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This document defines terms related to measurement including:
- TICO, PARTS, 2R.S which stand for Truth Value, Indicated Value, Correction, Overall Error, Precision, Accuracy - Bias, Range, Tolerance, Sensitivity - Resolution Sensitivity, Repeatability, Reproducibility, and Stability.
It also lists considerations for setting up primary standards including low temperature coefficient, accuracy of machining, rigidity of construction, no deterioration with environmental changes, and long-time stability of material.
Finally, it defines defects such as ball bond defect, incomplete metal etch causing shorts, misaligned photomask causing defective via, broken wire bonds, underetched via, particulate causing shorts,
This document defines terms related to measurement including:
- TICO, PARTS, 2R.S which stand for Truth Value, Indicated Value, Correction, Overall Error, Precision, Accuracy - Bias, Range, Tolerance, Sensitivity - Resolution Sensitivity, Repeatability, Reproducibility, and Stability.
It also lists considerations for setting up primary standards including low temperature coefficient, accuracy of machining, rigidity of construction, no deterioration with environmental changes, and long-time stability of material.
Finally, it defines defects such as ball bond defect, incomplete metal etch causing shorts, misaligned photomask causing defective via, broken wire bonds, underetched via, particulate causing shorts,
This document defines terms related to measurement including:
- TICO, PARTS, 2R.S which stand for Truth Value, Indicated Value, Correction, Overall Error, Precision, Accuracy - Bias, Range, Tolerance, Sensitivity - Resolution Sensitivity, Repeatability, Reproducibility, and Stability.
It also lists considerations for setting up primary standards including low temperature coefficient, accuracy of machining, rigidity of construction, no deterioration with environmental changes, and long-time stability of material.
Finally, it defines defects such as ball bond defect, incomplete metal etch causing shorts, misaligned photomask causing defective via, broken wire bonds, underetched via, particulate causing shorts,
T Truth Value The actual magnitude of the signal input to a measuring system General-purpose DC multimeter which can only be approached and never completely evaluated I Indicated Value It is the magnitude of a variable indicated by the measuring instrument C Correction The revision applied to the critical value so that the final result obtained improves the worth of the result O Overall Error
P Precision Degree of agreement within a group of measurements
A Accuracy - Bias Defined as the conformity with or closeness to an accepted standard value (true value) - (Bias) the difference between the observed average of measurements and the reference value R Range The region between the limits within which an instrument is designed to operate for measuring, indicating or recording a physical quantity T Tolerance S Sensitivity - Resolution Sensitivity The ratio of the output signal to the input signal or response of - Threshold Sensitivity measuring system to the quantity being measured - (Resolution Sensitivity) The minimum change in the measured variable which produces an effective response of instrument - (Threshold Sensitivity) The lowest level of measured variable which produces effective response of the instrument R Repeatability The measure of closeness with which a given input can be measured GENERIC ARCHITECTURE OF AN MIXED-SIGNAL ATE over and over again R Reproducibility S Stability
CONSIDERATIONS FOR SETTING UP PRIMARY STANDARDS
CARDS
C Low temperature Coefficient
A Accuracy of Machining R Rigidity of Construction D No Deterioration in its characteristics with changes in humidity, temperature an dother environmental conditions S Long-time Stability of the material
DEFECTS Bimbup, 2B
B Ball bond defect
I Incomplete Metal Ech causing Shorts M Misaligned Photomask Causing Defective Via B Broken wire bonds U Underetched Via P Particulate causing shorts