ZXMP S385: SDH Based Multi-Service Node Equipment

ZXMP S385
SDH Based Multi-Service Node Equipment

Product Description
Version 3.10
ZTE CORPORATION
NO. 55, Hi-tech Road South, ShenZhen, P.R.China
Postcode: 518057
Tel: +86-755-26771900
Fax: +86-755-26770801
URL: http://ensupport.zte.com.cn
E-mail: support@zte.com.cn
LEGAL INFORMATION
Copyright © 2011 ZTE CORPORATION.
The contents of this document are protected by copyright laws and international treaties. Any reproduction or
distribution of this document or any portion of this document, in any form by any means, without the prior written
consent of ZTE CORPORATION is prohibited. Additionally, the contents of this document are protected by
contractual confidentiality obligations.
All company, brand and product names are trade or service marks, or registered trade or service marks, of ZTE
CORPORATION or of their respective owners.
This document is provided “as is”, and all express, implied, or statutory warranties, representations or conditions
are disclaimed, including without limitation any implied warranty of merchantability, fitness for a particular purpose,
title or non-infringement. ZTE CORPORATION and its licensors shall not be liable for damages resulting from the
use of or reliance on the information contained herein.
ZTE CORPORATION or its licensors may have current or pending intellectual property rights or applications
covering the subject matter of this document. Except as expressly provided in any written license between ZTE
CORPORATION and its licensee, the user of this document shall not acquire any license to the subject matter
herein.
ZTE CORPORATION reserves the right to upgrade or make technical change to this product without further notice.
Users may visit ZTE technical support website http://ensupport.zte.com.cn to inquire related information.
The ultimate right to interpret this product resides in ZTE CORPORATION.
Revision History
Revision No. Revision Date Revision Reason
R1.0 2012-01-06 First edition
Serial Number: SJ-20120110092612-001
Publishing Date: 2012-01-06(R1.0)

Table of Contents
About This Manual ......................................................................................... I
Chapter 1 Product Position and Features................................................ 1-1
1.1 Product Position ................................................................................................. 1-1
1.2 Product Features................................................................................................ 1-2
Chapter 2 Product Architecture ................................................................ 2-1

2.1 Logical Structure ................................................................................................ 2-1
2.2 Hardware Structure ............................................................................................ 2-2
2.2.1 Subrack Structure .................................................................................... 2-3
2.2.2 Board Slots in a Subrack .......................................................................... 2-5
2.2.3 Board Types ...........................................................................................2-11
2.3 Software Architecture ....................................................................................... 2-16
2.3.1 Overview of Software Architecture........................................................... 2-16
2.3.2 Intelligent Software................................................................................. 2-17
2.3.3 Board Software ...................................................................................... 2-17
2.3.4 Agent Software ...................................................................................... 2-17
2.3.5 EMS Software........................................................................................ 2-18
Chapter 3 System Functions ..................................................................... 3-1

3.1 Service Functions............................................................................................... 3-1
3.1.1 Service Access Types............................................................................... 3-1
3.1.2 Service Access Capacity .......................................................................... 3-2
3.1.3 Multi-Service Functions ............................................................................ 3-3
3.2 Cross-connect Capacity...................................................................................... 3-6
3.3 Optical Adding/Dropping and Multiplexing/Demultiplexing Function ....................... 3-6
3.4 Optical Amplification Function ............................................................................. 3-6
3.5 Dispersion Management Function ....................................................................... 3-7
3.6 System Control and Communication Functions .................................................... 3-7
3.7 System Power Supply Function........................................................................... 3-7
3.8 Overhead Processing ......................................................................................... 3-8
3.9 Timing and Synchronization Output Function ....................................................... 3-8
3.10 Alarm Input/Output Function.............................................................................. 3-9
3.11 Proection Functions .......................................................................................... 3-9
3.11.1 Equipment-level Protection...................................................................... 3-9
3.11.2 Network-Level Protection ...................................................................... 3-13
I
3.11.3 Logic Sub-network Protection ................................................................ 3-16
Chapter 4 Technical Specifications .......................................................... 4-1

