RAW MATERIALS FOR MANUFACTURE OF PCBs AT ZERO DUTY

VIDE MINI BUDGET NOTIFICATION NO. 9/2004 DATED 8.1.2004,

INCLUSIVE OF ALL EARLIER NOTIFICATIONS COVERING RAW
MATERIALS AS INDICATED.
( Required raw materials for PCB Manufacture are indicated in red)
Table

S.No Cha Description of imported

Description of finished goods
. pter goods
(1) (2) (3) (4)
LIS
T A 15,2
Copper clad laminates phenolic
9,32 Alpha cellulose paper/cotton
or paper phenolic or glass ep-
, paper; Electrical grade kraft
1. oxy types; composite type
34,3 paper; Tung oil; Volan/Silane
copper clad laminates; printed
9,48 treated glass fabric/cloth
circuit boards.
, 70
Potassium
25,2
Carbonate/Potassium
8,40
Nitrate (prilled); Barium
, Glass shell/parts of television
2. carbonate; Pumice powder;
56,7 picture tube.
Cerium oxide; Anode buttons;
0,84
Necks and Neck tubings;
, 85
Wool felt; Spodumene
(In
25,2
Strontium carbonate; garnet
8,40
powder; stud pins; Titanium Class shells/parts for colour
3. , 70,
dioxide; sodium antimonate; picture tubes.
84,
rubber sleeve
85
4. Omitted
5. 28 High purity gases : Argon; Integrated circuits, Semi-
halocarbon-14; halocarbon- conductor devices.
116; halocar-bon-23; helium;
silicon tetra-chloride; sulphur
hexafluoride; chlorine; silane;
hydrochloric acid; phosphine
& silane mixture; boron
trichloride; dichlorosilane;
diborane; hydrogen bromide;
col.3
bold
wor
ds
has
been
subs
titut phosphine in nitrogen; nitrous
ed oxide; boron trifluoride; arsine
vide & arsine mixture; phosphine
Cus in hydrogen; hydrogen;
Ntf nitrogen
No.2
6/20
02
Dt.1
/03/
2002
)
High purity chemicals: Acetic
acid MOS/CMOS grade;
Sulphuric acid MOS/ CMOS
grade; Hydrochloric acid
MOS/CMOS grade; Buffered
oxide etchant MOS/ CMOS
grade; Ammonium fluoride
MOS/CMOS • grade;
28,2 Trichloro-ethylene MOS/ Integrated circuits, Semi-
6.
9 CMOS grade; Isopropyi conductor devices.
alcohol MOS/CMOS grade;
Acetone MOS/CMOS grade;
Hydrofluoric acid MOS/
CMOS grade; Nitric acid
MOS/CMOS grade; Phos-
phoric acid MOS/CMOS
grade; Hydrogen peroxide
MOS/ CMOS grade
7. 28,2 Cadmium sulphide; cadmium Solar cells/modules.
9,38 telluride; silicon dioxide;
, 76 cadmium chloride; zinc
telluride; indium; germane;
disilane; phosphine; hydrogen
 fluoride; aluminium sputtering
target; zinc oxide sputtering
target, adhesive coated
aluminium foil; high purity
hydrogen high purity nitrogen;
high purity argon; copper
doped graphite paste; high
purity methane; diborane in
high purity helium
Copper plating salts, their i,
brighteners, levellers, condi
28,2
tioners, replenishers, stabi
9,32
lizers; Black Oxide Coating
8. 38,3 Printed Circuit Boards.
(Microtech) solution/ salts,
9,68
predip solution/salts,
74 .,
palladium catalyst solution/
salts
Hybrid Microcircuits;
28,2 Resistive, Conductive, Di- Potentiometers; Resistors
9,32 electric, Overglaze or solder (other than heating resistors);
9.
38,7 pastes, compositions or inks in Ceramic and Mica Capacitors;
1 packing not exceeding 20 kg. Conductive Rubber
Switches/Key Boards.
Ceramic bodies (coated or
uncoated); bandoliering tape
with or without adhesives;
28,2
solder plated copper wire of
9,32
dia. upto 1 mm; solder plated
,39,
10. brass wire of dia. upto 1 mm; Thermistors.
48,6
high melting point solder
9,74
alloy; paper backed
,85
polyurethane tape; epoxy
marking ink with or without
hardner/thinner
28,2 Semi-conductor devices,
11. Resist stripper
9,34 printed circuit boards.
12. 28,2 Special materials: Surfactant, Integrated circuits, Semi-
9,34 tetra ethyl-ortho-silicate conductor devices.
,85 (TEOS); trimethyl borate
(TMB); trimethyl phosphite
(TMPI); trichloroethane
(TCA); dichloroethylene;
 sputtering targets; photo resist
primer; edge bead remover
Photo resist & associated
28,2 Semi-conductor devices,
13. thinners or/and developers;
9,37 printed circuit boards.
photospin glass
28,2 Etched or Formed Aluminium
14. Electrolyte
9,38 Foil, Electrolytic Capacitors.
28, Dopants or doping sources in
15. 29,3 all forms, and with or without Semi-conductor devices.
8 precious metal constituents
Capacitors; Semi-conductor
Devices; Light Emitting
Diodes; mounted piezo
electric crystal; Liquid Crystal
Displays; Electronic Valves
and Tubes; Switches; Copper
clad laminates of glass
epoxy/paper expoxy type;
composite type copper clad
laminates; Delay lines; Line
and Wave Traps;
Epoxy/Epoxide resins/ Epoxy Potentiometers; Silicon
28,2 moulding powder, compounds Crystals or Silicon wafers;
16. 9,38 or encapsulants; Fillers, Connectors; Resistors (other
,39 thinners, hardeners, than heating resistors);
accelerators and fire retardants Deflection parts;
Loudspeakers; Magnetic
Heads; Paper Cones/
Spiders/Dust Caps for
Loudspeaker; Hybrid
Microcircuits; Printed parts.

