Advanced Interconnect and Antenna-in-Package

Design for Millimeter-wave 5G Communications

Boping Wu, SMIEEE
Intel Research
Hillsboro, Oregon, USA
bennywu@ieee.org

Abstract-This paper presents a high-gain millimeter-wave

array anten na highly integrated on a single organic chip package.
The multi-phased beam steering capability is enabled to reduce
Paras; t;c patch
multipath fading and over-the-air applications around 30GHz.
To improve antenna bandwidth, gain and radiation efficiency, a
dual-patch antenna is built on a superstrate structure. A number
of design attributes, such as patch, dipole, and slot sizes have
been studied. Advanced interconnect between die and antennas
in multi-Iayered dielectric is optimized for transceiver integration
and packaging with minimal insertion loss and coupling between
the antenna feed-Iines. Good correlation is reached among
measurement and full-wave electromagnetic simulations. System-
level characterization of a mechanically assembled transceiver
module is presented with antenna radiation patterns.

Keywords-antenna array; millimeter-wave; antenna-in-

package; 5G; wireless communication

I. INIRODUCTlON Fig. 1. 3D view offeed n etwork structure for a patch anten n a

There is great interest of developing millimeter-wave radio
technology for a number of 5G applications, like high-
11. D ESIGN AN D ARCHIIECI URE
definition video streaming, fast large file transfer, and Internet-
of-Things machine-to-machine communications. Various In this paper, we demonstrate that the phase array
highly integrated millimeter-wave radio solutions are millimeter-wave antenna could be integrated in an organic chip
developed [1-4] and made available in the market. Significant package for 5G wireless communications. To improve antenna
progress has been made in regulations, standards, and solutions bandwidth, gain and radiation efficiency, a stacked dual-patch
in the recent years. The link budget for highly integrated antenna is built using a parasitic planar structure placed above
millimeter-wave radios is constrained due to low transmit an active patch in a thick superstrate as shown in Fig.l . The
power lOmW, large propagation loss 60 dB @ 1m, and high package layer stackup in Fig.2 and materials of low dielectric
data rate >2 Gb/s. Hence, the use of high-gain antennas is constant are carefully selected for the optimum RF design
necessary to reduce multipath effect, especially for over-the-air target and manufacturability as listed in Table I.
applications [5-8]. The antenna element size at around 30GHz
is on the order of millimeters, which demands a new type of IABLE T. ÄN TENNA ÄRRA y DESIGN R EQ UlREMENTS
integration of antenna array in the single chip package. A
compact size of phase-array antenna with beam steering Specifications Requirement
functionality is a key for millimeter-wave radios [9] . Advanced Single element and array bandwidth 26.5 - 30.3 GHz(13% ßW)
interconnect between die and antennas in multi-layered Single element and array return loss IS ld < -10 dB at the die bump
package is also critical for transceiver integration with minimal Pol arization Horizontal + Vertical (Dual)
insertion loss between the antenna feed-lines. Assuming the Isol ation between pol arizations > 17 dB
10mW value for the average transmitter power for portable Single element gain 5 - 6 dBi for standalone
devices, the maximum allowable antenna gain value for
Array gain 14dB
worldwide millimeter-wave operation would be 10dBi. The
multi-antenna configuration also provides flexible directional IF and RF I-line impedance 50 Ohm
options with a small form factor for portable applications. The Insertion loss target < 2.5 dB for fulllink
high frequency channel and broad bandwidth will allow
networking of millions of smart devices and computers
communicating at high date-rate, inciuding cameras, sensors,
or robotics [10] .

2017 18th International Conference on Electronic Packaging Technology 17

978-1-5386-2972-7/17/$31.00 ©2017 IEEE
 A low loss grounded coplanar waveguide feeding scheme is
adopted to provide a wideband transition and signal divider as
U! shown in Fig.5. Careful considerations ofmutualline coupling
UD
19
effects would produce low crosstalk and attenuation. Discrete
la routing lengths at the order multiples of quarter-wavelength
l7 were chosen for low retlection and high radiation efficiency.
The theorem behind this is quarter-wave transformer of
impedance match. In the meantime, some minor hands-on
l6 tuning of impedance network is still necessary in the post-
l5 fabrication lab work. Thus, the return loss performance in Fig.3
l4
could meet both the magnitude and bandwidth design targets.
r---------------~8
Symmetrie 12L esp Paekage LZ Small radiuses of mitered bends in transmission lines have
15um Cu
60um th idc prepreg
LI
observed impact on the return loss suppression. Therefore the
parametric sweep study on the design dimensions is demanding
for optimal performance. Isolation between H-V polarizations
Fig. 2. Stackup of the integrated antenna in an organic package. within the same element is also checked against design targets.

Full-wave electromagnetic simulations were performed to

verify antenna performance in a complete package-board
model as shown in Fig.3, including power/ground planes and
signal routings. Critical parameters of design structures are
optimized to meet the return loss and isolation targets. Good
correlation is reached between measurement and numerical
simulation of material properties as illustrated in FigA.
Single element RL& H-V isolation
,------,------,---
iD
~
o
-5
'""0'" Fig. 5. Top view of antenna feed-[ines and transition structures optimized in
.~ - 1 0
the package design.
~

I:",,,. // / - --,. \\j

~ -1 5
Full antenna array demonstrates acceptable full array gain
"' and radiation efficiency within the spectrum of interest in Fig.6
and Fig.7 respectively. Beam steering capability and angle
prediction accuracy are improved and demonstrated for a broad
range of angles.
-3~ '.-.
5--------.,2"'.6;------2
;;'.7.------;;-
2 .'.
8 ------;;2:';;.9:-------<--'-"'----.'
3.1

1
20-
Freq. [Hzl x 10.0

Fig. 3. Simu[ated antenna return [oss and H-V isolation ofthe single element "
antenna

o
HT-POR+J
-ll.5 2.• 2.7 2-'
Freq, IH.:z:1
2 .• 3.'
. ' 0~
~
11 . 1
Fig. 6. FuH antenna array gain of an antenna-in-package design .
.9
:5 M easure m ents
1-1 .~
Si mu lation
·2

·2.5
o 2 3 4 6
Ftaq. [HZI

Fig.4. Insertion Lass of I inch transmission [ine in package characterization

and simulation correlation of low loss material and low surface
roughness copper treatment. 2.5 2.6 2 .7 2 .8
Freq . (Hz)
2 .9 3.1
X10'0

Fig. 7. FuH antenna array radiation efficiency of an antenna-in-package

design.

2017 18th International Conference on Electronic Packaging Technology 18

 Active array beam-steering and radiation pattern is
presented in Fig.8. Good simulation to measurement
correlation was achieved for desired return loss and isolation
metrics, as a result of full characterization and validation.
Excellent radiation pattern shape was observed with minimal
correlation discrepancy.
lfeasure d - Holder 1
Yeasured - Holder 2
lfeasur ement - Orbi t Ho lder
Calibration offset same for all traces
180
Fig. 8. Radiation pattern of an antenna-in-package design.
III. CONCLUSION
Intel is pioneering 5G mmWave antenna array on a single
organic package superstrate. A high-gain dual-patch antenna
array design is demonstrated with multi-phased beam steering
capability around 30GHz. Antenna bandwidth and radiation
efficiency have been improved by optimizing a number of
design attributes, such as patch, dipole, and slot sizes.
Advanced interconnect and embedded passives are validated
with high confidence for transceiver integration and packaging
in low 10ss dielectrics. Good correlation is reached among
2017 18th International Conference on Electronic Packaging Technology
system-level measurement and full-wave electromagnetic
simulations.
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