MCP3204/3208

2.7V 4-Channel/8-Channel 12-Bit A/D Converters

with SPI® Serial Interface
FEATURES PACKAGE TYPES
• 12-bit resolution PDIP, SOIC, TSSOP
• ± 1 LSB max DNL CH0 1 14 VDD
• ± 1 LSB max INL (MCP3204/3208-B) CH1 2 13 VREF

MCP3204
• ± 2 LSB max INL (MCP3204/3208-C) CH2 3 12 AGND
• 4 (MCP3204) or 8 (MCP3208) input channels CH3 4 11 CLK
• Analog inputs programmable as single-ended or NC 5 10 DOUT
pseudo differential pairs NC 6 9 DIN
DGND 7 8 CS/SHDN
• On-chip sample and hold
• SPI® serial interface (modes 0,0 and 1,1)
• Single supply operation: 2.7V - 5.5V
• 100ksps max. sampling rate at VDD = 5V PDIP, SOIC
• 50ksps max. sampling rate at VDD = 2.7V
• Low power CMOS technology CH0 1 16 VDD
- 500 nA typical standby current, 2µA max. CH1 2 15 VREF

MCP3208
CH2 3 14 AGND
- 400 µA max. active current at 5V
CH3 4 13 CLK
• Industrial temp range: -40°C to +85°C CH4 5 12 DOUT
• Available in PDIP, SOIC and TSSOP packages CH5 6 11 DIN
CH6 7 10 CS/SHDN
APPLICATIONS CH7 8 9 DGND

• Sensor Interface
• Process Control
• Data Acquisition FUNCTIONAL BLOCK DIAGRAM
• Battery Operated Systems
VDD VSS
DESCRIPTION VREF

The Microchip Technology Inc. MCP3204/3208 CH0

devices are successive approximation 12-bit Ana- CH1 Input
Channel DAC
log-to-Digital (A/D) Converters with on-board sample Mux
and hold circuitry. The MCP3204 is programmable to CH7*
provide two pseudo-differential input pairs or four sin- Comparator
gle-ended inputs. The MCP3208 is programmable to Sample 12-Bit SAR
provide four pseudo-differential input pairs or eight sin- and
Hold
gle-ended inputs. Differential Nonlinearity (DNL) is
specified at ±1 LSB, and Integral Nonlinearity (INL) is Shift
Control Logic
offered in ±1 LSB (MCP3204/3208-B) and ±2 LSB Register
(MCP3204/3208-C) versions. Communication with the
devices is done using a simple serial interface compat- CS/SHDN DIN CLK DOUT
ible with the SPI protocol. The devices are capable of
conversion rates of up to 100ksps. The MCP3204/3208 *Note: Channels 5-7 available on MCP3208 Only

devices operate over a broad voltage range (2.7V -

5.5V). Low current design permits operation with typi-
cal standby and active currents of only 500nA and
320µA, respectively. The MCP3204 is offered in 14-pin
PDIP, 150mil SOIC and TSSOP packages, and the
MCP3208 is offered in 16-pin PDIP and SOIC pack-
ages.

 1999 Microchip Technology Inc. Preliminary DS21298B-page 1

MCP3204/3208
1.0 ELECTRICAL PIN FUNCTION TABLE
CHARACTERISTICS
NAME FUNCTION
1.1 Maximum Ratings* VDD +2.7V to 5.5V Power Supply
VDD.........................................................................7.0V DGND Digital Ground
All inputs and outputs w.r.t. VSS ...... -0.6V to VDD +0.6V AGND Analog Ground
Storage temperature ..........................-65°C to +150°C
CH0-CH7 Analog Inputs
Ambient temp. with power applied......-65°C to +125°C
Soldering temperature of leads (10 seconds) .. +300°C CLK Serial Clock
ESD protection on all pins ...................................> 4kV DIN Serial Data In
*Notice: Stresses above those listed under “Maximum Ratings” may DOUT Serial Data Out
cause permanent damage to the device. This is a stress rating only and
functional operation of the device at those or any other conditions CS/SHDN Chip Select/Shutdown Input
above those indicated in the operational listings of this specification is
not implied. Exposure to maximum rating conditions for extended peri- VREF Reference Voltage Input
ods may affect device reliability.

ELECTRICAL CHARACTERISTICS
All parameters apply at VDD = 5V, VSS = 0V, VREF = 5V, TAMB = -40°C to +85°C, fSAMPLE = 100ksps and
fCLK = 20*fSAMPLE, unless otherwise noted.
PARAMETER SYMBOL MIN. TYP. MAX. UNITS CONDITIONS
Conversion Rate
Conversion Time tCONV 12 clock
cycles
Analog Input Sample Time tSAMPLE 1.5 clock
cycles
Throughput Rate fSAMPLE 100 ksps VDD = VREF = 5V
50 ksps VDD = VREF = 2.7V
DC Accuracy
Resolution 12 bits
Integral Nonlinearity INL ±0.75 ±1 LSB MCP3204/3208-B
±1 ±2 MCP3204/3208-C
Differential Nonlinearity DNL ±0.5 ±1 LSB No missing codes over
temperature
Offset Error ±1.25 ±3 LSB
Gain Error ±1.25 ±5 LSB
Dynamic Performance
Total Harmonic Distortion -82 dB VIN = 0.1V to 4.9V@1kHz
Signal to Noise and Distortion 72 dB VIN = 0.1V to 4.9V@1kHz
(SINAD)
Spurious Free Dynamic 86 dB VIN = 0.1V to 4.9V@1kHz
Range
Reference Input
Voltage Range 0.25 VDD V Note 2
Current Drain 100 150 µA
0.001 3 µA CS = VDD = 5V
Analog Inputs
Input Voltage Range for VSS VREF V
CH0-CH7 in Single-Ended
Mode
Input Voltage Range for IN+ In IN- VREF+IN-
pseudo-differential Mode
Input Voltage Range for IN- In VSS-100 VSS+100 mV
pseudo-differential Mode
Leakage Current 0.001 ±1 µA

DS21298B-page 2 Preliminary  1999 Microchip Technology Inc.

