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Version 7
417006-2311-0H3-A00
XDM-300 (ETSI) Installation and Maintenance Manual
V7
Catalog No: X36419
August 2007
1st Edition
Introduction.............................................................................. 1-1
XDM-300 Platform Overview............................................................................ 1-1
XDM-300 I/O Protection Options...................................................................... 1-2
XDM-300 Shelf with CWDM Networking Capabilities ...................................... 1-7
Maintenance............................................................................. 4-1
Overview .......................................................................................................... 4-1
Required Test Equipment, Tools, and Materials .............................................. 4-1
Preventive Maintenance................................................................................... 4-2
Traffic Monitoring System................................................................................. 4-7
Onsite Troubleshooting .................................................................................. 4-12
Replacing Cards and Modules ....................................................................... 4-20
Replacing RAP Components.......................................................................... 4-28
Figure 3-93: Inserting the coaxial cable into the extractor ......................................... 3-117
Figure 3-94: Positioning the connector in the extractor ............................................. 3-118
Figure 3-95: Inserting the connector .......................................................................... 3-118
Figure 3-96: Removing the extractor ......................................................................... 3-119
Figure 3-97: Removing the TPU connector from the XDM-300................................. 3-121
Figure 3-98: Inserting the TPU connector onto the XDM-300 ................................... 3-122
Figure 3-99: Installing the pin guides in the TPU ....................................................... 3-123
Figure 3-100: Lowering the TPU onto the XDM-300 ................................................. 3-123
Figure 3-101: Securing the TPU onto the XDM-300 .................................................. 3-124
Figure 3-102: Installing the XDM-300 pin guides and removing the lower
connector cover.......................................................................................................... 3-125
Figure 3-103: Assembling the TPU bracket and jumper connector ........................... 3-126
Figure 3-104: Lowering the XDM-300 onto the TPU ................................................. 3-127
Figure 3-105: Securing the lower TPU to the shelf .................................................... 3-127
Figure 3-106: Removing the connector cover and fastening bracket from the
first TPU/OCU ............................................................................................................ 3-129
Figure 3-107: Installing the pin guides in the TPU ..................................................... 3-130
Figure 3-108: Inserting the TPU/OCU connector onto the first TPU/OCU in
the XDM-300 .............................................................................................................. 3-130
Figure 3-109: Lowering the second TPU/OCU onto the expanded XDM-300........... 3-131
Figure 3-110: Securing the second TPU/OCU onto the expanded XDM-300 ........... 3-132
Figure 4-1: Inserting the air filter .................................................................................... 4-5
Figure 4-2: ECU300-F monitoring system interface....................................................... 4-7
Figure 4-3: Monitoring system interface of a typical module ......................................... 4-8
Figure 4-4: Inserting an SFP/XFP transceiver into an I/O module............................... 4-26
Figure 4-5: Replacing the xRAP-100 circuit breakers.................................................. 4-29
Figure 4-6: Replacing the xRAP-B circuit breakers ..................................................... 4-30
Figure A-1: ALARMS connector pin identification..........................................................A-2
Figure A-2: F-CHANNEL connector pin identification ....................................................A-7
Figure A-3: T3_1/T4_1 and T3_2/T4_2 connectors pin identification............................A-8
Figure A-4: ETHERNET connectors pin identification ...................................................A-9
Figure A-5: POWER input power connector pin functions...........................................A-10
Figure A-6: PIM2_21 E1 connectors pin identification.................................................A-10
Figure A-7: PIM2_63 typical pair connectors pin identification ....................................A-14
Figure A-8: 10/100BaseT connectors pin identification ...............................................A-17
Figure A-9: DC input power connectors pin functions .................................................A-19
Figure A-10: SHELF alarm connectors pin identification .............................................A-19
Figure A-11: ALARM IN/OUT connector pin identification...........................................A-21
Figure A-12: xRAP-100 shelf DC input power connectors pin functions .....................A-25
In this chapter:
Overview ........................................................................................................... xi
Intended Audience............................................................................................. xi
Document Organization.................................................................................... xii
Document Conventions .................................................................................... xii
Related Documentation ................................................................................... xiii
Obtaining Technical Documentation............................................................... xiii
Technical Assistance ....................................................................................... xiv
Overview
®
The XDM -300 Installation and Maintenance Manual (IMM) describes how to
set up, configure, and install XDM-300 shelves and their components and
accessories.
The manual also provides task-oriented instructions for indications,
troubleshooting hardware-related problems, and replacing hardware
components (cards, modules, accessories).
Intended Audience
This manual is intended for installation and other qualified service personnel
responsible for installing the system and its accessories.
The instructions require you to understand and follow the safety practices
included here, as well as any applicable national regulations and those enforced
at your site. They also require that you understand the physical, optical, and
electrical requirements of the installation site.
Document Organization
This manual contains the following information:
| Installation
| Maintenance
| Additional functionality
Document Conventions
When applicable, this manual uses the following conventions.
Related Documentation
The following publications may be of assistance to you in the installation and
commissioning processes. Some of these documents present information
supplied in this installation manual in greater or lesser detail.
| XDM Converged MSPP and All-Range™ ROADM General Description
| XDM Small Shelves Reference Manual
| XDM System Specifications
| EMS-XDM (Element Management System) User Manual
®
| LightSoft (Network Management System) User Manual
| IEC Publication 825 – Laser Safety Requirements
Obtaining Technical
Documentation
To obtain technical documentation related to the XDM-300 or any other ECI
Telecom product, please contact:
ECI Telecom Ltd.
Transport Networking Division
Documentation Department
30 Hasivim St.
Petach Tikva 49130
Israel
Fax: +972-3-9268060
Email: on.documentation@ecitele.com
Technical Assistance
The configuration, installation, and operation of the XDM-300 and its
operation in a network are highly specialized processes. Due to the different
nature of each installation, some planning aspects may not be covered in this
manual.
If you have questions or concerns about your network design or if you require
installation personnel to perform the actual installation process, ECI Telecom
maintains a staff of design engineers and highly trained field service personnel.
The services of this group are available to customers at any time.
If you are interested in obtaining design assistance or a network installation
plan from ECI Telecom's Customer Support team, contact your ECI Telecom
sales representative. With any support related issues, technical or logistic,
please contact the ECI Telecom Customer Support center at your location. If
you are not familiar with that location, please contact our central customer
support center action line at:
Telephone +972-3-9266000
Telefax +972-3-9266370
Email on.support@ecitele.com
In this chapter:
XDM-300 Platform Overview......................................................................... 1-1
XDM-300 I/O Protection Options ................................................................... 1-2
XDM-300 Shelf with CWDM Networking Capabilities ................................. 1-7
For a detailed description of the XDM-300 platform, see the XDM Converged
MSPP and All-Range™ ROADM General Description.
Each TPM is connected to both operating and protection I/O modules in the
shelf in a 1:1, 1:2, or 1:3 configuration. If a failure is detected in one of the
operating I/O modules, the active MXC via the TC module in the TPU switches
the traffic from the active I/O module to the protection module.
The following figures show several options for installing TPUs with the
XDM-300 shelf.
Similar I/O protection options are supported for XDM-300 shelves installed in
a vertical position.
A typical XDM-300 shelf with an OCU (and two TPUs) is shown in the
following figure.
In this chapter:
Overview ......................................................................................................... 2-1
Outline of Installation Procedure..................................................................... 2-1
Site Preparation................................................................................................ 2-4
Tools and Test Equipment ............................................................................... 2-6
Installing the XDM-300 in Racks.................................................................... 2-7
Preparing Cables and Fibers .......................................................................... 2-14
Work and Equipment Safety.......................................................................... 2-20
Data Cables for EISMBs, DIOMs, and MCSMs ........................................... 2-28
Protection Against ESD................................................................................. 2-30
Overview
This chapter contains important information to help you carry out safe and
trouble-free installation.
