Bonding Layer Material Selection for

use in High Performance Multilayer

Circuit Board Design

Presented by Joe Davis

Rogers Corporation Advanced Connectivity Solutions
July 2015
 Overview

• Define Thermoplastic
• Define Thermoset
• Electrical Properties
• Mechanical Properties
• Reinforced and Non-reinforced Systems
• Board Design Considerations
• Lamination Parameters
• Reliability

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Thermoplastic Polymers and Bond Films

• Thermoplastics – soft polymers that transition into a viscous phase

above a specific temperature and solidifies when cooling

• Thermoplastics - (PTFE/bonding films) do not have a Tg or glass

transition temperature similar to thermosets

• Transition from liquid to solid state is marked by the materials melt

point.

• Thermoplastics will re-melt when sequentially exposed to the

transition temperature (i.e. melt point)

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Thermoset Polymers and Prepregs

• Thermoset – Polymer generally pliable or loosely cross linked

below a specific temperature that irreversibly cures/solidifies when
exposed to the transition temperature (Tg)

• Tg (glass transition temperature) is the temperature at which the

molecular cross linking/curing reaction occurs

• Cross linking process is accelerated by heat and chemical reaction

of the molecular chain

• Thermosets will not re-melt when sequentially exposed to the

transition temperature (Tg)

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Thermoplastic vs. Thermoset
• Thermoplastic
• Has a melt point
• Ex: Melt point of PTFE 620F
• Surpass melt point under
pressure
• Composite is densified
• Soft Substrate -thermoplastic
• Thermoset
• Has a Tg or Glass Transition
temperature
• Defined by cross linking of
molecular chain/curing process
• Rigid Substrate -thermoset
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Glass Transition - Tg
Material Type Tg (°C)
Hydrocarbon 280
Polyimide 260
Cyanate Ester 240
PPE 210
BT Epoxy FR-4 185
Epoxy PPO FR-4 180
Multifunctional Epoxy FR-4 165 - 180
Polyester 145
Difunctional Epoxy FR-4 130 - 140
PTFE Ceramic N/A Melt Point
PTFE Glass N/A Melt Point

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Electrical Properties

• Thermoplastic Bond Film

– Low Dielectric Constant (2.0 typical, 1MHz)
– Low Dissipation Factor (0.0002 – 0.0007 typical, 1MHz)

• Thermoset Prepregs
– Dielectric constant (3.0 – 5.0 typical)
– Dissipation factor (0.003 – 0.018 typical)
– Consider electrical test method, frequency

• Dielectric Strength
– FEP 1800 V/mil
– Thermoset 750 V/mil

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Dielectric Constant Comparison
Material Type er Test Frequency
PTFE Glass 2.2 - 3.5 10 GHz
PTFE Ceramic (low DK) 3.0 10 GHz
RO4003CTM/RO4350B™ 3.4, 3.5 10 GHz
PPE 3.3 1 GHz
Cynater Ester 3.4 - 4.0 1 MHz
Polyester 2.9 - 3.5 10 GHz
Epoxy PPO FR-4 3.5 - 4.2 1 MHz
BT Epoxy 4.0 - 4.6 1 MHz
Polyimide Glass FR-4 4.1 1 MHz
Multifuntional Epoxy FR-4 4.2 - 5.0 1 MHz
Difunctional Epoxy FR-4 4.3 - 5.0 1 MHz
PTFE Ceramic (High DK) 6.0 -10.8 10 GHz
2929 2.94 10 GHZ

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Loss Tangent Comparison:
Material Type Df Test Freq
• PTFE/Glass .0009-.0035 10GHz
• PTFE Ceramic(Low Dk) .0012-.0015 10GHz
• PTFE Ceramic(High Dk) .0019-.0035 10GHz
• RO4003C™/RO4350B™ .0025-.004 10GHz
• Polyester .003-.018 10GHz
• PPE .005 1GHz
• Cyanate Ester .006, .015 1M, 10G
• Polyimide/glass .010 1MHz
• Epoxy PPO FR-4 .010-.015 1MHz
• BT Epoxy FR-4 .013-.017 1MHz
• Multifunctional Epoxy FR-4 .019-.025 1MHz
• Difunctional Epoxy FR-4 .017-.040 1MHz
• 2929