 MCP3204/3208
ELECTRICAL CHARACTERISTICS (CONTINUED)
All parameters apply at VDD = 5V, VSS = 0V, VREF = 5V, TAMB = -40°C to +85°C, fSAMPLE = 100ksps and
fCLK = 20*fSAMPLE, unless otherwise noted.
PARAMETER SYMBOL MIN. TYP. MAX. UNITS CONDITIONS
Analog Inputs (Continued)
Switch Resistance 1K Ω See Figure 4-1
Sample Capacitor 20 pF See Figure 4-1
Digital Input/Output
Data Coding Format Straight Binary
High Level Input Voltage VIH 0.7 VDD V
Low Level Input Voltage VIL 0.3 VDD V
High Level Output Voltage VOH 4.1 V IOH = -1mA, VDD = 4.5V
Low Level Output Voltage VOL 0.4 V IOL = 1mA, VDD = 4.5V
Input Leakage Current ILI -10 10 µA VIN = VSS or VDD
Output Leakage Current ILO -10 10 µA VOUT = VSS or VDD
Pin Capacitance CIN, COUT 10 pF VDD = 5.0V (Note 1)
(All Inputs/Outputs) TAMB = 25°C, f = 1 MHz
Timing Parameters
Clock Frequency fCLK 2.0 MHz VDD = 5V (Note 3)
1.0 MHz VDD = 2.7V (Note 3)
Clock High Time tHI 250 ns
Clock Low Time tLO 250 ns
CS Fall To First Rising CLK tSUCS 100 ns
Edge
Data Input Setup Time tSU 50 ns
Data Input Hold Time tHD 50 ns
CLK Fall To Output Data Valid tDO 200 ns See Test Circuits, Figure 1-2
CLK Fall To Output Enable tEN 200 ns See Test Circuits, Figure 1-2
CS Rise To Output Disable tDIS 100 ns See Test Circuits, Figure 1-2
CS Disable Time tCSH 500 ns
DOUT Rise Time tR 100 ns See Test Circuits, Figure 1-2
(Note 1)
DOUT Fall Time tF 100 ns See Test Circuits, Figure 1-2
(Note 1)
Power Requirements
Operating Voltage VDD 2.7 5.5 V
Operating Current IDD 320 400 µA VDD = VREF = 5V, DOUT unloaded
225 VDD = VREF = 2.7V, DOUT unloaded
Standby Current IDDS 0.5 2 µA CS = VDD = 5.0V
Note 1: This parameter is guaranteed by characterization and not 100% tested.
Note 2: See graphs that relate linearity performance to VREF levels.
Note 3: Because the sample cap will eventually lose charge, effective clock rates below 10kHz can affect linearity
performance, especially at elevated temperatures. See Section 6.2 for more information.

 1999 Microchip Technology Inc. Preliminary DS21298B-page 3

MCP3204/3208
tCSH

CS
tSUCS
tHI tLO

CLK

tSU tHD
DIN MSB IN

tDO tR tF tDIS
tEN
DOUT NULL BIT MSB OUT LSB

FIGURE 1-1: Serial Interface Timing.

Load circuit for tR, tF, tDO Load circuit for tDIS and tEN

1.4V Test Point

VDD
tDIS Waveform 2
3K Test Point 3K VDD/2
DOUT DOUT tEN Waveform

CL = 100pF 100pF tDIS Waveform 1

VSS

Voltage Waveforms for tR, tF Voltage Waveforms for tEN

VOH CS
DOUT VOL
1 2 3 4
CLK
tR tF
DOUT B11

tEN

Voltage Waveforms for tDO Voltage Waveforms for tDIS

VIH
CS
CLK
DOUT
90%
tDO Waveform 1*
TDIS
DOUT
DOUT 10%
Waveform 2†

* Waveform 1 is for an output with internal condi-

tions such that the output is high, unless dis-
abled by the output control.
† Waveform 2 is for an output with internal condi-
tions such that the output is low, unless disabled
by the output control.

FIGURE 1-2: Test Circuits.

DS21298B-page 4 Preliminary  1999 Microchip Technology Inc.

 MCP3204/3208
2.0 TYPICAL PERFORMANCE CHARACTERISTICS
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C

1.0 2.0
VDD = VREF = 2.7V
0.8 Positive INL 1.5
0.6
1.0
0.4 Positive INL

INL (LSB)
INL (LSB)

0.5
0.2
0.0 0.0

-0.2 -0.5
Negative INL
-0.4 Negative INL -1.0
-0.6 -1.5
-0.8
-2.0
-1.0 0 10 20 30 40 50 60 70 80
0 25 50 75 100 125 150
Sample Rate (ksps) Sample Rate (ksps)

FIGURE 2-1: Integral Nonlinearity (INL) vs. Sample FIGURE 2-4: Integral Nonlinearity (INL) vs. Sample
Rate. Rate (VDD = 2.7V).

