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September 2001
IGBT
FGS15N40L
General Description Features
Insulated Gate Bipolar Transistors(IGBTs) with trench • High Input Impedance
gate structure have superior performance in conductance • High Peak Current Capability (130A)
and switching to planar gate structure and also have wide • Easy Gate Drive
noise immunity. These devices are well suitable for
strobe application
Application
• Strobe Flash
C C
C
C
C G
E G
E
E
8-SOP E
Notes :
(1) Repetitive rating : Pulse width limited by max. junction temperature
Thermal Characteristics
Symbol Parameter Typ. Max. Units
RθJA Thermal Resistance, Junction-to-Ambient(PCB Mount) -- 62.5 °C/W
Off Characteristics
BVCES Collector-Emitter Breakdown Voltage VGE = 0V, IC = 1mA 450 -- -- V
ICES Collector Cut-off Current VCE = VCES, VGE = 0V -- -- 10 µA
IGES G-E leakage Current VGE = VGES, VCE = 0V -- -- ± 0.1 µA
On Characteristics
VGE(th) G-E threshold Voltage IC = 0V, IC = 1mA - - 1.4 V
VCE(sat) C-E Saturation Voltage IC = 130A , VGE = 4.0V 2.0 4.5 8.0 V
Dynamic Characteristics
Cies Input Capacitance -- 3800 -- pF
VGE = 0V , VCE = 30V
Coes Output Capacitance -- 45 -- pF
f = 1MHz
Cres Reverse Transfer Capacitance -- 30 -- pF
Switching Characteristics
td(on) Turn-On Delay Time -- 0.15 -- us
VCC = 300V , IC = 130A
tr Rise Time -- 1.5 -- us
VGE = 4.0V , RG = 15Ω *
td(off) Turn-Off Delay Time -- 0.15 0.3 us
Resistive Load
tf Fall Time -- 1.5 3.0 us
120 Ic=130A
VGE = 3V 5
90
4 Ic=100A
60
3 Ic=70A
30
0
2
0 2 4 6 8
-50 0 50 100 150
Collector-Emitter Voltage, VCE [V]
Case Temperature,TC [℃]
Fig 1. Typical Output Chacracteristics Fig 2. Saturation Voltage vs. Case Temerature
at Variant Current Level
10 10
Common Emitter Common Emitter
T C=-40℃ TC=25℃
Collector-Emitter Voltage, VCE [V]
8
Collector-Emitter Voltage, V CE [V]
6 6
130A
4 130A
4
100A 100A
2 IC=70A 2 IC=70A
0 0
0 1 2 3 4 5 6 0 1 2 3 4 5 6
Gate-Emitter Voltage ,VGE [V] Gate-Emitter Voltage ,VGE [V]
Fig 3. Saturation Voltage vs. VGE Fig 4. Saturation Voltage vs. VGE
10 10000
Common Emitter
TC=150℃ Cies
Collector-Emitter Voltage, VCE [V]
1000
Capacitance [pF]
Common Emitter
6
VGE=0V f=1MHz T C=25℃
130A
4 100A
100
Coes
IC=70A
2
Cres
0 10
0 1 2 3 4 5 6 0 10 20 30 40
180
Collector Peak Current, I CP [A]
160
140
120
100
80
60
40
20
0
0 2 4 6 8 10
8-SOP
0.1~0.25
MIN
0.004~0.001
1.55 ±0.20
0.061 ±0.008
)
0.022
0.56
(
#1 #8
0.194 ±0.008
MAX
4.92 ±0.20
0.202
5.13
0.016 ±0.004
0.41 ±0.10
#4 #5
0.050
1.27
6.00 ±0.30 1.80
0.236 ±0.012 MAX
0.071
0.006 -0.002
0.15 -0.05
MAX0.004
MAX0.10
3.95 ±0.20
+0.004
+0.10
0.156 ±0.008
8°
5.72
0~
0.225
0.50 ±0.20
0.020 ±0.008
Dimensions in Millimeters
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
INTERNATIONAL.
As used herein:
1. Life support devices or systems are devices or systems 2. A critical component is any component of a life support
which, (a) are intended for surgical implant into the body, device or system whose failure to perform can be
or (b) support or sustain life, or (c) whose failure to perform reasonably expected to cause the failure of the life support
when properly used in accordance with instructions for use device or system, or to affect its safety or effectiveness.
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
Advance Information Formative or In This datasheet contains the design specifications for
Design product development. Specifications may change in
any manner without notice.
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.