HIGH DENSITY PLASMA

SOURCES
Design, Physics and Performance

Edited by

Oleg A. Popov

Matsushita Electric Works

Woburn, Massachusetts

NOYES PUBLICATIONS
Park Ridge, New Jersey, U.S.A.
Copyright 8 1995 by Noyes Publications
No part of this book may be reproduced or utilized
in any form or by any means, electronic or
mechanical, including photocopying, recording or
by any information storage and retrieval system,
without permission in writing from the Publisher.
Library of Congress Catalog Card Number: 95-49 18
ISBN: 0-8155-1377-l
Printed in the United States

Published in the United States of America by

Noyes Publications
Mill Road, Park Ridge, New Jersey 07656

10987654321

Library of Congress Cataloging-in-Publication Data

High density plasma sources : edited by Oleg A. Popov

P. cm.
Includes bibliographical references and index.
ISBN 0-8155-1377-l
1. Plasma density. 2. Plasma generators. 3. High temperature
plasmas. 1. Popov, Oleg A.
QC718.5.D4H54 1995
621.044--dcZO 95-4918
CIP
 Editors
Rointan F. Bunshah, University of California, Los Angeles (Series Editor)
Gary E. McGuire, Microelectronics Center of North Carolina (Series Editor)
Stephen M. Rossnagel, IBM Thomas J. Watson Research Center
(Consutting Editor)

Electronic Materials and Process Technology

HANDBOOK OF DEPOSITION TECHNOLOGIES FOR FILMS AND COATINGS, Second
Edition: edited by Rointan F. Bunshah

CHEMICAL VAPOR DEPOSITION FOR MICROELECTRONICS: by Arthur Sherman

SEMICONDUCTOR MATERIALS AND PROCESS TECHNOLOGY HANDBOOK: edited

by Gary E. McGuire

HYBRID MICROCIRCUITTECHNOLOGY HANDBOOK: byJames J. Licari and Leonard R.

Enlow

HANDBOOK OF THIN FILM DEPOSITION PROCESSES AND TECHNIQUES: edited by

Klaus K. Schuegraf

IONIZED-CLUSTER BEAM DEPOSITION AND EPITAXY: by Toshinori Takagi

DIFFUSION PHENOMENA IN THIN FILMS AND MICROELECTRONIC MATERIALS:

edited by Devendra Gupta and Paul S. Ho

HANDBOOK OF CONTAMINATION CONTROL IN MICROELECTRONICS: edited by

Donald L. Tolliver

HANDBOOK OF ION BEAM PROCESSING TECHNOLOGY: edited by Jerome J. Cuomo,

Stephen M. Rossnagel, and Harold R. Kaufman

CHARACTERIZATION OF SEMICONDUCTOR MATERIALS, Volume 1: edited by Gary E.

McGuire

HANDBOOKOF PLASMA PROCESSINGTECHNOLOGY: edited by StephenM. Rossnagel,

Jerome J. Cuomo, and William D. Westwood

HANDBOOK OF SEMICONDUCTOR SILICON TECHNOLOGY: edited by William C.

O’Mara, Robert B. Herring, and Lee P. Hunt

HANDBOOK OF POLYMER COATINGS FOR ELECTRONICS, 2nd Edition: by James

Licari and Laura A. Hughes

HANDBOOK OF SPUTTER DEPOSITION TECHNOLOGY: by Kiyotaka Wasaand Shigeru

Hayakawa

HANDBOOK OF VLSI MICROLITHOGRAPHY: edited by William B. Glendinning and John

N. Helbert

CHEMISTRY OF SUPERCONDUCTOR MATERIALS: edited by Terre11 A. Vanderah

CHEMICAL VAPOR DEPOSITION OF TUNGSTEN AND TUNGSTEN SILICIDES: by John

E. J. Schmitz

ELECTROCHEMISTRY OF SEMICONDUCTORS AND ELECTRONICS: edited by John

McHardy and Frank Ludwig

V
vi Series

HANDBOOK OF CHEMICAL VAPOR DEPOSITION: by Hugh 0. Pierson

DIAMOND FILMS AND COATINGS: edited by Robert F. Davis

ELECTRODEPOSITION: by Jack W. Dini

HANDBOOK OF SEMICONDUCTOR WAFER CLEANING TECHNOLOGY: edited by

Werner Kern

CONTACTS TO SEMICONDUCTORS: edited by Leonard J. Brillson

HANDBOOK OF MULTILEVEL METALLIZATION FOR INTEGRATED CIRCUITS: edited

by Syd R. Wilson, Clarence J. Tracy, and John L. Freeman, Jr.