11. Install the ECU300/ECU300-F, FCU300, MXC300, and I/O cards in the
shelf (see "Installing XDM-300 Cards" on page 3-53).
12. Install the prescribed I/O modules in the shelf.
13. If applicable, install the TC card and the prescribed TPMs in the TPU.
15. Connect management cables between the equipment installed in the rack
and the management station.
16. Connect power and alarm monitoring cables from the RAP panels to each
XDM-300 installed in the rack, as described in Connecting Power Cables
(on page 3-86) and Connecting Alarm Cables (on page 3-87).
NOTE: In some cases, you may need to add a TPU after the
XDM-300 has already been installed. Instructions for this
procedure are provided in Attaching TPUs/OCU to the
XDM-300 shelf (on page 3-120).
Site Preparation
Perform a preliminary survey of the installation site, taking into consideration
the following issues:
| System environmental requirements
| Physical location of the XDM-300 shelves
| Location of power sources
| Types of interfaces used at the site (optical, electrical, management, alarm
monitoring, and so on)
| Work and equipment safety requirements
Environmental Requirements
The following environmental conditions must be provided at the installation
site:
Parameter Compliance requirements
Electromagnetic interference FTZ 1TR9, EN 55022/94, EN 50082-1/92
Temperature ETSI ETS 300-19-2-3 Test Spec. T3.1
Physical Location
Choose the physical location of the XDM-300 shelves, taking the following
aspects into consideration:
1. Equipment dimensions, as specified in the following table.
2. Required floor loading capability: 150 kg per rack for a typical 4-shelf
installation.
3. Routing requirements for grounding, power, alarm monitoring, and
management cables, and optical fibers. To ensure convenient access to
cables and fibers, it is recommended to use overhead cable ladders
whenever possible, to bring the cables/fibers to the top of each rack.
Power Sources
XDM-300 shelves must be powered only by DC sources complying with the
applicable sections of ETSI 300 132-2 and FTZ 19S1, and the SELV or TNV
requirements of EN 60950. The nominal supply voltage is -48 VDC or
-60 VDC (positive lead grounded); however, the allowed supply voltage range
is -40 VDC to -75 VDC. For redundancy, two separate DC power sources
should be available.
The power consumption of the XDM-300 is:
| Typical: 1100 W
| Maximum: 1600 W
Environmental Considerations
Observe the following guidelines when installing the XDM-300 in racks:
1. Free airflow through the rack must be guaranteed at all times.
2. XDM-300 shelves can be installed in open or closed (with door) racks.
When installed in a closed rack, the door must be perforated. An example
of a rack with a perforated door is the ETSI A rack shown in the following
figure.
3. Always install the first XDM-300 shelf in the lower part of the rack,
leaving a space of at least 1U from the bottom of the rack.
4. In mixed (horizontal and vertical airflow) equipment installations, always
install the equipment with the horizontal airflow (for example, XDM-300)
in the lower part of the rack, and the equipment with the vertical airflow
(for example, XDM-1000) above it.
5. Leave a space of at least 1U between the upper accessory of the XDM-300
and the next shelf.
6. Leave as much space as possible between the rack’s cable supports and the
XDM-300 sidewalls.
7. Always consider the shelf airflow requirements when organizing the cable
and fiber routes near the XDM-300 sidewalls.
| Fiber Storage Tray (FST). A separate FST can be installed above each
XDM-300 with optical modules. Each FST contains two storage reels,
enabling the fiber to be stored on the right or left side of the tray. Leave at
least 50 mm free space between the XDM-300 cabling accessories and its
FST, and another 50 mm free between the FST and the next XDM-300
shelf.
| Cable guide. Two units should be installed, one just above the XDM-300
and one under it, to help neatly route the cables connected to the shelf.
| Two fiber guides, installed one above the upper cable guide and one under
the lower cable guide. Helps to neatly route fibers, while keeping the
minimum allowed bend radius.
| Cable slack tray. One unit should be installed under the lower fiber guide,
to help organize the slacks of cables connected to the lower module cage
and lower TPU.
| xDDF-21 (optional). A separate xDDF-21 panel can be used when
unbalanced 75 Ω interfaces need to be connected and converted to balanced
120 Ω interfaces of PIM2_21 and PIM2_63/B modules. Leave at least
100 mm free space above the XDM-300 shelf and below the xDDF-21.
Figure 2-3: Typical installation of XDM-300 and XDM-100 shelves in an ETSI A rack
Grounding Cables
Rack equipment is bonded through the screws that fasten the equipment chassis
to the frame of the rack. Therefore, it is necessary to provide a reliable
low-impedance connection between the rack frame and the site grounding bus
using copper conductors.
Connect the rack grounding screw and the site grounding bar with a 2 AWG
(35 mm2) or thicker copper lead with green/yellow insulation, in compliance
with UL/ETSI recommendations. The RAP end of the lead must be terminated
in an M6 lug suitable for the gauge of the lead in use.
Route grounding conductors along the shortest possible route. Treat the bare
portion of the conductor with antioxidant and connect a listed two-hole
compression lug. If the lug is not plated, bring it to a bright finish and coat it
with antioxidant before connecting it to the rack frame. Do not mix conductors
of different types of metal.
DC Power Cables
Alarm Cables
Alarm cables used are included in the shipment according to the site
specifications. Alarm indications are carried by the following cables:
| Shelf alarm indication cable. One shelf alarm indication cable is required
for each XDM-300 shelf installed in the rack. One end of the cable is
always connected to the ALARMS connector on the ECU300/ECU300-F
card. Connection of the other end depends on the cable type, as follows:
xRAP-100 alarm cable. Connects to one of the SHELF connectors on
the xRAP-100.
xRAP-B alarm cable. Connects to one of the SHELF connectors on the
xRAP-B.
Client alarm cable. Connects to the client's alarm collecting facility.
| Bay alarm cable. One bay alarm cable is required for each rack. This cable
carries the alarm indications and monitoring lines of the bay (rack). One
end of the cable is connected to the RAP, the other end is open and
connects to the client's alarm collecting facility. Two types of this cable are
available:
xRAP-100 bay alarm cable. Connects to the ALARM IN/OUT
connector on the xRAP-100.
xRAP-B bay alarm cable. Connects to the ALARMS connector on the
xRAP-B.
Management Cables
Out-of-band management communication is connected to an XDM-300 by
means of a minihub with a pair of the RJ-45 Ethernet connectors located on the
ECU300-F and ECU300 cards.
If one XDM-300 is installed, the connection is made to the management MAIN
RJ-45 connector. If more than one XDM-300 is installed in the same site, it is
possible to save the use of an external hub. In this case, the first system is
connected as explained above, and the other systems are connected in an
Ethernet daisy chain. The management MAIN connector of each system is
connected to the management PROT/LCT connector of the previous system.
Suitable standard Ethernet station cables are available from many sources.
Cables of Category 3 or better must be used. The length of the cables must not
exceed the maximum recommended for the cable type and hub port in use (up
to a few dozen meters).
If the site timing reference distribution subsystem has unbalanced (75 Ω) G.703
interfaces, a 120 Ω/75 Ω adapter can be supplied for mounting on the
T3_1/T4_1 and T3_2/T4_2 connectors. This permits using coaxial cables
(BT3002 or equivalent) of the same type used for connecting to balanced E1
tributary interfaces.
