protective conductor and the neutral conductor in the LVMD. As a result, cur-
1186 rent flows that may cause potential differences in the equipotential bonding system are
1187 avoided.
1188 When implementing such a system, you can also provide for common protective and
1189 functional equipotential bonding, as it is no longer possible to ensure consistent separa-
1190 tion of these two equipotential bonding systems in modern plants. If a common bonding
1191 network (CBN) is used, make sure that it meets the requirements on proper protective
1192 and functional earthing. The equipotential bonding system must feature a sufficient am-
1193 pacity and low impedance. For the sake of electromagnetic compatibility, the connec-
1194 tions should be protected against unintentional loosening and adverse weather condi-
1195 tions.
1196 Optimal low-impedance equipotential bonding can be achieved by using a meshed

1197 equipotential bonding system in compliance with DIN EN 50310. A meshed equipoten-
1198 tial bonding system features a multitude of small meshes that reduce the impedance.
1199 Low impedance reduces the occurrence of potential differences caused by coupling.
1200 In addition, the cable shields of PROFIBUS and PROFINET lines should be connected
1201 to the equipotential bonding system at least at both ends. The connection should be
1202 made through the connector plug of the PROFIBUS/PROFINET device. The connection
1203 between the connector shroud and the functional earth connector should also have a
1204 low impedance. Additionally, there should be further connections between the cable
1205 shields and the equipotential bonding system in order to reduce the size of the meshes
1206 for coupling (see section 4.4.1).
1207 Currents in the equipotential bonding system could also be caused by the motor lines.
1208 Inside the motor lines, inductive and capacitive coupling may generate current. This can
1209 be avoided by using shielded motor lines, which in fact are already prescribed by the
1210 vendors of the corresponding frequency converters.
1211 When implementing 24 V power supply circuits, multiple earthing should basically be
1212 avoided. Multiple earthing of the negative pole in a 24 V power supply circuit may allow
1213 currents from the equipotential bonding system to reach into the 24 V power supply cir-
1214 cuit and cause potential shifts. These potential shifts may result in the failure of units

1215 when the voltage falls below their rated voltage. Moreover, currents from the 24 V pow-
1216 er supply circuit may reach into the equipotential bonding system. This system, howev-
1217 er, also comprises cable shields which do not feature a sufficiently high ampacity and
1218 will heat with increasing current. This means that multiple earthing of a 24 V power sup-
1219 ply circuit may present a fire hazard (see section 4.6.1.3). In order to avoid this, 24 V
1220 power supply circuits should be earthed only once through the equipotential bonding
1221 system. A simple monitoring function established by implementing a current monitor at
1222 the single earthing point allows you to identify multiple earthing of the 24 V power sup-
1223 ply circuit during ongoing plant operation.
1224
1225 6 Suggestions for possible acceptance tests

1226 It is recommended, for future acceptance tests of PROFIBUS or PROFINET systems, to
1227 also take into account their electromagnetic compatibility. To be sure, to remember the
1228 essential points, you should use a checklist as shown in Table 2. The table has the
1229 same layout as the checklists suggested in the Installation Guideline for Commissioning
1230 from PROFIBUS User Organization.
1231

1232 Table 2: Suggestions for possible acceptance tests
Plant Installation made by
Comments
EMC checklist
No. Check request YES NO Comment
1. Mains supply
Mains supply network preferably imple-
1.1
mented as TN-S system?
1.2 PEN bridge provided in LVMD?
1.3 No other PEN bridges installed?