4.1 Dimension and Weight........................................................................................ 4-1
4.1.1 Cabinet Dimensions and Weights .............................................................. 4-1
4.1.2 Dimensions and Weight of Components .................................................... 4-2
4.1.3 Dimensions and Weight of Boards............................................................. 4-3
4.2 Bearing Requirement of Equipment Room ........................................................... 4-8
4.3 Power Supply Specifications ............................................................................... 4-8
4.3.1 Power Supply Range................................................................................ 4-8
4.3.2 Power Consumption Specifications............................................................ 4-8
4.4 Environmental Conditions ................................................................................. 4-12
4.4.1 Grounding Requirements ........................................................................ 4-12
4.4.2 Temperature and Humidity Requirements ................................................ 4-12
4.4.3 Cleanness Requirements........................................................................ 4-13
4.4.4 Application Environment Requirements.................................................... 4-13
4.5 Lightning Protection Requirements .................................................................... 4-13
4.6 EMC Requirements .......................................................................................... 4-15
4.6.1 EMS ...................................................................................................... 4-15
4.6.2 EMI ....................................................................................................... 4-17
4.7 Optical Interface Specifications ......................................................................... 4-18
4.7.1 STM-64 Optical Interface Specifications................................................... 4-18
4.7.2 STM-16 Optical Interface Specifications................................................... 4-18
4.7.3 STM-4 Optical Interface Specifications .................................................... 4-19
4.7.4 STM-1 Optical Interface Specifications .................................................... 4-20
4.7.5 E1 Optical Interface Specifications .......................................................... 4-20
4.8 Electrical Interface Specifications ...................................................................... 4-21
4.8.1 E1/T1 Electrical Interface Specifications .................................................. 4-21
4.8.2 E3/T3 Electrical Interface Specifications .................................................. 4-22
4.8.3 STM-1 Electrical Interface Specifications ................................................. 4-24
4.9 Ethernet Interface Specifications ....................................................................... 4-24
4.9.1 FE Interface Specifications ..................................................................... 4-24
4.9.2 GE Interface Specifications ..................................................................... 4-25
4.10 ATM Optical Interface Specifications................................................................ 4-27
4.11 Optical Interface Specifications of OA Board .................................................... 4-28
4.12 SAN Interface Specifications ........................................................................... 4-29
4.13 DCM Specifications ........................................................................................ 4-29
4.14 Interface Jitter Specifications........................................................................... 4-30
II
4.14.1 Jitter and Wander Tolerance of PDH Input Interfaces .............................. 4-30
4.14.2 Jitter and Wander Tolerance of SDH Input Interfaces .............................. 4-31
4.14.3 STM-N Interface Inherent Output Jitter and Network Interface Output
Jitter of SDH Equipment ........................................................................ 4-32
4.14.4 Mapping Jitter of PDH Tributaries .......................................................... 4-33
4.14.5 Combined Jitter .................................................................................... 4-34
4.14.6 Jitter Transfer Characteristic of the Regenerator..................................... 4-35
4.15 Clock Specifications ....................................................................................... 4-36
4.16 Ethernet Performance Specifications ............................................................... 4-39
4.16.1 Transparent Transmission Performance Specifications ........................... 4-39
4.16.2 Specifications of L2 Switching ............................................................... 4-40
4.17 RPR Performance Specifications..................................................................... 4-43
4.18 ATM Characteristics........................................................................................ 4-44
4.19 External Interface Standards ........................................................................... 4-46
Chapter 5 Configuration and Networking ................................................ 5-1

