Ariane Bus Mems

3/10/05 – R&T CNES MEMS and Sensor Bus for the Telemetry Sub-System
MEMS – Sensor Bus

Application to the telemetry
subsystem
for the ARIANE 5 launcher
R&T CNES
(marché 01/CNES/5867 bdc 17)
This document is the property of EADS SPACE Transportation and shall not be communicated to third parties and/or reproduced without prior written agreement. Its contents
shall not be disclosed. © - EADS SPACE Transportation - 2005
Page 1
CONTENTS
STATEMENT OF THE PROBLEM
TELEMETRY COST BREAK DOWN STRUCTURE
MEMS AND SMART SENSORS FOR THE TELEMETRY :
- POSSIBLE SOLUTION FOR MEMS
- POSSIBLE SOLUTION SMART SENSORS
CONCLUSION
Page 2
OBJECTIVE OF THE STUDY
Use of New Sensors Technologies and Components for Cost

Reduction. 2 New concepts envisaged.
MEMS (micro electro-mechanical systems) = low cost sensors

for the automobile market. Mostly analog ; sometimes including
conditioning.
Seldom both
Smart Sensors (IEEE 1451 standard) = with electronics inside =

mostly related to the Bus Sensor Concept ; including New
Functions such as self-identifiable sensors, self-compensated
(offset, non linearities) sensors ; « plug and play » concept at the
limit.
Page 3
RECURRING COST FOR THE ARIANE 5 TELEMETRY
Telemetry stands for 20% of the cost of

avionics.
TM cost structure :
Sensors = 20 % MEMS
Harness & AIT(Assembly Integration & Test) = 35 % Smart

Electronics Boxes and Data Engineering = 45 % sensors
Page 4
DIFFICULTY with MEMS : INTERFACE
CONSTRAINTS + VERY HARSH ENVIRONMENT
„Intrusive“ sensors (pressures (in majority), temperatures, tank

levels) with strong leakage constraints.
Other sensors with mechanical interface constraints anyhow.
Î MEMS must be specially adapted for Ariane = overcosts
POSSIBLE SOLUTION : STANDARD MECHANICAL INTERFACE
Cryo zones (He = 4 °k ; LH2 = 20 °k ; N2 = 77 °k ; LOX = 90 °k)

Hot spots (nozzles) > 1000 °c …
SOLUTION ? (Silcon Carbide technology = 600 ° C ?)
Page 5
POTENTIAL CANDIDATES FOR MEMS REPLACEMENT
Out of 275 analog (operational) sensors per launcher,
Potential candidates for MEMS (Non intrusive with acceptable

temperature) amount to 50 ONLY.
But they are often costly Vibrations sensors, accelerometers

and gyrometers …
Page 6
ARIANE 5 / QUALIFICATION LEVELS OVERLOOK
1 cm 0-peak (5 - 16 Hz)
SINE VIBRATIONS
10 g 0-peak (16 - 60 Hz)
FOR ALL
22,5 g 0-peak (60 - 200 Hz)
10 g 0-peak (200 - 2000 Hz)
EQUIPMENT
RANDOM VIBRATIONS 20 g rms (20 - 2000 Hz) 4 mn Acoustics vibration test is

generally replaced (except for
ACOUSTICS 140 dB max ( - 10 kHz) large structures) by random
VIBRATIONS vibration test.
MEAN SHOCK 50 g ; 11 ms
1/2 sine wave
PYRO SHOCK Pyro shock are not applicable to
electronics equipment , unless
very close to the pyro shock
(pyro devices)
ACCELERATIONS 7,5 g (3 mn)
Generally combined with
VACUUN 10 – 3 to 10 5 pa thermics
THERMICS - 40 (if P < 20 W) to + 70 °C

(except cryo zones) ; 5 hours
NOTA 1 : Safety factor = 1,25 (7,5 g = 6 x 1,25)

NOTA 2 : electronics components range [-55° à +125°C]
Page 7
EXAMPLES OF CANDIDATE MEMS
4 criteria taken into account

Linearity -
Sensor Type Fabricant full scale Sensitivity Temperature
hysteresis
Ariane Sensor
candidate MEMS
EGCS-AR5-50-DF3 entrant +/- 5 g 360mV/g - 450 mV/g 0,4% full scale -40/80°C
accelerometer
KXF00 - F50 Silicon Designs 5g 800mV/g 0,5% FS -55/125°C
CE 254 M501 vibration at VIBROMETER 50g 50mV/g 1% -45/125°C

ordinary
MMA2202D temperature motorola 50g 40mV/g ? -40/125°C
NE115 / A5 / 140-TD differential NE-TECHNOLOGIE 140mbar 7,14 mV/mbar < 0,15% FS -40/100°C
3000 series pressure MERIT SENSOR 5 psi -350mb 75 mV < 0,15% -40/150°C
Page 8
DIFFICULTY (worse than with MEMS) with SMART

SENSORS : VERY HARSH ENVIRONMENT
SENSOR BUS could reduce harness and AIT.
Smart (self compensated, …) sensors could reduce

the data engineering (sensors calibration, Data Base
management, …).
Î BUT harsh environment is not appropriate for

electronics inside SMART Sensors.
SOLUTION : instead of « Smart sensor » use rather

« Smart interface » = CCS (coupleur conditionneur
standard), based on the IEEE 1451 standard.
Page 9
EPC engine compartment (BM)
28 TM harness (out of 78 in the BM)
TO BE REPLACED BY 1 OR A FEW BUSES
tank I/F
7 sensors
SNECMA I/F
3 x 27 sensors
Acq.
U ni t
3 to 4 wires / sensor
Page 10
BUS BASED TM ARCHITECTURE

