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Courtesy of Kateeva

From Technologies to Markets

Inkjet for functional


and additive
manufacturing in
electronics report
-
Sample
2018

Sample
January 2018
ABOUT THE AUTHORS
Biographies & contacts

Jerome Mouly, Technology and Market Analyst


Jerôme Mouly serves as a Technology & Market Analyst specialized in microtechnologies for biomedical & medical imaging applications at Yole
Développement, the “More than Moore” market research and strategy consulting company. Since 2000, Jérôme has participated in more than 100
marketing and technological analyses for industrial groups, start-ups and institutes related to semiconductor & medical technologies industry. Jérôme
holds a Master of Physics from the University of Lyon.
Email: mouly@yole.fr

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COMPANIES CITED IN THIS REPORT

Agfa, BATM Systems, BOE, Brother, Canon, Cosemi, Dow Chemical, Dupont, Fujifilm Dimatix, Funai, HP,
Intrinsiq, Japan Display, JOLED, Kateeva, Kodak, Konica Minolta, Kyocera, Lexmark, LG Display, Luxexcel,
MEMJET, Merck, Meyer Burger, MGI – Ceradrop, MicroFab, Microresist Technology, M-Solv, Mutracx,
Nano-Dimension, Notion Systems, Novacentrix, Océ – Canon Group, Orbotech, Panasonic, Printed
Electronics Ltd, PV Nanocell, Ricoh, Samsung, Schmid, Seiko Epson, Seiko Instruments, Semes, Sony, SRS,
Sumitomo Chemical, Sun Chemical, Thinfilm, Tokyo Electron Ltd (TEL), Toshiba Tec, Trident, Xaar, Xerox,
and many more

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REPORT OBJECTIVES
What is included
• This report is the first research performed on the inkjet printing technology in the field of electronics, micro-electronics and
micro-optics.

• The objectives of the report are to:


• Provide detailed information regarding the applicability of inkjet printing for functional and additive printing in the electronic field
• Major applications today and applications foreseen
• Inkjet printing roadmap by application
• Give the current status of the inkjet printing technology adoption and the various type of printhead devices available on the market
• Provide an overview of the technological trends for inkjet printheads dedicated to functional printing
• Understand what are the remaining challenges of the implementation of the inkjet technology in the field of electronics
• Provide market metrics of inkjet equipment and inkjet printhead market for functional printing applications (2017-2023)
• Equipment market in units by application
• Printhead market in units and value by printhead manufacturers
• Provide a competitive landscape, identify key players and major collaborations
• Give first level of information on functional inks, players and volume estimations

• This report does not cover:


• Graphic printings (commercial and industrial graphic markets including ceramic, textile or texturization)
• Functional printing for biomedical applications (liquid dispensing, biochemical deposition)
• 3D printing applications out of electronics.

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TABLE OF CONTENTS
Part 1/1
 Executive summary 6  Market application 82
o Application market – OLED display / PCB & Printed electronics (2.5D and
 Introduction 28 3D) / Solar cells / Microoptics / MEMS & Sensors
o Inkjet printing introduction o Introduction
o Functional and additive manufacturing concept o Major development
o Inkjet printing applications o Inkjet printing processes
o Functional and additive market applications o Players and collaboration
o Drivers for the adoption of Inkjet technology  Global roadmap
o 3D printing concept
 Inkjet printing trends 152
o Printhead technology trends
 Printheads 50 o MEMS vs. conventional printheads
o Major printhead types o Thin film PZT piezo ejection
o Printhead chips, module and printers o Single pass printing
o Industrial Inkjet printhead players o Ink recirculation concept
o Major industrial printheads on the market o

 Functional Inks 161


o Introduction
 Market for functional and additive printing forecast 2017 – 2023 67 o Market estimation
o Introduction o Product formulation and cost comparison
o Hypothesis o Players and collaboration
o Inkjet printer shipment market and installed base
o Inkjet printhead market – shipment, value and market share
o R&D and manufacturing shares in value 2017 and 2023  Conclusion 180

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WHO SHOULD BE INTERESTED BY THIS REPORT
• Equipment & Material suppliers:
• Find new business opportunities and prospects
• See your products’ and technologies’ differentiated value in this market
• Ascertain technology trends, challenges, and precise requirements related to inkjet technology

• Printhead manufacturers
• Find new business opportunities and prospects
• Benchmark potential competitors and identify your value proposition

• Electronics & microelectronics companies


• Understand Inkjet as a possible technology in your field of play
• Identify added value and challenges to implement such technology in your activity
• Monitor and benchmark potential competitors

• Financial & strategic investors


• Recognize the key players involved in Inkjet printing manufacturing for electronics
• Grasp which applications and market opportunities have the highest growth potential, and how the players involved in these segments will
benefit

• R&D organizations
• Assess the needs of the market and technical requirement to offer the right solution.

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ADDITIVE MANUFACTURING
Inkjet principle

Printhead nozzles

What is
inkjet
process?

Inkjet printing principle is based on the ejection of droplets through nozzles made in plate from a printhead (or series
of printhead) module.

