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Features
· Glass Passivated Die Construction
· High Case Dielectric Strength of 1500VRMS
· Low Reverse Leakage Current GBU
· Surge Overload Rating to 200A Peak Dim Min Max
· Ideal for Printed Circuit Board Applications A A 21.8 22.3
· Plastic Material: UL Flammability B K M B 3.5 4.1
Classification Rating 94V-0
· UL Listed Under Recognized Component C C 7.4 7.9
Index, File Number E94661 L D 1.65 2.16
D E 2.25 2.75
Mechanical Data - ~ ~ +
E
G 1.02 1.27
H 4.83 5.33
· Case: Molded Plastic F
J J 17.5 18.0
· Terminals: Plated Leads Solderable per N
MIL-STD-202, Method 208 G K 3.2 X 45°
· Polarity: Marked on Body L 18.3 18.8
· Mounting: Through Hole for #6 Screw P M 3.30 3.56
H
· Mounting Torque: 5.0 Inch-pounds Maximum N 0.46 0.56
· Marking: Date Code and Type Number P 0.76 1.0
· Weight: 6.6 grams (approx.) All Dimensions in mm
Characteristic Symbol GBU GBU GBU GBU GBU GBU GBU Unit
8005 801 802 804 806 808 810
Peak Repetitive Reverse Voltage VRRM
Working Peak Reverse Voltage VRWM 50 100 200 400 600 800 1000 V
DC Blocking Voltage VR
RMS Reverse Voltage VR(RMS) 35 70 140 280 420 560 700 V
Average Rectified Output Current (Note 1) @ TC = 100°C IO 8.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load IFSM 200 A
(JEDEC Method)
Forward Voltage (per element) @ IF = 4.0A VFM 1.0 V
Peak Reverse Current @TC = 25°C 5.0
IR
500 mA
at Rated DC Blocking Voltage @ TC = 125°C
I2 t Rating for Fusing (t < 8.3ms) (Note 2) I2 t 166 A2 s
Typical Junction Capacitance per Element (Note 3) CJ 130 pF
Typical Thermal Resistance Junction to Case (Note 1) RqJC 2.2 °C/W
Operating and Storage Temperature Range Tj, TSTG -55 to +150 °C
8
With heatsink Tj = 25°C
10
6
4
1.0
Without heatsink
0 0.1
0 50 100 150 0.0 0.2 0.6 1.0 1.4 1.8
TC, CASE TEMPERATURE (°C) VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 1 Forward Current Derating Curve Fig. 2 Typical Forward Characteristics
250 1000
IFSM, PEAK FORWARD SURGE CURRENT (A)
Tj = 25°C
f = 1.0MHz
100
100
Tj = 25°C
0 10
1 10 100 0.1 1.0 10 100