1
SIM1_8 configured as STM-1 electrical module with ETR-1 electrical SFP transceivers.
When a TPU is used, additional patch traffic cables between PIMs and TPMs
are required, as described in the following table.
Table 2-4: Patch traffic cables connecting I/O modules to the TPU
Optical Fibers
Optical fibers can be prepared on site.
Use only 2 mm optical fibers to connect to optical interfaces. For each optical
interface, ECI Telecom supplies patch cords with mating optical connectors
already attached to the fiber. Therefore, only the optical termination on the
ODF side, which is installation-dependent, must be installed on site.
The optical fibers should enter the rack from the top, be threaded through cable
guides running along the rack side rails, and end at the FST. The tray must
contain enough fiber length for extracting modules from the XDM-300 and for
replacing fiber in case of damage (splicing repairs). When routing fibers, make
sure to observe the minimum bending radius (35 mm).
The following table lists the type of fibers and mating connectors needed to
prepare fibers for each XDM-300 module/card.
2
SIM1_8 configured as STM-1 optical module with OTR-1 optical SFP transceivers.
XDM-300 shelves contain power sources of varying voltages. Take note of the
following guidelines for installing the shelves.
Grounding Requirements
All the equipment, including XDM-300 shelves, ancillary units, and equipment
from other vendors, must be properly grounded at all times. Good equipment
grounding is necessary to protect personnel and equipment, minimize noise,
and allow the discharge of accumulated static charges to earth.
AC power DC power
cable cable Equipment rack
Phase
~ –
AC IN DC OUT Grounded
Neutral Power RAP
0 + chassis
supply
Ground
CGND
+ –
CGND CGND
Battery XDM
bank
equipment
The rack mounting rails must be free of paint, and provide electrical continuity
to the main grounding bolt. The resistance between any rail and the rack main
grounding bolt must be less than 0.1 Ω.
Pay particular attention to the area in which the RAP is attached; remove paint
from the rack in this area to ensure efficient electrical contact.
Identification of CE listing
XDM-300 shelves are CE-listed. The following is a typical CE label for
XDM-300 shelves.
Laser classification
The equipment and components with laser devices described in this manual
comply with the International Electrotechnical Commission (IEC) safety
standards, including IEC-60825-1 – Safety of Laser Products and IEC-825 –
Safety of Optical Fiber Communication Systems.
With specific regard to the laser, XDM-300 equipment complies with laser
product performance standards set by government agencies for Class 1 laser
products. The product and its accessories do not emit hazardous light, and the
beam is totally enclosed during all operating modes and maintenance.
LASER KLASSE1
CLASS 1 LASER PRODUCT
HAZARD CLASS 1M
LASER RADIATION
WHEN OPEN AVOIO
EXPOSURE TO THE BEAM
Laser information
Information regarding the various optical modules available for the XDM-300
platform is provided in the following tables.
Table 2-9: EISMB Ethernet electrical cables and mating connector data
Table 2-11: DIOM Ethernet electrical cables and mating connector data
The following table lists the type of Ethernet electrical traffic cables and the
mating connectors needed for the MCSM module.
Table 2-13: MCSM Ethernet electrical cables and mating connector data
Personnel Training
During production and assembly, equipment is handled in workspaces
especially prepared and certified to serve as a permanent EPA. However, in
many cases the environment in which the same equipment is installed or
maintained cannot be assumed to form an EPA with a permanently controlled
boundary. Therefore, all the work involving handling of unprotected ESDs
must be considered as field work.
Field work in this context includes such activities as service and maintenance,
installation, site inspections, and commissioning of components and assemblies
classified as ESDs, together with associated packing and unpacking activities.
All the staff involved in field work must be trained to perform field work in the
same way as work performed in permanent EPAs with respect to the material
quality, personal responsibilities, training, labeling, and packing.
In this chapter:
Overview ......................................................................................................... 3-1
Unpacking and Performing Visual Inspection................................................. 3-9
Installation Options........................................................................................ 3-10
Installing Ancillary Units in Racks................................................................ 3-16
Installing the Shelf in the Rack...................................................................... 3-41
Grounding the XDM-300 Shelf ..................................................................... 3-52
Installing XDM-300 Cards ............................................................................ 3-53
Installing XDM-300 Modules ....................................................................... 3-60
Installing TPU Modules................................................................................. 3-69
XDM-300 Accessories .................................................................................. 3-77
Connecting Fibers and Cables in ETSI A Racks ........................................... 3-85
Attaching TPUs/OCU to the XDM-300 Shelf............................................. 3-120
Overview
This chapter provides general instructions for the installation of the XDM-300
and auxiliary equipment.
The procedures for equipment replacement and upgrades are similar to those
described for installation of the equipment, and when relevant, notes regarding
live replacement or upgrade are inserted in these procedures.
The information appearing in this chapter should be used in conjunction with
specific site installation plans in the particular customer network. If you are
interested in obtaining design or installation assistance from ECI Telecom
Transport Networking Division’s Customer Support team, or wish to prepare a
network installation plan, contact your ECI Telecom sales representative.
The XDM-300 shelf, cards, modules, and ancillary equipment are described in
the XDM-300 Reference Manual.
Preliminary Preparations
The installation procedures provided in this chapter assume that:
| The sites at which the installation procedures are carried out comply with
the requirements listed in Site Preparation (on page 2-4).
| The preliminary preparations specified in Before You Start (on page 2-1)
have been completed.
Before you start, determine what equipment is to be installed in the rack by
referring to the site installation plan, and note the exact position of each unit (to
avoid errors, it is recommended that you mark the prescribed positions on the
rack rails using a soft pencil).
NOTE:
If you are not installing an FST for a particular XDM-300
shelf, it is recommended that you leave empty space in the
rack in case optical modules are added to the shelf in the
future.
If you are not installing a TPU for a particular XDM-300
shelf, it is recommended that you leave empty space in the
rack so that the protection unit can be added in the future,
if required, without interrupting operation.
CAUTION:
If additional equipment is used in the rack, a heat buffer or
a buffer plate must be installed between any such
additional equipment and the XDM-300 shelf to minimize
the transfer of heat from shelf to shelf. This heat buffer
must be purchased from ECI Telecom.
During the installation of equipment in the rack, make
sure all the optical connectors are closed by protective
caps. Do not remove the cap until an optical fiber is
connected to the corresponding connector.
11. Route and connect all cables and fibers Connecting Fibers and Cables in
for ETSI A racks, including: ETSI A Racks (on page 3-85)
| Power and alarm cables
| Optical fibers to optical modules
transceivers
Electrical interface cables to electrical
modules (includes installation of the
optional xDDF-21 channel patch panel)
| Electrical traffic through the TPU
| Data cables to EISMB/MCSM/DIOM
modules
| Timing cables
| Management cables
12. In some cases, it may be necessary to Installing a TPU on the
connect a TPU unit to an existing XDM-300 Shelf
XDM-300 shelf.
3. Search the shipping boxes for any additional small items that may be
present.
4. Open each of the module and card packages for inspection, but do not
remove the modules/cards from their individual protective packages until
they can be inserted in the shelf.
5. Check the contents of the shipping boxes against the packing list attached
to each box. If damaged parts are detected or if any parts are missing,
notify the project manager and your local ECI Telecom representative.
Installation Options
XDM-300 shelves can be installed in ETSI A racks or a 19" 600 mm deep
racks (in consultation with and approved by ECI Telecom's Mechanical
Department). These racks can be installed on wooden, concrete, or suspended
floors, or suspended from overhead mountings.
The XDM-300 can be installed in the rack in an horizontal or vertical position.