5.1 Subrack and Board Configurations ...................................................................... 5-1
5.1.1 Board Description..................................................................................... 5-1
5.1.2 Board Configuration Description ................................................................ 5-3
5.2 Typical NE Configurations................................................................................... 5-4
5.2.1 Terminal Multiplexer (TM).......................................................................... 5-4
5.2.2 Add/Drop Multiplexer (ADM) ..................................................................... 5-5
5.2.3 Regenerator (REG) .................................................................................. 5-7
5.3 Networking Modes.............................................................................................. 5-9
5.3.1 Point-to-Point Networking ......................................................................... 5-9
5.3.2 Chain Network ....................................................................................... 5-10
5.3.3 Ring Network ..........................................................................................5-11
5.3.4 DNI Networking...................................................................................... 5-14
5.3.5 Hybrid Networking .................................................................................. 5-14
5.4 Networking Application of Multi-Service Node Equipment.................................... 5-15
5.4.1 Ethernet Private Line (EPL)..................................................................... 5-15
5.4.2 Ethernet Virtual Private Line (EVPL) ........................................................ 5-16
5.4.3 Ethernet Private LAN (EPLAN)................................................................ 5-17
5.4.4 Ethernet Virtual Private LAN (EVPLAN) ................................................... 5-19
5.4.5 Ethernet Private Tree (EPTREE) ............................................................. 5-20
5.4.6 Ethernet Virtual Private Tree (EVPTREE)................................................. 5-21
5.4.7 RPR Service Networking ........................................................................ 5-22
5.4.8 ATM Service Application ......................................................................... 5-23
III
5.5 Application Example ......................................................................................... 5-25
5.5.1 Service Requirements ............................................................................ 5-25
5.5.2 Networking Analysis ............................................................................... 5-25
5.5.3 Configurations........................................................................................ 5-27
5.5.4 Application Features............................................................................... 5-30
Appendix A Standards and Recommendations ..................................... A-1

Figures............................................................................................................. I
Tables ............................................................................................................ III
Glossary .......................................................................................................VII
IV
About This Manual
Purpose
This manual is applicable to the Unitrans ZXMP S385 SDH based multi-service node
equipment (ZXMP S385 for short).
ZXMP S385 is a multi-service node equipment with the highest transmission rate of 10
Gbit/s. It supports ASON and can apply to the transmission network (at the access layer
and convergence layer).
This manual describes the system architecture, system features, system functions, and
application examples of the ZXMP S385.
Intended Audience
The intended audience of this manual are as follow:
l Planning engineers
l Maintenance engineers
What Is in This Manual

This manual is the Unitrans ZXMP S385 (V3.10) SDH Based Multi-Service Node
Equipment Product Description, consisting of the following parts:
Chapter Contents
Chapter 1, Product Position and Describes the position and features of ZXMP S385.
Features
Chapter 2, Product Architecture Describes the hardware architecture and software architecture
of ZXMP S385.
Chapter 3, System Functions Introduces all functions and their implementation processes of
ZXMP S385, including service functions, optical amplification,
system control & communication, overhead processing,
timing synchronous output, alarm input/output, dispersion
management, cross-connect and protection functions.
Chapter 4, Technical Specifications Gives the ZXMP S385 specifications, including the physical
performances, power supply specifications, environmental
condition requirements, lightning protection requirements,
electromagnetic compatibility requirements, interface
specifications, dispersion module specifications, clock
specifications, optical amplification specifications, Ethernet
performance specifications, RPR performance specifications,
and ATM characteristics.
I
Chapter Contents
Chapter 5, Configuration and Describes the networking modes supported by the ZXMP S385,
Networking the system configuration requirements and network examples.
Appendix A, Standards and Gives the standards and recommendations that ZXMP S385
Recommendations complies with.
Related Documentation
The following documentation is related to this manual:
l Unitrans ZXMP S385 (V3.10) SDH Based Multi-Service Node Equipment Hardware
Description
It describes the equipment hardware, including cabinet, power distribution box,

subrack, boards, interfaces, and indicators.
l Unitrans ZXMP S385 (V3.10) SDH Based Multi-Service Node Equipment Installation
Manual
It describes the equipment installation procedures, including installation preparation,

hardware installation, cable layout, installation check, and the detailed power on/off
operations.
l Unitrans ZXMP S385 (V3.10) SDH Based Multi-Service Node Equipment
Maintenance Manual (Volume I) Routine Maintenance
It describes the major items and common operations of routine maintenance.
Maintenance Manual (Volume II) Alarms and Performances
It describes the handling methods for the equipment alarms and performance events.
Maintenance Manual (Volume III) Troubleshootings
It describes the analyses and solutions for some common faults.
Conventions
This document uses the following typographical conventions.
Typeface Meaning
Italics Variables in commands. It may also refers to other related manuals and
documents.
Note: Provides additional information about a certain topic.
II
Chapter 1
Product Position and
Features
Table of Contents
Product Position .........................................................................................................1-1
Product Features........................................................................................................1-2
1.1 Product Position

