THE IMPACT OF LEAD-FREE REFLOW TEMPERATURES ON THE

MOISTURE SENSITIVITY PERFORMANCE OF PLASTIC SURFACE MOUNT

PACKAGES
B.T. Vaccaro, R.L. Shook, D.L. Gerlach
Lucent Technologies
Allentown, PA
bvaccaro@lucent.com

ABSTRACT typically reflowed to peak package body temperatures

Environmental concerns continue to drive the demand for between 210-235°C.
lead-free products in the electronics industry. Board
assembly operations currently use near eutectic tin-lead Solder Alloy Peak Reflow
Melting Point
solders to attach components to printed circuit boards. Lead- Composition Temperature
free solder alloys which have been identified as substitutes Sn/37Pb (Conventional) 183°C 210-235°C
for tin-lead solders have melting points that are typically 30- Sn/3.5Ag 221°C 245-255°C
40°C higher. Therefore, peak reflow temperatures must be Sn/0.75Cu 227°C 250-260°C
increased to ensure reliable board attachment. The increased Sn/3.5Ag/0.75Cu 216-220°C 240-250°C
reflow temperatures that are required for lead-free solders Sn/4.0Ag/0.5Cu 217-218°C 240-250°C
will impact the moisture sensitivity performance of plastic Sn/2.5Ag/1.0Bi/0.5Cu 216-221°C 240-250°C
surface mount devices (SMDs). This paper presents the Sn/3.0Ag/0.8Cu/0.5Sb 219°C 240-250°C
effect of lead-free simulated assembly on the
moisture/reflow performance for conventional leadframe- Figure 1. The melting points and expected peak reflow
based products (160MQFP and 144LQFP) and overmolded temperature ranges for various solder alloys.
laminate-based products (27mm and 35mm PBGA and low
profile fine pitch BGA). Moisture/reflow performance was By contrast, candidate lead-free solder alloys (see Figure 1)
assessed using C-mode Scanning Acoustic Microscopy (C- currently being considered for lead-solder replacement
SAM) and cross-sectional failure analysis was performed to typically have melting points 30-40°C higher than
verify the location of the failing interface. The results conventional tin-lead solders. These higher melting points
indicate that the moisture sensitivity performance is will necessitate that component reflow temperatures are also
generally degraded by at least one IPC/JEDEC level when increased with suggested target reflow temperatures of 240-
the reflow temperature is increased to 260°C. Performance 260°C.
analysis on one package type, a 160MQFP, revealed
excessive die surface delamination even after reflow of The ramifications of subjecting SMDs to these significantly
“dry” packages at 260°C. Improvements in materials and higher peak reflow temperatures will either be a
possibly package design will be needed for some package downgrading of the moisture sensitivity performance or a
types to attain adequate moisture/reflow performance at the need to improve packaging materials and/or package
elevated temperatures required for lead-free assembly. designs as depicted in Figure 2. Accordingly, changes in the
moisture sensitivity classification of IC packages (see
Key words: lead-free, moisture sensitivity, reflow Figure 3) will directly impact floor life prior to board
attachment.
INTRODUCTION
Recently, pressure to reduce and eventually eliminate the
use of lead in the manufacture of electronic products has
grown significantly [1,2]. The pressure to reduce the use of New materials
lead is being driven by environmental concerns about toxic Floor life and/or package
release during product disposal through either incineration or designs are
MSL required to re-
or through landfill leachate. Primary sources of lead in the Without changes establish long
electronics industry are from the solder materials used for floor life declines floor life times
termination finishes and from the tin-lead solder pastes used dramatically
for IC component board attachment. Near eutectic tin-lead
solder alloys are commonly used and have melting Increasing Reflow Temperature
temperatures of approximately 183°C. During board
attachment, to ensure that proper solder reflow temperatures Figure 2. The effects of increasing reflow temperatures on
are attained, as well as to maintain acceptable assembly floor life or moisture sensitivity level (MSL).
cycle time intervals, plastic surface mount packages are
 Floor Life after Pre-conditioning Soak Requirements
opening bag 60°C/60% RH
Standard
MSL and storing in Accelerated
(Duration, Ambient)
<30°C/60%RH Equivalent
1 Unlimited 168hrs, 85°C/85%RH NA
2 One Year 168hrs, 85°C/60%RH NA
2a Four Weeks 696hrs, 30°C/60%RH 120 Hours
3 One Week 192hrs, 30°C/60%RH 40 Hours
4 Three Days 96hrs, 30°C/60%RH 20 Hours
5 Two Days 72hrs, 30°C/60%RH 15 Hours
5a One Day 48hrs, 30°C/60%RH 10 Hours
6 Time on label TOL, 30°C/60%RH
Figure 3. IPC/JEDEC moisture sensitivity levels or MSL.
The moisture sensitivity problem for plastic surface mount
packages is widely accepted in the industry as a significant
reliability issue and is well documented in the literature [3-
5]. Plastic IC packages readily absorb moisture from
humidity in the air. As moisture diffuses into the package, it
begins to collect and condense at internal material
interfaces. When packages are reflow soldered to printed
circuit boards, moisture present at the internal package
interfaces vaporizes. The magnitude of the vapor pressure
that develops in the package during reflow increases with
peak reflow temperature. The stresses that develop within
the package as a result of vapor pressurization can cause
interfacial material delamination if the adhesion strength of
the interface is exceeded. Furthermore, if the stresses that
develop exceed the fracture strength of the plastic, package
cracking may occur. In the worst case scenario, “popcorn”
cracks, or rapid crack propagation during reflow, may occur.
Delamination and package cracking pose serious reliability
concerns in that catastrophic failures may result due to lifted
ball or sheared wedge bonds. Long term reliability may also
be jeopardized by the possible ingress of ionic contaminants
along exposed cracks thereby increasing the likelihood of
device failure by corrosion [5].
The objective of this study is to characterize the effects of
increased reflow temperatures on the moisture sensitivity
performance of plastic surface mount packages. Several
different package families were represented in this study
including thick and thin leadframe-based packages, PBGAs
