Intel Core

Intel Core (stylized as intel CORE) is a line of mid-to-high end consumer, workstation, and enthusiast central processing units (CPU) marketed by Intel
Corporation. These processors displaced the existing mid-to-high end Pentium processors of the time, moving the Pentium to the entry level, and
bumping the Celeron series of processors to low end. Identical or more capable versions of Core processors are also sold as Xeon processors for the
server and workstation markets.

As of June 2017, the lineup of Core processors included the Intel Core i9, Intel Core i7, Intel Core i5, and Intel Core i3, along with the Y - Series Intel
Core CPUs.[1][2]

In early 2018, news reports indicated that security flaws, referred to as "Meltdown" and "Spectre", were found "in virtually all Intel processors [made in
the past two decades] that will require fixes within Windows, macOS and Linux". The flaw also affected cloud servers. At the time, Intel was not
commenting on this issue.[3][4] According to a New York Times report, "There is no easy fix for Spectre ... as for Meltdown, the software patch needed to
[5]
fix the issue could slow down computers by as much as 30 percent".

Bottom of an Intel Core i7-970

Contents
Outline
Overview
Enhanced Pentium M based
Core Solo
Core Duo
64-bit Core microarchitecture-based
Core 2 Solo
Core 2 Duo
Core 2 Quad
Core 2 Extreme
Nehalem microarchitecture-based
Core i3
Core i5
Core i7
Sandy Bridge (2nd gen) microarchitecture-based
Core i3
Core i5
Core i7
Ivy Bridge (3rd gen) microarchitecture-based
Core i3
Core i5
Core i7
Haswell (4th gen) microarchitecture-based
Core i3
Core i5
Core i7
Broadwell (5th gen) microarchitecture-based
Core i3
Core i5
Core i7
Core M
Skylake (6th gen) microarchitecture
Core i3
Core i5
Core i7
Kaby Lake (7th gen) microarchitecture
Features
List of Kaby Lake processors
Desktop processors
Mobile processors
High power
Low/Medium power
Server processors
Kaby Lake Refresh (8th gen) microarchitecture
Coffee Lake (8th gen) microarchitecture
Cannon Lake (8th gen) microarchitecture
See also
References
External links

Outline
Although Intel Core is a brand that promises no internal consistency or continuity
, the processors within this family have been, for the most part, broadly similar
.
The first products receiving this designation were the Core Solo and Core Duo Yonah processors for mobile from the Pentium M design tree, fabricated at 65 nm and brought to market in January 2006.
These are substantially different in design than the rest of the Intel Core product group, having derived from thePentium Pro lineage that predated Pentium 4.

The first Intel Core desktop processor—and typical family member—came from the
Conroe iteration, a 65 nm dual-core design fabricated brought to market in July 2006, based on the all-new Intel Core
microarchitecture with substantial enhancements in micro-architectural efficiency and performance, outperforming Pentium 4 across the board (or near to it), while operating at drastically lower clock
rates. Maintaining highinstructions per cycle (IPC) on a deeply pipelined and resourced out-of-order executionengine has remained a constant fixture of the Intel Core product group ever since.

The new substantial bump in microarchitecture came with the introduction of the 45 nm Bloomfield desktop processor in November 2008 on the Nehalem architecture, whose main advantage came from
redesigned I/O and memory systems featuring the newIntel QuickPath Interconnectand an integrated memory controller supporting up to three channels ofDDR3 memory.

Subsequent performance improvements have tended toward making addition rather than profound change, such as adding the Advanced Vector Extensions instruction set extensions to Sandy Bridge,
first released on 32 nm in January 2011. Time has also brought improved support for virtualization and a trend toward higher levels of system integration and management functionality through the
ongoing evolution of facilities such asIntel Active Management Technology.

Overview
 Desktop Mobile
Brand
Code-named Cores Fab Date released Code-named Cores Fab Date released
Core Solo Desktop version not available N/A 1 65 nm January 2006
Core Duo Desktop version not available Yonah 2 65 nm January 2006
Merom-L 1 65 nm September 2007
Core 2 Solo Desktop version not available
Penryn-L 1 45 nm May 2008
Conroe 2 65 nm August 2006
Merom 2 65 nm July 2006
Core 2 Duo Allendale 2 65 nm January 2007
Penryn 2 45 nm January 2008
Wolfdale 2 45 nm January 2008
Kentsfield 4 65 nm January 2007
Core 2 Quad Penryn 4 45 nm August 2008
Yorkfield 4 45 nm March 2008
Conroe XE 2 65 nm July 2006 Merom XE 2 65 nm July 2007
Core 2 Extreme Kentsfield XE 4 65 nm November 2006 Penryn XE 2 45 nm January 2008
Yorkfield XE 4 45 nm November 2007 Penryn XE 4 45 nm August 2008

Core M Desktop version not available Broadwell 2 14 nm September 2014[6]