ZXMP S385 is a ZTE Synchronous Digital Hierarchy (SDH) -based multiple service node
equipment, with the highest transmission rate of 9953.280 Mbit/s. It supports Automatically
Switched Optical Network (ASON).
ZXMP S385 is used in the metropolitan area transmission network (at the convergence
layer and core layer). It supports transferring SDH and data services.Figure 1-1 illustrates
the application of ZXMP S385.
1-1
SJ-20120110092612-001|2012-01-06(R1.0) ZTE Proprietary and Confidential

ZXMP S385 Product Description
Figure 1-1 ZXMP S385 Application in the Network
1.2 Product Features

Diversified Service Interfaces
ZXMP S385 provides diversified service interfaces, as follow:
l SDH service interfaces (such as STM-64 interface)
l PDH service interfaces (such as E1 optical/electrical interface)
l Packet Over SDH (POS) service interfaces
l Gigabit Ethernet (GE) service interfaces
l Fast Ethernet (FE) service interfaces
l Storage Area Network (SAN) service interfaces
l Asynchronous Transfer Mode (ATM) service interfaces
l Dense Wavelength Division Multiplexing (DWDM) service interfaces
l Coarse Wavelength Division Multiplexing (CWDM) service interfaces
ZXMP S385 provides additional data interfaces by employing Section Overhead (SOH),
including orderwire interfaces, RS422/RS232 interfaces, F1 interfaces at 64 kbit/s.
1-2

Chapter 1 Product Position and Features
Multiple Protection Mechanisms

ZXMP S385 supports the complex equipment-level protection, network-level protection
and the ASON protection recovery to ensure that the network works in safety.
Timing and Synchronization Processing Capacity

ZXMP S385 can use the external clock, line clock, or internal clock as the timing reference
of the equipment. The working modes include locked, hold, and free-oscillation modes.
The equipment supports the synchronous priority switching and Synchronization Status
Message (SSM)-algorithm based automatic switching.
The SSM-algorithm based automatic switching can optimize the timing and
synchronization distribution of the network, reduce the difficulty in the synchronization
layout, avoid the timing loop and, ensure the optimal network synchronization.
Multiple EMS Systems

ZXMP S385 supports the ZTE unified EMS system NetNumen U31 R22, the Network
element management system NetNumen T31 and the unified EMS/SNMS of optical
network ZXONM E300.
Note:
When the ZXMP S385 uses the ASON function, the EMS systems should be NetNumen
U31 R22 or NetNumen T31. ZXONM E300 does not support the ASON configurations.
l The EMS systems provide the functions of configuration management, fault

management, performance management, maintenance management, end-to-end
circuit management, security management, system management, and report
management.
l The EMS systems support the NE management, and provides user-friendly windows
that meet the requirements of conventional networks. It is can be operated and
maintained easily, such that the transport networks are easy to be managed and
maintained.
1-3

This page intentionally left blank.
1-4

Chapter 2
Product Architecture
Table of Contents
Logical Structure ........................................................................................................2-1
Hardware Structure ....................................................................................................2-2
Software Architecture ...............................................................................................2-16
2.1 Logical Structure