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FUNCTIONAL AND ADDITIVE PRINTING
Context

Graphic Functional and


Packaging Decoration
Communication additive

Graphic arts Functional & additive

Color inks Functional inks

Paper Paper/Board/Plastic Functional substrates & objects

• Home & office • Coding & Marking • Ceramic • Printed electronics


• Photo • Labelling • Glass • Functional coating
• Promotional • Corrugated • Laminates • Organic printing
• Transactional • Textiles • Microoptics
• Signage • 3D printing

Adapted from source: Infotrends 8


©2018 | www.yole.fr | Inkjet Functional and Additive Manufacturing for Electronics | Sample
MARKET SEGMENTATION
Overview

Format 2.5D printing 3D printing

Deposition
Organic Resist Metallic Resist Metallic

Surfacing
OLED lighting, OLED display,

Etching PCB (Solder mask,


resist etching)
Printed electronics
Flexible electronics
Solar cell
MEMS
Patterning
Pack./interconnect

Manufacturing
PCB
Micro-optics
protoyping

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DRIVERS
Overview

Waste
reduction

Low to
Specific
medium series
Several architectures
requirement
drivers but
not specific
drivers

Personalization
Cost reduction
/ on-demand

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INKJET PRINTING MANUFACTURING
Benchmark of the main techniques
Resolution (µm)
0.1 NIL

IC
0.2

photolithography
0.5
Laser
1 ablation
Continue to gain in resolution

MEMS Working on both resolution and


5 throughput

20 Inkjet Flexo Gravure

50
Screen-
100 printing
Throughput (m²/h)
10 100 1,000 10,000 100,000
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MAJOR PRINTHEADS
The specific printheads used for functional printing
Resolution
1,200 PCB etch resist

Océ TonerPearls printhead

600
OLED display TFE

300 XAAR 1003


KM 512 4pL KM 512 35pL
KM 512 14pL KM 512 42pL

100 Printed electronics – Solder mask

DMC 1pL SX3 DMC 10pL SE3

Droplet volume
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PIEZO PRINTHEAD MARKET (IN VALUE)

Revenues generated by players are presented in the full report


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ROADMAP - PRODUCTION WITH INKJET PRINTING

Drop RGB deposition – OLED display


placement

Microoptics - microlenses

Etch resist – PCB


Trace printing – OPV
Line Trace printing – Sensors
Selective emitters – Solar cell Trace repair– PCB
Trace printing R2R – Flexible electronics

Thin film encapsulation – OLED display


Surface

Solder mask – PCB

3D

3D prototyping - PCB

2015 2017 2019 2021 2023 2025


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OLED DISPLAY MANUFACTURING PRINCIPLE
The role of inkjet
In OLED display manufacturing process, inkjet technology could be used in 2 major steps:

OLED display

Thin Film Encapsulation (TFE) RGB OLED printing (+ encapsulation)

OLED & electrodes OLED OLED OLED


Substrate Substrate

©2018| |www.yole.fr
©2018 www.yole.fr| |Inkjet
InkjetFunctional
Functionaland
andAdditive
AdditiveManufacturing
Manufacturingfor
forElectronics
Electronics | |Sample
Sample
| Report | www.yole.fr | ©2017 15
PRINTED ELECTRONICS – PCB - BATTERIES
Supply chain
Printed
Inkjet printhead Ink Printers electronics
manufacturer

Printed
electronis

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FUNCTIONAL INKS
Type of functional inks

Conductive

Functional
For
functional inks
printing

Semiconductive Dielectrics

| Report | www.yole.fr | ©2017


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INKJET TECHNOLOGY TRENDS
The magic triangle
In the field of Inkjet printing, the concept of magic triangle concern 3 of the main components:

Resolution, ejection
frequency, droplet volume

Printhead
Clogging properties, Spatial deposition,
maintenance location accuracy

Quality

Ink Substrate

Viscosity, surface Properties (physical


tension, functionality Adhesion, drying and chemical)

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INK PLAYERS (NON EXHAUSTIVE LIST)

OLED display

PCB solder mask –


etch resist

Printed electronics –
PV – conductive inks

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RELATED REPORTS

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INKJET FUNCTIONAL AND ADDITIVE
MANUFACTURING FOR ELECTRONICS
Market & Technology report - January 2018
How inkjet is building a success story drop by drop within 2.5D and 3D manufacturing?
KEY FEATURES OF THE REPORT WHICH APPLICATIONS ARE DRIVING INKJET PRINTING’S ADOPTION?
 et the sample of the report
G
on www.i-Micronews.com Between a sheet of paper and a flat-screen TV, film encapsulation for displays (smartphones,
• Inkjet printhead - market volume a common theme exists: each can be printed TVs). Now driving the market, OLED display is
and value metrics 2017 - 2023 with inkjet printheads. Inkjet printers were doing much more than creating opportunities
for electronics, microelectronics, invented by IBM in the 1970s as an alternative for inkjet printing. It is also democratizing inkjet
display, and micro-optics to dot-matrix printing. However, at the time technology as a new process for manufacturing
applications IBM’s researchers probably didn’t think that their electronics and microelectronics. Kateeva, a
• Market drivers for inkjet printing invention would be a key process step in the US-based company manufacturing printers for
technology as a manufacturing manufacturing of TVs, electronic components, OLED displays, is one of the leading companies
tool and solar cells. It wasn’t until the end of the using inkjet printing technology. After being
• Inkjet printing segmentation, last decade that inkjet printheds stepped up to the first to reach mass production for thin-film
by applications for 2.5D and support all three of these categories – fueled encapsulation, the company is now targeting
3D printing for electronics, by the need for fast, low-cost prototyping of RGB (red/green/blue) OLED material deposition
microelectronics, and micro- printed circuits, as well as technologies able to by inkjet for TV LG display is currently in pilot
optics deposit very thin conductive lines on solar cells production using Kateeva printers.
• O verview of the different without compromising efficiency. A strong increase in wearables requiring miniaturized,
segments and trends Drop-on-demand (DoD) piezoelectric printheads “close to the skin” devices in certain applications,
• Technology trends in inkjet are the most suitable devices for depositing a is paving the way for flexible printed electronics.
printheads and modules picoliter of inks where you want, when you want, Expensive photolithography processes with mask
• Inkjet printing - manufacturing and at high frequencies. Compared to thermal technology could be replaced by inkjet printing
roadmap for applications ejection, which is largely used in consumer office, processes to deposit conductive lines on-demand.
• Comprehensive landscape and commercial printing, piezo printheads are Inkjet technology demonstrates consistently
covering players, supply chain, and used in industrial applications because of their improving performances in terms of deposition
collaborations higher resistance and longer lifetime in harsh accuracy, high-resolution printing, and droplet
• Functional ink challenges for environments. Furthermore, piezo ejection volume control. Printheads are one of a printer’s
printing and consumption estimates offers more choice in ink selection: for example, key components, and they’re becoming increasingly
aqueous, solvent, and UV-curable inks. complex, requiring strong knowledge and experience.
After lengthy R&D dedicated to utilizing inkjet High throughput printing is now reached with
printing as a prototyping tool, the first mass- high number of printhead modules in a same
production market emerged with OLED thin- printer. It is worth noting that nozzle positioning

