Lenovo A2010-a

Service Manual
 Contents
1 Layout of main board ................................................................................................................. 3
1.1 Layout ................................................................................................................................. 3
1.2 Mobile phone principle and fault analysis ........................................................................... 4
1.3 Baseband unit ..................................................................................................................... 5
1.3.1 Does not boot ........................................................................................................... 5
1.3.2 LCD .......................................................................................................................... 8
1.3.3 CTP ........................................................................................................................ 10
1.3.4 Flash ....................................................................................................................... 11
1.3.5 MAIN CAMERA ...................................................................................................... 12
1.3.6 SUB CAMERA ........................................................................................................ 13
1.3.7 KEY ........................................................................................................................ 15
1.3.8 VIB .......................................................................................................................... 15
1.3.9 RECEIVER ............................................................................................................. 16
1.3.10 SPEAKER ............................................................................................................. 17
1.3.11 MIC ....................................................................................................................... 18
1.3.12 Earphone failure ................................................................................................... 20
1.3.13 SIM_CARD ........................................................................................................... 20
1.3.14 G-SENSOR........................................................................................................... 22
1.3.15 BT/WIFI/FM/GPS .................................................................................................. 22
1.3.16 RF unit .................................................................................................................. 26
1.3.17 GSM failure ........................................................................................................... 26
1.3.18 WCDMA failure ..................................................................................................... 27
1.3.19 LTE failure............................................................................................................. 29
2 Assembly and disassembly instructions ...................................................................................... 32
2.1 Disassembly ..................................................................................................................... 32
2.1.1 Disassemble battery cover...................................................................................... 32
2.1.2 Remove the battery ................................................................................................ 32
2.1.3 Disassemble rear cover .......................................................................................... 32
2.1.4 Loosen the MIC ...................................................................................................... 33
2.1.5 Loosen the speaker ................................................................................................ 34
2.1.6 Loosen the vibrator ................................................................................................. 34
2.1.7 Dismantle the LCD connector ................................................................................. 35
2.1.8 Dismantle side key FPC connector ......................................................................... 35
2.1.9 Dismantle TP connector .......................................................................................... 36
2.1.10 Dismantle rear camera connector ......................................................................... 36
2.1.11 Loosen the MB screws .......................................................................................... 36
2.1.12 Separate MB front TP&LCD assembly.................................................................. 37
2.1.13 De-soldering speaker ............................................................................................ 37
2.1.14 Dismantle front camera ......................................................................................... 38
2.1.15 De-soldering receiver and remove ........................................................................ 38
2.1.16 De-soldering vibrator ............................................................................................ 38
2.1.17 De-soldering MIC .................................................................................................. 39
2.1.18 Tilt TP FPC ........................................................................................................... 39
2.1.19 Dismantle side key ................................................................................................ 39
2.1.20 Dismantle camera lens ......................................................................................... 40
2.1.21 Tear down battery compartment Mylar .................................................................. 40
2.1.22 Summary of demolition materials.......................................................................... 41
2.2 Assembly guide ................................................................................................................. 41
 1 Layout of main board
1.1 Layout
 1.2 Mobile phone principle and fault analysis

MT6735 baseband chip as illustrated：

MediaTek MT6735 SoC integrates four 64 ARMv8 architecture Cortex-A53 CPU core, clocked at
1.5GHz, while integrating the next generation of GPU Mali-T720,8 core, support for OpenGL ES 3.0,
OpenCL 1.2.
The biggest highlight of the baseband processor part to support GSM / EVDO Rev. A / CDMA2000 1x /
TD-SCDNA / WCDMA / TD-LTE / LTE FDD standard, including EVDO Rev. A / CDMA2000 1x is the first
time in the SOC MediaTek , patents from vIA Telecom.
Multimedia, supports low-power 1080p / 30fps video playback and recording, H.265 / H.264 video
encoding, integrated 13 million pixel camera ISP, supports PIP PIP, VIV dual video, Video Face Beautifier,
also supports ClearMotion, MiraVision.
Wireless technology supports dual-band Wi-Fi, Bluetooth 4.0.
 1.3 Baseband unit

