DFAE Dialog DA14580 FAE Training (Morning)

DA14580 – Bluetooth FAE Training
# Hands-on Experience
Date: February, 2014

Agenda
Morning Session
09.30 – 09.45 SmartBond™ - Introduction
09.45 – 10.15 BT Smart an Overview
10.15 – 10.30 DA14580 Hardware
10.45 – 11.00 Break
11:00 – 11:30 DA14580 development environment overview
11:30 – 12:30 Tools Installation + Using the Compiler Hands-On
12.30 – 13.30 Lunch

Agenda
Afternoon Session
13:30 – 15:30 Hands-on Experience on DA14580 SDK & Tools
15:30 – 15:45 Break
15:45 – 16:00 Measure current @ uA level with DA14580
16:00 – 16:15 Software Architecture Overview
16:15 – 16:25 Roadmap
16:25 – 16:45 Support Model (Where / What / Who) & Q&A
16:45 – 17:00 Wrap-up and Feedback

Agenda
Morning Session
09.30 – 09.45 SmartBond™ - Introduction (5-12)
10.15 – 10.30 DA14580 Hardware
10.45 – 11.00 Break
12.30 – 13.30 Lunch

SmartBond™
DA14580 Bluetooth Smart Solution
Part 1 – Introduction
5
Dialog Semiconductor Overview
■ Fabless provider of mixed signal integrated circuits

(ICs). Listed on Frankfurt Stock Exchange Dialog revenue (US$ million)
• Highly integrated power management, including AC/DC Cash (incl. restricted cash)
power conversion 2007
• Ultra low power audio 2008

• Low energy short-range wireless 2009
Multi-touch displays 774
• 2010 57%
• LED Solid State Lighting CAGR
2011
527
■ We work with the leading OEMs in high volume, 2012
high growth portable device segments 218

296
• Smartphones, tablets & Ultrabooks™ 162

87
• Portable media devices, gaming consoles and digital
cordless phones
2007 2008 2009 2010 2011 2012
• Wireless audio applications
• LED lighting
■ At forefront of mobile power management

innovation
• Highest PMIC integration in the industry
• Broad power management IP portfolio,
including high efficiency digital power conversion,
fast battery charging & advanced packaging
6 Dialog Semiconductor ©2013

Customers and partners in key segments
Power management and audio ICs Short-range wireless
DECT ULE chipsets and Bluetooth Smart SoC

■ #1 in smartphones/tablet PMICs by shipment
volume. Working with leading, trend-setting brands ■ DECT ULE – interference-free smart home
connectivity with the widest range
■ Processor Partner Initiative
■ Smallest and lowest power Bluetooth Smart SoC
AC-DC power conversion LED Solid State Lighting (SSL)
AC-DC Converter ICs in chargers and adapters LED Driver ICs in SSL applications
for portable devices ■ Positioned as a leader in retrofit bulbs
■ #1 in feature phones
■ #1 in smartphones/tablets

A global organisation
R&D Sales
Centers Offices
Stuttgart & Taipei,
Munich, Germany Taiwan ROC
Global HQ Swindon & Seoul,
Kirchheim
US HQ, (Stuttgart), Edinburgh, UK Korea
Santa Asia HQ,
Germany Taipei,
Clara Den Bosch & Tokyo,
Taiwan
Hengelo, Holland Japan
Athens & Patras, Shanghai,
Greece Shenzhen,
Hong Kong,
Graz, Austria China
Livorno, Italy Singapore

Europe
10% APAC & Japan Istanbul, Turkey Reading, UK
18% US
■ Total employees: ~1000 Stuttgart, Germany
Beijing, Tianjin, China
■ R&D engineering: ~72%
72%
% Tokyo, Japan
% Den Bosch, Holland
Santa Clara &

Santa Clara, US
Campbell, US
Source date: July 2013

Expertise in Radio & Software
Short-range wireless
DECT ULE chipsets and Bluetooth Smart SoC

■ DECT ULE – interference-free smart home
connectivity with the widest range
■ Smallest and lowest power Bluetooth Smart SoC
Capability to support Bluetooth Radio & Software ?
Yes ! We’re a group of over 80 people with experience in multiple radio

standards (including DECT ULE, Wireless Audio) and extensive software
support (DECT stack is >> complex than bluetooth – 50% of the DECT
phones on the market are Dialog Baseband & RF ! Dialog can support
you..