The logical structure of ZXMP S385 consists of the NE control platform, clock processing
platform, service cross-connect platform, overhead processing platform, power supply
support platform, and service access platform.
The relationships of all the platforms are shown in Figure 2-1. Table 2-1 lists the platform
functions.
Figure 2-1 The Relationships of the Platforms
Table 2-1 Platform Functions
Name Function
NE control As the interface between the NE equipment and background EMS, the NE
platform control platform is the agent for other platforms to receive or report network
management information.
Power supply With the distributed power supply mode, power supply modules in each board
support platform provide the power supply for the corresponding boards.
2-1

Name Function
Service access Supports accessing SDH, PDH, Ethernet, and ATM services.
platform And it converts the accessed services to corresponding formats, and then it
forwards them to the service cross-connect platform for convergence and
distribution.
Overhead Provides the orderwire voice channel and several assistant data channels
processing through section overhead (SOH) bytes while transmitting payloads.
platform
Clock processing As one of the core parts of the hardware system, this platform provides the
platform system clock for all platforms in the equipment.
Service cross- Implements the convergence, distribution and switching for service signals
connect platform and other information received from the service access platform and overhead
processing platform.
2.2 Hardware Structure

The ZXMP S385 subrack is installed in the ZTE International Electrotechnical Commission
(IEC) cabinet for ZTE transmission equipment. The cabinet is 300 mm deep and equipped
with rear columns. Figure 2-2 illustrates the ZXMP S385 cabinet structure.
2-2

Chapter 2 Product Architecture
Figure 2-2 ZXMP S385 Cabinet Structure and Configuration (Two Subracks)
1. Cabinet 4. Subrack 7. Subrack

2. Power distribution box 5. Dustproof unit 8. Front door
3. Cabling area 6. Ventilation unit
2.2.1 Subrack Structure

The ZXMP S385 subrack is installed in the standard IEC 19-inch cabinet. The subrack
facilitates installation, operation, and maintenance from subrack front.
It saves equipment room space and can satisfy the requirements for cabinet back-to-back
installation and cabinet installation against wall.
Note:
The ZXMP S385 IEC subrack (IEC 19-inch) can be installed in a standard ETS cabinet by
using corresponding mounting lugs.
A subrack consists of the board area, motherboard, cabling area, and fan plug-in box, with
heat dissipation and electromagnetic shielding functions.
2-3

Figure 2-3 shows the subrack structure. Table 2-2 describes the major parts of the subrack.
Figure 2-3 Subrack Structure
1. Top cable outlet 3. Board area 5. Fan plug-in box

2. Decorative door 4. Bottom cabling area 6. Mounting lug
Table 2-2 Brief Descriptions of Subrack Parts
Name Position in Subrack Brief Description
Decora- In the upper-layer of It is flexibly removable, with the function of decoration,

tive door subrack board area ventilation, and shielding
Board In the middle of the The board area is divided into upper layer and lower layer.
area subrack Service/functional interface boards are plugged into the upper
layer, while service/functional boards are plugged into the lower
layer.
The upper-layer board area has 15 slots, and the lower-layer
has 16 slots.
Fan At the bottom of the It provides forced air cooling for the equipment to dissipate the
plug-in subrack heat.
box The fan plug-in box accommodates three independent fan
boxes, all of which are connected to the fan motherboard (FMB)
for the convenience of maintenance.
2-4

Name Position in Subrack Brief Description
Mounting At the back of the It is used to fix the subrack in the cabinet.
lug subrack (one on the
left side and the other
on the right side)
2.2.2 Board Slots in a Subrack

Diagram of Boards in a Subrack
Figure 2-4 shows the board slots of the ZXMP S385 subrack.
Figure 2-4 Diagram of Boards in a Subrack
2-5

