The challenges of

the new global

scenario
 The global scenario

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 Consumerization of the
microelectronic industry

• High volumes

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 R
®R

An example: Pentium Intel Pentium® 4

Processor
Processor

• 50 millions of Pentium produced every year

(1 Pentium every 0.6 s!!)

[K. Thompson, Vice president Intel, ITC]

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 Consumerization of the
microelectronic industry

• High volumes
• High costs for design and production

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 High costs for design

100
# Designers

80
60
40
20
0
4004 80286 Pentium
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 High costs for production

1,5 G US $
Advanced µpr
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 Consumerization of the
microelectronic industry

• High volumes
• High costs for design and production
• Low prices of the final products

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 Greater Cost Pressure

Challenge: Deliver more functionality and higher performance at

lower cost

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 Two Pronged Approach to Reduce Product Costs

240% more die/wafer, 30% lower

Feature size scaling to reduce
cost per die 40% less energy and
die size
wafer per die

Aggressive feature size scaling introduces new test

challenges – more later
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 Transistor Technology Evolution

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 Transistor Technology Evolution
- A 14nm Broadwell chip, side-on, showing all 13 layers -

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 Innovation Enabled Technology Pipeline

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 Consumerization of the
microelectronic industry

• High volumes
• High costs for design and production
• Low prices of the final products
• High dependability

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 Consumerization of the
microelectronic industry

• High volumes
• High costs for design and production
• Low prices of the final products
• High dependability
• Faster technology advance
− a new technology every 9 months !!

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 Trends in Hardware Technology

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 Consumerization of the
microelectronic industry

• High volumes
• High costs for design and production
• Low prices of the final products
• High dependability
• Faster technology advance
− a new technology every 9 months !!
− System-on-a-chip (SOC)

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 System-on-a-chip

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 SOCs trend

Yesterday’s
PCBs

Today’s
chips

Tomorrow’s
re-usable IPs

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 Example:
A mixed signal model
(board implementation)

RAM
ROM
ROM

Data
terminal Micro-
DSP
controller

Transmission
medium
CoDec
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 Example:
A mixed signal model
(SOC implementation)

DSP RAM
Data core ROM
terminal Transmission
Interface CoDec medium
logic

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 Consumerization of the
microelectronic industry

• High volumes
• High costs for design and production
• Low prices of the final products
• High dependability
• Faster technology advance
• Smaller market windows

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 Smaller market windows

5y

1y

6m

1980 1990 2015

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 Which are the
consequences ?

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 Dramatic shrink of
products life-cycle

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 User’s
requirements

Design
Re-cycling t
The product
life-cycle

In-field
Production
operation

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 What should
we do?

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 To survive, you must
be able to meet the
trends.

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 The real challenge:
To meet user quality
requirements for your
new products

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 Reduce your
Time-To-Market

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 User’s
requirements

Design

Time-To-Market
( TTM )
t

Production

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 How can we
reduce our
TTM ?

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 Set up a
Concurrent
Engineering
environment

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 “The Concurrent Engineering is a systematical
approach of integrated and concurrent design of a
product and of the associated processes, including
construction and support.
At the developing of the product it consider all the
elements of its cycle of life , from specifications to
its destruction, including quality, costs
programming, users’ needs.”

[Institute for Defence Analyses, USA]

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 Concurrent Engineering

Teamwork
Redo until right (TigerTeam)

First time right

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 TigerTeam

Persons from different departments working

together for anticipating the problems and
weakness and their elimination, taking in
consideration all the life cycle of the product.

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 Diagnosability

Manufacturability
Reliability

Design for X-ability

Integrability

Commissionability
Testability
Verifiability

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 Reduce your
design time

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 Improve
designers
productivity

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 Exploit chip
complexity

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 System-on-a-chip

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 Our next product must be:
Better, Smaller, Cheaper, Faster
& Consume less power !!

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