(In S. No.16, in column (4)

bold words has been
substituted vide CUS NTF
NO. 28/2003 DATE
01/03/2003)
17. 28, Ferric Oxide of purity of 99% Ferrites.
32 and above; manganous
manganic oxide with
manganese content 71% or
above; Manganese di-oxide of
 purity of 99% and above,
Manganous Oxide; Nickel
Oxide; Strontium Carbonate

(In S. No.17, in column (3)

bold words has been
substituted vide CUS NTF
NO. 28/2003 DATE
01/03/2003)
Aluminium paste; ethylene
vinyl acetate sheets (EVA);
primer for EVA; Crane glass;
tedlar coated aluminium sheet;
phosphorous oxychloride;
halo carbon (CF4)/Freon gas;
tinned copper interconnect;
toughened glass with low iron
28,3 content and transmittivity of
8,39 min. 90% and above;
18. ,70, multilayered sheets with tedlar Solar cells/modules.
74,7 base; fluro polymer resin;
6 ultra high purity (UHP) silane
in UHP nitrogen; UHP silane;
diborane in UHP silane;
MOCVD grade phosphine in
UHP silane; silver sputtering
target; high purity tin
tetrachloride; nitrogen
trifluoride of 99% purity and
above
Mounted piezoelectric crystals;
Printed Circuit Boards; Semi-
conductor devices;
Potentiometers; Resistors
Blue steel lapping
28,3 (other than heating resistors);
carriers/lapping carriers;
9, Connectors; Switches; Relays;
19. lapping vehicles; lapping
68,7 Tape deck mechanism;
abrasive powder; lapping
3 Magnetic heads; Deflection
compound
parts; DC micromotor upto
13.5 V not exceeding 20 Watt
rating; Silicon in all forms,
LED lamps and displays.
 Tantalum powder; Tantalum
28,2
wire; CM Seals; Cans; Silver
9,
20. powder suspension; Tantalum capacitors.
81,8
Manganese Nitrate; Heat
5
shrinkable polyester tubing
Lead based ceramic
composition; Magnesium
titanate based ceramic
composition; Neodium based
ceramic composition; Alumina
28,4
setters/slabs; Lint free
8,69
paper/paper towels/filter Ceramic dielectric (multilayer)
21. ,75,
paper; Zirconia milling capacitors.
78,8
media/high alumina tumbling
1,84
media; Steel shots – copper
plated hollow; Nickel and
sulphonic acid based plating
chemicals; Razer
blades/doctor blades
Tantalum Neodyme oxide;
28,
22. Neodyme oxide; Strontium Ceramic Capacitors.
68
carbonate
Crystal Holders; Bases;
28,7
covers; Glass Bulbs; Glass
0,73
23. Bases; Nickel Eyelets; Mounted Piezoelectric crystals.
,75,
Springs; Solder wire 25 SWG
85
or thinner; Chromium Pellets
Tungsten rhenium wire;
Suspension of aluminium
oxide in binder; Suspension of
28, tungsten powder and Electron guns and electron gun
24.
81 aluminium oxide in binder; parts.
Triple carbonate suspension of
calcium, barium, strontium in
binder
Tetra Bromo Bisphenol-A; Copper clad laminates for
25. 29
Tricresyl/Aryl Phosphate Printed Circuit Boards.
26. 32 Electron Phosphor Electronic Valves and Tubes
27. 32 Desmearing agents Printed Circuit Boards.
28 32,3 Silicone based resins, oils, Semi-conductor Devices;
5,39 varnishes, lacquers, Liquid Crystal Displays;
elastomers, with or without Electronic Valves and Tubes;
 Resistors (other than heating
resistors); Connectors;
Magnetic Tape; Relays;
additives Potentiometers; Switches;
Capacitor grade metallised
plastic film; Piezoelectric
crystal; Hybrid Micro circuits.
32,3 Solder Mask/Resist in ink or
29. 7, film form, with or without Printed Circuit Boards.
39 associated catalysts
Semi-conductor devices,
printed circuit boards,
Screen printing inks, dyes,
potentiometers, capacitors,
32,3 emulsions, lacquers, films
30. hybrid microcircuits, printed
8 (including sensitisers,
parts, coils and inductors,
hardners, catalysts)
resistors (other than heating
resistors).
internal dag, aqua dag,
graphite, hitasols, external
quoting graphite or external
dag
32,
31. Electronic Valves and Tubes.
38
(In S. No.31, column (3) has
been substituted vide CUS
NTF NO. 28/2003 DATE
01/03/2003)
35, Polyamide coatings or Semi-conductor devices; Heat
32.
39 adhesives sinks; deflectioii parts.
Printed Circuit Boards; Liquid
33 37 Photo Polymer Film
Crystal Displays.
High resolution, high contrast
Printed Circuit Boards; semi-
37, photographic films and photo
34 conductor devices; hybrid
39 stencil films; DIAZO
microcircuits.
(C6H5N2) films
High Resolution Photo Masks;
Semi-conductor devices;
37, High Resolution Photo Plates;
35. Liquid Crystal Displays;
70 Photomask Substrates
Silicon Single Crystals or
Wafers.
Semi-conductor devices;
37,
36. High resolution photo mask Printed Circuit Boards; Liquid
70
Crystal Displays.
 Silicon in the form of
37. 38 undiffused wafers, discs or Semi-conductor devices.
chips
Polyvinyl flouride
38,3
38. (TEDLAR); Tedlar Solar cells/modules.
9,76
Aluminium Tedlar
38,
39. Lithium niobate wafers Hybrid microcircuits.
81
Silicon in the form of diffused
38, Hybrid microcircuits or semi-
40. wafers, discs or chips (with or
85 conductor devices.
without molybdenum disc)
38,
41. Getters Electronic valves and tubes.
85
Glass epoxy or/and polyamide Multilayer Printed Circuit
42. 39
prepregs Boards; copper clad laminates.
Keypad switches; parts of EHT
43. 39 Silicone rubber
transformers.
Plastic Film Capacitors or
Mixed Dielectric Capacitors,
other than Power Capacitors.