1.3.1 Does not boot

 boot sequence

 The Principle:
Phone is switched on in the process as shown above, press the power button, PWRKEY detected
low latency 30ms, drive power management chip LDO open and the brightest to the baseband circuitry,
starting from Vcore, 2ms interval turn on power to VMCH power-end. At the same time, from the
beginning of the end electrical power management chip RESET signal resets 200ms after the Vcore,
the baseband chip to boot into software startup program, complete boot.
In addition, this platform Power Good detection function. That PMIC will automatically detect each
way power output, the power output if there is not, PMIC will repeat the process on power. If this
phenomenon occurs, the performance of reset signal remains low.
 boot process
1. Mobile phone power supply: mobile phone plus battery or DC power supply, power management chip
(PMU) to get the battery voltage, its internal 32KHz watch crystal module to work, the output voltage of the
external RTC's work, for real-time clock crystal start-up.
2. Phone reset: press the power button, after PMU detected RST_ON outputs a reset signal to the
phone CPU, CPU will start the system self-test program;
3. The working voltage output: After the phone to complete the self-test, CPU PMU output by IIC bus
control circuit voltage of each cell phone, such as VDD1, VDD2, VDD3, AVDD and the like;
4. 13M crystal work: After the clock and get a job working voltage, CPU outputs REF_ON signals to
control the work of 13M circuit generates 13MHz clock, on the one hand to provide work master CPU clock,
on the other hand to provide the main chip radio frequency reference frequency source ;
5. Call the boot process: After the CPU self-test completed and the operating voltage and the master
clock, via IIC bus calibration work PMU output voltage from various quarters, the calibration is complete, it
will output chip select signals and address signals to FLASH, calling boot process , and boot;
6. Establishing a communication connection: the phone is turned on, CPU call RF parameters from
FLASH, the received signal strength of a cell through the broadcast control channel (BCCH), if there is a
SIM card or UIM card in the phone, the relevant information is transmitted to the adjacent base station, and
receives information from the base station, which is connected with the corresponding networks, known as
search network;
7.After completion of the standby search network, the phone will be in a wait state, the phone will
periodically during the exchange of information with the base station via a number of auxiliary slow control
channel (SACCH), such as signal strength, frequency synchronization, reception quality and reception level
Failure analysis processing：
1. For the failure does not boot, the first detection of the battery interfaces for any obvious damage. If
the battery interface OK, then use the DC power supply to the mobile phone, observe current fault plane;
 2. With a test fixture measurement bad motherboard power current：
The current is too large (typically greater than 1A), proved short-circuit motherboard, usually battery
Vbat pin connector is shorted to ground, can be removed U401 (PMIC) and then measuring the Vbat pin is
short-circuited, then turn on the replacement Vbat path other chip U901 (flash drive), U805 (backlight driver)
and then measuring the Vbat pin is shorted;
A current at 70mA or less, to check each power supply is normal, usually PMIC, clock circuit Weld or
damaged, you can measure the crystal is normal;
A current of 70 ~ 100mA, typically software data loss, half rubbing upgrade software;
d, current is 100 ~ 300mA, check the clock (X401) is normal, focus on examination PMIC (U401), CPU
(U101), MEMORY (U602) welding is bad

 Flow chart：

Current
inspection
<70mA 100～300mA

N 70～100mA Y
Check Welding Replace
U401 U401 U401
Re-downlo
ad software Y
Y N
N Y
Check Replace
X401 Y Replace U101
U401

N N
Replace
Replace U602
U401 OK

OK
OK

Circuit Schematic：
 Charge management chip U501, when checking the charging voltage, a signal is sent to the PMIC and
start charging, charging current is monitored by ISENSE, VBAT monitor the battery voltage:
After inserting the battery charger, the phone no response, can not be charged, first replace the battery
and charging cable for testing; and then measuring the charge current is normal; and then try to add or
replace welding U502, and then try to add another weld or replace PMIC.

Not charge

N
Check VCHG
Replace USB
Voltage
connector

Y
N
Replace R509
Check
current

N
Check the Replace U501
charging IC

Y
Replace PMIC
 1.3.2 LCD
 Circuit schematics：

LCD is MIPI interface, including power/data/clock/reset. The main screen LCD display circuit MIPI
interfaces are generally used communication interfaces. Each signal is described as follows:
TDP/TDN is MIPI data interface/TCP/TCN for the MIPI clock interface; VIO18_PMU control signal
voltage power supply; LCM_RST reset; LED_A, LED_K backlight power supply.
Fault analysis process:
Black screen, black and white, the video screen display dislocation
LCD Display
bad