Skylake 2 14 nm August 2015
Core m3 Desktop version not available
Kaby Lake 2 14 nm August 2016
Core m5 Desktop version not available Skylake 2 14 nm August 2015
Core m7 Desktop version not available Skylake 2 14 nm August 2015
Clarkdale 2 32 nm January 2010
Arrandale 2 32 nm January 2010
Sandy Bridge 2 32 nm February 2011
Sandy Bridge 2 32 nm February 2011
Ivy Bridge 2 22 nm September 2012
Ivy Bridge 2 22 nm June 2012
Core i3 Haswell 2 22 nm September 2013
Haswell 2 22 nm June 2013
Skylake 2 14 nm September 2015
Broadwell 2 14 nm January 2015
Kaby Lake 2 14 nm January 2017
Skylake 2 14 nm September 2015
Coffee Lake 4 14 nm October 2017
Lynnfield 4 45 nm September 2009
Clarkdale 2 32 nm January 2010
Arrandale 2 32 nm January 2010
Sandy Bridge 4 32 nm January 2011
Sandy Bridge 2 32 nm February 2011
Sandy Bridge 2 32 nm February 2011
Ivy Bridge 2 22 nm May 2012
Ivy Bridge 4 22 nm April 2012
Haswell 2 22 nm June 2013
Ivy Bridge 2 22 nm April 2012
Core i5 Broadwell 2 14 nm January 2015
Haswell 4 22 nm June 2013
Skylake 4 14 nm September 2015
Haswell 2 22 nm June 2013
Skylake 2 14 nm September 2015
Broadwell 4 14 nm June 2015
Kaby Lake 2 14 nm August 2016
Skylake 4 14 nm September 2015
Kaby Lake 4 14 nm January 2017
Kaby Lake 4 14 nm January 2017
Coffee Lake 6 14 nm October 2017
Bloomfield 45 nm November 2008
Clarksfield 4 45 nm September 2009
Lynnfield 45 nm September 2009
Arrandale 2 32 nm January 2010
Gulftown 32 nm July 2010
Sandy Bridge 4 32 nm January 2011
Sandy Bridge 4 32 nm January 2011
Sandy Bridge 2 32 nm February 2011
Sandy Bridge-E 4 32 nm November 2011
Ivy Bridge 4 22 nm May 2012
Sandy Bridge-E 6 32 nm February 2012
Ivy Bridge 2 22 nm May 2012
Ivy Bridge 4 22 nm April 2012
Haswell 4 22 nm June 2013
Core i7 Haswell 6 22 nm June 2013
Haswell 2 22 nm June 2013
Ivy Bridge-E 4 22 nm September 2013
Broadwell 2 14 nm January 2015
Ivy Bridge-E 4 22 nm September 2013
Broadwell 4 14 nm June 2015
Haswell-E 4 22 nm August 2014
Skylake 4 14 nm September 2015
Broadwell 6 14 nm June 2015
Skylake 2 14 nm September 2015
Skylake 14 nm September 2015
Kaby Lake 2 14 nm August 2016
Kaby Lake 14 nm January 2017
Kaby Lake 4 14 nm January 2017
Coffee Lake 14 nm October 2017
Bloomfield
Gulftown 4 45 nm November 2008
Sandy Bridge-E 6 32 nm March 2010 Clarksfield 4 45 nm September 2009
Core i7 Ivy Bridge-E 6 32 nm November 2011 Sandy Bridge 4 32 nm January 2011
Extreme Edition Haswell-E 6 22 nm September 2013 Ivy Bridge 4 22 nm May 2012
8 22 nm August 2014 Haswell 4 22 nm June 2013
Broadwell-E 10 14 nm May 2016

Core i9 Skylake-X 18 14 nm June 2017 Mobile version not available

List of Intel Core microprocessors

List of Intel Core 2 microprocessors
List of Intel Core M microprocessors
List of Intel Core i3 microprocessors
List of Intel Core i5 microprocessors
List of Intel Core i7 microprocessors
List of Intel Core i9 microprocessors

Intel Turbo Boost Technology)[7]

Clock speed slowest 1.2 GHz to the fastest 4.2 GHz (Intel Core i7-7700K) (or 4.5 GHz via

Enhanced Pentium M based

The original Core brand refers to Intel's 32-bit mobile dual-core x86 CPUs, which derived from the Pentium M branded processors. The processor family used an enhanced version of the Intel P6
microarchitecture. It emerged in parallel with the NetBurst microarchitecture(Intel P68) of the Pentium 4 brand, and was a precursor of the 64-bit Core microarchitecture of Core 2 branded CPUs. The
Core brand comprised two branches: theDuo (dual-core) and Solo (Duo with one disabled core, which replaced the Pentium M brand of single-core mobile processor).

Intel launched the Core brand on January 6, 2006 with the release of the 32-bit Yonah CPU – Intel's first dual-core mobile (low-power) processor. Its dual-core layout closely resembled two
interconnected Pentium M branded CPUs packaged as a singledie (piece) silicon chip (IC). Hence, the 32-bit microarchitecture of Core branded CPUs – contrary to its name – had more in common with
Pentium M branded CPUs than with the subsequent 64-bit Core microarchitecture of Core 2 branded CPUs. Despite a major rebranding effort by Intel starting January 2006, some companies continued
to market computers with the Yonah core marked as Pentium M.
The Core series is also the first Intel processor used as the main CPU in anApple Macintosh computer. The Core Duo was the CPU for the first generation MacBook Pro, while the Core Solo appeared in
Apple's Mac Mini line. Core Duo signified the beginning of Apple's shift to Intel processors across their entire line.

In 2007, Intel began branding the Yonah core CPUs intended for mainstream mobile computers as Pentium Dual-Core, not to be confused with the desktop 64-bit Core microarchitecture CPUs also
branded as Pentium Dual-Core.

September 2007 and January 4, 2008 marked the discontinuation of a number of [8][9]
Core branded CPUs including several Core Solo, Core Duo, Celeron and one Core 2 Quad chip.

Core Solo
Intel Core Solo[10] (product code 80538) uses the same two-core die as the Core Duo, but features only one active core. Depending on demand, Intel may also simply disable one of the cores to sell the
chip at the Core Solo price—this requires less effort than launching and maintaining a separate line of CPUs that physically only have one core. Intel used the same strategy previously with the 486 CPU
in which early 486SX CPUs were in fact manufactured as486DX CPUs but with the FPU disabled.

Codename
Brand name (list) L2 Cache Socket TDP
(main article)
Core Solo T1xxx 27–31 W
Yonah 2 MB Socket M
Core Solo U1xxx 5.5–6 W

Core Duo
Intel Core Duo[11] (product code 80539) consists of two cores on one die, a 2MB L2 cache shared by both cores, and an arbiter bus that controls both L2 cache and
FSB (front-side bus) access.

Codename
Brand name (list) L2 Cache Socket TDP
(main article)
Core Duo T2xxx 31 W
Yonah Core Duo L2xxx 2 MB Socket M 15 W
Core Duo U2xxx 9W

64-bit Core microarchitecture-based

The successor to Core is the mobile version of the Intel Core 2 line of processors using cores based upon the Intel Core microarchitecture,[12] released on July 27, 2006. The release of the mobile
version of Intel Core 2 marks the reunification of Intel's desktop and mobile product lines as Core 2 processors were released for desktops and notebooks, unlike the first Intel Core CPUs that were
targeted only for notebooks (although some smallform factor and all-in-one desktops, like theiMac and the Mac Mini, also used Core processors).

Unlike the Intel Core, Intel Core 2 is a 64-bit processor

, supporting Intel 64. Another difference between the original Core Duo and the new Core 2 Duo is an increase in the amount ofLevel 2 cache. The
new Core 2 Duo has tripled the amount of on-board cache to 6 MB. Core 2 also introduced a quad-core performance variant to the single- and dual-core chips, branded Core 2 Quad, as well as an
enthusiast variant, Core 2 Extreme. All three chips are manufactured at a 65 nm
lithography, and in 2008, a 45 nm lithography and support Front Side Bus speeds ranging from 533 MHz to 1600 MHz. In
addition, the 45 nm die shrink of the Core microarchitecture adds SSE4.1 support to all Core 2 microprocessors manufactured at a 45 nm lithography, therefore increasing the calculation rate of the
processors.