In addition, the XDM-300 can be expanded with one or two TPUs and an
OCU. Different brackets and mechanical adapters are available for attaching
the XDM-300 to the rack in each of these positions.
Figure 3-6: Typical horizontal installation of three XDM-300 shelves with TPUs in
2600 mm ETSI A racks
The DC input power cables connect between the two DC power sources and the
xRAP-B source A and source B inputs. Two cables are required, one for each
source.
2. Open the two captive screws fastening the xRAP-B front cover and remove
the cover.
3. Identify the various terminals located on the power source terminal board in
accordance with the following figure. This figure shows the terminals at the
source A side; the same board is used at the source B side.
4. Bring the two leads of one DC source input power cable to the appropriate
xRAP-B opening.
5. Attach the lug of the red lead to the positive stud terminal marked (+) on
the power terminal board.
6. Secure the lug using a flat washer, a spring washer, and a nut. Tighten the
nut with a torque of 450 N cm to 550 N cm.
7. Attach the lug of the black lead to the negative stud terminal marked (-) on
the power terminal board.
8. Repeat Step 6 for the black lead lug.
2. Insert the end of the DC power cable terminating with a 5-pin D-type male
connector near the SOURCE A power connectors and connect it to
connector Shelf 1 (see above figure).
3. Fasten the screws of the D-type connector.
4. If you are connecting an additional shelf to the xRAP-B, repeat the above
steps for the shelf.
5. If an additional power source is used, repeat the above steps to connect the
shelves to source B.
6. Route the DC power cables towards the cable retainers at the rear of the
xRAP-B, and attach them to the retainers with cable ties (see Location of
xRAP-B grounding stud (on page 3-19)).
7. Route each shelf power cable along the rack side rails down to the
corresponding shelf position, then securely attach the power cable to the
rack inner wall using cable ties. Attach a tag to each power connector in
accordance with its function.
3. Insert the circuit breaker into the circuit breaker sockets located on the
xRAP-B source A power terminal board, as shown in the previous figure.
4. If an additional shelf is powered from source A, repeat Steps 2 and 3 to
insert the other circuit breaker into the corresponding shelf position of the
power terminal board.
If an additional power source is used, repeat Steps 2, 3, and 4 for source B
circuit breakers.
4. Make sure the voltage is within the allowed range (-40 VDC to -75 VDC),
and that it has the correct polarity.
5. Return all xRAP-B circuit breakers to OFF.
6. Disconnect the xRAP-B input power sources.
7. Reinstall the xRAP-B front cover and fasten it using the two captive
screws.
The DC input power cables connect between the two DC power sources and the
xRAP-100 source A and source B inputs. Two cables are required, one for each
source.
Grounding stud
2. Open the two captive screws fastening the xRAP-100 front cover and
remove the cover.
3. Identify the various terminals located on the power source terminal board in
accordance with the following figure. This figure shows the terminals at the
source A side; the same board is used at the source B side.
4. Bring the two leads of one DC source input power cable to the appropriate
xRAP-100 opening.
5. Attach the lug of the red lead to the positive stud terminal marked (+) on
the power terminal board.
6. Secure the lug using a flat washer, a spring washer, and a nut. Tighten the
nut with a torque of 450 N cm to 550 N cm.
7. Attach the lug of the black lead to the negative stud terminal marked (-) on
the power terminal board.
8. Repeat Step 6 for the black lead lug.
9. If an additional power source (source B) is used, repeat Steps 3 to 8 for
source B.
10. Route the DC input power cables towards the cable support bracket at the
rear of the xRAP-100 (see Location of xRAP-100 grounding stud (on page
3-26)), and attach them to the bracket with cable ties.
2. Insert the end of the DC power cable terminating with a 3-pin D-type male
connector near the SOURCE A power connectors and connect it to
connector SHELF 1 (see above figure).
3. Insert the circuit breaker into the circuit breaker sockets located on the
xRAP-100 source A power terminal board, as shown in the previous figure.
4. If more than one shelf is powered from source A, repeat Steps 2 and 3 to
insert the other circuit breaker into the corresponding shelf position of the
power terminal board.
5. If an additional power source is used, repeat Steps 2, 3, and 4 for source B
circuit breakers.
5. Route the alarm cables along the side of the rack down to the corresponding
shelf position. Attach a tag to each connector in accordance with its
function.
6. If an additional shelf is installed in the rack, repeat Steps 2, 3, 4, and 5 for
the cables serving the additional shelf. Make sure to attach identification
tags to each cable end.
NOTE: The FST has two opening positions. The tray latches
with a click at the halfway position. Pull it again to open it
fully so that you can thread the fibers.
6. Thread the fibers into the FST, as illustrated in the following figure.
The ODF is supplied with two sets of rack mount brackets: one for 19 in. and
ETSI racks, and the other for 23 in. 7 foot bay racks. The 19 in./ETSI rack
mount brackets can be used for both ETSI A and ETSI B racks.
2. Attach each bracket to the corresponding ODF side panel with three
screws, as shown in the following figure.
2. Hold the end of the swing-out tray and pull it out to gain access to the ODF
components.
3. Open the two cover thumb nuts and remove the protective cover from the
ODF splice support.
4. Insert the external fibers cable through the protective tube.
5. Route the fiber ends through the cable guides to the splice support area.
6. Identify the adapter panel pigtail to be spliced to each user fiber.
7. Insert splicing sleeves over the pigtail, splice the user fiber to the pigtail,
and slide the splicing sleeve over the splice.
8. Place the splicing sleeve in one of the slots in the splice support.
9. After splicing all the fibers, reinstall the protective cover removed in Step
3.
10. Push the swing-out tray back into the unit.
11. Close the ODF front cover by pushing it up till it clicks to the unit.
12. Refer to Attaching rack mount brackets (on page 3-36) and secure the user
fibers with cable ties to the fiber fastening bracket at the rear of the ODF.
NOTE: The OPP has two opening positions. The tray latches
with a click at the halfway position. Pull it again to open it
fully so that you can thread the fibers.
6. Thread the fibers into the OPP, as illustrated in Threading and connecting
optical fibers in the OPP (on page 3-40).
7. Identify the duplex connector position on the duplex connectors panel (on
page 3-40).
8. Connect each equipment fiber to the corresponding network fiber according
to the site cabling diagram and the detailed cabling diagrams or tables of
each shelf.
9. Run the fibers up to the level of the corresponding optical connector.
10. Return the OPP to the rack until it latches in place with a click.
3. Fasten the lower bracket to the shelf with 11 screws from the installation
kit.
2. Insert the filter frame pin guides into the corresponding holes in the frame
support.
3. Attach the frame support to the filter frame.
3. Attach the filter frame to the shelf and fasten it with four screws from the
installation kit.
4. Fasten the upper bracket to the shelf with seven screws and washers from
the installation kit.
2. Lower the filter frame screws to their very lowest position, to bring the
filter guides in front of the opening in the lower bracket.
The following figure shows the filter frame in the lower position.
CAUTION:
If you feel resistance when inserting cards, immediately
retract the card and repeat the process.
Do not use excessive torque when tightening the fastening
card screws.
FCU300 Card
The FCU300 card is installed in the rightmost vertical slot of the XDM-300.
ECU300 Card
The ECU300 card is installed in the bottom horizontal slot of the card cage.
Installation is identical for the ECU300-F and ECU300 cards.
4. Insert the rear end of the ECU300/ECU300-F into the card guides.
5. Push the ECU300/ECU300-F in until it mates the chassis connectors and
the front of the card is flush with the front of the XDM-300 shelf. If you
feel resistance before the connectors are mated, pull the card out and repeat
the procedure.