Y
Reassemble
LCD Replace LCD

Y
Check J802 Is Replacing
abnormal Devices OK

Upgrade or
replace
memory

 Blacklight Driver
 Analysis process：
Gray screen fault plane generally weak backlight, which is due to the backlight driving voltage is not
enough cause, measuring LED-A in the phone is switched mode voltage is 36V. Measurement is not
L802/D807/U805 device abnormal.
 1.3.3 CTP
 Circuit Schematics

Capacitive touch screen technology CTP (Capacity Touch Panel) is used by the body to work in the
current sense. Capacitive screen is a four-layer composite glass screen, the inner surface of the glass panel
and the sandwich and coated with a layer ITO (indium tin oxide nano), the outermost layer is a protective
layer of silica glass only 0.0015mm thick, laminated ITO coating for the face, leads the four corners four
electrodes, the inner layer of ITO as a screen to ensure that the work environment. Power supply circuit
VIO18_PMU/VIO_28PMU, control signal GPIO_CTP_RSTB/EINT_CTP/I2C bus SDA1 and SCL1.
 Failure analysis：
1. Replace CTP；
2. Check the input voltage is normal；
3. Enable signal is pulled up, if it is pulled，The CPU exception, can be welded and then measuring。
4 Is there a control signal output, use an oscilloscope to measure SDA1 and SCL1 whether a signal
output, if abnormal, you can add insulation displacement connector J801.
 Failure analysis chart：

Touch failure

Y
Measure the voltage Replace PMIC
is abnormal

Y
Measure RET、
Replace CPU OK
EINT、SDA、SCL
signal is abnormal

Y
Reassemble ZIF
CTP ZIF connector connector
is abnormal

1.3.4 Flash
 Circuit Schematics

 Failure analysis process：

Flash ends with a 3V voltage flash test, if bad then replace flash; check whether the flash is external
components welded or body abnormal, check the flash IC welding is normal；
 Analysis flowchart：
 Flash failure

N
3V voltage to
FLASH, is normal Replace Flash

Y
Measure Driver IC OK
Replace Driver IC
voltage is
U901
abnormal

Y Replace CPU（U101）
Measure ENF
and ENM is
normal

1.3.5 MAIN CAMERA

 Camera principle analysis：

Main Camera: including power, clock, data and control lines, wherein the power line comprises
VCAMA_PMU, VCAMD_PMU, VCAM_IO_PMU. Clock line includes CMMCLK, MIPI data interface
includes RDP0-RDP1, RDN0-RDN1, MIPI clock interface RCN, RCP, the control line, including SDA0,
SCL0.
 Failure analysis process：
Repair process: General phone camera without image or the video, there are four possibilities: the
first rule Display failure, a camera bad; 2, camera and bad deck; 3, B2B deck J902 Weld. 4, CPU chip
anomalies. So first determine whether the power cord has power, if the power cord abnormalities, first
determine whether the short-circuit if a short circuit removed capacitance corresponding pathway, if not
short-circuit the plus welding PMIC circuit; look at whether there is an output clock signal, without output
can be to add PMIC chip welding; Check the signal cable is a signal, if not, you can first volume Z906 -
Z908 both sides, if the CPU has an output, then the exclusion air welding, soldering or replacement
parts can be added; if there is no output, then the CPU exception, the first increase welding and then
measured. If the peripheral signals are, we can conclude that the adverse socket, it can be welded and
then measured.
Failure analysis flowchart：

Camera fail

N
Check assembly is
normal Reassemble

N
Measure voltage Replace
PMIC（U401） OK

N Replace
Z906-Z908
CPU
Impedance is
normal

N
Measure Replacing
SCD0/SCL0/CLK/ Devices
RESET is normal

Replace
Camera
connector

1.3.6 SUB CAMERA

 Circuit schematics
 Analysis process：
Front camera: including power, clock, data and control lines, wherein the power line comprises
VCAMA_PMU/VGP1_PMU/VCAM_IO_PMU. Clock line includes CMMCLK. MIPI data line includes
RDN0_A-RDN1_A/RDP0_A-RDP1_A, MIPI clock interface RCN_A, RCP_A. Control lines include
CAM_RST1/SDA0/SCL0.
 Repair process：
Usually cell phone camera without image or the video, there are four possibilities: the first rule
Display failure, 1, before the camera is bad; 2, the camera and the ZIF connector bad; 3, before the
camera J901 ZIF connector Weld. 4, CPU or PMIC exception. So first determine whether the power
circuit supply is normal, first determine whether a short circuit, if a short circuit removed capacitance
corresponding pathway, if not short-circuit the plus welding PMIC circuit; look at whether there is an
output clock signal, the absence of output, you can first plus welding CPU chip; see signal line is a
signal, if not, then the CPU exception CPU plus welding can be measured again. If the peripheral
signals are, we can conclude that the connector is bad, can be welded and then measured.

