Nanoelectronics

for a better life

in a sustainable society
Roger De Keersmaecker
Senior Vice President IMEC
CEO IMEC Taiwan Co.

SEMICON Taiwan 2010

IC Executive Forum, September 8th 2010
Life in 2025 © imec 2010
© imec 2010
Challenge #1: Power

© imec 2010
©VITO
Leveraging Imec’s expertise for a smart grid

Photovoltaics Wireless
Fuel cells ICT
systems
Sustainable energy

generation
consumption
distribution
GaN power Materials for
devices & super-caps &
convertors batteries

© imec 2010
Leverage Imec’s expertise for a smart grid

Photovoltaics Wireless
Fuel cells ICT
systems
Sustainable energy

generation
consumption
distribution
GaN power Materials for
devices & super-caps &
convertors batteries

© imec 2010
AS A SOURCE OF ENERGY,
NOTHING MATCHES THE SUN
© imec 2010
 Energy
companies

Solar cell
producers

Tool
suppliers

Together towards Material

low-cost high-efficiency suppliers
silicon solar cells
© imec 2010
 Organic solar cells
conversion efficiencies above 5%

© imec 2010
 ORGANIC SOLAR CELLS
pave the way to new intelligent products

intelligent drug package

GaN for power conversion
and solid-state lighting

© imec 2010
Challenge # 2: Health Care

© imec 2010
Busy life styles

1 billion overweight population

300 million of which obese
Aging population

600 million population age 60+

expected to double by 2025
Increasing occurrence of chronic diseases

600 million people worldwide with chronic condition

$500 billion estimated current annual cost (US)
$685 billion estimated annual cost by 2020 (US)
MEDICAL TREATMENT GOES DIGITAL
PERSONALIZED - PREDICTIVE - PREVENTIVE

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WEARABLE HEALTH AND COMFORT MONITORING

internet
doctor
hospital

Anywhere, anytime
Connected health
Health and lifestyle
© imec & Holst 2010
imec
and Holst Centre

ECG necklace for ambulatory applications

© imec & Holst 2010
ECG necklace for ambulatory applications
© imec & Holst 2010
Ambulatory EEG monitoring in every-day life situations

© imec & Holst 2010

Ambulatory EEG monitoring in every-day life situations

Ultra-low-power
Smart & connected
© imec & Holst 2010
Wearable
Record piezoelectric
energy harvester using MEMS

© imec & Holst 2010

 Increased user comfort
with stretchable electronics

Fitness monitor Baby monitor

© imec & Holst 2010
 Implantable devices: neuroprobe

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© imec 2010
 Imec life sciences

Disease research
Early diagnostics
Efficient development of therapies

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A bio-lab of 1x1cm2 size
© imec 2010
Disposable biosensor for detection
of proteins or dna

© imec 2010
Challenge # 3: Connectivity

© imec 2010
 CONVERGENCE
computer - communication - consumer

Affordable
Easy to use
Linked to the internet
People and “things” connected
With killer CPU and GPU

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Source: Nokia
Towards sustainable mobile internet 2020

2000x higher energy efficiency

30x capacity increase
© imec 2010
Towards sustainable mobile internet 2020

Higher capacity
TECHNOLOGY SCALING
Lower radiation
Low power consumption
CELL SCALING Larger coverage
Higher mobility
© imec 2010
Imec’s “green” radio solutions

Cognitive reconfigurable radio

- towards digital radio

mm-wave radio
- 40nm CMOS technology
- beam forming

Ultra-low power radio

- wake-up receiver 51µW power
- towards battery-less radios (harvesting energy)
© imec 2010
 CONVERGENCE
computer - communication - consumer

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3D
Ultimate Graphics
Ubiquitous Connectivity © NVIDIA
 Imec virtual camera
dynamic viewing and advanced image manipulation

© imec 2010
 next generation vision systems

by combining imec’s process technology,

multimedia application & design expertise

ultimate angle on reality

© imec 2010
 HYPERSPECTRAL IMAGING

▸ From bulky slow research tool ...

Impsector,© Specim

▸ ... to MEMS-based, fast, industrial tool

© imec 2010
 Hyperspectral imaging

Example 1: food and feed sorting

© imec 2010
 Hyperspectral imaging

Compact
HSI module
Scan freckles, moles,
burns etc.

Real-time hyperspectral embedded processing and

analysis

Example 2 : skin analyser

© imec 2010
© imec 2010
Boosting chip performance
and system functionality

teraflops
terabits
© imec 2010
 relentless scaling
1965 2002-2003
~ 90 nm ~ 15nm

Lithography-enabled Scaling

Geometric scaling
(Dennard’s Law) Materials-enabled Scaling

Metal gate
High-k

Strained Si
High-k
High mobility
Metal Gate SiGe channel
Intel
Multi-gate
© imec 2010
 relentless scaling
1965 2002-2003
~ 90 nm ~ 15nm

Lithography-enabled Scaling

Materials-enabled Scaling

Fin poly-Si
Fin

Strained Si
High-k
Metal Gate FINFET
Multi-gate
© imec 2010
 relentless scaling
1965 2002-2003
~ 90 nm ~ 15nm

Lithography-enabled Scaling

Materials-enabled Scaling

© imec 2010
EXPLORATORY CONCEPTS

Tunnel FET Graphene FET

© imec 2010
 relentless scaling

Lithography-enabled Scaling

Materials-enabled Scaling

3D-enabled Scaling

From Plane to Cube

© imec 2010
3D-STACKED ICs CONNECTED THROUGH TSVs

Top die

10um
10um

25um
25um
5um
5um

Top tier

Bottom tier

Bottom die Cu - Cu bonding

© imec 2010
3D STACKED ICs CONNECTED THROUGH TSVs

Optical interconnects
Photonics

Multi-core logic

Memory

© imec 2010
 >600
companies worldwide
partner with imec

© IMEC 2010
1,783
co-workers *

* June 2010
>550
residents and guest researchers
 62
nationalities

© IMEC 2010 53
300mm clean room

© imec 2010
extension - 450mm ready

1,200m2 additional clean room space

vibration-controlled waffle table
class 1000 (ISO 6)
© imec 2010
 Expansion Expansion
CMORE program Bio-electronics Lab

Expansion
Expansion Office building
300mm program
Energy (PV) program Start Q4 2010
450mm test facility

© IMEC 2010 © imec 2010

56
From 62,000m2 to 80,000m 2
© imec 2010
JOINT multi-disciplinary R&D ...
... the KEY to INNOVATION

© imec 2010