Explanation.- for the removal

of doubts, “plain plastic film”
Plastic Film Capacitors; Mixed
44. 39 includes bi-axially oriented
Dielectric Capacitors.
polypropylene (BOPP) film

(In S. No.44 Explanation has

been inserted vide CUS NTF
NO. 28/2003 DATE
01/03/2003)
Nylon 6.30% glass filled,
flame retardant moulding
45. 39 Potentiometers; connectors.
powder/granules and with or
without other additives
Plain and glass filled
Relays; Potentiometers; tape
46. 39 nylon/polyamide with or
deck mechanism; connectors.
without other additives
Polypropylene moulding
47. 39 Deflection parts; Cassettes.
powder / granules
Connectors; deflection parts;
48. 39 Polybutylene terephthalate
switches; relays.
 Heat shrinkable PVC sleeving,Capacitors; relays; deflection
49. 39
tubing, film or ring parts.
Mounted piezoelectric crystals;
Printed Circuit Boards/semi-
conductors devices;
potentiometers; resistors (other
than heating resistors);
connectors; switches; relays;
50. 39 Polyurethane lapping pads
tape deck mechanisms;
magnetic heads; deflection
parts; DC Micromotors upto
13.5 volts and not exceeding
20 watts rating silicon (in all
forms).
Plain film capacitors; mixed
51. 39 Plain polystyrene film
dielectric capacitors.
Plain plastic film (other than
Polystyrene film) of thickness
12 microns or below
Electronic capacitor grade
52. 39 metallised dielectric plastic
'Explanation.- For the removal
film.
of doubt, "plan plastic film"
includes Biaxially Oriented
Polypropylene (BOPP) film;
Release film for multilayer
53. 39 Printed Circuit Boards.
laminates
Polyvinyl Alcohol,
39, Polyisobutylene,
54. Ferrites.
40 Chlorosulphona ted
Polyethylene (HYPALON)
Antistatic materials in the
form of tubes, strips, mats,
39,
55. covers, bins, boxes, containers
43
Semi-conductor devices.
Hybrid microcircuits.
Insulating/taping material Capacitors; deflection parts;
39,4
(including pocket carrier tape) resistors (other than heating
56. 8,59
in tape, roll or strip form with resistors); semi-conductor
, 85
or without adhesive devices; inductors.
39,4 Domes or Dust caps;
57. Loudspeakers.
8,85 Paper/Plastic cones
58. 39,4 Parts of Potentiometers Potentiometers.
 8,85
Screen mesh of stainless
39,
steel/polyester/metallised
59. 59, Ceramic capacitors.
polyester/metallised nylon (in
73
sizes of mesh 60 or above)
39,
60. 69,7 Ceramic/alumina substrates Potentiometers; printed parts.
3,85
39,
73,
61. Parts of magnetic sound heads Magnetic sound heads.
79,8
5
Copper clad laminates
laminated to nylon, teflon,
39,7
62. polyester; Aluminium clad Printed Circuit Boards.
4
entry foil and back up
laminates
Polyethylene terephthalate
film with ferro magnetic
39,8
63. coating of thickness upto Floppy diskettes.
5
0.005 inch with magnetic
coating 50 to 180 microinch
39,7 Moulded shell with liner, Steel
63A. Floppy diskette (3.5" size).
3 hub ring, spring, shutter
Liquid Crystal Displays; Semi-
conductor Devices; EHT
39,8 Parts/articles of silicone,
64. Transformers; Potentiometers;
5 Elastomer or Silicone rubber
Electrolytic Capacitors; Solid
tantalum capacitors.
Formers, bases, bobbins;
39,8 RF/IF coils or transformers or
65. Holders, brackets; Shielding
5 deflection parts.
cases,cans
40,5 Bungs; Rubber pinch rollers Electrolytic capacitors; tape
66.
9 with or without plastic bush deck mechanisms.
Parts of Rotor Assembly;
40, DC Micromotors upto 13.5
Commutator assembly or parts
67 84,8 volts and not exceeding 20
thereof; Brush assembly or
5 watts rating.
parts thereof
68. 40, Anode assembly consisting of Deflection parts.
85 EHT cable, silicone rubber
cap and contact spring or parts
thereof (EHT cable in cut
 pieces or running length)
Electrolytic
Electrolytic Capacitors; Plastic
69. 48 Capacitor/Condenser Tissue
Film Capacitors.
paper
48,7 Kraft paper/tissue paper or
70. Loud-speakers (cone type).
6 aluminium foil for voice coil
Felt sheet (fully compressed)
71 59 of 1.5 mm thickness and Tape deck mechanism.
below
Headers; Caps with or without
leads; Cans with or without
Semi-conductor devices; Light
leads; Pins; Stud seals; Lead
Emitting Diodes; Resistors
69, beads; Ceramic beads;
(other than heating resistors);
72. 78,8 Ceramic-glass packages; Cap
Capacitors; Connectors;
5 to Lead Assembles; Ceramic
Hybrid Microcircuits; Printed
Pipes; Lead frames, single or
parts.
in roll form; Housings; Brass
ring
Alumina rods and bars (with
Alumina content above 90%) Resistors (other than heating
in coated or uncoated form; resistors); Semi-conductor
69,
73. Ceramic plates/flats/cases/ Devices; Hybrid Microcircuits;
85
bases/formers; Steatite rods Electron Guns and Electron
and bars in coated or uncoated Gun parts.
form
69,8 Ceramic dielectric (coated or
74. Ceramic capacitors.
5 uncoated)
Silane treated glass cloth/fabric
75. 70 Glass filament yam for use in the copper clad
laminates.
Liquid Crystal Displays; semi-
conductor devices; Electronic
valves and tubes (other than
television picture tubes/cathode
ray tubes); Glass to metal
Glass frit or glass powder;
32,7 seals; Lead frames; Transistor
76. Glass preforms or pellets;
0,85 headers; Reed relays or Reed
Glass tubes
switches; delay lines; resistors
(other than heating resistors);
mounted piezoelectric crystals;
electron guns and electron gun
parts; gas discharge tubes.
 70, Semi-conductor devices;
77. Fused Quartzware
85 silicon in all forms.
Synthetic quartz crystal blocks
78. 71 Mounted Piezoelectric crystals.
and blanks
Contact tape with pure Nickel
base and Crown Gold alloy;
Contact tape with solder
79. 71 Diamond Back in fine silver; Relays; Switches.
Contact tape in silver or silver
alloy with or without
palladium with Gold overlay
Gold in the form of wire,
Semi-conductor devices; Light
80. 71 ribbon, preform of purity
Editing Diodes.
99.99 % and above
71,
72, Nickel plated steel strip; tin
81. Semi-conductor devices.
75,8 silver antimony alloy
0
Aluminium wire with silicon
71, or magnesium impurity of
82. 76, upto 2%; gold wire with Semi-conductor devices.
85 phosphorous or antimony
doping
CRNGO silicon steel strip
DC Micromotor;
83. 72 /sheet/coil/hoop with or
Potentiometer; Resistors.
without tin plating
Coated/uncoated electro-
galvanised CRCA/ mild steel/ DC Micromotor; tape deck
84. 72
stainless steel in the form of mechanism.
sheet / s trip /wire/coils
72,7 Iron of 99.7% purity and Cast Alloy Permanent
85.
3 above Magnets.
Semi-conductor devices;
electronic valves and tubes;
72,
transistor headers; glass to
73, Nickel Iron Cobalt Alloy in all
86. metal seals/lead frames; cast
75,8 forms
alloy permanent magnets;
1
hybrid microcircuits; gas
discharge tubes.
87. 72 Copper clad tin coated steel Lead tabs for electrolytic
or wire, dia 0.4 mm to 1.2 mm/ capacitors.
73 solder plated Copper cover
 steel wire (SPC).
Potentiometers; Hybrid
73,8 Metal clad substrates in any microcircuits; Printed parts;
88.
5 form with or without tags semi-conductor devices; Light
Emitting Diodes.
Electrolytic Tough Pitch
89. 74 Lead wire for electronic parts.
(ETP) Copper wire rods
Potentiometers/parts of
potentiometers;
connectors/parts of connectors;
switches/parts of switches;
Solder plated/unplated brass- relays/parts of relays.
strips upto 100 mm width;
90 74
silver plated brass strips upto (Col.4 has been substituted
100 mm width vide Cus Ntf No.57/2002 date
31/05/2002)