Failure

N
Camera is good
Replace or
and well
reassemble
assembly?

N
Measure voltage Replace
PMIC（U401） OK
is normal

N Replace
Measure
CPU or EMI
Z901-Z903
Impedance

N
Measure SCD0、 Replacing
Devices
SCL0/CLK/RESE
T

Replace
front camera
connector
 1.3.7 KEY
 Circuit schematics：

 Circuit principle analysis：

Key into the power button and side buttons (volume +, -), when the key is pressed, CPU / PMIC detects
a key signal to make appropriate judgments after being down and executing instructions; when all keys are
invalid, first that investigation if there is a short circuit button pressed this button consistent state, bad if you
consider whether a single key failure DOME / FPC body, after the exclusion of peripheral devices to the
CPU, PMIC measurement investigation, this model is controlled by PMIC Power and Vloume up button,
CPU control Volume down button; the button after replacing the first key signal FPC disassemble view is
unobstructed, and then view PMIC and CPU devices whether Weld, damage.

Key Failure

All key failure Replace FPC

Y
Power and Vol Plus welding OK
“-” fallure PMIC

Vol“+” failure Replace CPU

1.3.8 VIB
 Circuit schematics：
 Failure analysis process：
Motor works relatively very simple, all the way from PMIC LDO output voltage VIBR drive motor
vibration, as long PMIC output voltage is normal, the line in the resistance welding good container, motor
body work we can guarantee the normal operation of the motor, so the normal process of analysis starting
from the three. First cell phone on vibrate mode, resistors and capacitors on the motherboard check whether
good welding, such as welding good, with a multimeter to measure the motor between the two pads pad
voltage, normal should be about 3V, such as the voltage is normal, for the motor monomer issue Please
replace the motor; such as abnormal voltage, compared PMIC weld or damaged, plus welding or
replacement of the PMIC.

1.3.9 RECEIVER
 Circuit schematics：

 Failure analysis flowchart：

Maintenance process: check whether the assembly RECEIVER good; check around the handset device
(B701, B702) for damage or short, Weld, as the handset silent above normal circumstances, it can be
judged PMIC power supply problem (bulk or welding)；
 Receiver fail

Y
Check peripheral
Replace peripheral
devices
devices

N
Y

Check receiver Replace receiver OK

Y
Check PMIC(U401)
Replace PMIC

1.3.10 SPEAKER
 Circuit schematics
 Failure analysis process：
Speaker can not hear sound, check whether the horn assembly unusual or abnormal body；

Speaker fail

Y
Check speaker is
Reassemble or
good and well
replace
assemble

Y
Check R704 and R705
Replace R704 、
OK
R705

N
Check PA(U702)
Replace PA(U702)

Check PMIC(U401)
Replace PMIC

1.3.11 MIC
 Circuit Schematics：
 Circuit principle analysis：
MICBIAS0 bias voltage supply to the MIC, typically a voltage of about 2.4V-2.7V.
MIC bias current flows from MICBIAS-MIC GND (separate GND, rather than public GND, mainly
because of too much interference GND); beads have a high resistivity and magnetic permeability, which
is equivalent to resistance and inductor series, but the resistance and inductance values vary with
frequency. Better than conventional high-frequency filter inductor characteristics, showing resistance at
high frequencies, it is possible to maintain a high impedance over a wide frequency range, thereby
improving the filtering effect of FM
。
 Failure：Mic silent
Maintenance process: check MIC welding is good, can replace MIC experiment; dial phone,
measuring MIC circuit board C733
MICBIAS0 Is there bias; check whether the MIC circuit in question; plus welding PMIC.
Failure analysis process：

MIC silent

Confirm the Re-welding

device around Or Replacing
Devices

Y
Mic problem? Re-welding or replace OK
Mic

N
Y

MIC bias voltage Re-welding or

is abnormal replace PMIC
 1.3.12 Earphone failure
 Circuit schematics：

 Failure Analysis：
VIO18 PMU provided headphones voltage; EINT EAR headset button; HP MIC is a headset
microphone; AU HPL and AU HPR are the left and right earpiece headset; FM antenna is integrated in
the headset.
1 After replacing the headset and retest the headset features;
2 Check whether the earphone holder welding is good;
3 Check the headphone related components have significant adverse welding or body damage and so
on;
4 plug in your headphones, measuring VIO18 PMU voltage is normal;
5 After replacing the headset seat, then test;
6 plus welding / re-welded PMIC (U401 MT6328) or replaced.。