Roadmap - production with inkjet printing

Drop RGB deposition


placement OLED display
Microoptics - microlenses

Etch resist – PCB Trace printing


Line Sensors Trace printing
Selective emitters Trace repair – PCB OPV
Trace printing R2R
Solar cell Flexible electronics
Thin film encapsulation
OLED display
Surface
Solder mask – PCB

3D
3D prototyping - PCB

2015 2017 2019 2021 2023 2025


(Yole Développement, January 2018)
INKJET FUNCTIONAL AND ADDITIVE MANUFACTURING FOR ELECTRONICS

and well-controlled ejection are key to printer Can inkjet printing manufacture a full electronic
manufacturers and targeted applications. Printhead device? The answer is yes, but only in prototyping
quality is improved by using MEMS technologies and applications. Using an inkjet printer, 3D inkjet
thin-film PZT (Lead Zirconate Titanate), helping them printing can now manufacture a PCB card from A -
attain the required level for electronic applications. Z. Nano-Dimension, a developer of 3D printing
This report describes the technology requirements equipment solutions, released at the end of 2017
and improvements made in order to meet functional, its Dragongfly 2020, which uses Konica Minolta
additive printing requirements. printheads. In mass applications, inkjet remains one
of the key steps in the manufacturing process.

A PRINTHEAD MARKET REACHING MORE THAN $31 MILLION IN 2023

Functional printing is leveraging the use of inkjet This report contains printhead market share and
printing and opening new market opportunities printhead market forecasts for functional and
for printhead manufacturers. The manufacturing additive printing, along with estimated printer market
digital revolution is underway and inkjet printheads shipment by application.
integrated in industrial printing equipment are
R&D still represents a large portion of inkjet printer
expected to reach more than $31 million in 2023,
acquisition, with 93% of total printers shipped. Mass
with a CAGR of 30.3% from 2017 - 2023. Key players
production has only just begun for OLED display thin-
in this field are Konica Minolta, Fujifilm Dimatix,
film encapsulation. It’s a good sign that the industry is
Océ-Canon, and Xaar. Other Piezo printhead players
showing interest in RGB deposition, PCB, and flexible
are currently very active in the graphics domain,
electronics.
where the market is growing, However, competition
is focused on gaining its slice of the pie too.

Piezo printhead market (in value)


$35M

$30M

$25M
CAGR2017-2023: 30.3%
$20M

$15M

$10M

$5M

$0
2017 2018 2019 2020 2021 2022 2023

Revenues generated by printhead players are presented in the report


(Yole Développement, January 2018)

INK: THE OTHER KEY PARAMETER OF THE PRINTING PROCESS

Overview of functional ink players by major applications

OLED display

PCB solder mask –


etch resist

Printed
electronics –
PV – conductive
inks

(Yole Développement, January 2018)


MARKET & TECHNOLOGY REPORT

In an inkjet printing process, the “golden tolerance in terms of viscosity and surface
triangle” of key parameters is: Printheads – Inks tension is limited, and could only be optimized
– Substrates. Formulating functional inks is a key for a certain type of printhead.
challenge in manufacturing applications, since a This report also covers the challenges linked to
diversity of materials must be ejected: conductive ink formulation, and the ideal ink properties for
inks, metallic inks, resist inks, and OLED-based piezo printheads. Collaborations are mentioned,
material inks. This report presents an estimate of describing which ink players are currently interested
the ink volume required in the field of functional in developing a functional printing market.
and additive manufacturing. Inkjet printheads’

OBJECTIVES OF THE REPORT


• G et an overview of emerging printhead applications & market
• G ive the current status of inkjet printing technology adoption on the different market
• Provide an application roadmap
• Access market metrics at inkjet equipment and inkjet printhead devices for electronics,
microelectronics and microoptics applications from 2017-2023
• Understand the technological and economical challenges of using inkjet printing in those applications
• G ive an overview of the key players and key supply chains in related applications
• Learn about inkjet printhead technology trends to access electronics, microelectronics market
• Introduce ink players and collaboration

COMPANIES CITED IN THE REPORT (non exhaustive list)