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Electrical Considerations

• Impedance simulators are available

• Model impedance and loss factors based on Dk, Df,
frequency and spacing

• Versions of stripline software include bonding layer materials

in the modeling package

• Matching electrical properties (i.e. homogeneous)

constructions can be of benefit

• Rogers download MWI software can simulate bonding layers

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 Mechanical Properties
• Coefficient of thermal expansion (CTE)
• Loosely defined as materials change in volume with changes
in temperature.

• Example:
• PTFE = 100-150 ppm/°C
• E-glass = 8 ppm/°C
• Ceramic filler = 0.4-10 ppm/°C
• Copper = 17 ppm/°C

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Why is CTE Important?
X-Y Dimensions

• CTE dielectric > CTE copper = shrinkage

• CTE dielectric < CTE copper = growth

• CTE dielectric = CTE copper = “ZDC” No dimensional change

• Considering X-Y CTE of bonding layer materials relative to

core and prepreg; CTE effects dimensional change through
lamination (i.e. registration of interconnects).

Rogers Confidential
Z-Axis CTE
Material CTE 25-260°C CTE Below Tg
(ppm/°C) (ppm 10°C)
PTFE Ceramic 24 24
Hydrocarbon 35-50 35-50
Polyimide 50 50
Cyanate Ester 105 45
BT Epoxy FR-4 150 60
Multifunctional Epoxy FR-4 150 40- 0
Polyester 450 (above Tg 140°c) 60
PPE 160 80
Epoxy - PPO FR-4 125-170 75
DiFunctional Epoxy FR-4 170-215 85
PTFE Glass 150-200 150-200
ULTRALAM® 3908 150
2929 50

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Hybrid Multilayer

• Combination RF and
digital/low freq analog
• Matched CTE X,Y to Copper
& FR4
• Low Z axis CTE

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Typical Multilayer configurations

• Hybrid Constructions
– PTFE, FR4
– PTFE, Hydrocarbon
– Hydrocarbon, FR4
– Hydrocarbon, polyimide
– PTFE, polyimide
– LCP, PTFE
– LCP, Hydrocarbon
• Homogenous Constructions
– Pure Hydrocarbon (RO4350B/RO4450F)
– Pure FR4 (core/prepreg)
– Pure PTFE (fusion bond)
– PTFE, thermoplastic films

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Reinforced and Non-reinforced Systems (Core)

• PTFE Random Glass

• PTFE Ceramic
• PTFE Woven Glass with Ceramic
• Hydrocarbon Ceramic Glass
• PTFE Ceramic Limited Glass use

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RT/duroid® 5880 PTFE Random Glass

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RT/duroid® 6002 PTFE Ceramic

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PTFE Woven Glass

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RO4003CTM Hydrocarbon Resin Glass/Ceramic

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RO3203TM Laminate

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RO3203™
MATERIAL CONSTRUCTION

0.020” Construction 0.030” Construction

RO3003™ ply
PTFE/woven glass

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RO3000® PROPERTIES:
PTFE/ceramic

RO3003 RO3006 RO3010

Diel Constant 3.0+/-0.04 6.15+/-0.15 10.2+/-0.30
Loss Tangent 0.0013 0.0025 0.0035
TCK’, ppm/C +13 -160 -280
CTE, ppm/C 17,17 17,17 17, 17
X, Y, Z 24 24 24
Peel Strength 12 12 12
Water Abs. % <0.1 <0.1 <0.1

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RO3200™ PROPERTIES:
PTFE/ceramic

RO3203 RO3206 RO3210

Diel Constant 3.02+/-0.04 6.15+/-0.25 10.2 +/-0.50
Loss Tangent 0.0016 0.0027 0.0027
CTE, ppm/C 13,13 13,13 13, 13
X, Y, Z 58 45 34
Peel Strength 10 7 13
Water Abs. % <0.1 <0.1 <0.1