(2 and 4 metal layer substrates), and LFBGAs (low profile
fine pitch BGAs). Moisture/reflow testing was performed at
peak reflow temperatures of 250°C and 260°C. C-SAM was
used to judge package integrity before and after
moisture/reflow testing and cross-sectional failure analysis
was performed to verify the location of the failing interface.
EXPERIMENTAL TEST METHODOLOGY
Moisture/reflow analyses were performed on five different
package types as shown in Figure 4. Each device was
chosen to represent a specific package family. The
moisture/reflow performance of each family is unique due
to differences in assembly materials and/or package
thickness and was thus characterized independently.
Packages with large chip-to-package ratios were typically
selected to represent near worst case sensitivity to
moisture/reflow testing at lead-free reflow temperatures. In
this study, sample sizes of nine units were used to populate
each experimental cell.
Package Package Size Chip Size Package Family
Type (mm) (mm) Represented
144LQFP 20x20x1.4 7.51x10.35 LQFP
160MQFP 28x28x3.4 7.20x6.73 Thick QFP
169LFBGA 11x11x1.05 6.33x5.58 LFBGA
272PBGA 27x27x1.53 9.75x10.10 PBGA (2-metal layers)
456PBGA 35x35x1.73 10.16x10.94 PBGA (4-metal layers)
Figure 4. Description of package types used in
moisture/reflow experiments.
Experimental Process Flow
The experimental process flow is shown in Figure 5. Initial
C-SAM analysis was performed so that units with “as-
received” delamination could be identified. This sorting
process serves to separate otherwise convoluted variables
that significantly affect the results of moisture/reflow
testing.
After initial C-SAM analysis, the devices were baked
completely dry at 125°C. Weight loss measurements were
performed to determine the required bake time for each
package type in the study. A package was considered dry
when no significant change in the measured weight (less
than 0.002%) was observed over a 24 hour period. As in the
case of sorting units with “as received” delamination, this
method of baking the test samples completely dry was
chosen over the more conventional method of a fixed
duration bake to ensure a separation of otherwise
convoluted variables.
Although not the subject of this work, setting the appropriate bake
times to ensure that product is completely dry when sealed in
moisture barrier bags prior to shipment may be very important
when higher peak reflow temperatures are used. Bake times are
particularly important in packages with complex interconnect
schemes. Another potentially significant factor at high reflow
temperatures may be very low levels of moisture absorbed while
product is stored in moisture barrier bags. We suspect that success
in high volume production may depend upon the proper
anticipation, understanding, and control of these factors.
Moisture/reflow analyses were performed at various
moisture sensitivity levels (depending upon package type)
and peak reflow temperatures of 250°C and 260°C.
Packages were also tested at the current IPC/JEDEC
moisture sensitivity level and peak reflow temperature as a
control for the reflow experiments. Moisture pre-
conditioning was performed according to IPC/JEDEC J-
STD-020A [6] which is shown in Figure 3. Where
applicable (i.e., levels 2a-5a), the accelerated 60°C/60%RH
test conditions were used. After moisture pre-conditioning,
devices were subjected to three passes in a convection
reflow oven. Lead-free reflow profiles with peak
temperatures of 250°C and 260°C were created for each
package type per the NEMI [7] recommended conditions
that are shown in Figure 6. The reflow profiles that were
used to test at conventional eutectic tin-lead reflow
temperatures were established per J-STD-020A.
C-SAM was used to judge package integrity after
moisture/reflow testing was completed. For a given package
type, initial moisture/reflow evaluations were generally
performed at MSL-4/260°C conditions. If the test result was
a “pass”, an evaluation was performed on a new sample at
the next higher moisture level. Alternatively, if the result of
the test was a “fail”, an evaluation was performed on a new
sample at the next lower moisture level. Using this
approach, moisture/reflow testing was performed until a
passing and failing moisture level was identified for each
package type at both 250°C and 260°C. Once completed,
cross-sectional failure analysis was performed on failed
packages to confirm the location of the failing interface.
Initial C-SAM analysis to
identify units with as-
received delamination
Bake dry at 125°C
(verify with weight
loss measurements)
Pre-condition at various
moisture sensitivity levels
Convection oven reflow
at 250°C or 260°C
(3 passes)
Preheat
150°C (+/-25°C) for a total of 60-
120 seconds
Time >50°C 3.5 – 6.0 minutes
Time >217°C 60-150 seconds
Ramp rate >217°C 3°C/sec maximum
Time within 5°C of peak 10-20 seconds
Peak temperature range
260°C (-5/+0°C)
(or 250°C, 240°C, etc.)
Ramp down rate 6°C/sec maximum
Figure 6. NEMI lead-free reflow profile requirements.
Chip surface delamination is classified into two categories:
1. Failure: >5% of the chip surface area is delaminated.
Experience has shown that this amount of delamination
may lead to ball bond shear or chip passivation
cracking.
2. Marginal Pass: >1% but <5% of the chip surface area is
delaminated. Ball bond shear and chip passivation
cracking are unlikely. While not considered a
failure, marginal performance is a concern in high
volume manufacturing and additional studies are
recommended.
For thin leadframe packages (LQFP), bottom paddle
delamination greater than 50% of the pad area is considered
a failure because it may lead to belly bulge (swelling of the
package underside) and subsequent board attach problems.
For laminate-based packages (PBGA, LFBGA), through-
mode C-SAM must be performed to detect “popcorn” type
failures and delamination at any of the internal package
interfaces. With the exception of die-attach delamination
(delamination between the chip and die-pad area of the
substrate), any measurable amount of delamination detected
by C-SAM may lead to cracking in the wedge bonds,
substrate vias, or traces and is considered a failure. Die
attach delamination greater than 10% of the die-pad area
may also lead to belly bulge and is therefore considered a
failure.