Core 2 Solo
The Core 2 Solo,[13] introduced in September 2007, is the successor to the Core Solo and is available only as an ultra-low-power mobile processor with 5.5 Watt thermal design power. The original
U2xxx series "Merom-L" used a special version of the Merom chip with CPUID number 10661 (model 22, stepping A1) that only had a single core and was also used in some Celeron processors. The
later SU3xxx are part of Intel's CULV range of processors in a smaller µFC-BGA 956 package but contain the same Penryn chip as the dual-core variants, with one of the cores disabled during
manufacturing.

Codename
Brand name (list) L2 Cache Socket TDP
(main article)
Merom-L Mobile Core 2 Solo U2xxx 1 MB FCBGA 5.5 W
Penryn-L Mobile Core 2 Solo SU3xxx 3 MB BGA956 5.5 W

Core 2 Duo
The majority of the desktop and mobile Core 2 processor variants are Core 2 Duo[14][15] with two processor cores on a single Merom, Conroe, Allendale, Penryn, or Wolfdale chip. These come in a
wide range of performance and power consumption, starting with the relatively slow ultra-low-power Uxxxx (10 W) and low-power Lxxxx (17 W) versions, to the more performance oriented Pxxxx (25
W) and Txxxx (35 W) mobile versions and the Exxxx (65 W) desktop models. The mobile Core 2 Duo processors with an 'S' prefix in the name are produced in a smaller µFC-BGA 956 package, which
allows building more compact laptops.

Within each line, a higher number usually refers to a better performance, which depends largely on core and front-side bus clock frequency and amount of second level cache, which are model-specific.
Core 2 Duo processors typically use the full L2 cache of 2, 3, 4, or 6 MB available in the specific stepping of the chip, while versions with the amount of cache reduced during manufacturing are sold for
the low-end consumer market asCeleron or Pentium Dual-Core processors. Like those processors, some low-end Core 2 Duo models disable features such as
Intel Virtualization Technology.
 Codename
Brand name (list) L2 Cache Socket TDP
(main article)
Mobile Core 2 Duo U7xxx 2 MB 10 W
BGA479
Mobile Core 2 Duo L7xxx 4 MB 17 W
Merom
Mobile Core 2 Duo T5xxx 2 MB Socket M
Socket P 35 W
Mobile Core 2 Duo T7xxx 2–4 MB BGA479

Conroe and Core 2 Duo E4xxx 2 MB

LGA 775 65 W
Allendale Core 2 Duo E6xxx 2–4 MB
Mobile Core 2 Duo SU7xxx
3 MB 10 W
Mobile Core 2 Duo SU9xxx
BGA956
Mobile Core 2 Duo SL9xxx 17 W
6 MB
Mobile Core 2 Duo SP9xxx 25 W
Mobile Core 2 Duo P7xxx
3 MB
Penryn Mobile Core 2 Duo P8xxx 25 W
Mobile Core 2 Duo P9xxx 6 MB Socket P
Mobile Core 2 Duo T6xxx 2 MB FCBGA6

Mobile Core 2 Duo T8xxx 3 MB 35 W

Mobile Core 2 Duo T9xxx 6 MB
Mobile Core 2 Duo E8xxx 6 MB Socket P 35-55 W
Core 2 Duo E7xxx 3 MB
Wolfdale LGA 775 65 W
Core 2 Duo E8xxx 6 MB

Core 2 Quad
Core 2 Quad[16][17] processors are multi-chip modules consisting of two dies similar to those used in Core 2 Duo, forming a quad-core processor. This allows twice the performance of a dual-core
processors at the same clock frequency in ideal conditions.

Initially, all Core 2 Quad models were versions of Core 2 Duo desktop processors, Kentsfield derived from Conroe and Yorkfield from Wolfdale, but later Penryn-QC was added as a high-end version of
the mobile dual-core Penryn.

The Xeon 32xx and 33xx processors are mostly identical versions of the desktop Core 2 Quad processors and can be used interchangeably
.

Codename
Brand name (list) L2 Cache Socket TDP
(main article)
Kentsfield Core 2 Quad Q6xxx 2×4 MB 95–105 W
Core 2 Quad Q8xxx 2×2 MB LGA 775
Yorkfield 65–95 W
Core 2 Quad Q9xxx 2×3–2×6 MB
Penryn-QC Mobile Core 2 Quad Q9xxx 2×3–2×6 MB Socket P 45 W

Core 2 Extreme
Core 2 Extreme processors[18][19] are enthusiast versions of Core 2 Duo and Core 2 Quad processors, usually with a higher clock frequency and an unlocked clock multiplier, which makes them
especially attractive foroverclocking. This is similar to earlier Pentium processors labeled asExtreme Edition. Core 2 Extreme processors were released at a much higher price than their regular version,
often $999 or more.

Codename
Brand name (list) L2 Cache Socket TDP
(main article)
Merom Mobile Core 2 Extreme X7xxx 4 MB Socket P 44 W
Conroe Core 2 Extreme X6xxx 4 MB LGA 775 75 W
Kentsfield Core 2 Extreme QX6xxx 2×4 MB LGA 775 130 W
Penryn Mobile Core 2 Extreme X9xxx 6 MB Socket P 44 W
Penryn-QC Mobile Core 2 Extreme QX9xxx 2×6 MB Socket P 45 W
Yorkfield Core 2 Extreme QX9xxx 2×6 MB LGA 775 / LGA 771 130–150 W

Nehalem microarchitecture-based
With the release of the Nehalem microarchitecture in November 2008,[20] Intel introduced a new naming scheme for its Core processors. There are three variants, Core i3, Core i5 and Core i7, but the
names no longer correspond to specific technical features like the number of cores. Instead, the brand is now divided from low-level (i3), through mid-range (i5) to high-end performance (i7),[21] which
correspond to three, four and five stars in Intel's Intel Processor Rating[22] following on from the entry-level Celeron (one star) and Pentium (two stars) processors.[23] Common features of all Nehalem
based processors include an integrated DDR3 memory controller as well as QuickPath Interconnect or PCI Express and Direct Media Interface on the processor replacing the aging quad-pumped Front
Side Bus used in all earlier Core processors. All these processors have 256 KB L2 cache per core, plus up to 12 MB shared L3 cache. Because of the new I/O interconnect, chipsets and mainboards from
previous generations can no longer be used with Nehalem-based processors.