SmartBond - A Breakthrough Solution
World’s Lowest Power Consumption
Power consumption of available

<½ solutions
• <5mA Tx/Rx at 3V at 0/-93 dBm respectively
• 0.6 µA at 3V in deep sleep
■ Double the lifetime of your product

■ Halve the size of your battery and reduce
the size and cost of your system

SmartBond - A Breakthrough Solution
World’s Smallest Solution
Package size of currently available

<½ solutions
• 2.5x2.5x0.5mm WL-CSP package
• QFN also available
■ Minimize the size of your PCB
■ Create previously inconceivable small form
factor industrial designs
■ Lowest BOM count solution on the market

Enjoy the training !
• Please ask if you’d like anything covered again ..

• Feel free to give us feedback on what else you may need..
• The development kits are available now to enable your support
in the field.
• All the collaterals will be made available to you..
• Support doesn’t stop here : Dialog FAE team are here to help
you…
• Most importantly, enjoy your training on the best BT Smart
device on the market !

Agenda
Morning Session
09.45 – 10.15 BT Smart an Overview (14-25)
10.15 – 10.30 DA14580 Hardware
10.45 – 11.00 Break
12.30 – 13.30 Lunch

Bluetooth SMART, Demonstration
Find Me Profile
Proximity Profile

Bluetooth SMART, The history of it all…
• 2001, Nokia started working on a low power wireless specification inspired by

Bluetooth technology
• 2004, The first specification was published as “Bluetooth Low End Extension”
• 2006, The specification had matured and was branded Wibree
• 2007, An agreement was made with the Bluetooth SIG to include Wibree in the
Bluetooth specification under the name Bluetooth Low Energy
• 2010, The Bluetooth 4.0 specification which included Bluetooth Low Energy, now
branded as Bluetooth SMART, was adopted.
• 2011, The first product featuring Bluetooth 4.0 was released in Oct. (iPhone 4S)
• 2013, Android finally joined the bandwagon and released Android 4.3 (Jelly Bean)
with OS support for Bluetooth SMART.

Bluetooth SMART, design goals
Technology Design goals:

• Low Power, Low Power, Low Power…
• Worldwide Operation
• Low Cost
• Robust
• Short Range

Products already featuring Bluetooth Smart
Ace Sensor Inc. Pally Smart Health Scale Weight scale