1.3.13 SIM_CARD
 Circuit schematics：
 Failure analysis：

SIM failure

N
Check the SIM and Reassemble or
assembly is good replace SIM

N
Measuring VSIM Re-welding or
voltage is normal OK
replace PMIC

N
Measuring the
impedance Replace CPU
Of IO/RST/CLK
 1.3.14 G-SENSOR
 Circuit schemtatics

 Failure analysis process：

Phone gravity sensing technology is the use of piezoelectric effect to achieve. Through the sensor,
feeling in the change positions, change the focus of the phone. It's powered by an external interface
circuit VIO18_PMU, control / data circuit SCL2 / SDA2, constitute a control signal EINT_G.

G-sensor Fail

N
Measure the Re-welding or
voltage of 18_PMU replace PMIC
is normal

Re-welding or
replace U1107

Replace CPU
（U101）

1.3.15 BT/WIFI/FM/GPS
 FM Antenna circuit：
 WIFI/BT/GPS：

 GPS&LNA：

 MT6625N/A WIFI/BT/GPS/FM：
 X1201 supplied with the 26M working clock/WIFI/BT/GPS/FM 1.8V and 2.8V power supply from an
external LDO output, headset as an antenna for FM reception, after receiving FM demodulator chip, the
output audio signal (FM_OUTL, FM_OUTR), the two-channel audio signals to the baseband chip, the
baseband chip to do the handover process.
 Failure analysis process：
 Failure 1：FM doesn’t work：
Repair process: FM function in the open state, the clock signal and AVDD28_FM measuring signal
is correct, if not correct then that is PMIC (U401) problems; if more signals are correct then look at FM
chip MT6625 (U1201) is Weld or damage.
 Failure 2：GPS doesn’t work：
Repair process: GPS function in the open state, the measurement of the clock signal is correct,
measure GPS_AVDD18 voltage is normal, check the filter U1202, RF LAN U1203 is soldered properly and
the body is normal, and check whether the band-stop filter U1204 welding normal and the body is normal, if
these are normal, then check whether the MT6625 welding normal and the body is normal.
 Failure 3：WIFI/BT doesn’t work：
In the open WIFI, BT status, measure the clock signal is correct, measure WB_AVDD33 and
AVDD18_WB voltage is normal, check whether U1205 RF filter welding normal and the body is normal,
check the MT6625 welding is normal and the body is normal.
 Signal power is BT/WIFI/FM/GPS failure
low

Check Antenna
assembly is FM Fail: GPS Fail WIFI、BT Fail
correct Measuring Measuring Measuring clock
clock signal clock signal signal

Antenna line Y Y Y
welding is
abnormal
Measure the Measure the Measure the
voltage of voltage of voltage of
AVDD18_FM GPS-AVDD18 WB_AVDD33 and
AVDD18_WB
Re-welding
and retest Y
Y

Y
Check LAN
U1203 and Check U1202
U1204 is good and U1205 is
good

Y
Y

Check MT6625（U1201）is welding good and Device body good,

if not then replace U1201
 1.3.16 RF unit
RF chip MT6169 and the PA, RF switches, filters, etc. together constitute the RF module, supports
GSM, WCDMA, LTE. That support GSM \ WCDMA \ LTE
U1301 MT6169V / A 3-mode RF transceiver chip supports 8-frequency mode：

1.3.17 GSM failure

 GSM850（B5）

 GSM900（B8）

 GSM1800/1900
 Analysis：
GSM bands including GSM850/ GSM900,/DCS1800,/PCS1900. RF failure generally to receive,
transmit bad
。
 Repair process:
1 If the GSM850 fault, view the U1112 filter welding or body is abnormal;
2 If the GSM900 fault, view U1508 filter welding or body is abnormal;
3 If the fault DCS1800 see C1501 and C1519 filter welding or body is abnormal;
4 If PCS1900 fault, view R1509 and C1513 filter welding or body is abnormal;
5 Check the RF transceiver U1301 welding or body is normal.