C-SAM to assess The pass, marginal pass, and fail criteria are summarized in
Pass package integrity Figure 7.

Type of Applies
Fail Marginal Pass Fail
Delamination to
1% - 5% chip >5% of chip
Chip surface All
surface area surface area
Cross-section to verify Bottom of >50% of
LQFP n/a
location of failing interface Die-Pad die-pad area
Bottom of Die: Bottom of Die:
Laminate 1% -10% by area >10% by area
Figure 5. Experimental process flow used for Through mode Only
And Or
moisture/reflow analysis. delamination (PBGA &
LFBGA) No Detectable Any Detectable
Delamination Delamination
Evaluation Criteria Mold-compound cracks Criteria per IPC/JEDEC J-STD-020A
After moisture/reflow testing, results are reported as pass,
Figure 7. Evaluation criteria for judging moisture/reflow
marginal pass, or fail. If there are any failures, the number
response.
of failing units is reported along with the failure mode.
RESULTS through the mold compound towards the bottom of the
Weight Loss Analysis package but does extend to the external package boundary.
The time required to bake devices dry at 125°C is dependent
on the package type and the ambient exposure history of the Peak Reflow Temperature
samples. A standard 24 hour bake was sufficient for the 2- MSL 225°C 250°C 260°C
Pass Fail Fail
layer PBGA samples as shown in Figure 8. However, the 4- 2a (9 units) (9/9 internal mold- (8/8 internal mold-
layer PBGA package required a minimum bake time of 96 compound cracks) compound cracks)*
hours at 125°C to completely dry the internal package 3
Pass Pass
interfaces (see Figure 9). As previously mentioned, the (9 units) (9 units)
intricacies of completely drying packages with complex Pass
4
(9 units)
interconnect schemes may be critical to high-volume lead- * one unit was lost during testing
free manufacturing and will be the subject of future work.
Figure 10. Moisture/reflow results for thin leadframe
packages (144LQFP).
Percent Weight Change vs. Bake Time
at 125°C (2-layer PBGA)
0.015
Leadframe paddle edge
0.012
% Weight Change

0.009 Crack in mold compound

0.006

0.003

0
0 5 10 15 20 25
Bake Time (hours)
Bottom package edge
Figure 8. Weight loss data for the 2-layer 272PBGA
package.