[OLD Potentiometers;
connectors; switches; relays.]
Relays/parts of relays; Tape
Deck Mechanism;
connectors/parts of connectors;
potentiometers/parts of
potentiometers; Heat Sinks;
cassettes; parts of cassettes;
T.V.Tuner; telescopic antenna;
gas discharge tubes/parts of gas
Phosphor Bronze Sheets/ bars/ discharge tubes.
section/ flats/
91. 74
strips/wire/rods/foils/ pipes, (Col.4 has been substituted
with or without plating vide Cus Ntf No.57/2002 date
31/05/2002)

[OLD Relays; Tape Deck

Mechanism; Connectors;
Potentio-meters; Heat Sinks;
cassettes; parts of cassettes;
T.V. tuner; telescopic antenna;
Gas discharge tubes.]
92. 74 Beryllium Copper Connectors/parts of
rods/strips/sheets/wire/ foils, connectors; relays/parts of
with or without plating ; relays; switches/parts of
 switches; gas discharge
tubes/parts of gas discharge
tubes.

Rectangular Profile Brass (Col.4 has been substituted

material(CuZn39Pb2) vide Cus Ntf No.57/2002 date
31/05/2002)

[OLD Connectors; Relays;

Switches; gas discharge tubes.]

Tin coated/solder plated

93. 74 Resistors.
copper wire
Continuous cast copper wire
rod/copper scrap, electrolytic Copper foil for copper clad
94. 74
grade of purity 99.9% or laminates.
above
02
Dt.1 74,7 Copper-cadmium braided
95. 6, wire/Self-soldering/self- Loudspeakers; microphones.
85 bonding aluminium wire
Oxygen-free high conductivity
74,8
96. (OFHC) Copper base with Semi-conductor devices.
5
weldable steel ring
OFHC copper wires, bars, Semi-conductor devices;
74,8 rods, angles, shapes and electronic valves and tubes;
97.
5 sections, plates, sheets, strips, transistor headers; glass to
tubes and pipes metal seals; capacitors.
Rayon or Silk cover Litz wire
of the following sizes -(a) 6, 8,
74,8 12 and 24 strands with each
98. RF/IF Coils or transformers.
5 strand diameter 0.03 mm; (b)
6 or 9 strands with each strand
diameter 0.04 mm
Semi-conductor devices,
74,8 electronic valves & tubes,
99. Parts made of OFHC copper
5 transistor headers, glass to
metal seals, capacitors.
Etched or formed Aluminium
100. 76 Electrolytic Capacitors.
Foils
101. 76 Plain Aluminium foil Etched or formed Aluminium
containing more than 99% foil; electrolytic capacitors or
 Aluminium plastic film capacitors.
Cans or Leads for Electrolytic
Aluminium of purity 99% or Capacitors; Semi-conductor
above in the form of wire, Devices; Light Emitting
102. 76 strips, sheets, rods, bars, diodes; Capacitors; Capacitor
pipes, plates, sections, ribbons grade Metallised Plastic films;
or shapes Potentiometers; Disc covers for
electrolytic capacitors.
Cast Alloy Permanent Magne
103. 81 Cobalt
ts.
Semi-conductor devices,
Mounted piezo electric
High purity chromium powder
104. 81 crystals, electronic valves and
(99.99% and above)
tubes, vacuum interrupter
tubes.
Molybdenum and Electronic Valves and Tubes;
81,8 molybdenum alloys, wrought, X-ray tubes; Semi-conductor
105.
5 in all forms and articles and Devices; Mounted
parts thereof Piezoelectric Crystals.
84,8 Parts of Vacuum Interrupter
106. Vacuum Interrupter Tubes.
5 Tubes
Deflection parts;
Loudspeakers; Relays;
Magnetic Heads; RF/IF Coils;
Self bonding/Self soldering
Transformers (other than
107. 85 insulated or enamelled copper
Power transformers); DC
wire
Micromotors upto 13.5 volts
and not exceeding 20 watts
rating; electronic tuner.
02
Dt.1
108. 85 Parts of gas discharge tubes Gas discharge tubes.
Light Emitting Diodes in the
Light Emitting. Diodes; Lamps
109. 85 form of Chips, wafers or
and Displays.
undiced discs
Parts of Cathode Ray Tubes
110. 85 Cathode Ray Tubes.
(other, than Glass parts)
111. 85 Lead Tabs/Paddle Tabs Electrolytic Capacitors.
Parts of Relays, Switches,
112. 85 Relays; Switches; Connectors.
Connectors
113. 85 Parts of electron Guns Electron Guns, Television
picture tubes or Cathode Ray
 Tubes.
114. 85 Casings of aluminium Electrolytic capacitors.
115. 85 Parts of CD-Deck Mechanism CD Deck Mechanism.
116. 85 Parts of Fly-back Transformer Flyback Transformers.
117. 85 Parts of Tuners TV Tuners.
118. 85 Parts of Data Cartridge Data Cartridge.
119. 85 Parts of transmitting tubes Transmitting tubes.
Parts of deflection yoke (DY),
120. 85 excluding colour deflection Deflection parts.
yoke core
121.003
DAT Semi-conductor Devices;
Liquid Crystal Displays;
Electronic valves and tubes;
Pick-up cartridges; Stylii; X-
Ray Tubes; Cast Alloy
Permanent magnets; Transistor
[OL Nickel and nickel alloys,
75,8 Headers; Glass to metal seals;
D wrought in all forms and
5, 90 Lead frames; Resistors (other
121. articles thereof
than heating resistors);
Magnetic Heads;
Potentiometers; Electron guns
and electron gun parts; Electro-
magnetic shields; Encoders
and synchros.]
39,7 Composite copper clad
122 4,75, materials consisting of Paper Printed Circuit Boards
76 + Epoxy + Glass cloth
Glass Epoxy Copper clad
123 74 laminates or Paper Phenolic Printed Circuit Boards
Copper clad laminates
Copper clad laminates
(phenolic or glass epoxy
Copper foils(plain or adhesive
124 74 types);composite type copper
coated)
clad laminates; multi-layer
Printed Circuit Boards
125 28,2 Cupric Chloride Etchant; Printed Circuit Boards
9,38, Ammonical Etchants; Solid
72, Carbide Drills; Routers; Hot
74,8 Air Levelling Flux;
4 Electroless Copper Plating
 Solution; Sensitisers;
Activators; Post Activators;
Copper foil of refined copper;
Colloidal / Semi colloidal
Graphite (Shadow)
Plastic Film for Wafer Dicing;
Graphite Jigs /Block/
Rods /Plates; Dicing blades/
wheels; Tungsten filament and
or parts thereof;
Tungsten Wire / Rod; Colour
28,2 Paste and Diffusants; Silver LED/LED Displays;
9,39, conductive paste / Suspension; Semiconductor Devices;
126 68,7 Palladium Wire; n- Butyl Hybrid Microcircuits; Mounted
1,81, Acetate; Bonding Tools Piezo Electric Crystals;
82 Resistors; Potentiometers
(In Col.3 bold words has
been substituted vide Cus
Ntf No.57/2002 date
31/05/2002)