Ace Sensor Inc. Pally Smart Key Finder Proximity sensor
Acon Biotech On Call Bluetooth Adapter Medial adapter
Adidas MiCoach HRM Hear rate monitor
Adidas MiCoach SPEED_CELL Sports tracker
Adidas MiCoach X_CELL Sports tracker
Adonit Corp. Jot Touch Stylus
Alatech Technology CS010, CS009 Heart rate monitor
Albers Inc. Item Finder/APP controller Proximity sensor
Alutech Int'l Ltd. W183 Heart rate monitor
BAC Track BT-M5 Breathalyzer
BeetsBlu BBHRM1 Heart rate monitor
Beurer GmbH PM250 Heart rate monitor
BiiFit HRM01 Heart rate monitor
BiiSafe BiiSafe Buddy Proximity sensor
Bluegiga Technologies D112 USB dongle
Blue Bulb Chameleon LED light strip
Blue Leza BLSFHR01 Heart rate monitor
BodyGauge TMMB-1018B Blood pressure monitor
Buffalo Bluetooth Proximity Tag Proximity sensor
Cardiofitness GbR Brustgurt Proximity Device
Casio G-Shock GB-5600B, GB-6900, GB-6900B, GB-X6900 Smart watch
CCA Electronic Factory RT-1201A Mobile phone accessory
Chamberlain MyQ Garage door controller
Citizen W760 Smart watch
connectBlue OLS425, OLP425 Platform, OLS426 Module
Dayton HRM Heart rate monitor
Deltron Technology iFound Key Proximity sensor
Denso Corporation KFDNX Proximity sensor
EB Brands Sportline SYNC 3015, 3016 Heart rate monitor
EB Brands Sportline SYNC GPS 3010, 3011, 3012 Heart rate monitor
Echowell BH20 Heart rate monitor
Echowell BTR20 Cycling sensor
Efilliate SB-01HE Camera shutter remote
Elecom Co., Ltd M-BT11BB And many more... Mouse
Evluma Area Max LED outdoor light
FBSC F-PLUG Power consumption sensor
Find My Car Smarter Find My Car Smarter system Proximity sensor
Fitbit, Inc. Fitbit One Fitness tracker
Fitbit, Inc. Zip Fitness tracker
Fitcrew RUN 4.1 Treadmill
Fook Tin Scale Pro Series Body scale
Garmin Fenix GPS hiking watch
Geonaute Geonaute Heart rate monitor
GeoPalz iBitz Fitness Tracker
17 Dialog Semiconductor
Gpulse
©2013 BLE-HRM-100 Heart rate monitor
Gunitech L012 LED light bulb
Health&Life Blood Pressure Monitor Blood pressure monitor
Bluetooth SMART, Market Growth Projections
IMS research:
100 million Bluetooth Smart chipsets will be deployed in 2014
ABI research:
Bluetooth Smart enabled device shipments reaching over 1 billion
annual shipments by 2016
IHS research:
The adoption of Bluetooth Smart is set to grow rapidly, with over 350
million Bluetooth Smart ICs projected to be shipped cumulatively by
the end of 2016
IMS research:
Shipment surpassing three billion units in 2017 (BT combo included)

Bluetooth SMART, Network Topology, Roles, States
Link Layer State Machine

Scanning
Advertising Standby Initiating
Connected as Connected as
Slave Master
Connected


Scanning
Advertising Standby
Connected as
Slave


Scanning
Standby Initiating
Connected as
Master

Network Topology Link Layer State Machine
Scanning
Peripheral
Central
Advertiser
Scanner Standby
Slave Slave Master
Standby
Master Connected
Initiator

Network Topology Link Layer State Machine
Advertiser Scanning
Advertiser Peripheral
Central
Advertiser
Scanner Standby
Slave Slave Master
Standby
Slave Master Connected
Initiator
Connection Request
Slave
Slave Advertiser

Strengths / weaknesses, Bluetooth SMART in general
• Minimal Power Consumption • No direct cloud access

• Small Size • No Mesh Networking(*)
• Direct interface to Smartphones • Operates in crowded ISM band
• Profiles ensure interoperability
• Applicable to all markets
• Low cost
• Secure data transmission

Wi-Fi Co-existence, how robustness is achieved
Advertising Channels
Wi-Fi Ch. 1 Wi-Fi Ch. 6 Wi-Fi Ch. 11

Agenda
Morning Session
10.15 – 10.30 DA14580 Hardware (27-50)
10.45 – 11.00 Break
12.30 – 13.30 Lunch

The DA14580 Bluetooth Smart SoC
Designed for wearable computers, wireless keyboard

and mouse, Smart TV remote control and proximity
tag/indoor navigation markets
Doubles battery life in Bluetooth Smart products
(600nA in extended sleep, 4.9mA peek)
Smallest package on the market (2.5mm x 2.5 mm)
Minimum of external components required
No external PA required
On-chip OTP code space
Boost and Buck mode operation (powered directly
from 3V battery or 1.5V cell)
Stand-alone or externally hosted operation

The DA14580, Half the power consumption
Half the power consumption of currently available

solutions:
• <5 mA Tx/Rx at 3V at 0/-93 dBm respectively
• 600nA at 3V in deep sleep
Thereby doubling the lifetime of your product or

reducing the required battery size by 50%

DA14580 Package types
WL-CSP34 Tray order numbers:

