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Gerjan Diepstraten
Process Support Manager
Cobar Europe BV
Member of the Balver Zinn group
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Drivers for alternative for SAC
There are a number of drivers to have a LF non SAC
alloy.
SAC305
Technical:
• Copper leaching (rework issues)
• Reliabilty of SAC after ageing
• Hardness
• Voiding SN100C
• Appearance of shrinkage cavities
Financial:
• SAC305 contains 3% Ag
2/32
SnCu vs SN100C
Tetsuro Nishimura found that additions of nickel and
germanium at low but quite specific levels
dramatically change the behavior and appearance of
SnCu.
4/32
Paste - flux characteristics
XF3 flux is developed for reflow processes with
extended temperature profiles (lead-free)
Topography of SAC
- Attention:
This rheological network can be damaged by excessive
high transport or storage temperatures.
6/32
Print conditions
Print conditions should by consitent to guarantee the
visco-elastic behavior of the paste.
7/32
Printer performance
• Maximum printing speed is process indicator for the
print performance of the paste
• Differences in performance due to topographic
characteristics of the alloys
8/32
Thermal Stability XF3
High activity at
Low evaporation peak temperatures
rate results in
where oxidation
longer stencil- Activation starts
life becomes critical
at 150°C.
Remains during soak 9/32
Full Factorial Design
Design of Experiment to define solderability of SN100C
versus SAC305:
11/32
Reflow profiles
12/32
Spreading of solder paste
13/32
Solder spreading results
14/32
Solder spreading microscope
15/32
Solder spreading analysis
DoE experiment:
R-Sq = 85.70%
17/32
Intermetallic thickness
Solder (SN100C)
Intermetallic
layer
Copper
FR4
Printed Circuit Board
DoE experiment:
R-Sq = 78.24%
19/32
IMC analysis
• No significant difference
between 3 and 5 minute
reflow profile (only 1%)
• One heating process
before reflow results in a 4%
thinner intermetallic layer
(OSP is more oxidized)
SAC3-XF3
No significant difference
between the two alloys.
22/32
Vapour phase - tombstoning
SN100C-XF3
No significant difference
in yield between SN100C
and SAC305 vapour
phase process.
SAC3-XF3 SN100C-XF3
Cleaning standard components:
Very good cleaning results : no residues sticking to the
solder mask or components
Paste is designed to be no-clean. Residues are harmless
(REL0) 24/32
Intrusive reflow-printing
Stencil thickness = 0.006” (150um)
Stencil aperture size = 0.080” (2.03mm)
Solder paste printed into through hole and over
solder mask
25/32
Reflow – Pin in paste
SN100C-XF3
Top and bottom side show nice solder fillets acc. to IPC-610D
26/32
Feasibility SN100C BGA’s
BGA Spheres Solder paste
1 SAC305 SAC305
2 SAC305 SN100C
3 SN100C SN100C
27/32
Voiding SN100C vs SAC305
SAC3-XM5S
13% voids
Voiding: SAC3-XF3
- Solder paste flux 11% voids
- Oxidation of solder
powder
SN100C-XF3
4% voids
28/32
Reliability solder joints
2512 Resistor
Thermo cycling:
-40 °C + 125 °C
29/32
Boeing Recommendations
30/32
Corrosion resistance
After Exposure to a Marine Environment:
SN100C SAC305