Agfa, BATM Systems, BOE, Brother, Canon, Cosemi, Dow Chemical, Dupont, Fujifilm Dimatix, Funai, HP,
Intrinsiq, Japan Display, JOLED, Kateeva, Kodak, Konica Minolta, Kyocera, Lexmark, LG Display, Luxexcel,
MEMJET, Merck, Meyer Burger, MGI – Ceradrop, MicroFab, Microresist Technology, M-Solv, Mutracx, Nano-
Dimension, Notion Systems, Novacentrix, Océ – Canon Group, Orbotech, Panasonic, Printed Electronics Ltd,
PV Nanocell, Ricoh, Samsung, Schmid, Seiko Epson, Seiko Instruments, Semes, Sony, SRS, Sumitomo Chemical,
Sun Chemical, Thinfilm, Tokyo Electron Ltd (TEL), Toshiba Tec, Trident, Xaar, Xerox, and many more
AUTHOR
 TABLE OF CONTENTS (complete content on i-Micronews.com) Jérôme Mouly serves as a Technology
Executive summary 6 Market application 82 & Mar ket Analys t specialized in
Introduction 28 >A pplication market – OLED display / PCB &
microtechnologies for biomedical &
medical imaging applications at Yole
> Inkjet printing introduction Printed electronics (2.5D and 3D) / Solar cells /
Développement, the “More than Moore”
> Functional and additive manufacturing concept Microoptics / MEMS & Sensors
market research and strategy consulting
> Inkjet printing applications - Introduction
company. Since 20 0 0, Jérôme has
> Functional and additive market applications - Major development
participated in more than 100 marketing
> Drivers for the adoption of Inkjet technology - Inkjet printing processes
and technological analyses for industrial
> 3D printing concept - Players and collaboration groups, start-ups and institutes related to
Printheads 50 > Global roadmap semiconductor & medical technologies
> Major printhead types Inkjet printing trends 152 industry. Jérôme holds a Master of Physics
> Printhead chips, module and printers > Printhead technology trends from the University of Lyon.
> Industrial inkjet printhead players > MEMS vs. conventional printheads
>Major industrial printheads on the market > Thin film PZT piezo ejection
Market for functional and additive printing > Single pass printing
forecast 2017 – 2023 67 > Ink recirculation concept
> Introduction Functional inks 161
> Hypothesis > Introduction
> Inkjet printer shipment market and installed base > Market estimation
> Inkjet printhead market – shipment, value and
> Product formulation and cost comparison
market share
> Players and collaboration
> R&D and manufacturing shares in value 2017
and 2023
Conclusions 180