Core i3
Intel intended the Core i3 as the new low end of the performance processor line fromIntel, following the retirement of theCore 2 brand.[24][25]

[26]
The first Core i3 processors were launched on January 7, 2010.

The first Nehalem based Core i3 wasClarkdale-based, with an integratedGPU and two cores.[27] The same processor is also available as Core i5 and Pentium, with slightly dif
ferent configurations.
The Core i3-3xxM processors are based on Arrandale, the mobile version of the Clarkdale desktop processor. They are similar to the Core i5-4xx series but running at lower clock speeds and without
Turbo Boost.[28] According to an Intel FAQ they do not support Error Correction Code (ECC) memory.[29] According to motherboard manufacturer Supermicro, if a Core i3 processor is used with a
server chipset platform such as Intel 3400/3420/3450, the CPU supports ECC with UDIMM.[30] When asked, Intel confirmed that, although the Intel 5 series chipset supports non-ECC memory only
with the Core i5 or i3 processors, using those processors on a motherboard with 3400 series chipsets it supports the ECC function of ECC memory.[31] A limited number of motherboards by other
companies also support ECC with Intel Core ix processors; the Asus P8B WS is an example, but it does not support ECC memory underindows
W non-server operating systems.[32]

Codename
Brand name (list) Cores L3 Cache Socket TDP I/O Bus
(main article)
Clarkdale Core i3 4 MB LGA 1156 73 W Direct Media Interface,
Core i3-3xxM 2 3 MB rPGA-988A 35 W Integrated GPU
Arrandale
Core i3-3xxUM 3 MB BGA-1288 18 W

Core i5
The first Core i5 using the Nehalem microarchitecture was introduced on September 8, 2009, as a mainstream variant of the earlier Core i7, the Lynnfield core.[33][34] Lynnfield Core i5 processors have
an 8 MB L3 cache, a DMI bus running at 2.5 GT/s and support for dual-channel DDR3-800/1066/1333 memory and have Hyper-threading disabled. The same processors with different sets of features
(Hyper-Threading and other clock frequencies) enabled are sold as Core i7-8xx and Xeon 3400-series processors, which should not be confused with high-end Core i7-9xx and Xeon 3500-series
processors based on Bloomfield. A new feature called Turbo Boost Technology was introduced which maximizes speed for demanding applications, dynamically accelerating performance to match the
workload.

The Core i5-5xx mobile processors are named Arrandale and based on the 32 nm Westmere shrink of the Nehalem microarchitecture. Arrandale processors have integrated graphics capability but only
two processor cores. They were released in January 2010, together with Core i7-6xx and Core i3-3xx processors based on the same chip. The L3 cache in Core i5-5xx processors is reduced to 3 MB,
while the Core i5-6xx uses the full cache and the Core i3-3xx does not support for Turbo Boost.[35] Clarkdale, the desktop version of Arrandale, is sold as Core i5-6xx, along with related Core i3 and
Pentium brands. It has Hyper-Threading enabled and the full 4 MB L3 cache.[36]

According to Intel "Core i5 desktop processors and desktop boards typically do not support ECC memory",[37] but information on limited ECC support in the Core i3 section also applies to Core i5 and
i7.

Codename
Brand name (list) Cores L3 Cache Socket TDP I/O Bus
(main article)
Core i5-7xx 95 W
Lynnfield 4 8 MB Direct Media Interface
Core i5-7xxS LGA 1156 82 W
Clarkdale Core i5-6xx 4 MB 73–87 W
Core i5-5xxM
rPGA-988A 35 W Direct Media Interface,
Core i5-4xxM 2
Arrandale 3 MB Integrated GPU
Core i5-5xxUM
BGA-1288 18 W
Core i5-4xxUM[38]

Core i7
Intel Core i7 as an Intel brand name applies to several families of desktop and laptop 64-bit x86-64 processors using the Nehalem, Westmere, Sandy Bridge, Ivy Bridge, Haswell, Broadwell, Skylake,
and Kaby Lake microarchitectures. The Core i7 brand targets the business and high-end consumer markets for both desktop and laptop computers,[39] and is distinguished from the Core i3 (entry-level
consumer), Core i5 (mainstream consumer), andXeon (server and workstation) brands.

Intel introduced the Core i7 name with the Nehalem-based Bloomfield Quad-core processor in late 2008.[40][41][42][43] In 2009 new Core i7 models based on the Lynnfield (Nehalem-based) desktop
quad-core processor and the Clarksfield (Nehalem-based) quad-core mobile were added,[44] and models based on the Arrandale dual-core mobile processor (also Nehalem-based) were added in January
2010. The first six-core processor in the Core lineup is the Nehalem-based Gulftown, which was launched on March 16, 2010. Both the regular Core i7 and the Extreme Edition are advertised as five
stars in the Intel Processor Rating.

In each of the first three microarchitecture generations of the brand, Core i7 has family members using two distinct system-level architectures, and therefore two distinct sockets (for example, LGA 1156
and LGA 1366 with Nehalem). In each generation, the highest-performing Core i7 processors use the same socket and QPI-based architecture as the medium-end Xeon processors of that generation,
while lower-performing Core i7 processors use the same socket and PCIe/DMI/FDI architecture as the Core i5.

"Core i7" is a successor to the Intel Core 2 brand.[45][46][47][48] Intel representatives stated that they intended the moniker Core i7 to help consumers decide which processor to purchase as Intel releases
newer Nehalem-based products in the future.[49]

Release
Code name Brand name Cores L3 Cache Socket TDP Process Busses
Date
Core i7-9xxX Extreme Edition Mar 2010
Gulftown 6 12 MB 32 nm
Core i7-970 QPI, Jul 2010
LGA 1366 130 W
Core i7-9xx Extreme Edition 3 × DDR3
Bloomfield Nov 2008
Core i7-9xx (except Core i7-970/980)
Core i7-8xx 95 W Sep 2009
Lynnfield 8 MB LGA 1156
Core i7-8xxS 4 82 W 45 nm Jan 2010
DMI,
Core i7-9xxXM Extreme Edition 55 W PCI-e,
2 × DDR3
Clarksfield Core i7-8xxQM Sep 2009
rPGA-988A 45 W
Core i7-7xxQM 6 MB
Core i7-6xxM 35 W DMI,
PCI-e,
Arrandale Core i7-6xxLM 2 4 MB 25 W 32 nm Jan 2010
BGA-1288 FDI,
Core i7-6xxUM 18 W 2 × DDR3
Sandy Bridge (2nd gen) microarchitecture-based
In early 2011, Intel introduced a new microarchitecture named Sandy Bridge. This is the second generation Core processor microarchitecture. It kept all the existing brands from Nehalem, including
Core i3/i5/i7, and introduced new model numbers. The initial set of Sandy Bridge processors includes dual- and quad-core variants, all of which use a single 32 nm die for both the CPU and integrated
GPU cores, unlike the earlier microarchitectures. All Core i3/i5/i7 processors with the Sandy Bridge microarchitecture have a four
-digit model number. With the mobile version, thethermal design power
can no longer be determined from a one- or two-letter suffix but is encoded into the CPU number. Starting with Sandy Bridge, Intel no longer distinguishes the code names of the processor based on
number of cores, socket or intended usage; they all use the same code name as the microarchitecture itself.