Insulation test between neutral conductor
1.4 and protective conductor performed with
open PEN bridge?
Current monitoring provided at PEN bridge?
1.5
(optional)
1233
2. Equipotential bonding system

Common protective and equipotential bond-
2.1
ing network (CBN) installed?
Meshed equipotential bonding system in-
2.2
stalled?
Tin-plated copper strand used to ensure low
2.3 impedance of the equipotential bonding
system?
Is the current rating of the equipotential
2.4
bonding conductor sufficient?
3. Connection of PROFIBUS/PROFINET cable shields
Is functional earthing by means of connector
3.1 plugs provided at each end of the
PROFIBUS/PROFINET cable shields?
Do the used connector plugs have suffi-
3.2 ciently big contact surfaces for the cable
shields?
Does the cable shield feature a low-
3.3 impedance connection to the equipotential
bonding system?
4. 24 V power supply circuits
4.1 Is the 24 V power supply circuit earthed?

Is the functional earthing point of the nega-

4.2 tive pole in the 24 V power supply circuit
located close to the power supply unit?
Is the 24 V power supply circuit earthed only
4.3
once?
Was the insulation test between earth and
4.4 the equipotential bonding system performed
with open earth connector?
Is current monitoring of earth connection
4.5
provided (optional)?
Where a multiple earth connection of a 24 V
4.6 supply circuit is present: Is the spatial extent
of the 24 V supply circuit limited?
Where a multiple earth connection of a 24 V
supply circuit is present: Is a low impedance
4.7
of the equipotential bonding system en-
sured?
5. Cables outside cabinets laid in cable trays
Data lines laid separately from power supply
5.1
lines?
Minimum distances according to [DIN-EN .
50174-2] and [IEC 60364-4-44] observed? If
5.2
required, [NE 98] should be observed for
application in the process industry
1234
6. Motor lines
Are motor cables according specification of
6.1 the manufacturer of the frequency converter
in use?
Are the motors earthed?
6.2
Recommended for the sake of EMC if not
excluded by the manufacturer of the fre-
quency converter:
6.2
Were shielded symmetrical motor lines or
shielded three-wire motor lines with sepa-
rate protective conductor used?
1235

1236 7 List of reference documents

1237 [ABB2005] ABB: EMV gerechte Installation und Konfiguration eines Antriebs-
1238 Systems, 2005. (EMC compliant installation and configuration of a drive sys-
1239 tem, 2005)
1240 [DAN2015] Fredstedt, J.: Wissenswertes ber Frequenzumrichter, 2016. (Interesting

1241 facts about frequency converters, 2016)
1242 [DEH2016] Dehn: Erdungsfestpunkte. https://www.dehn.de/de/197/4785/Familie-

1243 html/4785/Erdungsfestpunkte.html, 13.01.16. (Earth clips)
1244 [DIN 18014] Deutsches Institut fr Normen e. V.: Fundamenterder - Planung, Ausfh-
1245 rung und Dokumentation. DIN Deutsches Institut fr Normung e. V., Berlin,
1246 2014. (German Institute for Standardization: Foundation earth electrode -
1247 Planning execution and documentation, 2014)
1248 [DIN-EN 50174-2] Deutsches Institut fr Normen e. V.: Informationstechnik -

1249 Installation von Kommunikationsverkabelung- Teil 2: Installationsplanung und
1250 Installationspraktiken in Gebuden. Deutsche Kommission Elektrotechnik
1251 Elektronik und Informationstechnik, Brssel, 2015. (German Institute for
1252 Standardization: Information technology - Cabling installation - Part 2: Instal-
1253 lation planning and practices inside buildings)
1254 [DIN-EN 50310] Deutsches Institut fr Normen e. V.: Anwendung von Manahmen
1255 fr Erdung und Potenzialausgleich in Gebuden mit Einrichtungen der Infor-
1256 mationstechnik. Deutsche Kommission Elektrotechnik Elektronik und Infor-
1257 mationstechnik, Brssel, 2011. (German Institute for Standardization: Appli-
1258 cation of equipotential bonding and earthing in buildings with information
1259 technology equipment)
1260 [DIN-EN 60204-1] Deutsches Institut fr Normen e. V.: Sicherheit von Maschinen -
1261 Elektrische Ausrstung von Maschinen-. VDE-Verlag, Berlin, 2014. (German
1262 Institute for Standardization: Safety of machinery - Electrical equipment of
1263 machines - Part 1: General requirements)
1264 [DIN-EN 60950-1] Deutsches Institut fr Normen e. V.: Einrichtungen in der Informati-
1265 onstechnik - Sicherheit - Teil 1: Allgemeine Anforderungen. VDE-Verlag, Ber-
1266 lin, 2014. (German Institute for Standardization: Information technology
1267 equipment - Safety - Part 1: General requirements)