[OLD
Parts of data graphic display Data graphic display
70,8 tubes(colour), with a phosphor tubes(colour), with a phosphor
127
5 dot screen pitch smaller than dot screen pitch smaller than
0.4mm 0.4mm
Glass Tubes/ Insulators/
Spacers;
70,7
128 (S.No.128 column (3) has Mounted piezo electric crystals
5
been substituted vide CUS
NTF NO. 28/2003 DATE
01/03/2003)
129 39 Diallylphthalate(DAP) Connectors; Switches with
Moulding Powder or contact rating less than 5
Compound (Plain or amperes at voltage not
Glass/Fibre filled with or exceeding 250 Volts AC or
without additives) DC; Potentiometers; Relays of
contact rating upto 7 amperes;
(Col.3 has been substituted Resistors
vide Cus Ntf No.57/2002
date 31/05/2002)
 [OLD Diallylphthalate (DAP)
Moulding Powder or
Compound; Plain or Glass/
Fibre filled with or without
additives]
130 39 Polyvinyl Chloride Film/SheetFloppy Disks/Diskettes
Gold plating make up and Semiconductor devices;
28,3
131 replenisher solutions and salts; LED/LED Displays;
8,39
Resins for gold recovery Connectors; PCBs
Solder Plated Annealed
132 74 Copper Wire (SCA) of Plastic film capacitors
diameter 0.4mm to 1mm
Zinc of purity 99% or above
in Rod, Wire or Strip form; Electronic Capacitor Grade
133 79 Zinc Wire / Zinc- Aluminum Metallised Plastic Film /
wire with dia up to 5mm ; Tin Capacitors
- zinc wire with dia upto 3mm
Plastic Film Capacitors;
134 80 Tin Foil/ Tin Alloy Foil Resistors (other than heating
resistors)
Lead Wires/Lead Tabs for
electrolytic capacitors;
Aluminium wire (of purity
Electronic Capacitor grade
135 76 99.9% or above ) of dia upto
Metallized Plastic film; Plastic
3mm
film capacitors; semiconductor
devices
136 28 Barium Carbonate Ceramic Capacitors
Hydroxy Propyl Methyl
Ceramic Capacitors, Ceramic
38,3 Cellulose Barium Titanate
137 Substrates /Rods/ Discs /
9,69 based or Lead Titanatebased
Dielectric
Ceramic composition/ Powder
138 28 Magnesium Oxide (Purity not Resistors; Ceramic Capacitors
less than 98%); Zinc Oxide
(Purity not less than 98%);
Aluminium Oxide (Purity not
less than 99.9%); Vanadium
Pentoxide (Purity not less than
99.9%); Lithium Carbonate
(Purity not less than 99%);
Manganese Carbonate (Purity
not less than 98%); Bismuth
 Oxide (Purity not less than
99%); Cobalt Oxide (Purity
not less than 99%); Copper
Carbonate (Purity not less
than 98%); Chromium Oxide
(Purity not less than 98%);
Indium Oxide (Purity not less
than 99%); Dysprosium oxide
(Purity not less than 99%);
Gadolinium Oxide (Purity not
less than 99%);Yttrium Oxide
(Purity not less than 99.9%);
Calcium Carbonate (Purity not
less than 98%) ; Tin Oxide
(Purity not less than 98%);
Magnesium Carbonate Purity
not less than 99%); Iron Oxide
(Purity not less than 99%);
Barium Carbonate (Purity not
less than 99%)