Ivy Bridge is the codename for Intel's 22 nm die shrink of the Sandy Bridge microarchitecture based on tri-gate ("3D") transistors, introduced in April 2012.

Core i3
Released on January 20, 2011, the Core i3-2xxx line of desktop and mobile processors is a direct replacement of the 2010 "Clarkdale" Core i3-5xx and "Arrandale" Core i3-3xxM models, based on the
new microarchitecture. While they require new sockets and chipsets, the user-visible features of the Core i3 are largely unchanged, including the lack of support for Turbo Boost and AES-NI. Unlike the
Sandy Bridge-based Celeron and Pentium processors, the Core i3 line does support the new Advanced Vector Extensions. This particular processor is the entry-level processor of this new series of Intel
processors.

Codename
Brand name (list) Cores L3 Cache Socket TDP I/O Bus
(main article)
Core i3-21xx 65 W
Sandy Bridge (Desktop) LGA 1155
Core i3-21xxT
Direct Media Interface,
2 3 MB rPGA-988B 35 W
Core i3-2xx0M Integrated GPU
Sandy Bridge (Mobile) BGA-1023
Core i3-2xx7M BGA-1023 17 W

Core i5
In January 2011, Intel released new quad-core Core i5 processors based on the "Sandy Bridge" microarchitecture at CES 2011. New dual-core mobile processors and desktop processors arrived in
February 2011.

The Core i5-2xxx line of desktop processors are mostly quad-core chips, with the exception of the dual-core Core i5-2390T, and include integrated graphics, combining the key features of the earlier
Core i5-6xx and Core i5-7xx lines. The suffix after the four-digit model number designates unlocked multiplier (K), low-power (S) and ultra-low-power (T).

The desktop CPUs now all have four non-SMT cores (like the i5-750), with the exception of the i5-2390T
. The DMI bus is running at 5 GT/s.

The mobile Core i5-2xxxM processors are all dual-core and hyper
-threaded chips like the previous Core i5-5xxM series, and share most of the features with that product line.

Codename
Brand name (list) Cores L3 Cache Socket TDP I/O Bus
(main article)
Core i5-2xxx
95 W
Core i5-2xxxK
4 6 MB
Sandy Bridge (Desktop) Core i5-2xxxS LGA 1155 65 W
Core i5-25xxT 45 W Direct Media Interface,
Core i5-23xxT Integrated GPU

rPGA-988B 35 W
Core i5-2xxxM 2 3 MB
Sandy Bridge (Mobile) BGA-1023
Core i5-2xx7M BGA-1023 17 W

Core i7
The Core i7 brand was the high-end for Intel's desktop and mobile processors, until the announcement of the i9 in 2017. Its Sandy Bridge models feature the largest amount of L3 cache and the highest
clock frequency. Most of these models are very similar to their smaller Core i5 siblings. The quad-core mobile Core i7-2xxxQM/XM processors follow the previous "Clarksfield" Core i7-xxxQM/XM
processors, but now also include integrated graphics.

Codename Release
Brand name (list) Cores L3 Cache Socket TDP Process I/O Bus
(main article) Date
Core i7-39xxX 15 MB
6
Sandy Bridge-E (Desktop) Core i7-39xxK 12 MB LGA 2011 130 W Direct Media Interface November 2011
Core i7-38xx 10 MB
Core i7-2xxxK, i7-2xxx 95 W
Sandy Bridge (Desktop) LGA 1155
Core i7-2xxxS 65 W
4 8 MB
Core i7-2xxxXM 55 W 32 nm January 2011
Core i7-28xxQM rPGA-988B Direct Media Interface,
45 W
Core i7-2xxxQE, i7-26xxQM, i7-27xxQM 6 MB BGA-1023 Integrated GPU
Sandy Bridge (Mobile)
Core i7-2xx0M 35 W
Core i7-2xx9M 2 4 MB 25 W February 2011
BGA-1023
Core i7-2xx7M 17 W

Ivy Bridge (3rd gen) microarchitecture-based

Ivy Bridge is the codename for a "third generation" line of processors based on the 22 nm manufacturing process developed by Intel. Mobile versions of the CPU were released on April 2012 following
with desktop versions on September 2012.
Core i3
The Ivy Bridge-based Core-i3-3xxx line is a minor upgrade to 22 nm process technology and better graphics.

Codename L3
Brand name (list) Cores Socket TDP I/O Bus
(main article) Cache
Core i3-32xx 55 W
Ivy Bridge (Desktop) LGA 1155
Core i3-32xxT
rPGA-988B 35 W Direct Media Interface,
Core i3-3xx0M 2 3 MB
BGA-1023 Integrated GPU
Ivy Bridge (Mobile)
Core i3-3xx7U 17 W
BGA-1023
Core i3-3xx9Y 13 W

Core i5

Codename L3
Brand name (list) Cores Socket TDP I/O Bus
(main article) Cache
Core i5-3xxx
77 W
Core i5-3xxxK
4 6 MB
Ivy Bridge (Desktop) Core i5-3xxxS LGA 1155 65 W
Core i5-35xxT 45 W
Direct Media Interface,
Core i5-34xxT
Integrated GPU
rPGA-988B 35 W
Core i5-3xx0M
2 3 MB BGA-1023
Ivy Bridge (Mobile)
Core i5-3xx7U 17 W
BGA-1023
Core i5-3xx9Y 13 W