GSM failure

Y
DCS1800 failure Replace U1112

Y
GSM900 failure
Replace U1508

Y
DCS1800 failure Replace C1501、C1519

Y
PCS1900 failure
Replace C1509、C1513

Check U1301 is
welding good and
body is good

1.3.18 WCDMA failure

WCDMA include W850/W900/W1900/W2100（B1/B2/B5/B8）
 B1
 B2

 B5

 B8

 Repair process
1. W850 (B5) failure, check the filter U1112 welding or body is normal;
2. W900 (B8) failure, check the filter element U1508 welding or body is normal;
3. W1900 (B2) failure, check the filter element U1515 welding or body is normal;
4. W2100 (B1) failure, check the filter element U1504 welding or body is normal;
5. Check MT6169 (U1301) RF transceiver welding or body is normal;
6. Check the CPU (U101) welding or body is normal
 WCDMA failure

Y
W850&W900 failure Replace U1112 or U1508

N
Y
W1900&W2100 failure Replace U1515 or U1504

Check T6169
（U1301）is normal

Check PU（U101）is
normal

1.3.19 LTE failure

 TDD（PRX B40）

 FDD（TRX B1）

 FDD（TRX B3）

 LTE（DRX）
 LTE RF Power Amplifiter

 Analysis：
LTE into TRX (main set to receive and transmit common) and DRX (diversity reception)
 Repair process：
1. If the TLE of PRX B40 fault, plus welding or replace filter U1507, RF power amplifier U1401;
2. If the TLE of TRX B1 fault, plus welding or replace filter U1504, RF power amplifier U1401, U1505;
3. If TRX B3 / B4 TLE's fault, plus welding or replace filter U1513 and U1514, RF switch U1512, RF
power amplifier U1505, U1401;
4. If the DRX TLE fault, plus welding or replace RF power amplifier U1608, and each band
corresponding filter;
5. The still unresolved, plus welding or replace RF transceiver chip MT6169 (U1301);
6. Re-welding or replace CPU (U101).
 LTE failure

B40 PRX Fail B1/3/4 TRX Fail B5/8 TRX Fail

Replace U1507、 Replace U1505，or Replace U1112、
U1401 U1504、U1513、 U1508
U1514

Y Y
Y

B5/8 DRX Fail

B1/3/4 DRX Fail re-welding or replace
re-welding or replace U1608/U1601/U1603
U1608/U1605/U1606

Y
Y

Check MT6169（U1301）is welding good and body good, if not then re-welding or replace
CPU（U101）
 2 Assembly and disassembly instructions

2.1 Disassembly

2.1.1 Disassemble battery cover

2.1.2 Remove the battery

2.1.3 Disassemble rear cover

First tighten the screws, and then separating the housing from the volume keys at the rear shell removed
 Isolated housing
with disassemble
card

2.1.4 Loosen the MIC

 2.1.5 Loosen the speaker

Using forceps at
the arrows tilt the
speaker. Be careful
not to damage the
speakers

2.1.6 Loosen the vibrator

Using forceps loose motor
2.1.7 Dismantle the LCD connector
Be careful not to damage the LCD FPC

2.1.8 Dismantle side key FPC connector

Be careful not to damage the side buttons FPC
2.1.9 Dismantle TP connector
Be careful not to damage the TP FPC

2.1.10 Dismantle rear camera connector

Be careful not to damage the surrounding components

2.1.11 Loosen the MB screws

2.1.12 Separate MB front TP&LCD assembly
Board separation process note to protect the rear camera FPC

2.1.13 De-soldering speaker

2.1.14 Dismantle front camera

2.1.15 De-soldering receiver and remove

Soldering iron temperature controlled at about 320 ℃

2.1.16 De-soldering vibrator

Soldering iron temperature controlled at about 320 ℃
 2.1.17 De-soldering MIC
Soldering iron temperature controlled at about 320 ℃

2.1.18 Tilt TP FPC

Use
tweezers
from arrow,
tilt TP.

2.1.19 Dismantle side key

The rubber-coated surface and the side buttons A shell using forceps to separate and remove the side
buttons
2.1.20 Dismantle camera lens

2.1.21 Tear down battery compartment Mylar

2.1.22 Summary of demolition materials

1. TP&LCD assembly
2. Rear cover
3. Battery
4. MB
5. Battery cover
6. Speaker
7. Vibrator
8. MIC
9. Receiver
10. Rear camera
11. Front camera
12. Side key
13. Rear cover screws
14. MB screws
15. Camera lens
16. Battery compartment
Mylar

2.2 Assembly guide

Assembly and disassembly is just the opposite