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Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.
2.4
0.8
0.0
10.8
12.3
13.4
AIO1
GND
GPIO11
GPIO10
GPIO9
GPIO8
GND
AIO0
Dimensions are in millimeters
Tolerances:
PCB Outline: +/- 0.13 mm
PCB Thickness: +/- 0.1 mm
RFPAD
Top View Side View
GND
GND
10.5
7.3
8.9
27 26 25
20.5
19.7 20.5 GND 1 24 SPI_MISO
SPI_MOSI 2 RN42N 23 SPI_CSB
Top View
16.0 GPIO6 3 22 GPIO4
14.8 0.80mm GPIO7 4 21 GPIO5
13.6
12.4 RESET 5 20 GPIO3
11.2
10.0 SPI_CLOCK 6 19 GPIO2
8.8 PCM_CLK 7 18 USB_D-
7.6
6.4 PCM_SYNC 8 17 USB_D+
5.2
4.0 PCM_IN 9 16 UART_CTS
2.8 PCM_OUT 10 15 UART_RTS
0.7
0.0 0.0
VDD 11 14 UART_TX
GND 12 13 UART_RX
35 29 34 33 32 31 28 30
0.0
1.1
2.6
3.6
4.9
6.1
7.3
8.5
9.8
2.4
0.8
0.0
10.8
12.3
13.4
AIO1
GND
GPIO11
GPIO10
GPIO9
GPIO8
GND
AIO0
Tolerances:
PCB Outline: +/- 0.13 mm
PCB Thickness: +/- 0.1 mm
Shield Pads
Toggle at 10 Hz The module is in command mode.
Dimensions are in millimeters
High The module is connected to
another device over Bluetooth.
Top View
Top View
10.5
7.3
8.9
20.0
19.7
0.70mm
2.00mm
16.0
14.8 0.80mm
13.6
12.4
11.2
10.0
8.8
7.6
6.4
5.2
4.0
2.8 Shield Pads
0.7 4 Corners
0.0 1.0 x 1.8mm
Top View
Edge of 31cm
Ground 5.3mm
Plane
20.5mm
RN42
Okay
2.5 External Antenna Types (RN42N) Using the module in HCI mode enables designers to
implement profiles that are not natively supported on
The RN42N module’s antenna pin (pin 26) provides a the Bluetooth module.
50-ohm impedance to external antennas. Pin 25 can
connect directly to a coaxial cable or to an antenna Note: HCI mode is only available by ordering
connector such as a U.FL or reverse polarity SMA. part RN42HCI and RN42HCI for UART
interface; or RN42U and RN42U for USB
The PCB trace from pin 26 to the coaxial cable or con-
interface.
nector should be less than 0.2 inches (5 mm) for mini-
mum loss and the best impedance match. If the PCB
Microchip offers HCI mode in two hardware interfaces:
trace is longer, it should be a 50-ohm impedance
microstrip trace. Connect adjacent ground pins 25 and • HCI over UART (RN42HCI-I/RM)
27 to a low-impedance ground on the host PCB and the • HCI over USB (RN42U-I/RM)
antenna connection. Figure 2-4 gives example host
PCB layout to a U.FL connector. 2.6.1 HCI OVER UART
In this mode, the hardware interface between the host
2.6 HCI Mode processor and the Bluetooth module is the UART con-
figured at 115.2Kbps. The UART hardware flow control
Microchip offers the Host Controller Interface (HCI)
signals are required between the host processor and
mode in addition to the standard operational mode of its
the Bluetooth module for the HCI interface to work.
Bluetooth modules (standard mode refers to the on-
Failure to do so can cause the host processor and the
board stack running on the module).
Bluetooth module to become out of sync and break the
In HCI mode, the on-board stack is bypassed and the Bluetooth link.
module is put in a state that runs the Bluetooth base-
band. The HCI provides a command reference inter- 2.6.2 HCI OVER USB
face to the baseband controller and the link manager,
In this mode, the hardware interface between the host
and provides access to the hardware status and control
processor and the Bluetooth module is the USB. In this
registers. This interface provides a uniform method for
architecture, the Bluetooth module is the USB slave
accessing the Bluetooth baseband capabilities.
and the host processor is the USB host.
In this mode, the Bluetooth stack is no longer on-board
Using the USB interface offers the advantage of a
the module. It is offloaded to the interfacing host pro-
faster data link between the Bluetooth module and the
cessor. The Bluetooth module is used as a radio, per-
host processor. With this interface, it is possible to
forming the lower level MAC functionalities, while the
achieve Bluetooth’s theoretical maximum throughput of
application stack runs on the host processor.
3 Mpbs.
M1 RN42 Module
3.3V
D1 Green LED
1 24 SPI _MI SO PI O5 R2
GND SPI _MI SO
470
SPI _MOSI 2 23 SPI _SS
SPI _MOSI SPI _CS#
PI O6 3 22 PI O4 Connection Status
PI O6 PI O4
PI O7 4 21 PI O5
PI O7 PI O5
RESET _N 5 20 PI O3
RESET PI O3
D2 Red LED
SPI _SCK 6 19 PI O2 PI O8 R3
SPI _SCK PI O2
470
PCM_CL K 7 18
PCM_CL K USB_D-
PCM_SYNC 8 17 Activity
PCM_SYNC USB_D+
PCM_I N 9 16 CT S
PCM_I N UART_CTS
U1 TC1185
PCM_OUT 10 15 RT S
PCM_OUT UART_RTS 3.3V VBUS
5 1
11 14 TX D VOUT VI N
3.3V VDD UART_TX
12 13 RX D R1
GND
GND UART_RX C2 4 3 SHDN C1
1uF BYP SHDN 1uF
SHIE L D
3k3
PIO11
PIO10
2
A IO1
A IO0
GND
GND
PIO9
PIO8
0
35
29
34
33
32
31
28
30
C6
PIO11
PIO10
A IO1
A IO0
PIO9
PIO8
VBUS 100nF
C4 C5
100nF 100nF
HEADER 1 HEADER 2
19
16
PI O6 PI O4
1
1 1
PI O7 PI O3 U3
V CCIO
V CC
3V 3OUT
2 2
RESET _N PI O2 RXD R12 3k3 30 FT232RQ
3 3 TXD
CT S TXD R13 3k3 2
4 4 RXD
RT S CTS R11 3k3 32 VBUS J4
5 5 RTS
TX D RTS R14 3k3 8 15 1
6 6 CTS USBDM VBUS
RX D 31 D_N 2
7 7 DTR D-
VB2 PI O11 6 D_P 3 6
8 8 DSR D+ MTAB
SHDN PI O10 7 14
9 9 DCD USBDP
PI O9 3 5
10 10 RI GND
PI O8
11 3.3V 11
VB1 18 USB Mini B
12 12 RESET
22
CBUS0
J1 J2 21
CBUS1
10 27
CBUS2 OSCI
11
CBUS3
3.3V 9
CBUS4
T HPA D
R10 3k3 1 PI O4 28
A GND
OSCO
T E ST
V B1
V B2
GND
GND
GND
R9 3k3 2 PI O3
R8 3k3 3 PI O6
20
17
4
24
33
26
R7 3k3 4 PI O7
S1
R18 R15
300k 300k
J3
A IO0
A IO1
SPI _MI SO
1
SPI _MOSI
2
SPI _SCK
3
SPI _SS
R17 R16 4
100k 100k 5 3.3V
6
SPI MASTER
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
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mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
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headquarters, design and wafer fabrication facilities in Chandler and
CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
== ISO/TS 16949 == devices, Serial EEPROMs, microperipherals, nonvolatile memory and
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