3.0 2.0
2.5
1.5
2.0
1.5 1.0 Positive INL
Positive INL
1.0
INL(LSB)
INL(LSB)

0.5
0.5
0.0 0.0
-0.5
Negative INL
-0.5
-1.0
-1.5 -1.0 Negative INL
-2.0
-1.5
-2.5
-3.0 -2.0
0 1 2 3 4 5 6 0.0 0.5 1.0 1.5 2.0 2.5 3.0

VREF (V) VREF (V)

FIGURE 2-2: Integral Nonlinearity (INL) vs. VREF. FIGURE 2-5: Integral Nonlinearity (INL) vs. VREF
(VDD = 2.7V).

1.0 1.0
0.8 0.8 VDD = VREF = 2.7V
FSAMPLE = 50ksps
0.6 0.6
0.4 0.4
INL (LSB)

INL (LSB)

0.2 0.2
0.0 0.0
-0.2 -0.2
-0.4 -0.4
-0.6 -0.6
-0.8 -0.8
-1.0 -1.0
0 512 1024 1536 2048 2560 3072 3584 4096 0 512 1024 1536 2048 2560 3072 3584 4096

Digital Code Digital Code

FIGURE 2-3: Integral Nonlinearity (INL) vs. Code FIGURE 2-6: Integral Nonlinearity (INL) vs. Code
(Representative Part). (Representative Part, VDD = 2.7V).

 1999 Microchip Technology Inc. Preliminary DS21298B-page 5

MCP3204/3208
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C

1.0 1.0
VDD = VREF = 2.7V
0.8 Positive INL 0.8
F SAMPLE = 50ksps
0.6 0.6
Positive INL
0.4 0.4

INL (LSB)
INL (LSB)

0.2 0.2
0.0 0.0
-0.2 Negative INL -0.2
-0.4 -0.4
-0.6 -0.6 Negative INL
-0.8 -0.8
-1.0 -1.0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Temperature (°C) Temperature (°C)

FIGURE 2-7: Integral Nonlinearity (INL) vs. FIGURE 2-10: Integral Nonlinearity (INL) vs.
Temperature. Temperature (VDD = 2.7V).

1.0 2.0
VDD = VREF = 2.7V
0.8 1.5
0.6 1.0
0.4 Positive DNL
DNL (LSB)
DNL (LSB)

Positive DNL
0.5
0.2
0.0 0.0
-0.2 -0.5 Negative DNL
-0.4
Negative DNL -1.0
-0.6
-0.8 -1.5

-1.0 -2.0
0 25 50 75 100 125 150 0 10 20 30 40 50 60 70
Sample Rate (ksps) Sample Rate (ksps)

FIGURE 2-8: Differential Nonlinearity (DNL) vs. FIGURE 2-11: Differential Nonlinearity (DNL) vs.
Sample Rate. Sample Rate (VDD = 2.7V).

3.0 3.0
VDD = VREF= 2.7V
2.0 2.0 FSAMPLE = 50ksps

Positive DNL
DNL (LSB)

1.0
DNL (LSB)

1.0 Positive DNL

0.0 0.0

Negative DNL Negative DNL

-1.0 -1.0

-2.0 -2.0

-3.0 -3.0
0 1 2 3 4 5 0.0 0.5 1.0 1.5 2.0 2.5 3.0

VREF (V) VREF(V)

FIGURE 2-9: Differential Nonlinearity (DNL) vs. FIGURE 2-12: Differential Nonlinearity (DNL) vs. VREF
VREF. (VDD = 2.7V).

DS21298B-page 6 Preliminary  1999 Microchip Technology Inc.

 MCP3204/3208
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C

1.0 1.0
0.8 0.8 VDD = VREF = 2.7V
FSAMPLE = 50ksps
0.6 0.6
0.4 0.4

DNL (LSB)
DNL (LSB)

0.2 0.2
0.0 0.0
-0.2 -0.2
-0.4 -0.4
-0.6 -0.6
-0.8 -0.8
-1.0 -1.0
0 512 1024 1536 2048 2560 3072 3584 4096 0 512 1024 1536 2048 2560 3072 3584 4096

Digital Code Digital Code

FIGURE 2-13: Differential Nonlinearity (DNL) vs. FIGURE 2-16: Differential Nonlinearity (DNL) vs.
Code (Representative Part). Code (Representative Part, VDD = 2.7V).

1.0 1.0
VDD = VREF = 2.7V
0.8 0.8
FSAMPLE = 50ksps
0.6 0.6
0.4 DNL (LSB) 0.4 Positive DNL
Positive DNL
DNL (LSB)

0.2 0.2
0.0 0.0
-0.2 -0.2
-0.4 -0.4 Negative DNL
Negative DNL
-0.6 -0.6
-0.8 -0.8
-1.0 -1.0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100

Temperature (°C) Temperature (°C)

FIGURE 2-14: Differential Nonlinearity (DNL) vs. FIGURE 2-17: Differential Nonlinearity (DNL) vs.
Temperature. Temperature (VDD = 2.7V).

4 20
18
3
VDD = 2.7V 16 VDD = 5V
Offset Error (LSB)
Gain Error (LSB)

2 F SAMPLE = 50ksps
14 F SAMPLE = 100ksps

1 12
10
0
8
-1 VDD = 2.7V
VDD = 5V 6
F SAMPLE = 50ksps
-2 FSAMPLE = 100ksps 4
-3 2
0
-4
0 1 2 3 4 5
0 1 2 3 4 5
VREF (V)
VREF(V)

FIGURE 2-15: Gain Error vs. VREF. FIGURE 2-18: Offset Error vs. VREF.