(S.No.138 column (3) has

been substituted vide CUS
NTF NO. 28/2003 DATE
01/03/2003)
Resin -VAGH Co-
Polymerised Vinyl Chloride
39,4 Vinyl Acetate, Pressure
139 Magnetic Tapes/Cassettes
8,59 Sensitive felt, with or without
adhesive,Silicon Coated/
Carbonized silicon paper
IC Sockets (Connectors);
140 39 Polyimide Film (Kapton) Resistors; Potentiometers;
Semiconductor devices
Modified Polyphenylene Deflection Components ;
141 39
Oxide potentiometers
Resistors; Potentiometers;
Phenolic Moulding Powder/
142 39 Capacitors; Hybrid Micro-
Resin
circuits
143 72,7 Lead wires of Iron or non Resistors ; Potentiometers;
4 alloy steel plated or coated Plastic Film Capacitors; Lead
with other base metals Tabs of Electrolytic Capacitors
 (In Col.4 bold words has
been substituted vide Cus Ntf
No.57/2002 date 31/05/2002)
29,7 Copper alloy resistance wire
2,74, and strips; Steel or Aluminium
144 Resistors; Potentiometers
76, in substrate or sheet form;
85 Butyl DiGol
Resistors; Resistor Grade
145 81 Metal alloy targets
Metallized Ceramic Cores
Chip Transistors; Varicap Tuners; Modulators; Hybrid
146 85
Diodes Micro Circuits
Switches with contact rating
Cladded Copper/ Copper less than 5 amperes at voltage
147 74
Alloy Strip / Foil not exceeding 250 Volts AC or
DC; Connectors
Zinc Oxide (Purity minimum
99.5%);Strontium Oxide/
Strontium Carbonate; Zinc
Pre-Calcined Ferrite Powder
148 28 Stearate (Purity minimum
(Spray Dried); Resistors
99%); Polyvinyl alcohol
(PVA); Polyvinyl Butyral
(Ash Content max 1%)
Zirconium Oxide (Purity not
less than 99%); Tin Oxide
(Purity not less than 99%);
Lanthanam Oxide (Purity not
less than 99%); Zinc Oxide
(Purity not less than 98%); Microwave Dielectrics;
Polystyrene (Purity not less Ceramic Capacitors;
149 28
than 98%); Magnesium Oxide Resistors ; Varistors;
(Purity not less than 98%); Thermistors
Calcium Carbonate (Purity not
less than 98%); Tantalum
Oxide (Purity not less than
99%); Barium Carb onate
(Purity not less than 99%)
150 39 Phenolic Moulding Powder Hybrid Micro circuits;
/Resin Potentiometers; Ceramic
Capacitors; Thermistors;
Varistors; Switches with
contact rating less than 5
 amperes at voltage not
exceeding 250 Volts AC or
DC; Connectors
39,6 Guide Ceramic; Guide LCP
151 Print heads
9 (Liquid Crystal Polymer)
152 85 Parts of Loudspeaker Loudspeakers
High Voltage Rectifier
Diodes; Focus Potmeter;
74,8
153 Electrolytic Tough Pitch Deflection Components
5
Wire/Rods/Formed Pins/parts
made thereof
Resistors; Potentiometers;
Switches with contact rating
Polycarbonate (Plain or glass
154 39 less than 5 amperes at voltage
filled moulding powder)
not exceeding 250 Volts AC or
DC
Resistors; Potentiometers;
155 39 Poly Vinyl Acetate
Hybrid Micro Circuits
Nickel Iron (low carbon / gas
free grade) in Sheet or strip
156 72 form / EB Welded Triple Resistors; Potentiometers ;
Metal Strips./ Controlled
Expansion Alloy Strips
SRBP (Synthetic resin bonded
paper) sheets and substrate
Potentiometers; Switches with
contact rating les than 5
157 39 (S. No.157 column (3) has
amperes at voltage not
been substituted vide CUS
exceeding 250 Volts AC or DC
NTF NO. 28/2003 DATE
01/03/2003)
Ceramic Cores /Substrates for
158 25 Ball Clay
resistors
Parts of Electron Gun
159 32 Borosilicate Glass Powder
/Multiform Bead Glass Rods
Unplated Brass Strips in Coil
160 74 form 70 mm width; Phosphor Connectors
Bronze Strips in Coil Form
Bimetal sheets in coil forms/
72,7 piece parts; Copper clad steel Relays of contact rating upto 7
161
4 sheets in coil forms / piece amperes
parts
 Ammonium Dihydrogen
28,2
162 Phosphate ; Ammonium Electrolytic Capacitors
9
pantaborate
Carbon / Flurographite
163 38 Potentiometers
Powder
Boron Nitride Suspension ; Electronic Capacitor Grade
28,3
164 Metallisation Inhabitation metallised Plastic Film/ Plastic
4
Fluid (Oil) Film Capacitors
Dowanol PX-16S (Non- CFC Flyback Transformers / Focus
165 29
solvent) Resistors
Monoalkylethers of ethylene
glycol.; Flux 1544
28,2
;Ammonium Hydroxide
166 9,38, Semiconductor devices
(CMOS Grade); Ammonia
48
(NH3) (CMOS Grade); Lid
perform; Chemcassette
Formed Aluminium Foil for
167 76 Etched Aluminium Foil
electrolytic capacitors.
002
Dt.1
(1) (2) (3) (4)
DBE Solvent; DMH Solvent;
Printing Inks; Protective
29,3
U.V.Lacquer; Dyes; Optical
2,
168 grade polycarbonate; Methyl CD-R (unrecorded CD)
38,3
Lactate; OFP; Cake Box;
9, 71
BOPP Film; Jewel box; Silver
Sputtering Target
003
Dat
[OL
28, Dyes; Optical grade
D CD-R (unrecorded CD)]
39 polycarbonate; Jewel box
168
(Sl.
169 76 Aluminium clad entry foil Printed circuit board
Phosphoric acid
(MOS/CMOS, electronic
Semi-conductor devices,
170.28 grade);Hydrogen peroxide
LED/LED displays
(MOS/CMOS, electronic
grade)
171.74, Aluminium wire with silicon Semi-conductor devices,
76, or magnesium with impurity LED/LED displays, Hybrid
80 upto 2%; micro-circuits
No.
168
has
bee
n
inse
rted
vide
Cus
Bonding wire (aluminum,
Ntf
gold and copper based )
No.
108/
200
2
Dat
e
10/1
0/20
02)
Tin silver antimony alloy in Semi-conductor devices,
172.80
any form LED/LED displays
Titanium dioxide of minimum Potentiometers, ceramic
173.28
purity 99% capacitors
Barium bromide; Sodium
aluminate ; Barium aluminate;
Methoklone; Methyl chloride;
Dichloro methane; Titanium
28, metal powder (99% purity);
29, Cesium glass powder; Barium