Core i7

Codename Release
Brand name (list) Cores L3 Cache Socket TDP Process I/O Bus
(main article) Date
Core i7-4960X 15MB
6
Ivy Bridge-E (Desktop) Core i7-4930K 12MB LGA 2011 130 W Direct Media Interface September 2013
Core i7-4820K 10MB
Core i7-37xx, i7-37xxK 77 W
Ivy Bridge (Desktop) Core i7-37xxS 65 W
Core i7-37xxT 8 MB 45 W
Core i7-3xxxXM 4 55 W
Core i7-38xxQM 22 nm

Core i7-36x0QM, i7-3xx0QE, i7-36x5QM, 45 W Direct Media Interface, April 2012

LGA 1155
i7-3xx5QE, i7-37xxQM 6 MB Integrated GPU

Ivy Bridge (Mobile) Core i7-3xx2QM, i7-3xx2QE

35 W
Core i7-3xxxM
Core i7-3xxxLE 25 W
2 4 MB
Core i7-3xx7U, i7-3xx7UE 17 W
Core i7-3xx9Y 13 W January 2013

Haswell (4th gen) microarchitecture-based

Haswell is the fourth generation Core processor microarchitecture, and was released in 2013.

Core i3

Codename Release
Brand name (list) Cores L3 Cache GPU Model Socket TDP Process I/O Bus
(main article) Date
Core i3-43xx 54 W
4 MB HD 4600
Core i3-43xxT, Core i3-4xxxTE 35 W
Haswell-DT (Desktop) LGA 1150
Core i3-41xx 54 W
HD 4400
Core i3-41xxT 35 W September 2013
Core i3-4xx2E 25 W Direct Media Interface,
2 BGA 1364 22 nm
Core i3-4xx0E HD 4600 Integrated GPU
3 MB 37 W
Core i3-4xxxM Socket G3
Haswell-MB (Mobile)
Core i3-4xx8U Iris 5100 28 W
Core i3-4xx0U, Core i3-4xx5U HD 4400 BGA 1168 15 W June 2013
Core i3-4xxxY HD 4200 11.5 W
Core i5

Codename
Brand name (list) Cores L3 Cache GPU Model Socket TDP Process I/O Bus Release Date
(main article)
Core i5-4xxx, i5-46xxK 84 W
Core i5-4xxxS 4 6 MB 65 W
HD 4600 LGA 1150
Haswell-DT (Desktop) Core i5-46xxT 45 W June 2013
Core i5-45xxT, Core i5-45xxTE 2 35 W
4 MB
Core i5-4xxxR 4 Iris Pro 5200 65 W
Core i5-4xxxH 47 W
BGA 1364 Direct Media Interface,
Core i5-4xx2E 25 W 22 nm
HD 4600 Integrated GPU September 2013
Core i5-4xx0E
37 W
Core i5-4xxxM Socket G3
Haswell-MB (Mobile) 2 3 MB
Core i5-4xx8U Iris 5100 28 W
Core i5-4x50U HD 5000
BGA1168 15 W June 2013
Core i5-4x00U HD 4400
Core i5-4xxxY HD 4200 11.5 W

Core i7

Codename L3 Release
Brand name (list) Cores GPU Model Socket TDP Process I/O Bus
(main article) Cache Date
Core i7-5960X 8 20 MB
Haswell-E LGA 2011- September
Core i7-5930K N/A 140 W Direct Media Interface
(Desktop)[50] 6 15 MB 3 2014
Core i7-5820K
Core i7-47xx, i7-47xxK 84 W
Core i7-47xxS 65 W
8 MB HD 4600 LGA 1150
Haswell-DT (Desktop) Core i7-47x0T 45 W
Core i7-47x5T 35 W
Core i7-47xxR 65 W
Core i7-4x50HQ, Core i7- Iris Pro
4x60HQ 5200 47 W
Core i7-4x50EQ, Core i7- 4 June 2013
4x60EQ BGA 1364
Core i7-47x2HQ, Core i7- 6 MB
22 nm
47x2EQ 37 W
Core i7-470xHQ, Core i7- 47 W Direct Media
470xEQ Interface,
Integrated GPU
Core i7-47x2MQ 37 W
Core i7-470xMQ HD 4600 47 W
Haswell-MB (Mobile) Core i7-49xxMQ, Core i7-
8 MB Socket G3 57 W
4xxxXM
September
Core i7-4xxxM 35 W
2013
Core i7-4xx8U Iris 5100 28 W
Core i7-4x50U 2 4 MB HD 5000
15 W
Core i7-4x00U HD 4400 BGA 1168 June 2013

11.5
Core i7-4xxxY HD 4200
W

Broadwell (5th gen) microarchitecture-based

Broadwell is the fifth generation Core processor microarchitecture, and was released by Intel on September 6, 2014, and began shipping in late 2014. It is the first to use a 14 nm chip.[51] Additionally,
mobile processors were launched in January 2015[52] and Desktop Core i5 and i7 processors were released in June 2015.
[53]

Core i3

Codename Release
Brand name (list) Cores L3 Cache GPU Model Socket TDP Process I/O Bus
(main article) Date
Core i3-5xx7U Iris 6100 28 W Direct Media Interface,
Broadwell-U (Mobile) 2 3 MB BGA 1168 14 nm January 2015
Core i3-5xx0U, Core i3-5xx5U HD 5500 15 W Integrated GPU

Core i5
 Codename Release
Brand name (list) Cores L3 Cache GPU Model Socket TDP Process I/O Bus
(main article) Date
Core i5-5675C

Broadwell-DT (Desktop)[53] Core i5-5675R 4 4 MB Iris 6200 LGA 1150 65 W June 2015
Direct Media Interface,
Core i5-5575R
14 nm Integrated GPU
Core i5-5xx7U Iris 6100 28 W
Broadwell-U (Mobile) Core i5-5x50U 2 3 MB HD 6000 BGA 1168 January 2015
15 W
Core i5-5x00U HD 5500

Core i7

Codename Brand name L3 GPU Release

Cores/Threads Socket TDP Process I/O Bus
(main article) (list) Cache Model Date

Broadwell-DT Core i7-5775C

4/8 6 MB Iris 6200 LGA 1150 65 W June 2015
(Desktop)[53] Core i7-5775R Direct Media Interface,
Core i7-5xx7U Iris 6100 28 W Integrated GPU
January
Broadwell-U (Mobile) Core i7-5x50U 2/4 4 MB HD 6000 BGA 1168
15 W 2015
Core i7-5x00U HD 5500 14 nm
Core i7-6800K
6/12 15 MB
Core i7-6850K LGA 2011- 140
Broadwell-E (Desktop) N/A Direct Media Interface Q2'16
Core i7-6900K 8/16 20 MB 3 W

Core i7-6950X 10/20 25 MB

Core M

Codename Release
Brand name (list) Cores L3 Cache GPU Model Socket TDP Process I/O Bus
(main article) Date
Direct Media Interface,
Broadwell-Y (Mobile) Core M-5Yxx 2 4 MB HD 5300 BGA 1234 4.5 W 14 nm September 2014
Integrated GPU

Skylake (6th gen) microarchitecture

Skylake is the sixth generation Core processor microarchitecture, and was launched in August 2015. Being the successor to the Broadwell line, it is a redesign using the same 14 nm manufacturing
process technology; however the redesign has better CPU and GPU performance and reduced power consumption. Intel also disabled overclocking non -K processors.