6. Secure the ECU300/ECU300-F in place by tightening the two captive
screws.
MXC300 Card
The XDM-300 shelf always operates as redundant platforms, therefore each
shelf must be equipped with two MXC300 cards installed, one in slot MXC-A
(main card) and one in slot MXC-B (protection card).
c. Orient the NVM card against the dedicated slot on the MXC300, and
then insert its rear end (the end with the connector) in the card guides.
Push the card in until it is locked in place.
d. Place the NVM cover on the slot, and fasten it with its two captive
screws.
8. Push the front panel of the MXC300 in until the extractor handles start to
move inside, the card mates the chassis connectors, and the front of the card
is flush with the front of the shelf. If you feel resistance before the
connectors are mated, pull the card out and repeat the procedure.
9. Turn the two extractor handles simultaneously to the horizontal position to
lock the card in place.
10. Secure the MXC300 in place by tightening the two captive screws.
WARNING:
To reset the system using the RESET button, you must
first remove the NVM cover.
To extract the NVM, press the release pushbutton using
the cover as a tool.
4. Push both brown levers, located on the card's extractor handles, to release
the handles.
5. Insert the rear end of the quad I/O card into the card guides.
6. Push the card in until it mates the chassis connectors and the front of the
card is flush with the front of the XDM-300 shelf. If you feel resistance
before the connectors are mated, pull the card out and repeat the procedure.
7. Press both handles simultaneously to lock the card in place.
8. Secure the quad I/O card in place by tightening the two captive screws.
9. Install the SFP/XFP transceivers according to Installing SFP/XFP
transceivers in optical/CWDM modules and cards (on page 3-65).
CAUTION:
When installing optical modules, make sure all SFP
transceiver slots are closed by protective caps. Do not
remove the cover until an SFP is inserted.
For your safety, to comply with electro-magnetic
compatibility (EMC) requirements and to prevent escape
of ventilation from the fans through these openings,
protect all unused slots with blank panels.
6. Fasten the module to the chassis by tightening the two fastening screws. Do
not use excessive torque when tightening the screws.
7. If you are installing an optical, CWDM, or mixed module with SFP
transceivers, proceed to Installing SFP/XFP transceivers in optical/CWDM
modules and cards (on page 3-65).
After inserting all the modules, check for correct installation against the
module insertion diagram. Install blank panels over all free slots.
7. Fasten the module to the adapter by tightening the two fastening screws. Do
not use excessive torque when tightening the screws.
8. Install the SFP transceiver according to Installing SFP/XFP transceivers in
optical/CWDM modules and cards (on page 3-65).
CAUTION: All slots that are not in use must remain covered.
If you have to replace a module or card, remove the SFP/XFP
first.
Because the PIM 2_63s and MCSMs occupy a pair of slots each, before you
can install them you must first remove the guide between the pair of slots.
6. Fasten the module to the chassis by tightening the two fastening screws.
7. If you are installing MCSMs with SFP transceivers, proceed to Installing
SFP/XFP transceivers in optical/CWDM modules and cards (on page 3-65).
8. After inserting all the modules, check for correct installation against the
module insertion diagram. Install blank panels over all free slots.
5. Push the module in until it mates the chassis connectors and the front of the
module is flush with the front of the XDM-300 shelf. Make sure the two
fastening screws are free to move backward as the TC/TCF module slides
in. If you feel resistance before the connectors are mated, pull the module
out and repeat the procedure.
6. Fasten the module to the chassis by tightening the two fastening screws.
XDM-300 Accessories
ECI Telecom offers accessories for efficient and optimal installation of
equipment in racks. This section describes the main types of accessories. If you
need custom modification to standard items, contact ECI Telecom’s Transport
Networking Division support team or your ECI Telecom sales representative.
xRAP-B
The xRAP-B is a power distribution and alarm panel for XDM shelves installed
in racks. The xRAP-B performs the following main functions:
| Power distribution for one or two XDM-300 shelves. The nominal DC
power voltage is -48 VDC or -60 VDC. Since XDM-300 shelves can use
redundant power sources, the xRAP-B supports connection to two separate
DC power circuits. The internal circuits of the xRAP-B are powered
whenever at least one power source is connected. The presence of DC
power within the xRAP-B is indicated by a POWER ON indicator.
The xRAP-B has two 5-pin DC output connectors for supplying power to
any shelf in the XDM-1000 or XDM-100 family of products. The
maximum power that can be supplied to each XDM shelf is up to 2250 W,
in accordance with the shelf type and version.
| Bay alarm indications. The xRAP-B includes four alarm indicators, one
for each alarm severity. When alarms of different severities are received
simultaneously, the corresponding alarm indications light simultaneously.
A buzzer is activated whenever a Major or Critical alarm is present in
XDM-300 shelves installed in the rack.
The following figure shows the front panel of the xRAP-B, and the table lists
the functions of the front panel components corresponding to the figure callout
numbers.
The xRAP-B connectors are located on its circuit board as shown in the
following figure. The table lists the connector functions. The index numbers in
the table correspond to those in the figure.
xRAP-100
The xRAP-100 is a power distribution and alarm panel for XDM shelves
installed in racks. The xRAP-100 performs the following main functions:
| Power distribution for up to four XDM-100 shelves or three XDM-100
and one XDM-1000 shelves. The nominal DC power voltage is -48 VDC
or -60 VDC. Since XDM shelves can use redundant power sources, the
xRAP-100 supports connection to two separate DC power circuits. The
internal circuits of the xRAP-100 are powered whenever at least one power
source is connected. The presence of DC power within the xRAP-100 is
indicated by a POWER ON indicator.
The xRAP-100 has a 3-pin DC output connector, for supplying power to
the XDM-300 shelf.
3
Alarm input lines arrive through the ALARMS connector and are connected to the corresponding SHELF
connector.
| Bay alarm indications. The xRAP-100 includes four alarm indicators, one
for each alarm severity. When alarms of different severities are received
simultaneously, all the corresponding alarm indicators light.
A buzzer is activated whenever a Major or Critical alarm is present in
XDM shelves connected to the xRAP-100.
xRAP-100
SOURCE A SOURCE B
1 2 3 4 5 6 7 8
The external connectors of the xRAP-100 are shown in the following figure.
The following table lists the connector functions. The connector pin assignment
is provided in Connectors Pin Assignment (on page A-1).
Table 3-8: xRAP-100 connector functions
4
The number of supported shelves depends on their total power consumption.
5
The same type of circuit breaker is used in all xRAP versions. The value of the circuit breaker is defined by the
power consumption requirements of the shelf and not by the type of xRAP.
6
Only one of the four supported shelves can be a large (XDM-1000 or XDM-2000) shelf.
7
Critical, Major, Warning, and Minor alarms toward the customer central monitoring system.
8
External Alarms input via Opto coupler.
9
External Alarms output via dry contacts.
1. Connect the connector at the end of the power cable to the POWER
connector of the MXC300 in slot MXC-A, and fasten it with its two screws.
2. Grasp the connector at the other end of the power cable, and thread it
through the opening in the left bracket of the XDM-300 shelf.
3. Repeat steps 1 and 2 for the second power cable to be connected to the
corresponding MXC300 in slot MXC-B.
4. Bend the cables and thread them through the side cable guides of the rack.
Pull the cables until the cable connectors are positioned against the
appropriate connectors on the RAP.
5. Use cable ties as required to fasten the cable to the rack side rails.
6. Connect the free ends of the power cables in accordance with the rack
installation plan and the cable tags to the DC power connectors on the
RAP.