1268 [DIN-EN 61557-8] Deutsches Institut fr Normen e. V.: Elektrische Sicherheit in Nie-
1269 derspannungsnetzen bis AC 1000 V und DC 1500 V. DIN Deutsches Institut
1270 fr Normung e. V. und VDE Verband der Elektrotechnik Elektronik Informati-
1271 onstechnik e. V., Berlin, 2007. (German Institute for Standardization: Electri-
1272 cal safety in low voltage distribution systems up to 1000 V a.c. and 1500 V
1273 d.c. - Equipment for testing, measuring or monitoring of protective measures
1274 - Insulation monitoring devices for IT systems)
1275 [DIN-EN 61918] Deutsches Institut fr Normen e. V.: Industrielle Kommunikations-

1276 netze Installation von Kommunikationsnetzen in Industrieanlagen. DIN
1277 Deutsches Institut fr Normung e. V. und VDE Verband der Elektrotechnik
1278 Elektronik Informationstechnik e. V., Berlin, 2014. (German Institute for
1279 Standardization: Industrial communication networks - Installation of commu-
1280 nication networks in industrial premises)
1281 [DIN-EN 62305-4] Deutsches Institut fr Normen e. V.: Blitzschutz - Teil 4: Elektrische
1282 und elektronische Systeme in baulichen Anlagen. DIN Deutsches Institut fr
1283 Normung e. V. und VDE Verband der Elektrotechnik Elektronik Informations-
1284 technik e. V., Berlin, 2011. (German Institute for Standardization: Protection
1285 against lightning - Electrical and electronic systems within structures)
1286 [DIN-VDE 0100-100] Deutsches Institut fr Normen e. V.: Errichten von Nieder-
1287 spannungsanlagen Teil 1: Allgemeine Grundstze, Bestimmungen allge-
1288 meiner Merkmale, Begriffe. DIN Deutsches Institut fr Normung e. V. und
1289 VDE Verband der Elektrotechnik Elektronik Informationstechnik e. V., Ber
1290 [GH2015] Ghringer, H.-L.: Technische Strategie Sitzung 2015. Status-Bericht der
1291 Troubleshooting Arbeitsgruppe, 2015.
1292 [IEC 60364-4-44] Deutsches Institut fr Normen e. V.: (DIN VDE 0100-444) Errichten
1293 von Niederspannungsanlagen - Teil 4-444: Schutzmanahmen - Schutz bei
1294 Strspannungen und elektromagnetischen Strgren (IEC 60364-4-44).
1295 DIN Deutsches Institut fr Normung e. V. und VDE Verband der Elektrotech-
1296 nik Elektronik Informationstechnik e. V., Berlin, 2010.
1297 (IEC 60364-4-44 Low-voltage electrical installations -. Part 4-44: Protection
1298 for safety - Protection against voltage disturbances and electromagnetic dis-
1299 turbances)

1300 [IEC 60364-5-54] Deutsches Institut fr Normen e. V.: Errichten von Niederspan-
1301 nungsanlagen - Teil 5-54: Auswahl und Errichtung elektrischer Betriebsmittel
1302 - Erdungsanlagen und Schutzleiter (DIN-VDE 0100-540); Deutsche ber-
1303 nahme HD 60364-5-54:2011. Deutsche Kommission Elektrotechnik El-
1304 ektronik und Informationstechnik, Frankfurt am Main, 2012.
1305 (IEC 60364-5-54: Low-voltage electrical installations - Part 5-54: Selection
1306 and erection of electrical equipment - Earthing arrangements and protective
1307 conductors)
1308 [KLE2016] Kleinwchter: Elektrostatische Aufladung verstehen und sicher messen.