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ABOUT YOLE DEVELOPPEMENT


Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate
finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon
and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors,
Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing,
Nanomaterials, Power Electronics and Batteries & Energy Management.
The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting,
PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology
trends to grow their business.
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be bought either on a unit basis or as an annual subscription. IBAN: FR76 3005 6001 7001 7020 0156 587 • Posting any Product to any other online service (including
(i.e. subscription for a period of 12 calendar months). The To ensure the payments, the Seller reserves the right to request bulletin boards or the Internet);
annual subscription to a package (i.e. a global discount based down payments from the Buyer. In this case, the need of down • Licensing, leasing, selling, offering for sale or assigning the
on the number of reports that the Buyer orders or accesses payments will be mentioned on the order. Product.
via the service, a global search service on line on I-micronews 6.3 The Buyer shall be solely responsible towards the Seller of
3.4 Payment is due by the Buyer to the Seller within 30 days
and a consulting approach), is defined in the order. Reports are all infringements of this obligation, whether this infringement
from invoice date, except in the case of a particular written
established in PowerPoint and delivered on a PDF format and the comes from its employees or any person to whom the Buyer
agreement. If the Buyer fails to pay within this time and fails
database may include Excel files. has sent the Products and shall personally take care of any
to contact the Seller, the latter shall be entitled to invoice
related proceedings, and the Buyer shall bear related financial
“Seller”: Based in Lyon (France headquarters), Yole interest in arrears based on the annual rate Refi of the «BCE»
consequences in their entirety.
Développement is a market research and business development + 7 points, in accordance with article L. 441-6 of the French
6.4 T
 he Buyer shall define within its company point of contact for
consultancy company, facilitating market access for advanced Commercial Code. Our publications (report, database, tool...)
the needs of the contract. This person will be the recipient
technology industrial projects. With more than 20 market are delivered only after reception of the payment.
of each new report in PDF format. This person shall also be
analysts, Yole works worldwide with the key industrial companies, 3.5 In the event of termination of the contract, or of misconduct,
responsible for respect of the copyrights and will guaranty that
R&D institutes and investors to help them understand the markets during the contract, the Seller will have the right to invoice
the Products are not disseminated out of the company.
and technology trends. at the stage in progress, and to take legal action for damages.
6.5 In the context of annual subscriptions, the person of contact
1. SCOPE shall decide who within the Buyer, shall be entitled to access
1.1 The Contracting Parties undertake to observe the following 4. LIABILITIES on line the reports on I-micronews.com. In this respect, the
general conditions when agreed by the Buyer and the Seller. 4.1 The Buyer or any other individual or legal person acting on Seller will give the Buyer a maximum of 10 password, unless
ANY ADDITIONAL, DIFFERENT, OR CONFLICTING its behalf, being a business user buying the Products for its the multiple sites organization of the Buyer requires more
TERMS AND CONDITIONS IN ANY OTHER DOCUMENTS business activities, shall be solely responsible for choosing the passwords. The Seller reserves the right to check from time
ISSUED BY THE BUYER AT ANY TIME ARE HEREBY Products and for the use and interpretations he makes of the to time the correct use of this password.
OBJECTED TO BY THE SELLER, SHALL BE WHOLLY documents it purchases, of the results he obtains, and of the 6.6 In the case of a multisite, multi license, only the employee
INAPPLICABLE TO ANY SALE MADE HEREUNDER AND advice and acts it deduces thereof. of the buyer can access the report or the employee of the
SHALL NOT BE BINDING IN ANY WAY ON THE SELLER. 4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable companies in which the buyer have 100% shares. As a matter
1.2 This agreement becomes valid and enforceable between the pecuniary loss, caused by the Products or arising from a of fact the investor of a company, the joint venture done with
Contracting Parties after clear and non-equivocal consent material breach of this agreement a third party etc..cannot access the report and should pay a
by any duly authorized person representing the Buyer. For 4.3 In no event shall the Seller be liable for: full license price.
these purposes, the Buyer accepts these conditions of sales a) damages of any kind, including without limitation, incidental
when signing the purchase order which mentions “I hereby or consequential damages (including, but not limited to, 7. TERMINATION
accept Yole’s Terms and Conditions of Sale”. This results in damages for loss of profits, business interruption and loss of 7.1 If the Buyer cancels the order in whole or in part or postpones
acceptance by the Buyer. programs or information) arising out of the use of or inability the date of mailing, the Buyer shall indemnify the Seller for
1.3 Orders are deemed to be accepted only upon written to use the Seller’s website or the Products, or any information the entire costs that have been incurred as at the date of
acceptance and confirmation by the Seller, within [7 days] from provided on the website, or in the Products; notification by the Buyer of such delay or cancellation. This
the date of order, to be sent either by email or to the Buyer’s b) any claim attributable to errors, omissions or other may also apply for any other direct or indirect consequential
address. In the absence of any confirmation in writing, orders inaccuracies in the Product or interpretations thereof. loss that may be borne by the Seller, following this decision.
shall be deemed to have been accepted. 4.4 All the information contained in the Products has been 7.2 In the event of breach by one Party under these conditions
2. MAILING OF THE PRODUCTS obtained from sources believed to be reliable. The Seller or the order, the non-breaching Party may send a notification
2.1 P roducts are sent by email to the Buyer: does not warrant the accuracy, completeness adequacy or to the other by recorded delivery letter upon which, after a
• within [1] month from the order for Products already reliability of such information, which cannot be guaranteed to period of thirty (30) days without solving the problem, the
released; or be free from errors. non-breaching Party shall be entitled to terminate all the
• within a reasonable time for Products ordered prior to 4.5 All the Products that the Seller sells may, upon prior notice
pending orders, without being liable for any compensation.
their effective release. In this case, the Seller shall use its best to the Buyer from time to time be modified by or substituted
endeavours to inform the Buyer of an indicative release date with similar Products meeting the needs of the Buyer. This 8. MISCELLANEOUS
and the evolution of the work in progress. modification shall not lead to the liability of the Seller, All the provisions of these Terms and Conditions are for the
2.2 Some weeks prior to the release date the Seller can propose provided that the Seller ensures the substituted Product is benefit of the Seller itself, but also for its licensors, employees
a pre-release discount to the Buyer similar to the Product initially ordered. and agents. Each of them is entitled to assert and enforce those
The Seller shall by no means be responsible for any delay in 4.6 In the case where, after inspection, it is acknowledged that provisions against the Buyer.
respect of article 2.2 above, and including incases where a the Products contain defects, the Seller undertakes to replace Any notices under these Terms and Conditions shall be given in
new event or access to new contradictory information would the defective products as far as the supplies allow and without writing. They shall be effective upon receipt by the other Party.
require for the analyst extra time to compute or compare indemnities or compensation of any kind for labor costs, The Seller may, from time to time, update these Terms and
the data in order to enable the Seller to deliver a high quality delays, loss caused or any other reason. The replacement is Conditions and the Buyer, is deemed to have accepted the latest
Products. guaranteed for a maximum of two months starting from the version of these terms and conditions, provided they have been
2.3 The mailing of the Product will occur only upon payment delivery date. Any replacement is excluded for any event as set communicated to him in due time.
by the Buyer, in accordance with the conditions contained out in article 5 below.
in article 3. 4.7 T
 he deadlines that the Seller is asked to state for the mailing 9. GOVERNING LAW AND JURISDICTION
2.4. The mailing is operated through electronic means either by of the Products are given for information only and are not 9.1 
Any dispute arising out or linked to these Terms and
email via the sales department or automatically online via an guaranteed. If such deadlines are not met, it shall not lead to Conditions or to any contract (orders) entered into in
email/password. If the Product’s electronic delivery format any damages or cancellation of the orders, except for non application of these Terms and Conditions shall be settled
is defective, the Seller undertakes to replace it at no charge acceptable delays exceeding [4] months from the stated by the French Commercial Courts of Lyon, which shall have
to the Buyer provided that it is informed of the defective deadline, without information from the Seller. In such case only, exclusive jurisdiction upon such issues.
formatting within 90 days from the date of the original the Buyer shall be entitled to ask for a reimbursement of its first 9.2 French law shall govern the relation between the Buyer and
download or receipt of the Product. down payment to the exclusion of any further damages. the Seller, in accordance with these Terms and Conditions.
Source: Wikimedia Commons

Yole Développement
From Technologies to Market

© 2018
FIELDS OF EXPERTISE COVERED BY OUR 35+ ANALYSTS
Imaging
Photonics MEMS & Sensors

RF
Devices &
Software
Techno.

Displays MedTech

Solid State Lighting


(LED, OLED, …) Manufacturing

Compound Semi. Advanced


Packaging

Power Electronics Advanced


Substrates
Batteries / Energy Management ©2018 | www.yole.fr | About Yole Développement 22
3 BUSINESS MODELS

o Consulting and Analysis


• Market data & research,
marketing analysis
• Technology analysis
o Reports
• Strategy consulting
• Market & technology reports
• Reverse engineering & costing
• Patent investigation and patent
• Patent analysis
infringement risk analysis
• Design and characterization of o Media
• Teardowns & reverse costing
innovative optical systems
analysis • i-Micronews.com website
• Financial services (due diligence,
• Cost simulation tool • @Micronews e-newsletter
M&A with our partner)
www.i-Micronews.com/reports • Communication & webcast
www.yole.fr
services
• Events: TechDays, forums,…
www.i-Micronews.com

©2018 | www.yole.fr | About Yole Développement 23


A GROUP OF COMPANIES

Due diligence

www.yole.fr

Innovation and business maker


www.bmorpho.com

Manufacturing costs analysis


Market, technology Teardown and reverse engineering
and strategy Cost simulation tools
consulting www.systemplus.fr

www.yole.fr IP analysis
Patent assessment
www.knowmade.fr

Design and characterization of


innovative optical systems
www.piseo.fr

©2018 | www.yole.fr | About Yole Développement 24


OUR GLOBAL ACTIVITY
Europe office
Frankfurt

Paris

Nantes
Yole Korea Yole Inc.
HQ in Lyon
Seoul Phoenix
Vénissieux
Yole Japan
Tokyo
Nice Palo Alto