NOTE: The FST has two opening positions. The tray latches
with a click at the halfway position. If you cannot release the
fiber in the halfway position, pull the tray again to open it
fully.
3. Insert the end of the fiber in the appropriate slot of the conduit running
along the front support of the rack, and route it to the appropriate level.
4. At the desired level lead the end through the appropriate slot of the conduit,
and pass the fiber through one of the slots in the fiber guide.
5. Bring the end of the fiber to the LC connector on the designated
module/card. Leave some slack to prevent stress.
6. Thoroughly clean the connectors of the optical fibers, using an approved
cleaning kit.
7. Remove the cover from the module/card connector, and connect the fiber
connector to the module/card connector.
8. Repeat Steps 2 through 7 for all optical modules/cards in the XDM-300
shelf.
9. When you have finished connecting all the optical modules/cards, gently
push the FST back into the rack until it clicks into place.
5. Use a cabling diagram of the site to associate module connectors with the
appropriate DDF connections. Cut excess cable length if necessary.
6. Connect the cable connector to the corresponding module.
7. Secure the cable connector to the module connector with the two cable
connector screws. Tighten the screws manually; if the screws cannot be
reached with your bare hand, use an adjustable-torque flatblade screwdriver
(maximum blade size 0.6). Set the tightening torque to 40 N cm to 44 N
cm.
Each TPM is dedicated for protection of a specific traffic rate and protection
scheme. The TPM name designates the protected traffic rate and the protection
scheme, as follows:
| The first digit after the name designates the traffic rate.
| The last digit after the underscore designates the protection scheme.
For example, the TPM2_3 is a module for 2 Mbps traffic, and supports a
protection scheme of 1:3.
Similarly TPMH_1 is a module for High rate traffic (including 34/45 Mbps and
155 Mbps), and a protection scheme of 1:1.
The following table summarizes the available TPMs, the type of I/O modules
they protect, the traffic rate, and the protection scheme.
The following table shows the slot association for 1:1 protection scheme in the
XDM-300.
Table 3-11: XDM-300 1:1 I/O protection
The following table shows the slot association for 1:2 protection scheme in the
XDM-300.
Table 3-12: XDM-300 1:2 I/O protection
The following table shows the slot association for 1:3 protection scheme in the
XDM-300.
The following figure shows connection to 252 E1s with 1:2 protection. Six
PIM2_63 modules are connected in the XDM-300 shelf protected by two
TPM2_63_2 modules in the TPUs.
Tool Kit
ECI Telecom offers a tool kit to facilitate extraction/insertion of connectors and
optical SFP transceivers connected to ports in very high density cabling
environments.
The tool kit is packed in a compact box and enables the technical staff to
handle installation and maintenance activities in a quick and efficient fashion,
without affecting traffic of a neighboring connector that should not be
removed.
The kit includes the following tools:
| RJ-45 extractor
| LC connector extraction/insertion and optical SFP extractor (all in the same
tool)
| DIN 1.0/2.3 (regular and small profile) connector extractor
| Pincers
2. Move extractor forward to attach the far groove to the module's handle.
2. Move extractor forward to attach the near groove to the module's handle.
To extract an LC connector:
1. Insert the fiber near the boot under the extractor's wide end tab.
2. Push the extractor straight forward and press its release tab onto the SFP's
clip, until it clicks over top of the clip.
4. Move the fiber backward till its connector is beyond the extractor's tab.
To insert an LC connector:
1. Insert the fiber near its boot, under the extractor's narrow end tab. Orient
connector's clip in front of the tool's teeth.
4. Gently pull the extractor back until its edge is beyond the boot.
3. Push the extractor forward to fit SFP's middle partition into extractor's edge
slot.
4. Move the extractor's teeth to the right (toward the SFP clip).
5. Pull the extractor slightly backward. Make sure that the clip is grasped and
moves with the tool.
6. Slide the lever forward to lock the SFP's clip, and press slightly.
Figure 3-86: Locking the clip between lever and extractor's teeth
7. With the clip locked, pull the extractor backward to rotate the clip by` 90°,
and release the SFP from its housing.
2. Push the extractor forward and attach the end tabs on the connector's step.
3. Pull the extractor with the connector backward and release the connector.
2. Pull the cable backward until the connector 's edge is stopped by the tab.
3. Push the extractor with the connector forward until it clicks into the SFP.
4. Gently pull the extractor backward and release it from the cable.
When you order an XDM-300 system with one or two TPUs, the shelf is
supplied with the TPUs installed and their fastening brackets attached to each
one. The same applies to OCU shelves.
If your XDM-300 shelf does not include TPU protection, it is possible to
upgrade your system and add one or two TPUs and an OCU at a later stage,
provided you have left space on the rack for this possibility. You need at least
150 mm space above/under the XDM-300 for each TPU/OCU.
The TPUs can be installed without disconnecting any of the XDM-300 cables
and fibers and without affecting traffic not going via a TPU.
6. Remove the H-connector from its protective packaging and install it on the
XDM-300 shelf.
9. Take two pin guides from the installation kit and screw them securely into
the TPU.
12. Insert the three long screws, supplied with the installation kit, into the
appropriate holes, as illustrated in the following figure, and secure the TPU
in place.
13. Insert the TC module in the TPU, as described in Installing the TC/TCF
Module in the TPU Shelf (on page 3-70).
14. Insert the TPMs in the TPU, as described in Installing Single-Slot TPMs in
the TPU (on page 3-71) and Installing Double-Slot TPMs in the TPU (on
page 3-73).
15. If the I/O modules to be protected by the TPU are already connected to
traffic cables, disconnect them.
16. Connect the TPMs to the relevant I/O modules, as described in Installing
TPU Modules (on page 3-69).
Figure 3-102: Installing the XDM-300 pin guides and removing the lower
connector cover
7. Open the two captive screws fastening the lower TPU connector cover to
the shelf. Remove the cover.
8. Identify the two threaded holes for the pin guides at the bottom of the shelf
(see the figure above).
9. Take two pin guides from the installation kit and screw them securely in
place.
10. Remove the H-connector from its protective packaging and install it on the
XDM-300 shelf (see installation of the H-connector in Inserting the TPU
connector onto the XDM-300 (on page 3-122)). Note that the connector
should be installed with the angled corner facing backwards.
11. Open the two screws securing the TPU connector cover (located at the back
right corner, on top of the TPU). Remove the cover.
12. Open the six screws securing the fastening bracket to the TPU shelf (keep
the screws handy). Remove the bracket.
13. Orient the TPU on a clean flat surface, upside down.
14. Place the TPU's fastening bracket (removed in step 12) on the TPU and
attach it with the six screws.
15. Open the two captive screws fastening the second connector cover to the
TPU. Remove the cover.
16. Take the jumper connector from the installation kit and insert it into the
connector house.
17. Fasten the jumper connector in place with three screws from the installation
kit.
18. Turn the TPU back to regular position.
19. Carefully lower the XDM-300 shelf onto the TPU, taking care that the pin
guides are inserted into the slots, as illustrated in the following figure.
20. Insert the three long screws supplied in the installation kit into the
appropriate holes, as illustrated in the following figure, and secure the TPU
in place.
5. Open the two screws securing the protective cover of the TPU/OCU
connector in place (located at the back right corner on the top of the first
TPU/OCU shelf, as shown in the following figure). Remove the cover.
Figure 3-106: Removing the connector cover and fastening bracket from the
first TPU/OCU
6. Open the six screws securing the fastening bracket to the first TPU/OCU
shelf installed on the expanded XDM-300 (see the previous figure).
