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Progress Report 1

Title: Mobile Robot Controlled Landmine Detection and Diffusion

Area of work: Embedded


Type of model: Hardware

PROJECT OBJECTIVES
With peacekeeping operations now often taking place in deserts, as well as
forests and towns all in the same day, ADAPTIV is capable of shielding large pieces
of military equipment from detection by allowing vehicles to mimic the
temperature of their surroundings to suit varying terrain.

The main modes of working would be:

 To create a prototype RC vehicle attached to it will be the Peltier Plates(LTC


035) on its side ,

 These plates will be connected to a thermocouple. Another temperature


sensor will sense the temperature of its surrounding and feed it into to the
microcontroller(Atmega16) which gives a digital output, further fed into a
Digital to Analog Converter(DAC),

 The DAC outputs an Analog signal, fed into a Power Amplifier (with
MOSFETS IRF 9522 & IRF 520) to amplify the power to counter the loss in
power(=60W) due to LTC035 Peltier Module.

 The temperature of the plates is varied and desired temperature is received


and made equivalent to the surroundings causing the prototype to blend in
the surroundings ultimately making it invisible.
LCD Display
LM 35
Temperat
ADC
ure
sensor

Power
supply
Microcontroller Peltier
Atmega16 Plate
Series
controlling
element

ADC Thermocouple
Working
 LM35 temperature sensor is used to sense the atmospheric temperature. This value will be
given to ADC and then to microcontroller Atmega16.

 Thermocouple will sense the temperature of peltier plate and give it to ADC and then
microcontroller Atmega16.

 Microcontroller will compare these two temperatures, if temperature of peltier plate is less than
atmospheric temperature then microcontroller will turn on the series element and peltier plate
will get the power supply.

 Now peltier plate will start heating up untill its temperature become equal to atmospheric
temperature.

Project Modules:

Module1: circuit designing PCB layout selection and purchasing of components.

Module 2: Component mounting and assembling of mechanical parts.

Module 3: firmware coding.

Module 4: testing of complete project.

Current progress:
Module 1 comprises of 30% work of the project has been completed.

Module 2currently running

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