Percent Weight Change vs. Bake Time Figure 11. Cross-section of 144LQFP package after level
at 125°C (4-layer PBGA) 2a/260°C indicating crack in mold compound.
0.1

0.08
QFPs
% Weight Change

Moisture/reflow test results for the 160MQFP package are

0.06 shown in Figure 12. This package type proved to be the
most sensitive to increased reflow temperatures. At reflow
0.04 temperatures of 220-225°C, the 160MQFP passes
IPC/JEDEC level 2a. However, the package cannot
0.02 withstand lead-free reflow temperatures of 250°C or higher.
C-SAM analysis indicates severe chip surface delamination
0
after the parts are baked dry and reflowed at 250°C and
0 50 100 150 200
260°C (no MSL) as shown in Figure 13.
Bake Time (hours)
Peak Reflow Temperature
Figure 9. Weight loss data for the 4-layer 456PBGA MSL 225°C 240°C 250°C 260°C
package. Pass
2a
(9 units)
Moisture/Reflow Test Results Fail**
3
(2/9)
LQFPs Marginal Pass* Fail**
The moisture/reflow test results for the 144LQFP package 4
(1/9) (9/9)
are shown in Figure 10. At standard reflow temperatures of Marginal Pass* Fail**
5
220-225°C, this package type passes IPC/JEDEC level 2a. (3/9) (9/9)
The moisture sensitivity performance of the 144LQFP is Dry Marginal Pass* Fail** Fail**
(2/9) (4/9) (6/9)
reduced to level 3 at 250°C and 260°C. The failure mode at * >1% but <5% of chip surface delaminated
lead-free reflow temperatures is internal package cracking ** >5% of chip surface delaminated
as detected by C-SAM and confirmed by cross-sectional Figure 12. Moisture/reflow results for thick QFP type
analysis. As shown in Figure 11, the crack initiates from the packages (160MQFP).
leadframe paddle and propagates along a diagonal path
Due to the severity of the moisture/reflow response at
250°C and 260°C, further testing was performed for this
package type at 240°C. These packages demonstrate only
marginal performance at 240°C and will require additional
studies to investigate manufacturability. This data suggests
that the 160MQFP package will require improvements in
materials and/or package design if reflow performance is
required at 250°C and higher.
PBGAs
The moisture/reflow test results for 2 and 4 metal layer
PBGAs are shown in Figures 15 and 16, respectively. At
current reflow temperatures of 220-225°C these packages
are able to withstand moisture level 2a stressing with no
delamination. When subjected to 250°C peak reflow
temperatures, the moisture sensitivity performance of both
package types is reduced to level 3. At 260°C, no further
reduction is observed for the 2-layer PBGA. However, the
performance of the 4-layer package continues to decline,
passing only level 4 at 260°C.

C-SAM results for the 2-layer PBGA package are shown in

Figure 17. As indicated by through-mode C-SAM, the
failure mode at lead-free reflow temperatures for PBGAs is
popcorn cracking. Cross-sectional analysis shows
delamination within the die attach layer and within the
internal layers of the substrate (see Figure 18).

Peak Reflow Temperature

Figure 13. C-SAM images of the chip surface for the MSL 225°C 250°C 260°C
Pass Fail Fail
160MQFP package after stressing at level 2a/225°C (left) 2a
(9 units) (9/9 popcorn) (9/9 popcorn)
and dry/260°C (right). Delamination is color-coded black. Pass Pass
3
(9 units) (9 units)
LFBGAs Pass
4
(9 units)
Moisture/reflow test results for the 169LFBGA are shown in
Figure 14. When the reflow temperature is increased to Figure 15. Moisture/reflow results for 2-metal layer PBGAs
250°C, no degradation in moisture performance is observed, (272PBGA).
and the package passes level 3 conditions. However, at
260°C, the moisture sensitivity performance is reduced to Peak Reflow Temperature
MSL 225°C 250°C 260°C
level 4. The failure mode at lead-free reflow temperatures is
Pass Fail Fail
popcorn cracking which occurs within the die attach layer 2a
(9 units) (9/9 popcorn) (9/9 popcorn)
and internal layers of the substrate. Pass Fail
3 (9 units) (2/9 small areas of
Low profile fine pitch BGAs are currently classified as a substrate delam. )
Pass
level 3 package at reflow temperatures of 235-240°C. 4
(9 units)
IPC/JEDEC J-STD-020A currently requires that all
leadframe-based packages less than 350mm3 in volume and Figure 16. Moisture/reflow results for 4-metal layer PBGAs
less than 2.5mm in thickness be subjected to 240°C peak (456PBGA).
reflow temperatures because smaller, thinner packages will
typically reach higher temperatures during the board attach
process. Although IPC/JEDEC does not currently include
laminate-based packages in this rule, we apply the higher
reflow temperature to any LFBGA package that meets these
volume and thickness requirements.