 1999 Microchip Technology Inc. Preliminary DS21298B-page 7

MCP3204/3208
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C

0.2 2.0
0.0 VDD = VREF = 2.7V 1.8
FSAMPLE = 50ksps VDD = VREF = 5V
1.6

Offset Error (LSB)

-0.2
Gain Error (LSB)

FSAMPLE = 100ksps
-0.4 1.4
-0.6 1.2
-0.8 1.0
VDD = VREF = 2.7V
-1.0 0.8
FSAMPLE = 50ksps
VDD = VREF = 5V
-1.2 0.6
FSAMPLE = 100ksps
-1.4 0.4
-1.6 0.2
-1.8 0.0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100

Temperature (°C) Temperature (°C)

FIGURE 2-19: Gain Error vs. Temperature. FIGURE 2-22: Offset Error vs. Temperature.

100 100.0
90 VDD = VREF = 5V VDD = VREF = 5V
90.0
FSAMPLE = 100ksps FSAMPLE = 100ksps
80 80.0
70
SINAD (dB)
70.0
SNR (dB)

60 60.0
50 50.0 VDD = VREF = 2.7V
40 VDD = VREF = 2.7V 40.0 F SAMPLE = 50ksps
30 FSAMPLE = 50ksps 30.0
20 20.0
10 10.0
0 0.0
1 10 100 1 10 100
Input Frequency (kHz) Input Frequency (kHz)

FIGURE 2-20: Signal to Noise (SNR) vs. Input FIGURE 2-23: Signal to Noise and Distortion
Frequency. (SINAD) vs. Input Frequency.

0 80
-10 VDD = VREF = 5V
70 FSAMPLE = 100ksps
-20
-30 60
VDD = VREF = 2.7V
THD (dB)

SINAD (dB)

-40 F SAMPLE = 50ksps 50

VDD = VREF = 2.7V
-50 40 FSAMPLE = 50ksps
-60
30
-70
20
-80 VDD = VREF = 5V
-90 FSAMPLE = 100ksps 10
-100 0
1 10 100 -40 -35 -30 -25 -20 -15 -10 -5 0

Input Frequency (kHz) Input Signal Level (dB)

FIGURE 2-21: Total Harmonic Distortion (THD) vs. FIGURE 2-24: Signal to Noise and Distortion
Input Frequency. (SINAD) vs. Input Signal Level.

DS21298B-page 8 Preliminary  1999 Microchip Technology Inc.

 MCP3204/3208
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C

12.0
12.00
11.75 11.5
11.50
11.0

ENOB (rms)
11.25
ENOB (rms)

11.00 VDD = VREF = 5V 10.5

10.75 VDD = VREF = 2.7V FSAMPLE =100ksps
10.50 10.0 VDD = VREF = 5V
FSAMPLE = 50ksps
10.25 F SAMPLE = 100ksps
9.5
10.00
9.75 9.0 VDD = VREF = 2.7V
9.50 F SAMPLE = 50ksps
9.25 8.5
9.00 8.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 1 10 100
VREF (V)
Input Frequency (kHz)

FIGURE 2-25: Effective Number of Bits (ENOB) vs. FIGURE 2-28: Effective Number of Bits (ENOB) vs.
VREF. Input Frequency.

100 0
VDD = VREF = 5V

Power Supply Rejection (dB)

90 -10
FSAMPLE = 100ksps
80
-20
70
SFDR (dB)

-30
60
50 VDD = VREF = 2.7V -40
40 FSAMPLE = 50ksps
-50
30
-60
20
-70
10
0 -80
1 10 100 1 10 100 1000 10000
Ripple Frequency (kHz)
Input Frequency (kHz)

FIGURE 2-26: Spurious Free Dynamic Range FIGURE 2-29: Power Supply Rejection (PSR) vs.
(SFDR) vs. Input Frequency. Ripple Frequency.

0
0
-10 VDD = VREF = 2.7V
-10 VDD = VREF = 5V
-20 FSAMPLE = 50ksps
-20 FSAMPLE = 100ksps -30 FINPUT = 998.76Hz
-30
Amplitude (dB)

FINPUT = 9.985kHz
Amplitude (dB)

-40 4096 points

-40 4096 points -50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-100
-110
-110
-120
-120
-130
-130
0 5000 10000 15000 20000 25000
0 10000 20000 30000 40000 50000
Frequency (Hz)
Frequency (Hz)

FIGURE 2-30: Frequency Spectrum of 1kHz input

FIGURE 2-27: Frequency Spectrum of 10kHz input
(Representative Part, VDD = 2.7V).
(Representative Part).

 1999 Microchip Technology Inc. Preliminary DS21298B-page 9

MCP3204/3208
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C

500 100
VREF = VDD VREF = VDD
450 90
All points at FCLK = 2MHz except All points at FCLK = 2MHz except
400 at VREF = VDD = 2.5V, F CLK = 1MHz 80
at VREF = VDD = 2.5V, F CLK = 1MHz
350 70

IREF (µA)
60
IDD (µA)

300
250 50
200 40
150 30
100 20
50 10
0 0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

VDD (V) VDD (V)

FIGURE 2-31: IDD vs. VDD. FIGURE 2-34: IREF vs. VDD.