174. 35, glass powder; Argon –Neon Gas discharge tubes
72, mixed gas (99% purity);
81 Argon-hydrogen mixed gas
(99% purity); Copper Plied
Steel wire (tin plated ) with
dia upto 1.5 mm;Adhesive
paste
Printed circuit boards,
semiconductor devices, multi
175.39 Tedlar film
layer laminates, glass epoxy
copper clad laminates
Magnetic tape, plastic film
176.39 Polyester film
capacitors
 MEK (Methyl Ethyl Ketone);
29,
177. Polyurethane /Urethane Magnetic tape
39
elastomer;Cyclohexanone
Polyolefin heat shrinkable
178.39 Deflection components
tubes/ sleeves
27, Kilopoise Grease; Polyester
39, mesh; Nickel alloys resistance
179. Resistors and Potentiometers
75, wires and strips in bare or
85 enameled form;
Semi-conductor devices,
180.85 Buffered Oxide Echants
LED/LED displays
Conductive silver epoxy and Mounted Piezoelectric
181.39
hardener crystals,Hybrid microcircuits
LED/LED Displays, switches,
182.39 Noryl; Nylon
power entry connectors
183.39 Polyacetal LED/LED displays, switches
184.39 HDPE; LDPE; Poly propylene LED/LED displays
75, Electron gun, electronic valves
185. Stem pin
85 and tubes, parts of electron gun
Capacitors, resistors, electronic
capacitor grade metallised
186.39 Silicon oil
plastic film/ plastic film
capacitors
187.27 Microcrystalline wax Plastic film capacitors
Coated/ uncoated CRCA/
188.72 Mild stainless steel in the Switches, lead frames
form of sheets/ strips/ coils
Conveying trays/super
refractories/ pusher tiles/
Soft ferrite parts/ pre-calcined
69, ceramic saggers; Grinding
189. ferrite powder (spray dried),
73 steel balls (hardness 58-60%,
capacitors, resistors
carbon minimum 0.15%,
chromium 1-1.2%);Steel balls
Silver copper alloy
wires;Glass tubes of sizes
69,
between 4mm and 6mm Glass cartridges fuses/ ceramic
70,
190. outside diameter, in cut tube fuses/ PPTC resettable
74,
lengths upto 40mm; Brass fuses
85
fuse caps; PPTC chips;
Ceramic tubes
191.28, Silicon carbide roller for Soft ferrites parts/ pre-
 furnace; polyethylene glycol;
29, calcinated ferrite powder
Zucoplast; Polyamonium
38 (spray dried)
citrate; Octanol; Copper oxide
Grinding wheels (metal bond,
Soft ferrites parts/ pre-calcined
resin bond, diamond wheel,
192.68 ferrite powder (spray dried),
Conc 50-100%, grit D15-D30-
semiconductor devices
400 mesh)/slicing wheels
High speed spindles of more
than 10,000 RPM; silicon
carbide hollow heating rods,
with or without perforations;
Heating coils (made of kanthal
wire suitable for 13750 C dia
1 mm ); Cobalt oxide (99%
25, pure); Conveying trays (335 X
28, 340 X 30 mm Alumina /
40, cumulite); Setting batts
193. Ferrites
69, (320X320X15 mm alumina /
73, cumulite);Alumina
85 sandwiched silicon carbide
plate (340X170X15 mm
alumina / cumulite);
Magnesium oxide; Cupric
oxide; Miraflow-A
(polycarbon acid);
Chloropolyethylene (CPE);
Temperature measuring rings
Piezo ceramic formulated
material / powder; Piezo
69, ceramic discs/ mounted piezo
194. Buzzers/ sirens /ringers
85 electric plates; diaphragm of
permalloy; weight of
permalloy; terminal pins; yoke
195.73 Needle and springs Print head
72,
196. T-yoke Loudspeakers
85
Acetylene black carbon/ other
28,
197. carbon and carbon powders; Resistors and potentiometers
39
PTFE powder solutions
198.39, Former, bases, bobbins, Transformers
74, brackets; CP wires; P.B.T.;
85 Phenol resin moulding
 powder;Lamination/ El silicon
steel strips
199.39 Polybutylene terephthalate Connectors
Ammonium adipate;Acelaic
200.29 Electrolytic capacitors
acid;P.Nitro benzoic acid
Pelladium copper contact
201.71 Relays
tapes
34, Polywax; Tin coated CRCA
202. Tuners
72 sheets
203.85 Parts of remote control Remote control
204.85 Diffusion elements Semiconductor devices
Silver copper alloy wire in dia Metal to ceramic brazing rings
205.71
upto 0.25 mm for GD tubes
Ceramic disc single layer; pin;
washer; axial lead finish;
38, solder/ solder paste/ solder
39, with paste/ solder flux; solder
40, with flux; wire leads; eyelet
206. EMI/RFI filters
68, finish; eyelet fixing collect;
74, marking ink; epoxy resin/
85 stycast; carrier tape/ cover
tape/ taping material/ sealing
tape/ plastic reels
207.34 Termination paste Capacitors, EMI/RFI filters
Phenolic resins; epoxy
208.39 phenolic resins; silicon Capacitors, resistors
adhesive agent
209.73 Rivets Potentiometers
69,
210. 75, Parts of cathodes Cathodes for electron guns
85
211. 72 Soft magnetic iron strips Relays
212.79 Zinc manganate Soft ferrites
213.39 Polypropylene granules Capacitors
214.38 Catalysts Resistors
215.74 Bronze powder Resistors
216.38 Bentone Resistors
217.25 Quartz powder Resistors
218.32 Pigments Capacitors, resistors
219.28 Magnesium aluminum silicate Resistors
220.59 Fabric coated with Loudspeakers, paper cones/
 rubber;Wax emulsion; spiders/ dust caps for
basoplast loudspeakers
Polyacetals, Acrylonitrile-
Butadiene-Styrene(ABS)
39, copolymers; polystyrene;
CD /DVD mechanism,
221. 40, Rubber belts /ring upto 150
loudspeakers
84 mm; Acetal plastic powder/
resin /granule; Capstan shafts,
sintered bush, rubber belts
28,
Polyester latex; glass cloth
39,
222. tape; acry emulsion; cobalt Cathode ray tubes
40,
blue
70
Stainless steel wire of dia
69,
below 0.8 mm; Stainless steel
72,
223. strips of thickness below Parts of electron guns
75,
0.6mm; ceramic bases;
85
eyelets; sleeves; caps; nails