40%
Greater
China office
Hsinchu

of our business
30%
30%
of our business

of our business

©2018 | www.yole.fr | About Yole Développement 25


ANALYSIS SERVICES - CONTENT COMPARISON
High

Technology
and Market
Report
Breadth of the analysis
Leadership
Meeting

Q&A Meet the Custom


Service Analyst Analysis

Low

Depth of the analysis High


©2018 | www.yole.fr | About Yole Développement 26
SERVING THE ENTIRE SUPPLY CHAIN

Integrators and
end-users

Our analysts Device manufacturers


provide
market
analysis,
technology
evaluation, Suppliers: material, equipment,
and business OSAT, foundries…
plans along
the entire
supply chain

Financial investors,
R&D centers

©2018 | www.yole.fr | About Yole Développement 27


SERVING MULTIPLE INDUSTRIAL FIELDS

Industrial Medical
We work and defense systems
across
multiples
industries to
understand Energy
the impact of management Automotive
More-than-
Moore
technologies
from device Mobile phone
to system Transportation and
makers consumer
electronics
From A to Z…

©2018 | www.yole.fr | About Yole Développement 28


REPORTS COLLECTION
oYole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a collection
of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market & technology analysis, patent investigation and
patent infringement risk analysis, teardowns & reverse costing analysis.They cover:

• MEMS & Sensors • Advanced substrates


• RF devices & technologies • Power electronics
• Imaging • Batteries and energy management
• Medical technologies (MedTech) • Compound semiconductors
• Photonics • Solid state lighting
• Advanced packaging • Displays
• Manufacturing • Software

oYou are looking for:


o An analysis of your product market
o A review of your competitors evolution
o An understanding of your manufacturing and production costs
o An understanding of your industry technology roadmap and related IPs
o A clear view on the evolution of the supply chain…
Our reports are for you! www.i-Micronews.com

The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,
identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry
landscape.
In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of the
industry.
oIn 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Annual Subscription offers and receive at least a 36% discount.

©2018 | www.yole.fr | About Yole Développement 29


OUR 2018 REPORTS COLLECTION (1/3)
MEMS & SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement o PATENT ANALYSES – by KnowMade
− Status of the MEMS Industry 2018 - Update − RF Front End Module – Patent Landscape Analysis
− Silicon Photonics 2018 - Update − RF GaN – Patent Landscape Analysis
− Consumer Biometrics: Sensors & Software 2018 - Update
− MEMS Pressure Sensors 2018 IMAGING & OPTOELECTRONICS
− Air Quality Sensors 2018 o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Sensors for AR/VR 2018 − Status of the CMOS Image Sensor Industry 2018 – Update
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting − Status of the Compact Camera Module Industry 2018 - Update
− Gas & Particles Sensors − 3D Imaging and Sensing 2018 - Update
− MEMS Pressure Sensors − Imaging for Industry and Automation 2018
− Piezo MEMS 2018 * − Sensors for Robotic Vehicles 2018
o PATENT ANALYSES – by KnowMade − Imagers and Detectors for Security and Smart Buildings 2018
− MEMS Microphone – Patent Landscape Analysis − LiDARs 2018
o QUARTERLY UPDATE – by Yole Développement
RF DEVICES AND TECHNOLOGIES − CMOS Image Sensors 2018 *
o MARKET AND TECHNOLOGY REPORT – by Yole Développement o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− RF Front End Module and Connectivity for Cellphones 2018 – Update − CMOS Image Sensors
− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals − Compact Camera Modules
2018 - Update o PATENT ANALYSES – by KnowMade
− RF GaN 2018 – Update − LiDAR – Patent Landscape Analysis
− Advanced RF System-in-Package for Cellphones 2018 – Update * − Time-of-Flight IR Sensor in the Apple iPhone 7 Plus - Patent-to-Product Mapping
− Radar Technologies for Emerging Applications 2018 *
− Radar Technologies for Automotive 2018 SOFTWARE
− RF & Photonic Technologies for 5G Infrastructure 2018 o MARKET AND TECHNOLOGY REPORT – by Yole Développement
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting − Consumer Biometrics: Sensors & Software 2018 - Update
− Processing Hardware and Software for AI: Integration Challenges 2018
− RF Front-End Modules in Smartphones
− RF GaN *

Update : 2017 version still available / *To be confirmed ©2018 | www.yole.fr | About Yole Développement 30
OUR 2018 REPORTS COLLECTION (2/3)
ADVANCED PACKAGING MEMORY
o MARKET AND TECHNOLOGY REPORT – by Yole Développement o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Advanced Packaging Industry 2018 - Update − Emerging Non Volatile Memory 2018 – Update
− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrates − Memory Packaging Market and Technology Report 2018 – Update
Like PCB Trends o QUARTERLY UPDATE – by Yole Développement
− Fan-Out Packaging 2018 – Update − Memory Market 2018 (NAND & DRAM)
− 3D TSV and Monolithic Business Update 2018 – Update o MONTHLY UPDATE – by Yole Développement
− Advanced RF System-in-Package for Cellphones 2018 – Update * − Memory Pricing 2018 (NAND & DRAM)
− Power Packaging Modules 2018 - Update o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− Discrete Power Packaging 2018 – Update − DRAM Technology & Cost Review 2018
− MEMS Packaging and Testing 2018 – Update − NAND Memory Technology & Cost Review 2018
− Memory Packaging Market and Technology Report 2018 – Update
− Status of Panel Level Packaging 2018 COMPOUND SEMICONDUCTORS
− Trends in Automotive for Advanced Packaging 2018 MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Processing Hardware and Software for AI: Integration Challenges 2018 − Status of Compound Semiconductor Industry 2018 *
− Integrated Passive Devices (IPD) 2018 − Power SiC 2018: Materials, Devices, and Applications - Update
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting − Power GaN 2018: Materials, Devices, and Applications – Update
− RF Front-End SiP − RF GaN 2018 – Update
− Fan-Out Packaging * − GaAs Materials, Devices and Applications 2018
o PATENT ANALYSES – by KnowMade − InP Materials, Devices and Applications 2018
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− Power SiC Devices
MANUFACTURING − Power GaN Devices
o MARKET AND TECHNOLOGY REPORT – by Yole Développement o PATENT ANALYSES – by KnowMade
− Manufacturing Wafer Starts for More than Moore 2018 − Power SiC – Patent Landscape Analysis
− Equipment for More than Moore: Technology & Market Trends for Lithography & − Status of the GaN IP – Patent Landscape Analysis
Bonding/Debonding 2018
− Equipment for More than Moore: Technology & Market Trends for Thin Film
Deposition & Etching 2018
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− Wafer Bonding Technology Overview 2018