400 100
350 90 VDD = VREF = 5V

80
300
VDD = VREF = 5V 70
IREF (µA)

250 60
IDD (µA)

200 50
VDD = VREF = 2.7V
40
150
30 VDD = VREF = 2.7V
100 20
50 10

0 0
10 100 1000 10000 10 100 1000 10000

Clock Frequency (kHz) Clock Frequency (kHz)

FIGURE 2-32: IDD vs. Clock Frequency. FIGURE 2-35: IREF vs. Clock Frequency.

100
400 VDD = VREF = 5V
VDD = VREF = 5V 90 FCLK = 2MHz
350 FCLK = 2MHz
80
300
70
250
IDD (µA)

60
IREF (µA)

200 50

150 VDD = VREF = 2.7V 40

FCLK = 1MHz VDD = VREF = 2.7V
30
100 FCLK = 1MHz
20
50
10
0
0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Temperature (°C) Temperature (°C)

FIGURE 2-33: IDD vs. Temperature. FIGURE 2-36: IREF vs. Temperature.

DS21298B-page 10 Preliminary  1999 Microchip Technology Inc.

 MCP3204/3208
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C

80 2.0

Analog Input Leakage (nA)

VREF = CS = VDD
70 1.8
1.6
60
1.4
50
IDDS (pA)

1.2 VDD = VREF = 5V

40 1.0 FCLK = 2MHz

30 0.8

20
0.6
0.4
10
0.2
0 0.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
-50 -25 0 25 50 75 100
VDD (V)
Temperature (°C)

FIGURE 2-37: IDDS vs. VDD. FIGURE 2-39: Analog Input Leakage Current vs.
Temperature.

100.00

VDD = VREF = CS = 5V

10.00
IDDS (nA)

1.00

0.10

0.01
-50 -25 0 25 50 75 100
Temperature (°C)

FIGURE 2-38: IDDS vs. Temperature.

 1999 Microchip Technology Inc. Preliminary DS21298B-page 11

MCP3204/3208
3.0 PIN DESCRIPTIONS
3.1 CH0 - CH7
Analog inputs for channels 0 - 7 respectively for the
multiplexed inputs. Each pair of channels can be pro-
grammed to be used as two independent channels in
single ended-mode or as a single pseudo-differential
input where one channel is IN+ and one channel is IN-.
See Section 4.1 and Section 5.0 for information on pro-
gramming the channel configuration.
3.2 CS/SHDN(Chip Select/Shutdown)
The CS/SHDN pin is used to initiate communication
with the device when pulled low and will end a conver-
sion and put the device in low power standby when
pulled high. The CS/SHDN pin must be pulled high
between conversions.
3.3 CLK (Serial Clock)
The SPI clock pin is used to initiate a conversion and to
clock out each bit of the conversion as it takes place.
See Section 6.2 for constraints on clock speed.
3.4 DIN (Serial Data Input)
The SPI port serial data input pin is used to load chan-
nel configuration data into the device.
3.5 DOUT (Serial Data output)
The SPI serial data output pin is used to shift out the
results of the A/D conversion. Data will always change
on the falling edge of each clock as the conversion
takes place.
3.6 AGND
Analog ground connection to internal analog circuitry.
3.7 DGND
Digital ground connection to internal digital circuitry.
4.0 DEVICE OPERATION
The MCP3204/3208 A/D Converters employ a conven-
tional SAR architecture. With this architecture, a sam-
ple is acquired on an internal sample/hold capacitor for
1.5 clock cycles starting on the fourth rising edge of the
serial clock after the start bit has been received. Follow-
ing this sample time, the device uses the collected
charge on the internal sample and hold capacitor to
produce a serial 12-bit digital output code. Conversion
rates of 100ksps are possible on the MCP3204/3208.
See Section 6.2 for information on minimum clock
rates. Communication with the device is done using a
4-wire SPI-compatible interface.
DS21298B-page 12 Preliminary
4.1 Analog Inputs
The MCP3204/3208 devices offer the choice of using
the analog input channels configured as single-ended
inputs or pseudo-differential pairs. The MCP3204 can
be configured to provide two pseudo-differential input
pairs or four single-ended inputs. the MCP3208 can be
configured to provide four pseudo-differential input
pairs or eight single-ended inputs. Configuration is
done as part of the serial command before each con-
version begins. When used in the pseudo-differential
mode, each channel pair (i.e., CH0 and CH1, CH2 and
CH3 etc.) are programmed as the IN+ and IN- inputs as
part of the command string transmitted to the device.
The IN+ input can range from IN- to (VREF + IN-). The
IN- input is limited to ±100mV from the VSS rail. The IN-
input can be used to cancel small signal com-
mon-mode noise which is present on both the IN+ and
IN- inputs.
When operating in the pseudo-differential mode, if the
voltage level of IN+ is equal to or less than IN-, the
resultant code will be 000h. If the voltage at IN+ is equal
to or greater than {[VREF + (IN-)] - 1 LSB}, then the out-
put code will be FFFh. If the voltage level at IN- is more
than 1 LSB below VSS, then the voltage level at the IN+
input will have to go below VSS to see the 000h output
code. Conversely, if IN- is more than 1 LSB above VSS,
then the FFFh code will not be seen unless the IN+
input level goes above VREF level.
For the A/D Converter to meet specification, the charge
holding capacitor, (CSAMPLE) must be given enough time
to acquire a 12-bit accurate voltage level during the 1.5
clock cycle sampling period. The analog input model is
shown in Figure 4-1.
In this diagram it is shown that the source impedance
(RS) adds to the internal sampling switch (RSS) imped-
ance, directly affecting the time that is required to
charge the capacitor, CSAMPLE. Consequently, larger
source impedances increase the offset, gain, and inte-
gral linearity errors of the conversion. See Figure 4-2.
4.2 Reference Input
For each device in the family, the reference input (VREF)
determines the analog input voltage range. As the ref-
erence input is reduced, the LSB size is reduced
accordingly. The theoretical digital output code pro-
duced by the A/D Converter is a function of the analog
input signal and the reference input as shown below.
Digital Output Code = 4096 * VIN
VREF
where:
VIN = analog input voltage
VREF = reference voltage
When using an external voltage reference device, the
system designer should always refer to the manufac-
turer’s recommendations for circuit layout. Any instabil-
ity in the operation of the reference device will have a
direct effect on the operation of the A/D Converter.
 1999 Microchip Technology Inc.
 MCP3204/3208