Rogers Confidential
RO3003™ vs. RO3203™
High Frequency Materials Properties

RO3003 RO3203
Flexural Modulus 125 400
Flexural Strength kpsi 1.3 9.0
Tensile Modulus kpsi 65 110
Tensile Strength kpsi .65 12.5
Dimensional Stability - mm/m (mil/inch) 0.50.08
CTE X,Y 17 13
Z 24 58

Rogers Confidential
Board Design Considerations
• Thin materials <.020 without glass reinforcement need more
registration allowance.
•
• .005 and .010 dielectric thickness should always be glass reinforced.
(RO3203TM, RT/duroid® 6202, CLTE™)

• Material movement caused by handling/mechanical exposures is

difficult to predict. (carrier boards, framing – fabricator options)

• Maintain Copper retention (maximum Cu. possible)

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Bonding Layer Adhesives

• Thermoplastic films - non reinforced

• Thermoset Resins reinforced with glass
• Thermoset Resins reinforced with glass and filler
• Thermoset Resins reinforced with filler, no glass
– High Flow
– Low Flow
– No Flow
• Contributing Factors
– Copper fill height
– Copper distribution
– Via fill requirements
– Available spacing

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Hydrocarbon Ceramic Fill and Flow

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>2oz Copper Fill – Resin Flow

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Stacked Copper Layers – Resin Flow

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Ceramic Hydrocarbon Low Pressure Area
(RO4450FTM)

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RO4450FTM Prepreg Via Fill

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2929 Bondply

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2015
2929 Bondply Process Evaluations

Core Via Adhesive Core Via Adhesive

Thickness Diameter Thickness Thickness Diameter Thickness
(mil) (mil)
(mil) (in) Target Actual (mil) (in) Target Actual
30 0.0098 4 3.0 60 0.0098 4 3.8
0.0138 2.9 0.0138 3.5
0.0197 2.8 0.0197 3.1
0.0300 2.6 0.0300 2.3
30 0.0098 8 7.5 60 0.0098 8 8.1
0.0138 7.4 0.0138 7.9
0.0197 7.2 0.0197 7.6
0.0300 7.2 0.0300 6.2
30 0.0098 12 10.7 60 0.0098 12 12.0
0.0138 10.7 0.0138 12.7
0.0197 10.6 0.0197 12.4
0.0300 10.0 0.0300 13.0
12.1

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2929 Thickness Calculation

• Example:
• 2929 thickness = 0.004”
• Side A Cu thick = 0.0007” (0.5E)
• Side B Cu thick = 0.0014” (1E)
• Side A retained Cu = 0.25 (25%/100)
• Side B retained Cu = 0.5 (50%/100)
• Core: core spacing = 0.004” + (0.0007 X 0.25) + (0.0014 X
0.5) = 0.0049”
• Note: Cu: Cu spacing would be 0.0049” – (0.0007” + 0.0014”)
= 0.0028”

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2929 Pressed Thickness Example

Pressed thickness 400 PSI

2929
0.0042" 0.003" 2 plies 0.0015"
CU 0.0013"

2929
0.0044" 0.0032" 1 ply 0.0015"
CU 0.0013" 1 ply 0.002"

2929
0.0046" 0.0036" 2 plies 0.002"
CU 0.0013"

Rogers Confidential
2929 Bondply Cavity Flow Example

Flow of 2929 Into Round & Rectangular Cavities

Varied Film Thickness & Applied Pressure
60
Flow From Edge (Mils)

45

30

15

0
200 PSI 400 PSI 200 PSI 400 PSI 200 PSI 400 PSI
0.0015 0.002 0.004

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Thin Core Post Lamination

RO4350B 0.004" .5oz Post Lamination Movement

MD-CMD X-bar

0.0000000
.5oz 25% .5oz 50% .5oz 75%
-0.1000000

-0.2000000
Mils/in.