2.5 x 2.5 x 0.5mm
14GPIOs Order Number: DA14580-01UN6
QFN40
5.0 x 5.0 x 0.9mm
24GPIOs Order Number: DA14580-01AT1
QFN48
6.0 x 6.0 x 0.9mm
Order Number: DA14580-01A31
32GPIOs

DA14580 Minimum Implementation
optional
Reference Value
C1 1uF
C2 1uF
C3 100nF
Y1 16.000MHz
Y2 32.768kHz
Optional!
U1 DA14580
L1 2.2uH

Comparison matrix
Feature DA14580 Competition

Boost Regulator
Physical Size 2.5mm x 2.5mm 3.5mm x 3.8mm
External Components 5 13
Peak Current Draw 4.9mA 13.4mA
Deep sleep 600nA 530nA (off)
Extended Sleep 1.2µA -

DA14580 Hardware
Power Management
Buck/Boost converter for efficient

power conversion from a large range
of batteries
Lithium coincell
Small form factor inductor 2.2 uH
Alkaline LithiumIon pack Wide voltage range coverage
NiMh USB 0.9 to 3.3V natively
3.3V+ with external LDO
0.9V 1.8V 2.2V 3.3V 5V
On chip LDO’s for disabling power
Boost Operation domain when possible – no external
Buck Operation
capacitors needed.
+ext. LDO
Switchable GPIO supply rails
Battery monitor ADC

DCDC converter efficiency
Power efficiency between 80% and 90% in

Buck mode
Power efficiency up to 90% in Boost mode
At Vbat1V > 1.5V the boost converter will

go to a linear mode to avoid excess power
on the LDOs: Vdcdc max voltage ~1.4V

DA14580 product availability
Product Status Container Package Order number Available Lead

time
WLCSP DA14580-00UN6
Tray In
DA14580-00 Development QFN40 DA14580-00AT1 Now
(50 units) Stock
QFN48 DA14580-00A31
WLCSP DA14580-01UN6
Production Tray In
QFN40 DA14580-01AT1 12 Feb
samples (50 units) Stock
QFN48 DA14580-01A31
DA14580-01
5k T&R WLCSP DA14580-01UNA 28 Feb
Volume
5k T&R QFN40 DA14580-01AT2 12 wks
Production 24 Mar
4k T&R QFN48 DA14580-01A32

DA14580 Development Kit availability
Product Container Package Order number Available Lead

time
Motherboard Box - DA14580DEVKT
Box WLCSP DA14580UNDB
20 Feb 2 wks
Daughterboard kit Box QFN48 DA14580A3DB
Box QFN40 DA14580ATDB

Delta description between DA14580-00 and
DA14580-01
The numbering change from DA14580-00 to DA14580-01 is

indicating a ROM code update.
The ROM update is done for following reasons:
Clearing of the patch space
To update the boot-rom to improve battery voltage
monitoring during the boot sequence.
In the same mask release an improvement in the 32kHz
oscillator was done to reduce current consumption by 150nA
and bring it back to the specified level in the datasheet.

Software Development Kit Overview
Product SDK version Release date

DA14580-00 SDK-2.0.4 Dec 24, 2013
SDK-3.0.2-Engineering Feb 20, 2014
DA14580-01
SDK-3.0.2-Final March 21, 2014
Changes from SDK-2.0.4 to SDK-3.0.2

SDK structure will be simplified to improve ease-of-use
Peripheral drivers will be added (Note: software API will not change)
Old patches will be removed
SDK Migration Process
The customer application must be copied to the new SDK-3.0.2 and re-
built before running it on the DA14580-01.
A migration document is available together with the SDK-3.0.2 release