VDD
Sampling
Switch
VT = 0.6V
RS CHx SS RSS = 1kΩ

CSAMPLE
CPIN
VA ILEAKAGE = DAC capacitance
7pF VT = 0.6V ± 1 nA = 20 pF

VSS
Legend
VA = Signal Source
RS = Source Impedance
CHx = Input Channel Pad
CPIN = Input Capacitance
VT = Threshold Voltage
ILEAKAGE = Leakage Current at the pin
due to various junctions
SS = Sampling Switch
RSS = Sampling Switch Resistor
CSAMPLE = Sample/Hold Capacitance

FIGURE 4-1: Analog Input Model

2.5

VDD = 5V
Clock Frequency (MHz)

2.0

1.5

1.0
VDD = 2.7V

0.5

0.0
100 1000 10000

Input Resistance (Ohms)

FIGURE 4-2: Maximum Clock Frequency vs. Input

resistance (RS) to maintain less than a 0.1LSB
deviation in INL from nominal conditions.

 1999 Microchip Technology Inc. Preliminary DS21298B-page 13

MCP3204/3208
5.0 SERIAL COMMUNICATIONS CONTROL BIT
SELECTIONS
Communication with the MCP3204/3208 devices is INPUT CHANNEL
CONFIGURATION SELECTION
done using a standard SPI-compatible serial interface. SINGLE/ D2 D1 D0
Initiating communication with either device is done by DIFF

bringing the CS line low. See Figure 5-1. If the device 1 0 0 0 single ended CH0
was powered up with the CS pin low, it must be brought 1 0 0 1 single ended CH1
high and back low to initiate communication. The first
clock received with CS low and DIN high will constitute 1 0 1 0 single ended CH2
a start bit. The SGL/DIFF bit follows the start bit and will 1 0 1 1 single ended CH3
determine if the conversion will be done using single 1 1 0 0 single ended CH4
ended or differential input mode. The next three bits
1 1 0 1 single ended CH5
(D0, D1 and D2) are used to select the input channel
configuration. Table 5-1 and Table 5-2 show the config- 1 1 1 0 single ended CH6
uration bits for the MCP3204 and MCP3208, respec- 1 1 1 1 single ended CH7
tively. The device will begin to sample the analog input 0 0 0 0 differential CH0 = IN+
on the fourth rising edge of the clock after the start bit CH1 = IN-
has been received. The sample period will end on the 0 0 0 1 differential CH0 = IN-
falling edge of the fifth clock following the start bit. CH1 = IN+
After the D0 bit is input, one more clock is required to 0 0 1 0 differential CH2 = IN+
complete the sample and hold period (DIN is a don’t CH3 = IN-
care for this clock). On the falling edge of the next clock, 0 0 1 1 differential CH2 = IN-
the device will output a low null bit. The next 12 clocks CH3 = IN+
will output the result of the conversion with MSB first as 0 1 0 0 differential CH4 = IN+
shown in Figure 5-1. Data is always output from the CH5 = IN-
device on the falling edge of the clock. If all 12 data bits 0 1 0 1 differential CH4 = IN-
have been transmitted and the device continues to CH5 = IN+
receive clocks while the CS is held low, the device will
0 1 1 0 differential CH6 = IN+
output the conversion result LSB first as shown in CH7 = IN-
Figure 5-2. If more clocks are provided to the device
0 1 1 1 differential CH6 = IN-
while CS is still low (after the LSB first data has been CH7 = IN+
transmitted), the device will clock out zeros indefinitely.
TABLE 5-2: Configuration Bits for the MCP3208.
If necessary, it is possible to bring CS low and clock in
leading zeros on the DIN line before the start bit. This is
often done when dealing with microcontroller-based
SPI ports that must send 8 bits at a time. Refer to
Section 6.1 for more details on using the
MCP3204/3208 devices with hardware SPI ports.

CONTROL BIT
SELECTIONS
INPUT CHANNEL
CONFIGURATION SELECTION
SINGLE/ D2* D1 D0
DIFF

1 X 0 0 single ended CH0

1 X 0 1 single ended CH1
1 X 1 0 single ended CH2
1 X 1 1 single ended CH3
0 X 0 0 differential CH0 = IN+
CH1 = IN-
0 X 0 1 differential CH0 = IN-
CH1 = IN+
0 X 1 0 differential CH2 = IN+
CH3 = IN-
0 X 1 1 differential CH2 = IN-
CH3 = IN+
*D2 is don’t care for MCP3204
TABLE 5-1: Configuration Bits for the MCP3204.

DS21298B-page 14 Preliminary  1999 Microchip Technology Inc.