Available Slots for Functional Boards

The available slots for functional boards are listed in Table 2-3.
Table 2-3 Available Slots for Functional Boards of ZXMP S385
Board ID Available Slots Remark
CSA, CSE, CSF, CSCP 8, 9 The slot 8 and slot 9 must be configured
with the same boards, such as CSA
board.
OW 17 –
ANCP, ENCP, NCP 18, 19 The slot 18 and slot 19 must be

configured with the same boards, such
as ANCP board.
QxI 66 –
SCI 67 –
OBA/OPA 1 to 7, 10 to 16 l OBA is the Optical Booster Amplifier

board.
l OPA is the Optical Pre-Amplifier
board.
l OBA12/OPA32 board occupies one
slot.
l OBA14/OBA17/OBA19/OPA38
board occupies one or two slots.
OADD 1 to 7, 10 to 16 –
OADC 1 to 7, 10 to 16 –
Available Slots for Service Boards

l The available slots for optical/electrical line boards and service boards are listed in
Table 2-4.
Table 2-4 Available Slots for Optical/Electrical Line Boards and Service Boards
of ZXMP S385
OL64 1 to 7, 10 to 16 –
OL64x2 6, 7, 10, 11 –
OL64FEC, OL4x4, OL4x2, 1 to 7, 10 to 16 –

OL16, OL16x4, OL16x8,
OL1x8, OL1x4
2-6

OEL1x16 1 to 7, 10 to 16 When configured in slot 1, 6, 7, 10, 11, and 16,

the board only supports eight pairs of service
processing, because it does not support
configuring interface boards.
OEIS1x8 62 to 65, 68 to 71 Cooperates with OEL1x16 board.
LP1x8 1 to 5, 12 to 16 à LP1x8 board in slot 1 and slot 16 can only

serve as a protection board, and cannot be
configured with services.
à Supports two groups of 1:N(N≤4) protec-

tion.
à The board does not support ECC, over-

head cross connect, OW, OMS link protec-
tion in 1:N protection.
ESS1x8 62 to 65, 68 to 71 Should be inserted in the slot of the upper-layer

interface board (interface switching board) that
corresponds to the service board.
BIE3 61, 72 à Only serves for 1:N (N≤4) protection.
à Should be inserted in the slot of the up-

per-layer interface board (interface bridge
board) that corresponds to the protection
board.
Note:
The relations between service slots and slots for upper-layer interface boards,
interface switching boards, and interface bridge boards are: slots 1 to 5 correspond
to slots 61 to 65 sequentially, slots 12 to 16 correspond to slots 68 to 72 sequentially.
For example, if a service board LP1x8 is inserted in slot 2, its corresponding interface
switching board ESS1x8 should be inserted in slot 62.
If a service board EPE1x63 (75) is inserted in slot 12 and there is no protection, its
corresponding electrical interface board EIE1x63 should be inserted in slot 68.
l The available slots for E3/T3 service boards are listed in Table 2-5.
2-7

Table 2-5 Available Slots for E3/T3 Service Boards of ZXMP S385
Board ID Available Remark

Slots
EP3x6 1 to 5, 12 to 16 à Serving as E3/T3 processor, it can be inserted in slots 2 to

5 and slots 12 to 15.
à Serving as protection board and inserted in slot 1, it can

implement one group of 1:N (N≤4) protection for boards in
slots 2 to 5.
à Serving as protection board and inserted in slot 16, it can

implement one group of 1:N (N≤4) protection for boards in
slots 12 to 15.
BIE3 61, 72 à Only serves for the 1:N (N≤4) protection.
à If the BIE3 board is inserted in slot 61, it works with the

protection board in slot 1. If the BIE3 board is inserted in
slot 72, it works with the protection board in slot 16.
ESE3x6 62 to 65, 68 to Should be inserted in the slot of the upper-layer interface board
71 (interface switching board) that corresponds to the service
board.
l The available slots for E1/T1 service boards are listed in Table 2-6.
Table 2-6 Available Slots for E1/T1 Service Boards of ZXMP S385
EPE1x63 (75), EPE1x63 1 to 5, 12 to 16 à Any E1/T1 electrical processor in slots 1

(120), EPE1Fx63, EPT1x63, to 5 and slots 12 to 16 can serve as the
EPE1Zx63 (75), EPE1Zx63 protection board.
(120)
à Can implement one group of 1:N (N≤9)
protection.
EIE1x63, EIT1x63, BIE1 61 to 65, 68 to à BIE1 board only serves for the 1:N (N≤9)
72 protection of E1 electrical service.
à Should be inserted in the slot of the

upper-layer interface board (interface
bridge board) that corresponds to the
protection board.
ESE1x63, EST1x63 62 to 65, 68 to à Serves for services with E1 electrical