HANDBOOK OF CARBON, GRAPHITE, DIAMONDS AND FULLERENES: by Hugh 0.

Pierson

MOLECULAR BEAM EPITAXY: edited by Robin F. C. Farrow

HANDBOOKOF COMPOUND SEMICONDUCTORS: edited by Paul H. Holloway and Gary

E. McGuire

HANDBOOK OF VACUUM ARC SCIENCE AND TECHNOLOGY: edited by Raymond L.

Boxman, Philip J. Martin, and David M. Sanders

HIGH DENSITY PLASMA SOURCES: edited by Oleg A. Popov

DIAMOND CHEMICAL VAPOR DEPOSITION: by Huimin Liu and David S. Dandy

Ceramic and Other Materials-Processing and Technology

SOL-GEL TECHNOLOGY FOR THIN FILMS, FIBERS, PREFORMS, ELECTRONICS
AND SPECIALTY SHAPES: edited by Lisa C. Klein

FIBER REINFORCED CERAMIC COMPOSITES: edited by K. S. Mazdiyasni

ADVANCED CERAMIC PROCESSING AND TECHNOLOGY, Volume 1: edited byJon G. P.

Binner

FRICTION AND WEAR TRANSITIONS OF MATERIALS: by Peter J. Blau

SHOCK WAVES FOR INDUSTRIAL APPLICATIONS: edited by Lawrence E. Murr

SPECIAL MELTING AND PROCESSING TECHNOLOGIES: edited by G. K. Bhat

CORROSION OF GLASS, CERAMICS AND CERAMIC SUPERCONDUCTORS: edited by

David E. Clark and Bruce K. Zoitos

HANDBOOK OF INDUSTRIAL REFRACTORIES TECHNOLOGY: by Stephen C. Carniglia

and Gordon L. Barna

CERAMIC FILMS AND COATINGS: edited by John B. Wachtman and Richard A. Haber

CERAMIC CUTTING TOOLS: edited by E. Dow Whitney

Related Titles
CODE COMPLIANCE FOR ADVANCED TECHNOLOGY FACILITIES: by William R. Acorn

SEMICONDUCTOR INDUSTRIAL HYGIENE HANDBOOK: by Michael E. Williams and

David G. Baldwin
Contributors

Oleg A. Popov, Editor

Matsushita Electric Works
Research & Development Laboratory
Wobum, Massachusetts

Jes Asmussen, Jr. John H. Keller

Department of Electrical Engineering IBM Microelectronic Division
Michigan State University Hopewell Junction, New York
East Lansing, Michigan
JoClle Margot
Francis F. Chen Department of Physics
Electrical Engineering Department University of Montreal
University of California, Los Angeles Montreal, Quebec, Canada
Los Angeles, California
Meyya Meyyappan
Michael J. Colgan Scientific Research Associates, Inc.
Alimentrics, Inc. Glastonbury, Connecticut
Morris Plains, New Jersey
Michel Moisan
John C. Forster Department of Physics
Applied Materials Corporation University of Montreal
Santa Clara, California Montreal, Quebec, Canada

Wayne L. Johnson Jacques Pelletier

Prototech Research, Inc. LEMD-CNRS
Tempe, Arizona Grenoble Cedex, France

...
Xl11
xiv Contributors

James E. Stevens Zenon Zakrzewski

Microelectronics Development Adademie des Sciences de Polgue
Laboratory Gdansk, Poland
Saudia National Laboratories
Albuquerque, New Mexico

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