 MCP3204/3208

tCYC tCYC

tCSH
CS

tSUCS

CLK

DIN Start SGL/ D2 D1 D0 Don’t Care Start SGL/ D2

DIFF DIFF

HI-Z Null HI-Z

DOUT Bit B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 *

tCONV

tSAMPLE tDATA **

* After completing the data transfer, if further clocks are applied with CS low, the A/D Converter will output LSB
first data, then followed with zeros indefinitely. See Figure 5-2 below.
** tDATA: during this time, the bias current and the comparator power down while the reference input becomes
a high impedance node, leaving the CLK running to clock out the LSB-first data or zeros.

FIGURE 5-1: Communication with the MCP3204 or MCP3208.

tCYC

tCSH
CS
tSUCS
Power Down

CLK

Start
DIN D2 D1 D0 Don’t Care
SGL/
DIFF

HI-Z Null * HI-Z

B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11
DOUT Bit
(MSB)
tCONV tDATA **
tSAMPLE

* After completing the data transfer, if further clocks are applied with CS low, the A/D Converter will output zeros
indefinitely.
** tDATA: During this time, the bias circuit and the comparator power down while the reference input becomes a
high impedance node, leaving the CLK running to clock out LSB first data or zeroes.

FIGURE 5-2: Communication with MCP3204 or MCP3208 in LSB First Format.

 1999 Microchip Technology Inc. Preliminary DS21298B-page 15

MCP3204/3208
6.0 APPLICATIONS INFORMATION As shown in Figure 6-1, the first byte transmitted to the
A/D Converter contains five leading zeros before the
6.1 Using the MCP3204/3208 with start bit. Arranging the leading zeros this way produces
Microcontroller (MCU) SPI Ports the output 12 bits to fall in positions easily manipulated
by the MCU. The MSB is clocked out of the A/D Con-
With most microcontroller SPI ports, it is required to verter on the falling edge of clock number 12. After the
send groups of eight bits. It is also required that the second eight clocks have been sent to the device, the
microcontroller SPI port be configured to clock out data MCUs receive buffer will contain three unknown bits
on the falling edge of clock and latch data in on the rising (the output is at high impedance for the first two clocks),
edge. Because communication with the MCP3204/3208 the null bit and the highest order four bits of the conver-
devices may not need multiples of eight clocks, it will be sion. After the third byte has been sent to the device, the
necessary to provide more clocks than are required. receive register will contain the lowest order eight bits of
This is usually done by sending ‘leading zeros’ before the conversion results. Easier manipulation of the con-
the start bit. As an example, Figure 6-1 and Figure 6-2 verted data can be obtained by using this method.
shows how the MCP3204/3208 can be interfaced to a
Figure 6-2 shows the same thing in SPI Mode 1,1
MCU with a hardware SPI port. Figure 6-1 depicts the
which requires that the clock idles in the high state. As
operation shown in SPI Mode 0,0 which requires that the
with mode 0,0, the A/D Converter outputs data on the
SCLK from the MCU idles in the ‘low’ state, while
falling edge of the clock and the MCU latches data from
Figure 6-2 shows the similar case of SPI Mode 1,1
the A/D Converter in on the rising edge of the clock.
where the clock idles in the ‘high’ state.

CS
MCU latches data from A/D Converter
on rising edges of SCLK

SCLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

Data is clocked out of

A/D Converter on falling edges

SGL/ D2 D1 DO
DIN Start Don’t Care
DIFF

HI-Z NULL
DOUT BIT B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0

Start
Bit
MCU Transmitted Data SGL/
(Aligned with falling 0 0 0 0 0 1 D2 D1 DO X X X X X X X X X X X X X X
DIFF
edge of clock)

MCU Received Data

(Aligned with rising ? ? ? ? ? ? ? ? ? ? ? 0 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
edge of clock) (Null)

Data stored into MCU receive register Data stored into MCU receive register Data stored into MCU receive register
after transmission of first 8 bits after transmission of second 8 bits after transmission of last 8 bits
X = Don’t Care Bits

FIGURE 6-1: SPI Communication using 8-bit segments (Mode 0,0: SCLK idles low).

CS MCU latches data from A/D Converter

on rising edges of SCLK

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
SCLK
Data is clocked out of
A/D Converter on falling edges

SGL/ D2 D1 DO Don’t Care

DIN Start DIFF

HI-Z NULL
DOUT BIT B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0

Start
Bit
MCU Transmitted Data
(Aligned with falling 0 0 0 0 0 SGL/ D2
1 DIFF D1 DO X X X X X X X X X X X X X X
edge of clock)

MCU Received Data

(Aligned with rising ? ? ? ? ? ? ? ? ? ? ? 0 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
edge of clock) (Null)

Data stored into MCU receive register Data stored into MCU receive register Data stored into MCU receive register
after transmission of first 8 bits after transmission of second 8 bits after transmission of last 8 bits
X = Don’t Care Bits

FIGURE 6-2: SPI Communication using 8-bit segments (Mode 1,1: SCLK idles high).

DS21298B-page 16 Preliminary  1999 Microchip Technology Inc.