7. Open the two screws fastening the bracket to the rack. Remove the bracket.
8. Orient the second TPU upside down, on a clean flat surface.
9. Identify the two threaded holes for the pin guides on the bottom of the
second TPU.
10. Take two pin guides from the installation kit and screw them securely into
the TPU.
11. Remove the H-connector from its protective packaging and install it on the
first TPU/OCU shelf, as shown in the following figure.
Figure 3-108: Inserting the TPU/OCU connector onto the first TPU/OCU in the
XDM-300
12. Carefully lower the second TPU/OCU onto the expanded XDM-300 (on the
first TPU/OCU shelf), taking care that the pin guides are inserted into the
slots as illustrated in the following figure.
Figure 3-109: Lowering the second TPU/OCU onto the expanded XDM-300
13. Insert the three long screws supplied in the installation kit into the
appropriate holes, as illustrated in the following figure, and secure the
second TPU/OCU in place.
Figure 3-110: Securing the second TPU/OCU onto the expanded XDM-300
In this chapter:
Overview ......................................................................................................... 4-1
Required Test Equipment, Tools, and Materials ............................................. 4-1
Preventive Maintenance .................................................................................. 4-2
Traffic Monitoring System .............................................................................. 4-7
Onsite Troubleshooting ................................................................................. 4-12
Replacing Cards and Modules ....................................................................... 4-20
Replacing RAP Components ......................................................................... 4-28
Overview
This chapter provides maintenance procedures for XDM-300 equipment.
Preventive Maintenance
The purpose of the preventive maintenance activities is to keep the XDM-300
hardware in good condition, and detect and correct as soon as possible any
condition that may lead to deterioration and equipment malfunction.
Record the execution of the various activities and their results according to the
procedures used in your organization.
3. Cold water rinse: Under normal service conditions, the foam media used
in the filters require no oily adhesives. Therefore, collected dust and dirt
can be washed away using a standard hose nozzle with plain water. Stand
the filter until completely dry and free of moisture, and return to service.
4. Immersion in warm soapy water: Where stubborn airborne dirt is present,
the filter may be dipped in a solution of warm water and mild detergent.
Then simply rinse in clear water, stand until completely dry and free of
moisture, and return to service.
The recommended method is No. 4, as it ensures thorough cleaning of all types
of contaminants under any reasonable service conditions.
NOTE: The air filter can be removed and reinstalled while the
XDM-300 shelf is in operation.
Principles of Operation
The XDM-300 incorporates a traffic monitoring system that enables rapid
allocation of major problems in the traffic passing through its aggregate and
I/O modules.
The XDM-300 monitoring system enables you to monitor traffic passing
through the I/O modules installed in slots I1 to I16 of the modules cages.
The main components of the monitoring system interface are located on the
ECU300-F front panel. These components, except for the monitoring point and
monitoring indicator, are common to all modules. In addition, the system has a
monitoring point and monitoring indicators on the front panel of the modules.
The PIM2_21, PIM2_63/B, and PIM345 have only one monitoring indicator
used for all their channels. STM-1 modules do not have a monitoring point, and
use the monitoring point on the ECU300-F card.
Selecting a module
The MODULE selector chooses the monitored module slot number. The
selected module is displayed on the 2-digit display to the right of the selector.
Pressing the selector upward increments the slot number; pressing it downward
decrements the slot number. The selection is cyclic. Possible selections are QA
(I17) and QB (I18) for the aggregate cards (I/O cards), and I1 to I16 for the I/O
modules. If the selected module is an STM-1, the MON indicator on the
ECU300-F lights.
Selecting a channel
The CHANNEL selector chooses the specific monitored channel (port) on the
module selected. The selected channel is displayed on the 2-digit display to the
left of the selector. Pressing the selector upward increments the channel
number; pressing it downward decrements the channel number. The selection is
cyclic. Possible selections are from 00 to the module's maximum number of
channels. For example, in a PIM2_21 (which has 21 ports), the selection goes
from 00 to 21. When the value 00 is selected, the system blocks the monitoring
to the selected module.
In addition to the number of the selected channel shown on the display, a MON
indicator lights near the selected port on the module. If an STM-1 module is
selected, the MON indicator on the ECU300-F lights in addition to the LED
near the selected port on the module.
Stabilization time
The monitoring system has a stabilization time of approximately 1.5 seconds.
This means that after a new value is selected with the MODULE or CHANNEL
selectors, the display starts blinking for the stabilization time, and only after
that the new selection is displayed.
Response to events
This section describes the response of the monitoring system to the following
events:
| Power-on
| Cold restart
| MXC300 switching to redundancy
| Warm restart
| ECU300-F extraction/insertion
After power-on, the monitoring system displays 17 00. This is the default state,
and indicates slot I17 and channel 00. Channel 00 is defined in the system as
idle state, and indicates that no channel was selected and that monitoring is
disabled. To enable the monitoring results, a module and a channel must be
selected.
The response of the system to MXC300 switching to redundancy is identical to
the response to cold restart.
Warm restart does not affect the traffic or monitoring of any modules in the
XDM-300.
After extracting/inserting the ECU300-F, the monitoring display is reset to the
default state 17 00, and the monitoring history stored in the ECU300-F's
memory is lost.
Monitoring options
The system can monitor a number of channels in different modules
simultaneously. This feature is useful when traffic passing through different
modules in the XDM-300 has to be analyzed.
After monitoring channels of different modules, all selected channel numbers
of these modules are saved in the ECU-F's memory.
You can connect test equipment to various modules or connect test equipment
with multiple inputs to simultaneously monitor the traffic passing through the
channels in these modules.
Onsite Troubleshooting
The purpose of onsite troubleshooting is to identify the hardware causing the
malfunction and return the equipment to normal operation as soon as possible.
Troubleshooting is usually initiated in response to one of the following
conditions:
| Alarm or performance degradation reported by the management station.
| Alarm or malfunction detected on site by maintenance personnel, either as
a result of a troubleshooting activity initiated by the management center
personnel or as a result of a periodic inspection or preventive maintenance
action. Many problems can be detected via the various indicators available
on the XDM-300 system components.
This chapter assumes familiarity with the XDM-300, with SDH, data, and
CWDM equipment, and with the LightSoft and EMS-XDM management
stations. Refer to the respective user manuals for details on the various
capabilities of the management stations, and for instructions on performing the
desired activities.
The following sections provide procedures for performing onsite
troubleshooting for various trouble categories, as well as for specific
subsystems, for example, OADMs, Mux/DeMux subsystems, and so on. For
each category, you will find a troubleshooting table that provides the
instructions for identifying the trouble.
Troubleshooting Management
Communication
When the management station cannot manage an XDM-300 shelf, use the
following table to identify the cause of the problem.
CAUTION:
Do not extract/insert an MXC300 while the DC cables are
connected to it.
If the FAIL (red), MAIN (blue), and TMU (orange) LEDs
blink simultaneously, the MXC300 is not mounted
correctly or not all four screws are properly locked.
Before attempting to remove the card, monitor its NVM
(yellow) indicator; remove the card only after this
indicator has been off for at least 2 minutes.
3. Open the MXC300 upper left screw first, then the upper right screw, and
then the two lower screws.
4. Hold both extractor handles and pull them simultaneously outward until the
card is released from the backplane.
5. Keep holding the handles, and gently pull the card out of the shelf.
6. If necessary, transfer the NVM from the replaced MXC300 card to its
replacement (see Replacing the NVM on MXC300 cards).
7. Insert the rear end of the replacement card into the corresponding card
guides.
8. Push the card’s front panel with both hands until the extractor handles
attach to the panel.