Core i3

Codename
(main article) Brand name Cores/Threads L3 Cache GPU Model Socket TDP Process I/O Bus Release Date

Core i3-6098P HD 510 54 W December 2015

Core i3-6100 3 MB 51 W
Core i3-6100T 35 W
Skylake-DT (Desktop) LGA 1151
Core i3-6300 HD 530 Direct Media Interface,
51 W
Core i3-6320 2/4 4 MB 14 nm Integrated GPU
September 2015
Core i3-6300T 35 W
Core i3-6100U HD 520 15 W
Skylake-U (Mobile) Core i3-6100H 3 MB HD 530 FBGA 1356 35 W
Core i3-6167U HD 550 28 W

Core i5
 Codename
(main article) Brand name Cores/Threads L3 Cache GPU Model Socket TDP Process I/O Bus Release Date

Core i5-6400
Core i5-6500 65 W
Core i5-6600 September 2015
HD 530
Skylake-DT (Desktop) Core i5-6600K 4/4 6 MB LGA 1151 91 W
Core i5-6xx0T
35 W
Core i5-6xx0R June 2016
Core i5-6402P HD 510 65 W Direct Media Interface, December 2015
14 nm Integrated GPU
Core i5-
3 MB HD 520
6200U
15 W
Core i5-
Iris 540
6260U
Skylake-U (Mobile) Core i5-62x7U 2/4 Iris 550 FCBGA 1356 28 W September 2015
Core i5- 4 MB
HD 520 15 W
6300U
Core i5-
Iris 540 9.5 W
6360U

Core i7

Codename
(main article) Brand name Cores/Threads L3 Cache GPU Model Socket TDP Process I/O Bus Release Date

Core i7-6700 65 W
September 2015
Core i7-6700T HD 530 35 W
Skylake-DT (Desktop) 4/8 8 MB LGA 1151
Core i7-6700K 91 W August 2015
Core i7-6785R Iris Pro 580 65 W Direct Media Interface, May 2016
Core i7-6x00U HD 520 14 nm Integrated GPU
15 W
Core i7-6x60U Iris 540
Skylake-U (Mobile) Core i7-6567U 2/4 4 MB Iris 550 FCBGA 1356 28 W September 2015
Core i7-6600U HD 520 25 W
Core i7-6650U Iris 540 15 W

Kaby Lake (7th gen) microarchitecture

Kaby Lake is the seventh generation Core processor microarchitecture, and was launched in October 2016 (mobile chips)[54] and January 2017 (desktop chips).[55] With the latest generation of
microarchitecture, Intel decided to produce Kaby Lake processors without using their "tick tock" manufacturing and design model.[56] Similar to Skylake, Kaby Lake processors are produced using a 14
nanometer manufacturing process technology.[56]

Features
Built on an improved 14 nm process (14FF+), Kaby Lake features faster CPU clock speeds, clock speed changes, and higher Turbo frequencies. Beyond these process and clock speed changes, little of
the CPU architecture has changed fromSkylake, resulting in identicalIPC

Kaby Lake features a new graphics architecture to improve performance in 3D graphics and 4K video playback. It will add native HDCP 2.2 support, along with fixed function decode of H.264, HEVC
Main and Main10/10-bit, andVP9 10-bit and 8-bit video. Hardware encode is supported for H.264, HEVC Main10/10-bit, and VP9 8-bit video. VP9 10-bit encode is not supported in hardware. OpenCL
2.1 is now supported

Kaby Lake is the first Core architecture to supporthyper-threading for the Pentium-branded desktop CPU SKU. Kaby Lake also features the first overclocking-enabled i3-branded CPU.

List of Kaby Lake processors

Features common to desktop Kaby Lake CPUs:

LGA 1151 socket

DMI 3.0 and PCIe 3.0 interfaces
Dual channel memory support in the following configurations: DDR3L-1600 1.35 V (32 GiB maximum) or DDR4-2400 1.2 V (64 GiB maximum)
A total of 16 PCIe lanes
The Core-branded processors support the AVX2 instruction set. The Celeron and Pentium-branded ones support only SSE4.1/4.2
350 MHz base graphics clock rate
No L4 cache (eDRAM).
A release date of January 3, 2017

Desktop processors
 Target Cores Processor CPU CPU Turbo clock rate Maximum
GPU
segment (threads) branding and model clock rate Single Dual Quad model GPU clock rate
core core core

7700K 4.2 GHz 4.5 GHz 4.4 GHz 4.4 GHz

Performance 4 (8) Core i7 7700 3.6 GHz 4.2 GHz 4.1 GHz 4.0 GHz

7700T 2.9 GHz 3.8 GHz 3.7 GHz 3.6 GHz 1150 MHz

7600K 3.8 GHz 4.2 GHz 4.1 GHz 4.0 GHz

7600 3.5 GHz 4.1 GHz 4.0 GHz 3.9 GHz

7600T 2.8 GHz 3.7 GHz 3.6 GHz 3.5 GHz

4 (4) Core i5 7500 3.4 GHz 3.8 GHz 3.7 GHz 3.6 GHz 1100 MHz

7500T 2.7 GHz 3.3 GHz 3.2 GHz 3.1 GHz

7400 3.0 GHz 3.5 GHz 3.4 GHz 3.3 GHz

1000 MHz
7400T 2.4 GHz 3.0 GHz 2.9 GHz 2.7 GHz HD
630
7350K 4.2 GHz
1150 MHz
7320 4.1 GHz
7300 4.0 GHz

7300T 3.5 GHz

Mainstream
Core i3 7100 3.9 GHz

7100T 3.4 GHz

1100 MHz
2 (4) 7101E 3.9 GHz

7101TE 3.4 GHz N/A

G4620 3.7 GHz

G4600 3.6 GHz

G4600T 3.0 GHz

Pentium
G4560 3.5 GHz
1050 MHz
G4560T 2.9 GHz
HD
G3950 3.0 GHz 610
G3930 2.9 GHz
2 (2) Celeron
G3930T 2.7 GHz 1000 MHz

