Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]
HP Pavilion dv5 Entertainment PC - dv5-2000 to dv5-2099 (AMD)
Name / Model #2
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Quantity
of items
Item Description Notes
included
in product
Printed Circuit Boards (PCB) or Printed Circuit With a surface greater than 10 sq cm 3
Assemblies (PCA) (Motherboard,SD card reader,wireless card)
Batteries All types including standard alkaline and lithium coin 2
or button style batteries (Battery,RTC Battery)
Mercury-containing components For example, mercury in lamps, display backlights, 0
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater Includes background illuminated displays with gas 0
than 100 sq cm discharge lamps i (LCD panel)
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring 0
greater than 2.5 cm in diameter or height
External electrical cables and cords (EPS) 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants 0
Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent 0
including liquids, semi-liquids (gel/paste) and toner chambers, and service stations.
Components and waste containing asbestos 0
Components, parts and materials containing 0
refractory ceramic fibers
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Components, parts and materials containing 0
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Type-cross
Description #1 Screwdriver
#1
Type-cross
Description #2
#0
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove battery
2. Remove three screws on the edge of battery ditch
3. Remove remove 2 screws on RAM cover and then remove 1 screw on HDD cover.
4. Pull out WLAN cable, and remove 2 scres then remove WLAN module.
5. Pull out HDD cable and remove HDD.
6. Remove 4 screws around HDD ditch, then pull out ODD from system.
7. Remove 2 screws align with battery ditch(mark M2.5x4)
8. Remove 4 screws on ODD bracket
9. Remove 2 rubber feet at the back, and 7 screws on the 4 sides.
10. Remove 1 screw in HDD ditch(mark M2x2), and 2 screws around WLAN connector.
11. Turn to upside of the system, remove KB and pull out KB FFC.
12. Pull out Power S/W FFC and T/P FFC
13. Remove top case from system
14. Remove 2 screws on the bracket upon USB board and remove the bracket.
15. Remove power jack cable and USB/B, LVDS cable from M/B
16. Pull out antenna cable from bottom case and remove rubber next to power jack.
17. Remove 4 screws on the right/lest side of hinge.
18. Remove 2 screws & speaker cable, ODD cable from MB.
19. M/B can be removed from bottom case.
20. Remove LCM mylar on the 2 sides.
21. Remove 2 screws under mylar
22. Remove hinge cover and take apart bezel
23. Remove 4 screws below LCM
24. Remove 2 screws on the upper right and left side
25. Rip off tape and pull out logo LED cable.
26. Remove LCM set from cover case.
27. Remove 6 screws and R/L brackets from LCM
28. Remove LVDS cable from LCM
29. Pull out camera cable and remove canera module
30. Pull out Main and AUX WLAN antenna
31. Lift the lower right side of LCM foil and take apart backlite logo module.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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