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Features
• Low capacitance. (C = 0.5 pF max)
• Low forward resistance. (rf = 2.0 Ω max)
• Super small Flat Package (SFP) is suitable for surface mount design.
Ordering Information
Type No. Laser Mark Package Code
HVD132 2 SFP
Pin Arrangement
Cathode mark
Mark
2
1 2
1. Cathode
2. Anode
Electrical Characteristics
(Ta = 25°C)
Item Symbol Min Typ Max Unit Test Condition
Reverse current IR — — 0.1 µA VR = 60 V
Forward voltage VF — — 1.0 V IF = 10 mA
Capacitance C — — 0.5 pF VR = 1 V, f = 1 MHz
Forward resistance rf — — 2.0 Ω IF = 10 mA, f = 100 MHz
Note: 1. Please do not use the soldering iron due to avoid high stress to the SFP package.
Main Characteristic
10-2 10-7
10-8
10-4
10-9
Ta = 75°C
10-6
10-10
Ta = 75°C
10-8
Ta = 25°C 10-11
Ta = 25°C
10 -10 Ta = -25°C
10-12
Ta = -25°C
-12
10
1.0 10-130 20 40 60 80 100
0 0.2 0.4 0.6 0.8
Forward voltage VF (V) Reverse voltage VR (V)
Fig.1 Forward current vs. Forward voltage Fig.2 Reverse current vs. Reverse voltage
103
f = 1MHz f = 100MHz
10
102
Forward resistance rf (Ω)
Capacitance C (pF)
101
1.0
100
0.1
10-1 -5
1.0 10 100 10 10-4 10-3 10-2
Reverse voltage VR (V) Forward current IF (A)
Fig.3 Capacitance vs. Reverse voltage Fig.4 Forward resistance vs. Forward current
Package Dimensions
As of January, 2003
Unit: mm
0.3 ± 0.05
0.6 ± 0.05
1.0 ± 0.10
1.4 ± 0.10
0.13 ± 0.05
0.5 – 0.55
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