Mobile processors

High power

Target Cores Processor CPU CPU Turbo clock rate GPU clock rate
segment (threads) branding and model clock rate Single Dual Quad GPU
Base Max.
core core core
7920HQ 3.1 GHz 4.1 GHz 3.9 GHz 3.7 GHz
7820HQ
Performance 4 (8) Core i7 2.9 GHz 3.9 GHz 3.7 GHz 3.5 GHz 1100 MHz
7820HK
7700HQ HD
2.8 GHz 3.8 GHz 3.6 GHz 3.4 GHz 350 MHz
630
7440HQ
4 (4) Core i5 1000 MHz
7300HQ 2.5 GHz 3.5 GHz 3.3 GHz 3.1 GHz
Mainstream
2 (4) Core i3 7100H 3.0 GHz N/A 950 MHz

Low/Medium power
 CPU Turbo
Target Cores Processor CPU GPU clock rate
clock rate
segment (threads) branding and model clock rate GPU cache
Single Dual
Base Max.
core core
Iris
7660U 2.5 GHz 4.0 GHz Plus 1100 MHz
640
HD
7600U 2.8 GHz 3.9 GHz
620
Iris 1150 MHz
7567U 3.5 GHz 4.0 GHz Plus
Premium Core i7 650 4 MB
Iris
7560U 2.4 GHz 3.8 GHz Plus
640
HD 1050 MHz
7500U 2.7 GHz 3.5 GHz
620
HD
7Y75 1.3 GHz 3.6 GHz
615
Iris
7360U 2.3 GHz 3.6 GHz Plus 1000 MHz 4 MB
640
HD
2 (4) 7300U 2.6 GHz 3.5 GHz ? 300 MHz 3 MB
620 1100 MHz
7287U 3.3 GHz 3.7 GHz Iris
Plus
7267U 3.1 GHz 3.5 GHz 650 1050 MHz
Core i5 4 MB
Iris
7260U 2.2 GHz 3.4 GHz Plus 950 MHz
640

Mainstream HD
7200U 2.5 GHz 3.1 GHz 1000 MHz 3 MB
620
7Y57 3.3 GHz HD
1.2 GHz 950 MHz 4 MB
7Y54 3.2 GHz 615

Iris
7167U 2.8 GHz Plus
Core i3 N/A 650 1000 MHz
HD 3 MB
7100U 2.4 GHz
620
7Y30 1.0 GHz 2.6 GHz HD
Core m3 900 MHz
7Y32 1.1 GHz 3.0 GHz 615

Server processors

Target Cores Processor CPU CPU Turbo clock rate GPU clock rate
GPU
segment (threads) branding and model clock rate Single Dual Quad EUs
model Base
core core core

E3-1280 v6 3.9 GHz N/A

HD
E3-1275 v6 4.2 GHz ? 350 MHz
P630
3.8 GHz
4 (8) E3-1270 v6 N/A

HD
Server E3-1245 v6 ? ? ? 350 MHz
3.7 GHz 4.1 GHz P630
E3-1240 v6
Xeon N/A
E3-1230 v6 3.5 GHz 3.9 GHz
HD
E3-1225 v6 3.3 GHz 3.7 GHz ? 350 MHz
P630
4 (4)
E3-1220 v6 3.0 GHz 3.5 GHz N/A

E3-1535M v6 3.1 GHz 4.2 GHz 4.1 GHz 3.9 GHz

Mobile HD
4 (8) E3-1505M v6 3.0 GHz 4.0 GHz 3.8 GHz 3.6 GHz ? 350 MHz
P630
Embedded E3-1505L v6 2.2 GHz 3.0 GHz ? ?

Kaby Lake Refresh (8th gen) microarchitecture

 CPU CPU Turbo clock rate GPU clock rate Max. cTDP
Processor Cores L3 L4 Release Price
Model clock Single Dual Quad GPU PCIe TDP
branding (threads) Base Max. cache cache Up Down date (USD)
rate core core core lanes

1.9 3.9
8650U 4.2 GHz
GHz GHz 1150
Core i7 8 MB $409
1.8 3.7 MHz
8550U 4.0 GHz
GHz GHz UHD 300 15 25
4 (8) N/A 12 10 W Q3 2017
1.7 620 MHz W W
8350U 3.6 GHz
GHz 1100
Core i5 6 MB $297
1.6 MHz
8250U 3.4 GHz
GHz

Coffee Lake (8th gen) microarchitecture

[57]
This table shows the current CPUs based on Coffee Lake and their specifications. More Coffee Lake CPUs will be released in the first half of 2018 along with more chipsets.

Turbo clock rate[58] [GHz]

Processor Cores CPU max iGPU L3 Memory Price
Model Number of cores used GPU TDP Socket
branding (threads) clock rate clock rate cache support (USD)
1 2 3 4 5 6
8700K 3.7 GHz 4.7 4.6 4.5 4.4 4.3 95 W $359
Core i7 6 (12) 1.20 GHz 12 MB
8700 3.2 GHz 4.6 4.5 4.4 4.3 65 W $303
UHD DDR4-2666 LGA 1151[59]
8600K 3.6 GHz 4.3 4.2 4.1 Graphics 1.15 GHz 95 W $257
Core i5 6 (6) 9 MB (Only compatible
8400 2.8 GHz 4.0 3.9 3.8 630 1.05 GHz 65 W $182
(GT2) with 300 series
motherboards)
8350K 4.0 GHz 1.15 GHz 8 MB 91 W $168
Core i3 4 (4) N/A DDR4-2400
8100 3.6 GHz 1.10 GHz 6 MB 65 W $117

Cannon Lake (8th gen) microarchitecture

See also
Centrino
List of Intel Core i9 microprocessors

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External links
Intel Core technical specificationsat the Wayback Machine (archived August 9, 2007)
CPU Database. TechPowerUp.
Intel Core Duo (Yonah) Performance Preview– Part II vs AMD 64 X2 and Intel Pentium M. Anandtech.
Intel Core i7-3960X CPU Performance Comparison.
Intel Centrino Duo Mobile Technology papers. Intel.
Intel Product Information, providing a list of various processor generations

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