9. Push the card in by holding both handles and pushing them simultaneously
inward, until the card mates the chassis connectors and is locked in place. If
you feel resistance before the connectors are mated, pull the card out and
repeat the procedure.
10. Close the card’s upper left screws first, then the upper right screw, and then
the two lower screws.
NOTE: Make sure that all four screws in the MXC300 are
properly tightened. Failing to do so may result in improper
operation of the shelf.
4. Insert the replacement circuit breaker into the circuit breaker sockets of the
corresponding xRAP-100 power terminal board, as shown in the following
figure.
5. Reinstall the xRAP-100 front cover and fasten it with its two captive
screws.
4. Insert the replacement circuit breaker into the circuit breaker sockets of the
corresponding xRAP-B power terminal board, as shown in the following
figure.
5. Reinstall the xRAP-B front cover and fasten it with its two captive screws.
In this appendix:
Overview ........................................................................................................ A-1
ECU300/ECU300-F Card Connectors............................................................ A-2
MXC300 DC Input Power Connectors......................................................... A-10
PIM2_21 Connection Data ........................................................................... A-10
PIM2_63/B Connection Data ....................................................................... A-14
EISMB/DIOM/MCSM Connectors .............................................................. A-17
xRAP-100 Connectors.................................................................................. A-19
xRAP-B Connectors ..................................................................................... A-25
Overview
This appendix provides connection data for the user connectors located in the
XDM-300 shelf and associated ancillary equipment supplied by ECI Telecom’s
Transport Networking Division.
Any connectors not described in this Appendix are reserved for use by ECI
Telecom’s Transport Networking Division technical support personnel and/or
for future expansion, and therefore no user equipment may be connected to
them.
ECU300/ECU300-F Card
Connectors
ALARMS Connector
The ALARMS connector is a 36-pin SCSI female connector that carries three
groups of lines:
| Five external alarm input lines referenced to an internal power supply
common line (the power supply’s common line is floating relative to the
chassis ground). The alarm input lines are monitored by the XDM-300
management subsystem. Each input is connected to the input diode of an
optocoupler.
| Three external alarm outputs/inputs. Each output is provided by three relay
dry contacts. These lines can be configured as additional alarm inputs by
the system’s management.
| Four severity alarm outputs and a buzzer control line. Each output is
provided by three relay dry contacts. The buzzer control line is provided by
two dry contacts.
Relay contact ratings are 75 V in open state and 1A in closed state.
The following figure identifies the connector pins as seen when looking into
the connector. The table lists the pin assignment for the ALARMS connector.
Pin 18 Pin 1
Pin 36 Pin 19
F-CHANNEL Connector
The F-CHANNEL connector is a 9-pin D-type male connector that provides a
serial RS-232 communication channel supporting SLIP. This connector is
intended for connection to a Craft terminal. The connection is made to one of
the serial RS-232 ports of the PC serving as a Craft terminal, using a crossed
cable.
The following figure identifies the connector pins as seen when looking into
the connector. The table lists the connector pin assignment, together with the
corresponding pin in the Craft terminal serial RS-232 port (assuming that this
port uses a 9-pin connector).
ETHERNET Connectors
The two ETHERNET connectors located on the ECU300/ECU300-F panel,
designated MANAGEMENT MAIN and PROT/LCT, are 8-pin RJ-45
connectors that provide two Ethernet 10BaseT management interfaces (one for
each MXC300 card installed in the XDM-300 shelf).
At any time, only the interface connected to the MXC300 serving as the current
main card is active; the interface connected to the MXC300 serving as the
protection card is in standby to provide protection for the out-of-band
management traffic.
Each ETHERNET connector is wired as a station port intended for direct
connection through a straight cable to a port of a 10BaseT Ethernet hub.
The following figure identifies the connector pins as seen when looking into
the connector. The table lists the pin assignment for a typical connector.
Pin 25 Pin 1
Pin 50 Pin 26
Pin 25 Pin 1
Pin 50 Pin 26
LOWER
Pin 25 Pin 1
Pin 50 Pin 26
Pin 25 Pin 1
Pin 50 Pin 26
LOWER
Table A-9: PIM2_63/B typical receive lines (upper) connector pin assignment
Table A-10: PIM2_63 typical transmit lines (lower) connector pin assignment
EISMB/DIOM/MCSM Connectors
EISMB_804 and DIOM_04 are GbE/Fast Ethernet modules that provide
electrical 10/100/1000BaseT ports. DIOM_08 is a Fast Ethernet module that
provides 10/100BaseT ports. MCSM in an MPLS Core Switch module that
provides 10/100BaseT ports. All these modules use 8-pin RJ-45 connectors for
the electrical ports.
The following figure identifies the connector pins as seen when looking into
the connector. The first table lists the pin out for a 10/100BaseT interface and
the second for a 1000BaseT interface.
xRAP-100 Connectors
Pin 18 Pin 1
Pin 36 Pin 19
Pin 34 Pin 1
Pin 68 Pin 35
xRAP-B Connectors
Pin 18 Pin 1
Pin 36 Pin 19
ALARMS Connector
The ALARMS connector is a SCSI 68-pin female connector that carries three
groups of lines:
| Eight external alarm inputs connected to the ALARM inputs of the
XDM-300 shelf. Four inputs are allocated to each XDM-300 shelf. Each
input is activated by closing a dry contact provided from the customer’s
facility.
| Eight sets of change-over relay contacts floating with respect to shelf
ground, which serve as rack (bay) status outputs. Each couple of the eight
relays is assigned to one of the output alarm lines of the two XDM-300
shelves connected to the xRAP-B.
| Four sets of change-over relay contacts floating with respect to shelf
ground, which serve as rack (bay) alarm indication lines. The relays,
identified as critical, major, minor, and warning, are activated by the
corresponding alarm relays of XDM-300 shelves.
| Two sets of change-over relay contacts floating with respect to shelf
ground, which serve as Critical alarm buzzer activation signal. The relay is
activated whenever a Critical alarm is detected in the corresponding shelf.
The signal can be used to activate a local buzzer (Critical buzzer) in the
customer's alarms collecting system.
| Two lines for muting the Critical buzzer in the customer's alarms collecting
system.
Relay contact ratings are 75 V in open state, and 1A in closed state.
The following figure identifies the ALARMS connector pins as seen when
looking into the connector. The table lists the pin assignment for the ALARMS
connector. This table also lists the color of the wire connected to the
corresponding pin in the cables offered by ECI Telecom’s Transport
Networking Division for connecting between the ALARMS connector and a
distribution frame.
In this appendix:
Installing Equipment Racks............................................................................ B-1
19" Rack Installation ...................................................................................... B-6
1-45/64” 1-45/64”
18-1/2” 14-1/2”
3-11/16” 3-11/16”
25-7/8” 21-7/8”
a. 23” wide bay mounting hole drilling template b. 19” wide bay mounting hole drilling template
SCREW M12X50
FLAT WASHER
SPACER
SQUARE WASHER
ANCHOR BRACKET
OPEN DUCT
LOCK WASHER
FLAT WASHER CEILING
FLAT WASHER
640 MAX
50 MIN
NUT M8
FLAT WASHER
SCREW M8X20
Rack Grounding
Immediately after installing the rack, connect its grounding stud to the
prescribed grounding point on the site grounding bar. Use a grounding lead that
meets the Rack grounding requirements (on page 2-22) listed in section Before
You Start.
667
600
500
Maximum distance
between levels
2021
1912
499mm
625
515
44
Z 538
Mounting angle
355
Foremost position
Detail Z
44
500
515
538
M S