CCS can cope with MEMS Today Architecture
as well as with intrusive sensors or simple TOP sensors
UCTM BDP
UCTM BDP
Central
Filtering 200 Hz
Power Bus
Sensor Bus
2 kHz
60 kHz
X 10 buses (20 - 30
UCAT
sensors / bus)
x 7 UCAT (16 DSP)
Intrusive Sensor
MEMS
ccs Conditionning
Adapted filter
Bus terminal
Page 11
ACQUISITION CHAIN MUST BE SIMPLIFIED
Today system =
Standard acquisition at high frequency (60 kHz).
Digital filtering (to frequency adapted to each sensor) needs
costly DSP x 16.
CCS (coupleur-conditionneur standard) =

Centralized digital filtering.
Transmission at medium frequency via the Sensor Bus (4 KHz
can meet all requirements, including shocks).
Suppression of Acquisition Units

Page 12
CONDITIONS « SINE QUA NON » ON THE CCS
COTS component if possible.

Low cost (300 to 350 CCS per operational flight, including TOPS :
regrouping needed)
several CCS types required : without conditioning, thermocouple,
…
+ CCS inside HARNESS , close to sensor (but in « temperate »

spot) in order to maximize the harness reduction.
CCS < 10 grams (tbc)
Page 13
CONCLUSION / EXPECTED OUTCOMES
COST REDUCTION : ≅ 30% (in part due to MEMS) of TM

Recurring cost.
Drastic noise reduction and reliability enhancement (less

connectors).
Harness mass reduction (> 10 kg for the upper composite) as well

as electrical power reduction.
simplification of interfaces between stages and sub-assemblies
Î more easy adding of sensors (less impacts on stage
definition).
Possibility of adding a complete Bus to investigate a local problem

Î not envisageable today.
Page 14

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3/10/05 – R&T CNES MEMS and Sensor Bus for the Telemetry Sub-System

MEMS – Sensor Bus

STATEMENT OF THE PROBLEM

TELEMETRY COST BREAK DOWN STRUCTURE

MEMS AND SMART SENSORS FOR THE TELEMETRY :

- POSSIBLE SOLUTION FOR MEMS

- POSSIBLE SOLUTION SMART SENSORS

OBJECTIVE OF THE STUDY

Use of New Sensors Technologies and Components for Cost

 MEMS (micro electro-mechanical systems) = low cost sensors

 Smart Sensors (IEEE 1451 standard) = with electronics inside =

RECURRING COST FOR THE ARIANE 5 TELEMETRY

Telemetry stands for 20% of the cost of

 Harness & AIT(Assembly Integration & Test) = 35 % Smart

 „Intrusive“ sensors (pressures (in majority), temperatures, tank

POSSIBLE SOLUTION : STANDARD MECHANICAL INTERFACE

 Cryo zones (He = 4 °k ; LH2 = 20 °k ; N2 = 77 °k ; LOX = 90 °k)

SOLUTION ? (Silcon Carbide technology = 600 ° C ?)

POTENTIAL CANDIDATES FOR MEMS REPLACEMENT

Out of 275 analog (operational) sensors per launcher,

Potential candidates for MEMS (Non intrusive with acceptable

But they are often costly Vibrations sensors, accelerometers

ARIANE 5 / QUALIFICATION LEVELS OVERLOOK

RANDOM VIBRATIONS 20 g rms (20 - 2000 Hz) 4 mn Acoustics vibration test is

THERMICS - 40 (if P < 20 W) to + 70 °C

NOTA 1 : Safety factor = 1,25 (7,5 g = 6 x 1,25)

EXAMPLES OF CANDIDATE MEMS

4 criteria taken into account

CE 254 M501 vibration at VIBROMETER 50g 50mV/g 1% -45/125°C

DIFFICULTY (worse than with MEMS) with SMART

 SENSOR BUS could reduce harness and AIT.

 Smart (self compensated, …) sensors could reduce

Î BUT harsh environment is not appropriate for

SOLUTION : instead of « Smart sensor » use rather

BUS BASED TM ARCHITECTURE

ACQUISITION CHAIN MUST BE SIMPLIFIED

 CCS (coupleur-conditionneur standard) =

Suppression of Acquisition Units

CONDITIONS « SINE QUA NON » ON THE CCS

 COTS component if possible.

+ CCS inside HARNESS , close to sensor (but in « temperate »

CCS < 10 grams (tbc)

CONCLUSION / EXPECTED OUTCOMES

 COST REDUCTION : ≅ 30% (in part due to MEMS) of TM

 Drastic noise reduction and reliability enhancement (less

 Harness mass reduction (> 10 kg for the upper composite) as well

 Possibility of adding a complete Bus to investigate a local problem

S-ar putea să vă placă și

MEMS (micro electro-mechanical systems) = low cost sensors

Smart Sensors (IEEE 1451 standard) = with electronics inside =

Harness & AIT(Assembly Integration & Test) = 35 % Smart

„Intrusive“ sensors (pressures (in majority), temperatures, tank

Cryo zones (He = 4 °k ; LH2 = 20 °k ; N2 = 77 °k ; LOX = 90 °k)

SENSOR BUS could reduce harness and AIT.

Smart (self compensated, …) sensors could reduce

CCS (coupleur-conditionneur standard) =

COTS component if possible.

COST REDUCTION : ≅ 30% (in part due to MEMS) of TM

Drastic noise reduction and reliability enhancement (less

Harness mass reduction (> 10 kg for the upper composite) as well

Possibility of adding a complete Bus to investigate a local problem