Glass shells/parts for colour

1. 28 Litharge
picture tubes.
Magnetic Inks or Magnetic
2. 28 Gamma Ferric Oxide
Tape.
Precalcined / Pre-sintered
3. 38 Ferrites
ferrite powder
Molybdenum Silidde/
58,6
Molybdenum disilicide
4. 9,84, Ferrites
heating elements; conveying
85
trays; saggers
OMI
5. TTE
D
OMI
6. TTE
D
OMI
7. TTE
D
(Sl.
[OL 39,7 Composite copper clad Printed Circuit Boards
D 5. 4,75, materials consisting of paper
Nos
.5,6
&7
has
bee
n
omi
tted
vide
76 + Epoxy + Glass cloth
Cus
Ntf
No.
26/2
002
Dt.1
/03/
200
2)
Glass Epoxy Copper clad
OL
74 laminates or Paper Phenolic Printed Circuit Boards
D 6.
Copper clad laminates
Copper clad laminates
(phenolic or glass epoxy
OL Copper foils (plain or
74 types); composite type copper
D 7. adhesive coated)
clad laminates; multi-layer
Printed Circuit Boards.]
(LI
ST
[OL
D
1. Omitted
2. Omitted
3. Omitted
4. Omitted
TV Glass bulbs/shells; CRT Television picture tubes.
5. 70 Glass Bulbs/shells; Magnetron Cathode Ray tubes or
Glass bulbs/shells magnetrons.
Glass parts for colour picture
6. 70 tubes (excluding neck or Colour picture tubes.
reneck tubes)
7. 70 Parts of TV/CRT Glass TV Glass bulbs/shells for TV
bulbs/shells including panels, picture tube or CRT Glass
funnels. Glass tubes bulbs/shells for CRT.
(excluding neck or reneck
 tubes)
CRT Glass bulbs/shells for
8 70 Neck or reneck tubes
CRT.
9. Omitted
10. Omitted]

(This notification has been last amended vide CUS NTF NO. 09/2004 DATE
08/01/2004)

(Amended vide Cus Ntf No. 20/2001 Date 1/3/2001)

(Please refer CUS CIR NO. 71/2003 DATE 07/08/2003)

(Please refer CUS CIR NO. 70/2003 DATE 06/08/2003)