Update : 2017 version still available / *To be confirmed ©2018 | www.yole.fr | About Yole Développement 31
OUR 2018 REPORTS COLLECTION (3/3)
POWER ELECTRONICS o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
MARKET AND TECHNOLOGY REPORT – by Yole Développement − VCSELs 2018
− Status of Power Electronics Industry 2018 - Update − UV LEDs 2018 *
− Power Packaging Modules 2018 - Update
− Discrete Power Packaging 2018 - Update DISPLAYS
− EV/HEV Market Expectations and Technology Trends - Update o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Wireless Charging Market Expectations and Technology Trends 2018 − MicroLED Displays 2018 – Update
− Integrated Passive Devices (IPD) 2018 − Quantum Dots and Wide Color Gamut Display Technologies 2018 - Update
o QUARTERLY UPDATE – by Yole Développement − Organic Thin Film Transistor 2018: Flexible Displays and Other Applications -
− Power ICs Market 2018 – Update Update *
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting − Displays for AR / VR / MR 2018
− Power ICs Market 2018 * − Non Display Applications of MicroLEDs 2018 *
− Power Modules * o PATENT ANALYSES – by KnowMade
− MicroLED Display – Patent Landscape Analysis
BATTERY AND ENERGY MANAGEMENT
o MARKET AND TECHNOLOGY REPORT – by Yole Développement MEDTECH
− Status of Battery Industry Update with Focus on Manufacturing 2018 * o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Battery Pack Technology and Business Opportunities 2018 - Update − Status of the BioMEMS Industry 2018 - Update
o PATENT ANALYSES – by KnowMade − Point-of-Need Testing: Application of Microfluidic Technologies 2018 - Update
− Solid-State Batteries – Patent Landscape Analysis − Neuro-Technologies for Healthcare and Consumer Applications 2018
− CRISPR Technology: From Lab to Industries 2018
SOLID STATE LIGHTING − Portable Medical Imaging 2018
o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Inkjet for Additive Manufacturing in the Micro-Electronics Industry 2018
− IR LEDs and Lasers 2018 - Update − Liquid Biopsy 2018: From Isolation to Downstream Applications
− Automotive Lighting 2018 – Update − Chinese Microfluidics Industry 2018
− UV LEDs 2018 - Update o PATENT ANALYSES – by KnowMade
− VCSELs 2018 − Microfluidic IC Cooling – Patent Landscape Analysis
− Lasers 2018 − Circulating Tumor Cell Isolation – Patent Landscape Analysis
− Light Shaping Technologies 2018 − Organ-on-a-Chip – Patent Landscape Analysis
− LiFi 2018

Update : 2017 version still available / *To be confirmed ©2018 | www.yole.fr | About Yole Développement 32
OUR 2017 PUBLISHED REPORTS (1/3)
MEMS & SENSORS − 5G Impact on RF Front-End Industry 2017
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2017 ADVANCED PACKAGING
− High End Inertial Systems Market and Technology 2017 o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Magnetic Sensors Market and Technologies 2017 − Status of the Advanced Packaging Industry 2017
− MEMS and Sensors for Automotive - Market and Technology Trends 2017 − Embedded Die Packaging: Technology and Market Trends 2017
− Acoustic MEMS and Audio Solutions 2017 − Fan-Out: Technologies and Market trends 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017 − Advanced Substrates Overview: From IC Package to Board 2017
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017 − 3D TSV and 2.5D Business Update - Market and Technology Trends 2017
o REVERSE COSTING REPORT – by System Plus Consulting − Advanced RF System-in-Package for Cellphones 2017
− Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Systems – − Memory Packaging Market and Technology Report 2017
Reverse Costing Report − MEMS Packaging 2017
− Bosch Mobility Ultrasonic Sensor – Reverse Costing Report − Emerging Non-Volatile Memory 2017
− MEMS Packaging 2017 - Reverse Costing Review o REVERSE COSTING REPORT – by System Plus Consulting
− Bosch BMP380 Pressure Sensor – Reverse Costing Report − NVIDIA Tesla P100 - Reverse Costing Report
− MEMS Packaging - Reverse Technology Review
IMAGING & PHOTONICS − Advanced RF SiP for Cellphones 2017 - Reverse Costing Review
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the CMOS Image Sensor Industry 2017 SOFTWARE
− 3D Imaging and Sensing 2017 o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Uncooled Infrared Imaging Technology & Market Trends 2017 − Embedded Software in Vision Systems
− Camera Module Industry Market and Technology Trends 2017
o REVERSE COSTING REPORT – by System Plus Consulting MEDTECH
− FLIR Boson – a small, innovative, low power, smart thermal camera core – Reverse o MARKET AND TECHNOLOGY REPORT – by Yole Développement
Costing Report − Status of the Microfluidics Industry 2017
− Camera Module Physical Analyses Overview 2017 − Solid-State Medical Imaging 2017
− Organs-On-Chips 2017
RF DEVICES AND TECHNOLOGIES − Connected Medical Devices Market and Business Models 2017
o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Artificial Organ Technology and Market analysis 2017
− RF Front End Modules and Components for Cellphones 2017 − Medical Robotics Technology & Market Analysis 2017
− Advanced RF System-in-Package for Cell Phones 2017
©2018 | www.yole.fr | About Yole Développement 33
OUR 2017 PUBLISHED REPORTS (2/3)

