7.

2 SOLDERING

Soldering is the processes of joining metals by using lower melting

point to weld or alloy with the joining surface.

SOLDER

Solder is the joining material that melts below 427 degree connections
between components. The popularly used solders are alloys of tin ( Sn ) and
lead ( Pb ) that melts below the melting point if tin.

Types :

1. Rosin core :- 60/40 Sn/Pb solders are the most common types used for
electronics assembly. These solders are available in various diameters
and are most appropriate for small electronics work (
0.02” – 0.05” diameter is recommended )
2. Lead free :- Lead free solders are used as more environmental –
friendly substitutes for leaded solder, but they are typically not as
easy to use mainly because of their higher melting point and poorer
wetting properties.
3. Silver :- Silver solders are typically used for low resistance
connections but they have higher melting point and are expensive
than Sn/Pb solders.
4. Acid - core :- Acid – core solders should not be used for electronic.
They are intended for plumbing of non – electronic assembly work.
The acid – core flux will cause corrosion of the circuitry and can
damage components.
5. Other special solders :- various melting point eutectics : these
special solders are typically used for non – electronic assembly of

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difficult to construct mechanical items that must be assembled in a

particular sequence.
6. Paste solders :- these solders are used in the field application or in
specialized manufacturing application.

FLUX

In order to make the surface accept the solder readily, the components
terminals should be cleaned chemically or by abrasion using blades or knives.
Small amount of lead coating can be done on the portion of the leads using
soldering iron, this process is called as fluxers.These are available in
petroleum jelly as paste flux.

The desirable properties of flux are :-

 It should provide a liquid cover over the materials and exclude air gap
up to the soldering temperature.

 It should dissolve any oxide on the metal surface.

 It should be easily replaced from the metal by the molten soldering
operation.
 Residue should be removed after completing soldering operation.
 The most common flux used in hand soldering of electronic
components is rosin, combination of mild organic acids extracted from
pine tree.

SOLDERING IRON

It is a tool used to melt the solder and apply it at the joints in the
circuit. It operates in 230V supply. The iron at the tip gets heated

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while few minutes. 50W and 25W soldering irons are commonly used for
soldering of electronic circuits.

SOLDERING STEPS :

1. Make the layout of the component in the circuit. Plug in the chord of
the soldering irons the main to get heated.
2. Straighten and clean the component leads using a blade or knife.
3. Mount the components on the PCB by bending the leads of the
components. Use nose pliers.
4. Apply flux on the joints and solder the joints. Solder must be in
minimum time to avoid dry soldering and heating up of the
components.
5. Wash the residue using water and brush.
6. Solder joints should be inspected when completed to determine if they
have been properly made.

CHARACTERISTICS OF A GOOD SOLDER JOINTS :

A .Shiny surface

B . Good, smooth fillet

CHARACTERISTICS OF A POOR SOLDER JOINTS :

1. Dull or crystallized surface :- This is an indicator of a cold solder joint.

Cold solder joint result from moving the component after

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soldering has been removed, but before the solder has hardened.
Cold solder joints may work at first, but will eventually fail.
2. Air Pocket :- Air pocket ( voids ) result from incomplete wetting of
surface, allowing air to be in contact with the connecting metals. This will
cause oxidation of the joints & eventual failure. Blow holes can occur due
to vaporization of moisture on the surface of the board & existing through
the molten solder. Boards should be clean & dry, prior to soldering.
Ethanol ( 100% ) can be used as a moisture chaser if boards are wet prior
to soldering.
3. Dimples :- Dimples in the surface do not always indicate a serious
problem, but they should be avoided since they are precursors to voids.

4. Floaters : Black spots :- Floating in the soldering fillet should be

avoided, because they indicate contamination & potential for failure
as in the case of voids. These black spots usually results from
overheated ( burnt ) Rosin or other contaminants such as burnt wire
insulation. Maintaining a clean tip will help to avoid these
problems.
5. Balls :- A solder balls instead of a fillet can occur if the trace was heated
but the leads were not ( vice versa ). This prevents proper wetting of both
surfaces & result in solder being attached to only one surface ( component
of trace ).
6. Excess solder :- Excess solder usage can cover up other potential
problems & should be avoided. It can lead to solder bridge. In addition,
spherical solder joints can result from the application of too much solder.