Panasonic PAN1740
4PAN1740
4Based on Dialogs single chip DA14580
4Highly integrated and compact Bluetooth controller
4Small 9.0 x 9.5 x 1.8 mm SMD package with antenna
4Includes 16MHz and 32.768kHz crystal
4Bluetooth 4.0 qualified (4.1 qualification is ongoing)
4Temperature Range from -40°C to +85°C
4Power consumption 5.0mA Rx and Tx
4Link budget 93dBm (Rx Sensitivity -93, Tx 0 dBm)
Panasonic Bluetooth Low Energy Portfolio
Part Number PAN1720 PAN1740
Size in mm 15.6 x 8.7 x 1.8 9.0 x 9.5 x 1.8
1) BlueRadios AT Command IC with GATT/GAP API

Software
2) TI LE Stack with profiles Profiles available
4 dBm PAN1720
RF Performance 0 dBm
0 dBm PAN1721
Tx: 5mA
Tx: 23mA
Rx: 5mA
Power Consumption Rx: 18 mA
Sleep Mode: <1 µA
Sleep Mode: <1 µA
256k 32k free (OTP)

Available Memory
(stack uses 90-120k) stack already included
PAN1740 Eval Kit
4Dialog Mother-Board 4PAN1740 ETU

4Profiling tool for Real-time power 4Daughter Board with Connector
consumption measurement
4Mount on Mother-Board
4Correlate power consumption to your code
4Optimize your code
4Meet your power budget target
Hardware overview

Active mode
DCDC (Buck/Boost) RC16 RC32 PO

XTAL
ARM Cortex XTAL MHz kHz R
32.468
M0 16MHz LDO LDO LDO
kHz LD
SYS RET RF
System/
Exchange
RAM 42KB
BLE Core Radio Transceiver
Retention
Mem. Ctrl
RAM 2KB
Retention
APB bridge
RAM 3KB
Retention
WAKE UP
Power/
4CH ADC
DECODER
RAM 2KB
TIMER
TIMER
UART
UART
QUAD
Clock
SPI
I2C
Retention MGNT.
RAM 1KB
(PMU)
OTP DMA
32KB CTRL
GPIO MULTIPLEXING
ROM
84KB

Sleep/idle mode

XTAL
32.468
kHz LD
SYS RET RF
System/
Exchange
RAM 42KB
Retention
Mem. Ctrl
RAM 2KB
Retention
APB bridge
RAM 3KB
Retention
WAKE UP
Power/
4CH ADC
DECODER
RAM 2KB
TIMER
TIMER
UART
UART
QUAD
Clock
SPI
I2C
Retention MGNT.
RAM 1KB
(PMU)
OTP DMA
32KB CTRL
GPIO MULTIPLEXING
ROM
84KB

Extended sleep mode

XTAL
32.468
kHz LD
SYS RET RF
System/
Exchange
RAM 42KB
Retention
Mem. Ctrl
RAM 2KB
Retention
APB bridge
RAM 3KB
Retention
WAKE UP
Power/
4CH ADC
DECODER
RAM 2KB
TIMER
TIMER
UART
UART
QUAD
Clock
SPI
I2C
Retention MGNT.
RAM 1KB
(PMU)
OTP DMA
32KB CTRL
GPIO MULTIPLEXING
ROM
84KB

Deep sleep mode

XTAL
32.468
kHz LD
SYS RET RF
System/
Exchange
RAM 42KB
Retention
Mem. Ctrl
RAM 2KB
Retention
APB bridge
RAM 3KB
Retention
WAKE UP
Power/
4CH ADC
DECODER
RAM 2KB
TIMER
TIMER
UART
UART
QUAD
Clock
SPI
I2C
Retention MGNT.
RAM 1KB
(PMU)
OTP DMA
32KB CTRL
GPIO MULTIPLEXING
ROM
84KB

Hosting configurations
Applications can be created in different memory and processor configurations:
Flash MCU
SPI/I2C I/F Ext. Proc. I/F
DA14580 DA14580 DA14580
Integrated Processor Integrated Processor External Processor

Solution (stand-alone): Solution with External Solution:
memory:
Controller and host stack Controller and host stack Controller and host stack
running on DA14580. running on DA14580. running on DA14580.
Profiles and Application stored Profiles and Application loaded Profiles and Application
in OTP and executed from from external Flash and
SRAM executed on Ext MCU
executed from SRAM
Fully sourced sample code available for both stand-alone and externally hosted
applications