MANUFACTURING POWER ELECTRONICS


o MARKET AND TECHNOLOGY REPORT – by Yole Développement o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Laser Technologies for Semiconductor Manufacturing 2017 − Status of the Power Electronics Industry 2017
− Equipment and Materials for 3D TSV Applications 2017 − Thermal Management Technology and Market Perspectives in Power Electronics and
− Equipment and Materials for Fan-Out Packaging 2017 LEDs 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017 − Gate Driver Market and Technology Trends 2017
− Power MOSFET 2017: Market and Technology Trends
BATTERIES & ENERGY MANAGEMENT − Power Module Packaging: Material Market and Technology Trends 2017
o MARKET AND TECHNOLOGY REPORT – by Yole Développement − IGBT Market and Technology Trends 2017
− Status of the Rechargeable Li-ion Battery Industry o QUARTERLY UPDATE – by Yole Développement
− Market Opportunities for Thermal Management Components in Smartphones − Power Management ICs Market 2017
o REVERSE COSTING REPORT – by System Plus Consulting
− EPC2045 100V GaN-on-Silicon Transistor – Reverse Costing Report
DISPLAYS
− Silicon Capacitor - Technology and Cost Review
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Industrial 100V MOSFET - Technology and Cost Review
− MicroLED Displays
− InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor
− Quantum Dots and Wide Color Gamut Display Technologies
Combo – Reverse Costing Report
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

COMPOUND SEMICONDUCTORS
SOLID STATE LIGHTING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Bulk GaN Substrate Market 2017
− LED Packaging 2017: Market, Technology and Industry Landscape
− RF Power Market and Technologies 2017: GaN, GaAs and LDMOS
− CSP LED Lighting Modules
− Power SiC 2017: Materials, Devices, Modules, and Applications
− IR LEDS and VCSELs - Technology, Applications and Industry Trends
− Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− Automotive Lighting: Technology, Industry and Market Trends 2017
− Horticultural LED Lighting: Market, Industry, and Technology Trends

©2018 | www.yole.fr | About Yole Développement 34


OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent Landscape Analysis
− RF Acoustic Wave Filters Patent Landscape Analysis
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N Patent Watch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− Microfluidic Technologies for Diagnostic Applications Patent Landscape

TEARDOWN & REVERSE COSTING – by System Plus Consulting


More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017

MORE INFORMATION
o All the published reports from the Yole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Annual Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).

©2018 | www.yole.fr | About Yole Développement 35


MICRONEWS MEDIA

o About Micronews Media ONLINE ONSITE INPERSON


To meet the growing demand for market,
@Micronews e-newsletter
technological and business information,
i-Micronews.com
Micronews Media integrates several tools able Events Webcasts
i-Micronewsjp.com
to reach each individual contact within its FreeFullPDF.com
network.We will ensure you benefit from this.
Brand visibility, networking
Targeted audience
opportunities
involvement equals clear,
Unique, cost-effective ways Today's technology makes it
concise perception of your
to reach global audiences. easy for us to communicate
company’s message.
Online display advertising regularly, quickly, and
Webcasts are a smart,
campaigns are great strategies inexpensively – but when
innovative way of
for improving your understanding each other is
communicating to a wider
product/brand visibility. They critical, there is no substitute
targeted audience. Webcasts
are also an efficient way to for meeting in-person. Events
create very useful, dynamic
adapt with the demands of the are the best way to exchange
reference material for
times and to evolve an effective ideas with your customers,
attendees and also for
marketing plan and strategy. partners, prospects while
absentees, thanks to the
increasing your brand/product
recording technology.
visibility.
Benefit from the i-Micronews.com
traffic generated by the 11,200+ Several key events planned for Gain new leads for your business
monthly unique visitors, the 2018 on different topics to from an average of 340
10,500+ weekly readers of attract 120 attendees on average registrants per webcast
@Micronew se-newsletter

Contact: Camille Veyrier (veyrier@yole.fr), Marketing & Communication Project Manager

©2018 | www.yole.fr | About Yole Développement 36


CONTACT INFORMATION
oCONSULTING AND SPECIFIC ANALYSIS
o North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr – +1 31 06 008 267
o Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development
Email: onozawa@yole.fr - +81 3 4405 9204
o Greater China: Mavis Wang, Director of Greater China Business Development
Email: wang@yole.fr - +886 979 336 809
o RoW: Jean-Christophe Eloy, CEO & President, Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80

oREPORT BUSINESS
o North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr – +1 31 06 008 267
o Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
o Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development
Email: onozawa@yole.fr - +81 3 4405 9204 Follow us on
o Japan: Miho Othake, Account Manager
Email: ohtake@yole.fr - +81 3 4405 9204
o Greater China: Mavis Wang, Director of Greater China Business Development
Email: wang@yole.fr - +886 979 336 809

oFINANCIAL SERVICES (in partnership with Woodside Capital Partners)


o Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr - +33 4 72 83 01 80

oGENERAL
o Public Relations: leroy@yole.fr - +33 4 72 83 01 89
o Email: info@yole.fr - +33 4 72 83 01 80

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