1309 http://www.kleinwaechtergmbh.de/cms/upload/downloads/allgemein/ESD_An
1310 leitung.pdf, 18.01.16.
1311 [LEN2015] Lenze SE: Gertehandbuch L-force Drives 9400, 2015.
1312 [NA 114] NAMUR-Arbeitskreis 2.6 Feldbus und 1.8 Montage: Best Practice Feld-
1313 busanwendungen. Auswahl, Planung, Montage, Inbetriebnahmeund Betrieb
1314 von Feldbussen, Leverkusen, 2012.
1315 [NE 98] NAMUR-Arbeitskreis 4.6 EMV: EMV-gerechte Planung und Installation von
1316 Produktionsanlagen, Leverkusen, 2007.
1317 [NIE2017] Niemann, K.-H. Niemann, K.-H.: Produkt: Indu-Sol, Foto: Niemann. Email,
1318 Hannover, 2017.
1319 [PRO2009] PROFIBUS Nutzerorganisation e.V.: PROFINET Montagerichtlinie, Karls-

1320 ruhe, 2009. (PROFINET Installation Guideline)
1321 [PRO2015-1] PROFIBUS Nutzerorganisation e.V.: PROFIBUS. Montagerichtlinie.

1322 http://www.profibus.com/nc/download/installation-guide/downloads/profibus-
1323 installation-guideline/display/, 12.01.16. (PROFIBUS Installation Guideline for
1324 Cabling and Assembly)
1325 [RUD2011] Rudnik, S.: EMV-Fibel fr Elektroniker, Elektroinstallateure und Planer.

1326 Manahmen zur elektromagnetischen Vertrglichkeit nach DIN VDE 0100-
1327 444:2010-10. VDE-Verl., Berlin [u.a.], 2011.
1328 [SCH2008] Schmolke, H.: EMV-gerechte Errichtung von Niederspannungsanlagen.

1329 Planung und Errichtung elektrischer Anlagen nach den Normen der Gruppen
1330 0100 und 0800 des VDE-Vorschriftenwerks. VDE-Verl., Berlin, 2008.

1331 [SIE2014] Siemens: SINAMICS - Low VoltageProjektierungshandbuch. SINAMICS

1332 G130, G150, S120 Chassis, S120 Cabinet Modules, S150.
1333 http://w3app.siemens.com/mcms/infocenter/dokumentencenter/ld/InfocenterL
1334 anguagePacks/sinamics-projektierungshandbuch-lv/sinamics-
1335 projektierungshandbuch-lv-de.pdf, 26.11.15.
1336 [WOL2008] Wolfsperger, H. A.: Elektromagnetische Schirmung. Theorie und Praxis-

1337 beispiele. Springer, Berlin, Heidelberg, 2008.
1338 OL2015] Wolff, G. K.: Erdung - (K)ein Buch mit sieben Siegeln, Blomberg, 2015.
1339

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1387 Copyright by
1388
1389 PROFIBUS Nutzerorganisation e. V. (PNO)
1390 PROFIBUS & PROFINET International (PI)
1391 Haid-und-Neu-Str. 7 76131 Karlsruhe Germany
1392 Phone +49 721 96 58 590 Fax +49 721 96 58 589
1393 E-mail info@profibus.com
1394 www.profibus.com www.profinet.com


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Functional Earthing and Shielding of

PROFIBUS and PROFINET

Version 0.63 Date September 2017

Order No.: 8.102

File name: Earthing-Shielding_8102_d063_Sep17

Prepared by PI Working Group PG3 Installation Guide PB&PN in Committee CB PROFINET.