Minimum hardware implementation
The WL-CSP and low count of external components allow for

very small Bluetooth Smart applications

OTP programming
Customer needs to program the OTP in the production line

It requires 6.8V on the DA14580 to program the OTP
Programming is done through UART interface using
SmartSnippet tool
A Command Line Interface (CLI) tool is available for
integration in a customer production environment
For a 10kByte application Program + Verify is about 1sec

Agenda
Morning Session
10.15 – 10.30 DA14580 Hardware
10.45 – 11.00 Break
12.30 – 13.30 Lunch

Agenda
Morning Session
10.15 – 10.30 DA14580 Hardware
10.45 – 11.00 Break
11:00 – 11:30 DA14580 development environment overview (53-61)
12.30 – 13.30 Lunch

The Smartbond DVK
WL-CSP
QFN40
QFN48

The DVK contents
Daughterboard with
Segger Link Lite for ARM
DA14580 mounted
DVK Motherboard

The DVK Motherboard
• JTAG interface for programming and debugging

• Interface to the DA14580 Daughterboard
• OTP supply voltage generator (6V8)
• Mother board is powered through the USB interface.
• 2 Bicolor LEDs and 2 pushbuttons for application development
• USB to serial port converter (UART for debugging and/or external
host application interface. SPI for current consumption evaluation
using SmartSnippets).
• Current evaluation A/D conversion circuitry
• One battery holder for single alkaline AAA cell and one for a 3V
CR2032 coin cell battery
• All I/Os are exposed onto 100mill pin headers for easy prototyping

The DVK Daughterboard
• Stand-alone implementation of DA14580

(except for power source)
• Three variants available: WL-CSP, QFN40 and
QFN48 – ordered separately in sets of three
• External antenna for easy RF evaluation
• All I/Os are brought to the edge connectors
WL-CSP variant
(interface to motherboard)

DVK USB Dongle
• Features the DA14580

• Provides a secondary BLE entity (USB dongle can
act as central device while DVK board acts as
peripheral – or the other way around)
• Useful when working with Connection Manager
• Can operate as stand-alone or can use PC as
external host.

Tools provided with DVK
• Keil uVision IDE, free 32kByte ARM MDK-lite version
• SmartSnippets for evaluation of power consumption
• Connection Manager for protocol analysis and test

Keil uVision MDK-Lite, IDE and compiler (Ver.5)
• Free 32KByte version

• Standard IDE
• Full debugger
• Easy to use
• SW loads directly to target via Segger J-Link interface
• Well-known and popular IDE

SmartSnippets
• Provides exact power profiling

• Includes a boot-loader (UART)
• Includes an OTP programmer
• Displays profiling data graphically (User defined cursors)
• Capable of export to and import from comma separated files

Connection Manager
• Can act as central or peripheral device

• Includes a UART boot loader
• Log window displays protocol frames (Logs can be
stored)
• Let’s user modify scan interval and scan window
timing
• Let’s user modify Connection Interval, Slave Latency
and Connection Supervision interval
• Connection can be established and bonding can be
performed
• Full service and characteristic discovery
• Reading and writing of characteristics

Agenda
Morning Session
10.15 – 10.30 DA14580 Hardware
10.45 – 11.00 Break

(63-68)
12.30 – 13.30 Lunch

Kit Content

Tools & Software Overview
Keil MDK ARM uVision IDE

Microcontroller (ARM) Development Kit, including C-compiler and Debugger
Segger J-Link driver

JTAG/SWD+SWO Debug Probe
FTDI RS-232/USB Driver

Virtual COM-Port driver
Connection Manager (needs Microsoft .NET vs.4)

Dialog tool to manage BTLE peer connections
Smartsnippets
Dialog tool to optimize code/power usage and OTP programming

Installing the tools & software 1 (refer to handout)
Copy the files from the USB Drive to your computer and include
the latest SDK:

