Lecture Plan - MEMS

Sl. Date &

Hr. Topics to be Covered
No Day

Module 1-- MEMS and Microsystems: MEMS as a micro

sensor,acutator, components of micro system, Intelligent mcro
system
1 Comparson between micro system and micro electronics.
Applications –Health care industry,aerospace industry, industral
products consumer products and tele communication.
Multidisciplinary nature of MEMS

Principles and examples of Micro sensors and micro actuators:

acoustic wave sensor, biomedical sensor, chemical sensors, optical
2 sensors, pressure sensors, thermal sensor, actuation using thermal
forces, shape memory alloys, piezo electric crystals and
electrostatic forces
3 Micro accelerometer –comb drives - Micro grippers –micro motors
4 Micro valves, micro pumps
Review of Mechanical concepts: Stress, Strain, Modulus of
5
Elasticity, yield strength, ultimate strength
6 General stress strain relations – compliance matrix.
7 Overview of commonly used mechanical structures in MEMS
- Beams, Cantilevers, Plates

8 Mechanical structures in MEMS - Beams, Cantilevers,

Plates,Diaphragms – Typical applications
Module 2-- Flexural beams: Types of Beams, longitudinal
9
strain under pure bending
10 Deflection of beams
11 Spring constant of cantilever –Intrinsic stresses
12 Actuation and Sensing techniques : Thermal sensors and actuators
13 Electrostatic sensors and actuators
14 Piezoelectric sensors and actuators
15 magnetic actuators
Module 3-- Scaling laws in miniaturization - scaling in geometry,
16
scaling in rigid body dynamics
17 Trimmer force scaling vector
18 scaling in electrostatic and electromagnetic forces
19 scaling in electricity and fluidic dynamics
20 scaling in heat conducting and heat convection.
21 Module 4--Materials for MEMS – Silicon
22 Silicon compounds – Silicon Nitride
23 Silicon Dioxide, Silicon carbide, Poly Silicon
24 GaAs , Silicon Piezo resistors
25 Polymers in MEMS – SU-8, PMMA, PDMS
26 Langmuir –Blodgett Films, Micro System fabrication
27 Photolithography – Ion implantation
28 Diffusion – Oxidation
29 Chemicalvapour deposition – Etching
30 Module 5--Overview of Micro manufacturing

Bulk micro manufacturing: overview of etching, isotopic and

31
ansotropic etching, wet etchants, etch stop, dry etchng

32 Surface micro machining: process, mechanical problems

33 LIGA process: process, materials, SLIGA process
34 Microstereo lithography
35 Microstereo lithography
36 Micro system Packaging
37 General considerations in packaging design
38 Levels of Micro system packaging: die level, device level, system level.

Module 6--Bonding techniques for MEMS : Surface bonding ,

39
Anodic bonding

40 Silicon - on - Insulator , wire bonding , Sealing

41 Assembly of micro systems
42 Overview of MEMS areas : RF MEMS, BioMEMS
43 MOEMS, NEMS