Peak Reflow Temperature

MSL 240°C 250°C 260°C
Fail
2a
(9/9 popcorn)
Pass Pass Fail
3
(9 units) (9 units) (8/9 popcorn)
4
Pass Figure 17. Through-mode C-SAM data for the 2-layer
(9 units) PBGA package after stressing at level 2a/225°C (left) and
Figure 14. Moisture/reflow results for low profile fine pitch level 2a/260°C (right). Delamination is color-coded black.
BGAs (169LFBGA).
 Tejpal Hooghan for their efforts in preparing cross-
Mold compound
sectioned samples.

REFERENCES
Chip
[1] 4th draft of the European Commission (EC) directive,
Crack in substrate “Waste from Electronic and Electrical Equipment”
(WEEE), 2000.

[2] The Japan Electronic Industry Development

Association (JEIDA), “Challenges and Efforts Toward
Commercialization of Lead-free Solder – Road Map
Crack in die attach 2000 for Commercialization of Lead-free Solder –
ver1.2”, 2000.
Figure 18. Cross-section of the 2-layer PBGA package after
[3] Fukuzawa, I., S. Ishiguro and S. Nanbu, “Moisture
level 2a/260°C stressing indicating delamination within the
Resistance Degradation of Plastic LSIs by Reflow
die attach layer and internal substrate layers.
Soldering”, Proc. 23rd Rel. Phys. Sym., 1985, pp. 192-
197.
CONCLUSION
The increased reflow temperatures that are required for
[4] Kitano, M., A. Nishimura, S. Kawai, and K. Nishi,
lead-free solders will result in a downgrading of the
“Analysis of Package Cracking During Reflow
moisture sensitivity performance of SMDs. Improvements
Soldering Process”, Proc. 26th Rel. Phys. Sym., 1988,
in either materials or designs will be needed if comparable
pp. 90-95.
tin-lead reflow performance is desired. In summary, the
results of this study indicate that the moisture sensitivity
[5] Shook, R.L., “Moisture Sensitivity Classification of
performance is reduced by at least one IPC/JEDEC level
Plastic Surface Mount Devices Using Scanning
when the peak reflow temperature is increased to 260°C.
Acoustic Microscopy”, Proc. 30th Rel. Phys. Sym.,
However, the effects of lead-free reflow temperatures on
1992, pp. 157-168.
moisture sensitivity performance vary widely based on
package type:
[6] IPC/JEDEC, “J-STD-020A, Moisture/Reflow
Sensitivity Classification for Plastic Integrated Circuit
! The 144LQFP package is able to withstand level 2a
Surface Mount Devices”, The Electronics Industries
stressing at 225°C. At 260°C, the moisture sensitivity
Association and The Institute for Interconnecting and
performance is reduced to IPC/JEDEC level 3.
Packaging Electronic Circuits. 1998.
! Thick QFP packages such as the 160MQFP are not
[7] National Electronics Manufacturing Initiative, Inc.
currently useable at increased lead-free reflow
(NEMI), “NEMI’s Form Letter to the Component
temperatures above 250°C. It is likely that the current
Suppliers”, 2000.
mold-compound and die-attach materials must be
replaced with more advanced materials if these package
types are to be used in lead-free manufacturing.

! The moisture sensitivity performance of low profile

fine pitch BGAs is downgraded from level 3 at 240°C
to level 4 at 260°C.

! PBGAs are currently classified as level 2a at 225°C.

When the reflow temperature is increased to 260°C, the
moisture sensitivity performance of 2-layer PBGAs is
reduced to IPC/JEDEC level 3 and 4-layer PBGAs are
downgraded to level 4.

ACKNOWLEDGEMENTS
The authors would like to acknowledge the Assembly and
Process Development Group in Singapore for assembling
the packages for this study. The authors also wish to
acknowledge Susan Geiger for performing the reflow testing
and Jonathan Scharwz for performing C-SAM analyses.
Finally, the authors wish to acknowledge Ray Nika and