1/ Install Keil compiler ‘mdk501.exe’

No need to
install
additional
packages
2/ Install Segger J-Link driver ‘Setup_JLinkARM_V478k.exe’

3/ Install FTDI driver ‘CDM v2.08.30 WHQL Certified.exe’

4/ Install Smart{Snippets} ‘SmartSnippets_install_winxx.exe
(.._win32.exe for 32-bit OS /.._win64.exe for 64-bit OS)
If the Java runtime environment is not installed you’ll get an error:
Install Java ‘jre-7u45-windows-i586.exe’
5/ Install ConnectionManager ‘ConnectionManager_install.exe’

Using the Bluetooth Smart
Development Kit
Once you have installed all the tools and software continue with
the ‘Hands-On’ manual.

Agenda
Morning Session
10.15 – 10.30 DA14580 Hardware
10.45 – 11.00 Break
12.30 – 13.30 Lunch

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DFAE Dialog DA14580 FAE Training (Morning)

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DA14580 – Bluetooth FAE Training

Date: February, 2014

09.30 – 09.45 SmartBond™ - Introduction

09.45 – 10.15 BT Smart an Overview

10.15 – 10.30 DA14580 Hardware

10.45 – 11.00 Break

11:00 – 11:30 DA14580 development environment overview

11:30 – 12:30 Tools Installation + Using the Compiler Hands-On

12.30 – 13.30 Lunch

13:30 – 15:30 Hands-on Experience on DA14580 SDK & Tools

15:30 – 15:45 Break

15:45 – 16:00 Measure current @ uA level with DA14580

16:00 – 16:15 Software Architecture Overview

16:15 – 16:25 Roadmap

16:25 – 16:45 Support Model (Where / What / Who) & Q&A

16:45 – 17:00 Wrap-up and Feedback

09.30 – 09.45 SmartBond™ - Introduction (5-12)

09.45 – 10.15 BT Smart an Overview

10.15 – 10.30 DA14580 Hardware

10.45 – 11.00 Break

11:00 – 11:30 DA14580 development environment overview

11:30 – 12:30 Tools Installation + Using the Compiler Hands-On

12.30 – 13.30 Lunch

■ Fabless provider of mixed signal integrated circuits

• Ultra low power audio 2008

high growth portable device segments 218

• Smartphones, tablets & Ultrabooks™ 162

■ At forefront of mobile power management

6 Dialog Semiconductor ©2013

Power management and audio ICs Short-range wireless

DECT ULE chipsets and Bluetooth Smart SoC

AC-DC power conversion LED Solid State Lighting (SSL)

7 Dialog Semiconductor ©2013

Livorno, Italy Singapore

Santa Clara &

8 Dialog Semiconductor ©2013

DECT ULE chipsets and Bluetooth Smart SoC

Capability to support Bluetooth Radio & Software ?

Yes ! We’re a group of over 80 people with experience in multiple radio

9 Dialog Semiconductor ©2013

Power consumption of available

■ Double the lifetime of your product

10 Dialog Semiconductor ©2013

Package size of currently available

11 Dialog Semiconductor ©2013

• Please ask if you’d like anything covered again ..

12 Dialog Semiconductor ©2013

09.30 – 09.45 SmartBond™ - Introduction

09.45 – 10.15 BT Smart an Overview (14-25)

10.15 – 10.30 DA14580 Hardware

10.45 – 11.00 Break

11:00 – 11:30 DA14580 development environment overview

11:30 – 12:30 Tools Installation + Using the Compiler Hands-On

12.30 – 13.30 Lunch

14 Dialog Semiconductor ©2013

• 2001, Nokia started working on a low power wireless specification inspired by

15 Dialog Semiconductor ©2013

Technology Design goals:

16 Dialog Semiconductor ©2013

Ace Sensor Inc. Pally Smart Health Scale Weight scale

18 Dialog Semiconductor ©2013

Link Layer State Machine

Advertising Standby Initiating

19 Dialog Semiconductor ©2013