MURD620CT

Preferred Device

SWITCHMODEt
Power Rectifier
DPAK Surface Mount Package
These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.

Features
ULTRAFAST RECTIFIER
• Ultrafast 35 Nanosecond Recovery Time
6.0 AMPERES
• Low Forward Voltage Drop
200 VOLTS
• Low Leakage
• Pb−Free Packages are Available

Mechanical Characteristics: 1
• Case: Epoxy, Molded 4
3
• Weight: 0.4 Gram (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes: MARKING
DIAGRAM
260°C Max. for 10 Seconds

4
MAXIMUM RATINGS
YWW
Rating Symbol Value Unit DPAK U
1 2
Peak Repetitive Reverse Voltage VRRM 200 V 3 CASE 369C 620TG
Working Peak Reverse Voltage VRWM
DC Blocking Voltage VR
Average Rectified Forward Current IF(AV) A
(Rated VR, TC = 140°C) Per Diode 3.0 Y = Year
Per Device 6.0 WW = Work Week
U620T = Device Code
Peak Repetitive Forward Current IF 6.0 A G = Pb−Free Package
(Rated VR, Square Wave,
20 kHz, TC = 145°C) Per Diode
Non−Repetitive Peak Surge Current IFSM 50 A
(Surge Applied at Rated Load Conditions ORDERING INFORMATION
Halfwave, 60 Hz)
Device Package Shipping †
Operating Junction and Storage TJ, Tstg −65 to +175 °C
Temperature Range MURD620CT DPAK 75 Units/Rail

THERMAL CHARACTERISTICS (Per Diode) MURD620CTG DPAK 75 Units/Rail

(Pb−Free)
Rating Symbol Value Unit
Thermal Resistance, Junction−to−Case 9 °C/W MURD620CTT4 DPAK 2500/Tape & Reel
RqJC
Thermal Resistance, Junction−to−Ambient RqJA 80 °C/W MURD620CTT4G DPAK 2500/Tape & Reel
(Note 1) (Pb−Free)
Maximum ratings are those values beyond which device damage can occur. †For information on tape and reel specifications,
Maximum ratings applied to the device are individual stress limit values (not including part orientation and tape sizes, please
normal operating conditions) and are not valid simultaneously. If these limits are refer to our Tape and Reel Packaging Specifications
exceeded, device functional operation is not implied, damage may occur and Brochure, BRD8011/D.
reliability may be affected.
1. Rating applies when surface mounted on the minimum pad sizes
recommended. Preferred devices are recommended choices for future use
and best overall value.

© Semiconductor Components Industries, LLC, 2006 1

 MURD620CT

ELECTRICAL CHARACTERISTICS (Per Diode)

Rating Symbol Value Unit
Maximum Instantaneous Forward Voltage Drop (Note 2) vF V
(iF = 3 Amps, TC = 25°C) 1
(iF = 3 Amps, TC = 125°C) 0.96
(iF = 6 Amps, TC = 25°C) 1.2
(iF = 6 Amps, TC = 125°C) 1.13
Maximum Instantaneous Reverse Current (Note 2) iR mA
(TJ = 25°C, Rated dc Voltage) 5
(TJ = 125°C, Rated dc Voltage) 250
Maximum Reverse Recovery Time trr ns
(IF = 1 Amp, di/dt = 50 Amps/ms, VR = 30 V, TJ = 25°C) 35
(IF = 0.5 Amp, iR = 1 Amp, IREC = 0.25 A, VR = 30 V, TJ = 25°C) 25
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.

100 100

70 TJ = 175°C

IR, REVERSE CURRENT (mA)

10
150°C
50

1.0 100°C
30

20 0.1 25°C
i F , INSTANTANEOUS FORWARD CURRENT (AMPS)

0.01
10

7.0 0.001
0 20 40 60 80 100 120 140 160 180 200
5.0 VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Typical Leakage Current* (Per Leg)
3.0 * The curves shown are typical for the highest voltage device in the
175°C TJ = 25°C voltage grouping. Typical reverse current for lower voltage selections
2.0 can be estimated from these curves if VR is sufficiently below rated
VR.
150°C 100°C
PF(AV), AVERAGE POWER DISSIPATION (WATTS)

14
1.0 13 5.0 SINE
12 10 WAVE
0.7 11
10 IPK/IAV = 20 dc
0.5
9.0
8.0
7.0 SQUARE
0.3
6.0 WAVE
0.2 5.0
4.0
3.0 TJ = 175°C
2.0
0.1
1.0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0
vF, INSTANTANEOUS VOLTAGE (VOLTS) 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10

Figure 1. Typical Forward Voltage (Per Leg) IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 3. Average Power Dissipation (Per Leg)

2
 MURD620CT

PACKAGE DIMENSIONS

DPAK
CASE 369C
ISSUE O

NOTES:
−T− SEATING
PLANE 1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
B C 2. CONTROLLING DIMENSION: INCH.

V R E INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.235 0.245 5.97 6.22
B 0.250 0.265 6.35 6.73
4
C 0.086 0.094 2.19 2.38
Z D 0.027 0.035 0.69 0.88
A
E 0.018 0.023 0.46 0.58
S F 0.037 0.045 0.94 1.14
1 2 3
U G 0.180 BSC 4.58 BSC
K H 0.034 0.040 0.87 1.01
J 0.018 0.023 0.46 0.58
K 0.102 0.114 2.60 2.89
F L 0.090 BSC 2.29 BSC
J
R 0.180 0.215 4.57 5.45
L H S 0.025 0.040 0.63 1.01
U 0.020 −−− 0.51 −−−
D 2 PL V 0.035 0.050 0.89 1.27
Z 0.155 −−− 3.93 −−−
G 0.13 (0.005) M T

SOLDERING FOOTPRINT*

6.20 3.0
0.244 0.118
2.58
0.101

5.80 1.6 6.172

0.228 0.063 0.243

SCALE 3:1 ǒinches

mm Ǔ

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.