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C ISOPLUS 247TM
E153432
G
G
C
E
E Isolated Backside
IGBT Features
t
Symbol Conditions Maximum Ratings • NPT3 IGBT
- low saturation voltage
VCES TVJ = 25°C to 150°C 1200
u
V - positive temperature coefficient for
VGES ± 20 V easy paralleling
- fast switching
-o
IC25 TC = 25°C 95 A - short tail current for optimized
IC90 TC = 90°C 60 A performance in resonant circuits
ICM VGE = ±15 V; RG = 22 Ω; TVJ = 125°C 100 A
• ISOPLUS 247TM package
VCEK RBSOA, Clamped inductive load; L = 100 µH VCES
- isolated back surface
e
tSC VCE = 900 V; VGE = ±15 V; RG = 22 Ω; TVJ = 125°C 10 µs - low coupling capacity between pins
(SCSOA) non-repetitive and heatsink
- high reliability
s
Applications
Symbol Conditions Characteristic Values
(TVJ = 25°C, unless otherwise specified) • single switches
h
t
IGBT (typ.)
Cth1 = 0.13 J/K; Rth1 = 0.06 K/W
Cth2 = 0.32 J/K; Rth2 = 0.27 K/W
u
-o
ISOPLUS247TM OUTLINE
e
s
a
h
p
The convex bow of substrate is typ. < 0.04 mm over plastic surface level
of device bottom side
This drawing will meet all dimensions requirement of JEDEC outline
TO-247 AD except screw hole and except Lmax.
0644
60 60
9V
9V
40 40
20 20
TVJ = 25°C TVJ = 125°C
0 0
0 1 2 3 V 4 0 1 2 3 V 4
VCE VCE
t
160 20
u
VCE = 20 V
A V
120 15
-o
IC VGE
80 10
e
40 TVJ = 125°C 5
s
VCE = 600 V
TVJ = 25°C IC = 50 A
0 0
a
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20 100 8 800
td(on)
mJ ns
90
mJ ns
16 80 td(off)
Eoff 6 600
Eon 70 t t
tr
12 60
VCE = 600 V
50 4 VGE = ±15 V 400
8 VCE = 600 V 40 RG = 22 Ω
VGE = ±15 V TVJ = 125°C
30
RG = 22 Ω 2 Eoff
200
4 TVJ = 125°C
20
Eon
10
tf
0 0 0 0
0 20 40 60 80 100 A 120 20 40 60 80 100 A
IC IC
Fig. 5 Typ. turn on energy and switching Fig. 6 Typ. turn off energy and switching
times versus collector current times versus collector current
15.0 12
t
300 1200
VCE = 600 V ns
mJ VCE = 600 V td(on) ns mJ td(off)
VGE = ±15 V
12.5 VGE = ±15 V 250 10 1000
IC = 50 A
u
Eon IC = 50 A Eoff
TVJ = 125°C t TVJ = 125°C t
10.0 200 8 800
-o
7.5 150 6 600
Eon
tr
5.0 100 4 Eoff
400
e
2.5 50 2 200
tf
0.0 0 0 0
s
Fig. 7 Typ. turn on energy and switching Fig. 8 Typ. turn off energy and switching
times versus gate resistor times versus gate resistor
h
120 1
A
K/W
p
100
0.1
ICM
80 ZthJC
60 0.01
40 single pulse
0.001
20 RG = 22 Ω
TVJ = 125°C
IXER60N120
0 0.0001
0 200 400 600 800 1000 1200 1400 V 0.0001 0.001 0.01 0.1 1 s 10
VCE t
Fig. 9 Reverse biased safe operating area Fig. 10 Typ. transient thermal impedance
RBSOA
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