Copyright PNO 2017 - All Rights Reserved Seite 2 von 96

PROFIBUS Nutzerorganisation e.V. (PROFIBUS user organization, hereinafter in this

Copyright PNO 2017 - All Rights Reserved Seite 3 von 96

The recommendations for action are listed in the following table.

Provide both protective equipotential bonding and functional equipotential

R2 Preferably use a 230/400 V power supply using a TN-S system.

R3 Mesh equipotential bonding systems as finely as possible (MESH-BN).

Provide for the functional earthing of PROFIBUS/PROFINET cable shields at

Use shielded motor cables in accordance with the manufacturer specifi-

R5 Earth the motor.

If not excluded by the manufacturer of the frequency converter, preferably

Multiple earthing of 24-V-Supply-Circuits has to be avoided.

Copyright PNO 2017 - All Rights Reserved Seite 4 von 96

Management Summary ................................................................................................... 3

1.1 Introduction to the subject/problem ..................................................................... 10

2 EMI fundamentals .................................................................................................. 12

2.1 Couplings ............................................................................................................ 13

3 Fundamentals of equipotential bonding and shielding ............................................ 21

3.1 Cable shielding ................................................................................................... 21

4 Recommendations for the design of PROFIBUS and PROFINET networks

4.1 Combination of protective and functional equipotential bonding systems ........... 30

4.2.1.1 Mains supply network as TN-C system .................................................... 34

Copyright PNO 2017 - All Rights Reserved Seite 5 von 96

4.2.1.2 Mains supply network as TN-C-S system ................................................ 38

4.2.2 Descriptions in the relevant standards and specialist literature ....................... 45

4.5.1.1 Capacitive coupling in motor lines ............................................................ 72

4.5.2 Solutions from standards and specialist literature ........................................... 75

4.6.1.1 Earthing of 24 V power supply circuits, scenario 1 ................................... 82

4.6.2 Solutions from standards and technical literature ............................................ 84

5 Summary of the recommendations for the design of PROFIBUS and PROFINET

6 Suggestions for possible acceptance tests............................................................. 89

7 List of reference documents ................................................................................... 92

Copyright PNO 2017 - All Rights Reserved Seite 6 von 96

Figure 2: EMC interfaces of a device according to [RUD2011]...................................... 12

Figure 3: Coupling lines ................................................................................................. 13

Figure 4: Conductive coupling in equipotential bonding system 1 ................................. 14

Figure 5: Conductive coupling in equipotential bonding system 2 ................................. 15

Figure 6: Conductive coupling in equipotential bonding system 3 ................................. 15

Figure 7: Conductive coupling in equipotential bonding system 4 ................................. 16

Figure 8: Capacitive coupling ........................................................................................ 17

Figure 9: Inductive coupling ........................................................................................... 18

Figure 10: Repetition of capacitive coupling .................................................................. 22

Figure 11: Active shielding with one-sided functional earthing ...................................... 22

Figure 12: Induction in the cable shield ......................................................................... 23

Figure 13: Plant example from the process industry...................................................... 28

Figure 14: Plant example from the manufacturing industry ........................................... 29

Figure 15: Network systems .......................................................................................... 32

Figure 16: TN-C-S system as network system .............................................................. 33

Figure 17: TN-C system................................................................................................. 34

Figure 18: TN-C system with load ................................................................................. 35

Figure 22: TN-C-S system ............................................................................................. 38

Figure 23: Current flow in a TN-C-S system .................................................................. 39

Copyright PNO 2017 - All Rights Reserved Seite 7 von 96

Figure 26: TN-S system ................................................................................................. 41

Figure 27: TN-S system with load.................................................................................. 42

Figure 29: TN-S system with two PEN bridges .............................................................. 43

Figure 31: Ideal TN-S system ........................................................................................ 46

Figure 32: Star-type equipotential bonding .................................................................... 48