71 protection.
à Should be inserted in the slot of the

upper-layer interface board or interface
switching board that corresponds to the
working board.
2-8

OPE1Z 1 to 7, 10 to 16 –
l The available slots for Ethernet service boards are listed in Table 2-7.
Table 2-7 Available Slots for Ethernet Service Boards of ZXMP S385

Slots
TGE2B, TGSAx8 1 to 7, 10 to -
16
MSE, SECx24, 1 to 5, 12 to à SECx48, SECx24, MSE board in slot 1 and slot 16

SECx48 16 can only serve as a protection board, and cannot be
configured with services.
à Supports two groups of 1:N(N≤4) protection.
à Do not configure GE service on the protected

SECx48, SECx24 or MSE board, when configuring
1:N protection to avoid GE service interruption
during FE service switching.
RSEB 2 to 5, 12 to -
15
OIS1x8 62 to 65, 68 Should be inserted in the slot of the upper-layer

to 71 interface board (interface switching board) that
corresponds to the SECx48, SECx24, MSE, and RSEB
board.
ESFEx8 62 to 65, 68 Should be inserted in the slot of the upper-layer

corresponds to the SECx48, SECx24, MSE, RSEB,
and SEE board.
BIE3 61, 72 à Only serves for the 1:N (N≤4) protection of FE ser-
vice
à Should be inserted in the slot of the upper-layer

interface board (interface bridge board) that corre-
sponds to the protection board
2-9


Slots
SEE 1 to 7, 10 to à The SEE board supports optical/electrical interface

16 board OEIFEx8, electrical interface board ESFEx8
or no interface board. Refer to Table 2-8 for corre-
sponding EMS software and hardware version con-
figuration.
à When OEIFEx8 board is configured, FE interface

supports the coexistence of SFP optical module and
optical/electrical interface, but SEE board does not
support 1:N protection.
à When an FE optical interface (1320 or 1321 soft-

ware/hardware version is selected on the EMS) is
needed, the SEE board can only be inserted in slots
1 to 5 and slots 11 to 15, and the cooperating optical
interface board OEIFEx8 can be inserted in slots 62
to 65 and slots 68 to 71.
à When an FE optical interface (2320 or 2321 soft-

ware/hardware version is selected on the EMS) is
needed, if the board 1:N protection is required, the
SEE board can only be inserted in slots 2 to 5 and
slots 12 to 15, and the cooperating electrical inter-
face switching board ESFEx8 can only be inserted
in slots 62 to 65 and slots 68 to 71.
if the board 1:N protection is required, the SEE
board should also be inserted in slot 1 or 16 (2320
or 2321 software/hardware version is selected
on the EMS), and the bridge board BIE3 should
be inserted in slot 61 or 72 in the corresponding
interface area.
à The SEE board only supports 1:N protection for
eight FE electrical interfaces on the service board,
and it does not support 1:N protection for the service
at GE optical interface, FE optical interface, and FE
optical/electrical interface coexistence.
Slots 1 to 5 and slots 12 to 16 can provide two
independent groups of 1:4 tributary protection as
required: the SEE board in slot 1 can protect the
service at FE electrical interface on any SEE board
in slots 2 to 5, and the SEE board in slot 16 can
protect the service at FE electrical interface on any
SEE board in slots 12 to 15.
2-10


Slots
OEIFEx8 62 to 65, 68 Should be inserted in the slot of the upper-layer

corresponds to the SEE board.
Table 2-8 Description of SEE Board Software/Hardware Configuration
Interface Board Software/hardware Version Remark
No interface board is 1310 or 1311 When the software/hardware

configured. version is 1310, 1320, and
2320, the SEE board does
OEIFEx8 1320 or 1321
not provide port-level Ethernet
ESFEx8 2320 or 2321
Protection Switch.
When the software/hardware
version is 1311, 1321, 2321,
the board supports EPS.
l The available slots in master and expansion subracks for ATM service board AP1x8
are: 1 to 7 and 10 to 16.
2.2.3 Board Types