6.2 Maintaining Minimum Clock Speed
When the MCP3204/3208 initiates the sample period,
charge is stored on the sample capacitor. When the
sample period is complete, the device converts one bit
for each clock that is received. It is important for the
user to note that a slow clock rate will allow charge to
bleed off the sample capacitor while the conversion is
taking place. At 85°C (worst case condition), the part
will maintain proper charge on the sample capacitor for
at least 1.2ms after the sample period has ended. This
means that the time between the end of the sample
period and the time that all 12 data bits have been
clocked out must not exceed 1.2ms (effective clock fre-
quency of 10kHz). Failure to meet this criterion may
induce linearity errors into the conversion outside the
rated specifications. It should be noted that during the
entire conversion cycle, the A/D Converter does not
require a constant clock speed or duty cycle, as long as
all timing specifications are met.
6.3 Buffering/Filtering the Analog Inputs
If the signal source for the A/D Converter is not a low
impedance source, it will have to be buffered or inaccu-
rate conversion results may occur. See Figure 4-2. It is
also recommended that a filter be used to eliminate any
signals that may be aliased back in to the conversion
results. This is illustrated in Figure 6-3 where an op
amp is used to drive the analog input of the
MCP3204/3208. This amplifier provides a low imped-
ance source for the converter input and a low pass fil-
MCP3204/3208
6.4 Layout Considerations
When laying out a printed circuit board for use with ana-
log components, care should be taken to reduce noise
wherever possible. A bypass capacitor should always
be used with this device and should be placed as close
as possible to the device pin. A bypass capacitor value
of 1µF is recommended.
Digital and analog traces should be separated as much
as possible on the board and no traces should run
underneath the device or the bypass capacitor. Extra
precautions should be taken to keep traces with high
frequency signals (such as clock lines) as far as possi-
ble from analog traces.
Use of an analog ground plane is recommended in
order to keep the ground potential the same for all
devices on the board. Providing VDD connections to
devices in a “star” configuration can also reduce noise
by eliminating return current paths and associated
errors. See Figure 6-4. For more information on layout
tips when using A/D Converters, refer to AN688 “Lay-
out Tips for 12-Bit A/D Converter Applications”.
VDD
Connection
Device 4

ter, which eliminates unwanted high frequency noise.

Low pass (anti-aliasing) filters can be designed using Device 1

Microchip’s free interactive FilterLab™ software. Fil-

terLab will calculate capacitor and resistors values, as
well as determine the number of poles that are required Device 3
for the application. For more information on filtering sig-
Device 2
nals, see the application note AN699 “Anti-Aliasing
Analog Filters for Data Acquisition Systems.”
VDD
FIGURE 6-4: VDD traces arranged in a ‘Star’
10µF
4.096V configuration in order to reduce errors caused by
Reference
0.1µF 1µF
current return paths.
ADI Tant. 0.1µF
REF198

1µF
VREF
IN+

MCP3204
C1 MCP601 IN-
R1
+
R2
VIN -
C2
R4
R3

FIGURE 6-3: The MCP601 Operational Amplifier is

used to implement a 2nd order anti-aliasing filter for FilterLab is a trademark of Microchip Technology Inc. in
the signal being converted by the MCP3204. the U.S.A and other countries. All rights reserved.

 1999 Microchip Technology Inc. Preliminary DS21298B-page 17

MCP3204/3208
6.5 Utilizing the Digital and Analog
Ground Pins
The MCP3204/3208 devices provide both digital and
analog ground connections to provide another means
of noise reduction. As shown in Figure 6-5, the analog
and digital circuitry is separated internal to the device.
This reduces noise from the digital portion of the device
being coupled into the analog portion of the device. The
two grounds are connected internally through the sub-
strate which has a resistance of 5 -10 Ω.
If no ground plane is utilized, then both grounds must
be connected to VSS on the board. If a ground plane is
available, both digital and analog ground pins should
be connected to the analog ground plane. If both an
analog and a digital ground plane are available, both
the digital and the analog ground pins should be con-
nected to the analog ground plane. Following these
steps will reduce the amount of digital noise from the
rest of the board being coupled into the A/D Converter.

VDD

Digital Side Analog Side

-SPI Interface -Sample Cap
-Shift Register -Capacitor Array
-Control Logic -Comparator

Substrate

5 - 10 Ω

Digital Analog
Ground Pin Ground Pin

FIGURE 6-5: Separation of Analog and Digital

Ground Pins.

DS21298B-page 18 Preliminary  1999 Microchip Technology Inc.

 MCP3204/3208
MCP3204 PRODUCT IDENTIFICATION SYSTEMS
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

MCP3204 - G T /P

Package: P = PDIP (14 lead)

SL = SOIC (150 mil Body), 14 lead
ST = TSSOP, 14 lead (C Grade only)

Temperature I = –40°C to +85°C

Range:

Performance B = ±1 LSB INL (TSSOP not available in this grade)

Grade: C = ±2 LSB INL

Device: MCP3204 = 4-Channel 12-Bit Serial A/D Converter

MCP3204T = 4-Channel 12-Bit Serial A/D Converter on tape and reel
(SOIC and TSSOP packages only)

MCP3208 PRODUCT IDENTIFICATION SYSTEMS

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

MCP3208 - G T /P

Package: P = PDIP (16 lead)

SL = SOIC (150 mil Body), 16 lead

Temperature I = –40°C to +85°C

Range:

Performance B = ±1 LSB INL (TSSOP not available in this grade)

Grade: C = ±2 LSB INL

Device: MCP3208 = 8-Channel 12-Bit Serial A/D Converter

MCP3208T = 8-Channel 12-Bit Serial A/D Converter on tape and reel
(SOIC packages only)

Sales and Support

Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (602) 786-7277. After September 1, 1999, (480) 786-7277
3. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

 1999 Microchip Technology Inc. Preliminary DS21298B-page 19

 WORLDWIDE SALES AND SERVICE
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 1999 Microchip Technology Inc.