-0.3000000
X-bar
-0.4000000

-0.5000000

-0.6000000

-0.7000000
Percent Copper Retention

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Thick Core Post Lamination

RO4350B 0.020" .5oz Post Lamination Movement

MD-CMD X-bar

0.0000000
.5oz 25% .5oz 50% .5oz 75%
-0.0500000

-0.1000000

-0.1500000
Mils/in.

-0.2000000 X-bar

-0.2500000

-0.3000000

-0.3500000

-0.4000000

Percent Copper Retention

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Thieving Pattern Rogers ULTRALAM®
Laminate, Example:
Border Circuit Area Border

L1
Ultralam 3850 Core
L2
Ultralam 3908 Bondply
L3
Ultralam 3850 Core
L4
Ultralam 3908 Bondply
L5
Ultralam 3850 Core
L6
Ultralam 3908 Bondply
L7
Ultralam 3850 Core
L8

Good pressure distribution in border region

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Offset Border Image

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Balance Constructions

• Bow and Twist

– Match CTE
– Match Tg
– Match thickness
– Control copper distribution

– Fabricator Options
– Pressure bump cycles, pressure step down cycle
– Control rate of rise and cool down
– Post bake
– Flat bake
– Pre bake
– Pre-thermal cycle

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Lamination Parameters

• Three Key Considerations (controlled at fabricator level)

• Time
– Generally, little influence on the design (can effect full cure and
wettability) 30-90 minutes at dwell typical

• Temperature
– Major consideration
• Meltpoint of films and full curing of prepreg,
– rate of rise,
» material compatibility
• Pressure
– Impact spacing and reliability

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Thermoplastic Bond Films

• 3001 - 6700 • FEP

– Chlorotrifluro-ethylene – (Flourinated
– Meltpoint 374F ethylenepropylene
– Bonding Temperature 428F copolymer)
– 0.0015” available thx. – Meltpoint of 520F
– Bonding Temperature 565F
– varied thickness available.

 Difficult to build-up consistent thickness

 Metal finish and assembly considerations (ENIG vs. HASL)
 Sequential lamination (possible in combination)
 Legacy Constructions, Low Dk. Low Loss

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Thermoset Bonding Layers

• FR4 Epoxy
– matched electrical property
– matched CTE

• Hydrocarbon Ceramic (RO4350B™/RO4450F™)

– matched electrical properties
– matched CTE

• PTFE
– Fusion bond to match electrical mechanical
• Other options

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PTFE Ceramic – Fusion Bond and MLB Options

• Adhesive Er Df Thickness
RO3003™ 3.0 0.001 5.0 mil*
RO3006™ 6.2 0.002 5.0 mil*
RO3010™ 10.2 0.003 5.0 mil*
RO2800® 2.6/7.6 0.003 1.0, 1.4, 2.0 mils
FEP 2.1 0.001 0.5, 1.0, 2.0 mils
3001 2.3 0.003 1.5 mils
ULTRALAM® 3908 2.9 0.002 1.0, 2.0, 4.0 mils
RO4400™ 3.2-6.2 0.004 3.6, 4.0 mils
FR4 4.5 0.018 Multiple

*NOTE: Core or Bondply

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Common Lamination Temperatures

• PTFE Fusion Bond 700F

• FEP 550F
• ULTRALAM® 3908 540F
• 2929 450F
• Polyimide 430F
• 3001,6700 428F
• RO4450TM Bond Ply 350F
• FR4 Epoxy Resins 350F
• CuClad® 6250 275F

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Fabricator Challenges

• Capability
– High temperature presses
– Pressure capability
– Vacuum assist
– Tooling, high temperature separator plates
– Press pad materials
– Conformal pressure driving materials
• Process
– Cavity routing, resin flow
– Filled and buried vias (back drilling, depth drilling etc)
– Sequential laminations
– Registration

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 Reliability

• Lead Free Reflow Temperatures (3X-5X typical)

• Soldershock - 288C
• UL Testing UL746E, UL796
• IPC 4103A – Specification for for Base Materials for High
Speed/High Frequency Applications
• IPC 6012C –Qualification and Performance Specification for
Rigid Printed Boards
• IPC 6018A – Microwave End Product Board Inspection and
Test

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