Table 2-9 lists the functions of ZXMP S385 boards .
Table 2-9 ZXMP S385 Board List
Board ID Board Name Description
ANCP Advanced Network unit Provides the NE management, ECC protocol processing,
Control Processor and ASON signal processing.
NCP Net Control Processor Provides the NE management, and ECC protocol
processing.
ENCP Enhanced Net Control Provides the NE management, and ECC protocol
Processor processing.
OW Orderwire board Provides the orderwire.
CSA Cross_switch and Implements the service cross-connection and supports 40

Synchronous_clock - Type A Gbit/s (256×256 VC-4) space division cross connection and
5 Gbit/s (32×32 VC-4) time division cross connection.
CSE Cross_switch and Implements the service cross-connection and supports

Synchronous_clock - Type E 180 Gbit/s (1152×1152 VC-4) space division cross
connection and 40 Gbit/s (256×256 VC-4) time division
cross connection.
2-11

CSF Cross_switch and Implements the service cross-connection and supports

Synchronous_clock - Type F 240 Gbit/s (1536×1536 VC-4) space division cross
connection and 40 Gbit/s (256×256 VC-4) time division
cross connection.
CSCP Cross_switch and Implements the service cross-connection and supports 80

Synchronous_clock - Type C Gbit/s (512×512 VC-4) space division cross connection and
40 Gbit/s (256×256 VC-4) time division cross connection.
TCS32 Timeslot cross switch module Implements 5 Gbit/s time division cross-connection
of 32×32 AU4 function.
TCS64Z Timeslot cross switch module Implements 2×5 Gbit/s time division cross-connection
of 2×32×32 AU4 (Type Z) function.
TCS128P Timeslot Cross Switch of Implements 20 Gbit/s time division cross-connection

128×128 AU4 - Type P function.
TCS128Z Timeslot cross switch module Implements 20 Gbit/s time division cross-connection
of 128×128 AU4 (Type Z) function.
TCS256P Timeslot Cross Switch of Implements 40 Gbit/s time division cross-connection

256×256 AU4 - Type P function.
TCS256Z Timeslot Cross Switch of Implements 40 Gbit/s time division cross-connection

256×256 AU4 - Type Z function.
QxI Qx Interface board l Provides the system interfaces.

l Provides subracks with the power supply.
SCIB Synchronous Clock Interface Provides 2.048 Mbit/s external clock input/output interfaces.
board (2 Mbit/s)
SCIH Synchronous Clock Interface Provides 2.048 MHz external clock input/output interfaces.
board-type H (2 MHz)
OL64 Optical Line of STM-64 l Accesses and processes a channel of STM-64 optical
service.
l Supports ASON.
OL64x2 Optical Line of STM-64×2 l Accesses and processes two channels of STM-64
optical service.
l Supports ASON.
OL64FEC Optical Line of STM-64 with l Accesses and processes a channel of STM-64 optical
FEC service.
l Supports FEC.
OL16OL16FD Optical Line of STM-16 Accesses and processes a channel of STM-16 optical
service.
2-12

OL16OL16FDA Optical Line of STM-16 with l Accesses and processes two channels of STM-16
ASON function optical service.
l Supports ASON.
OL16x4 Optical Line of STM-16×4 l Accesses and processes four channels of STM-16
optical service.
l Supports ASON.
OL16x8 Optical Line of STM-16×8 l Accesses and processes eight channels of STM-16
optical service.
l Supports ASON.
OL4x2 Optical Line of STM-4×2 l Accesses and processes two channels of STM-4
optical service.
l Supports ASON.
optical service.
l Supports ASON.
optical service.
l Supports ASON.
OL1x8 Optical Line of STM-1×8 l Accesses and processes eight channels of STM-1
optical service.
l Supports ASON.
OEL1x16 STM-1×16 Optical/ Electrical l Accesses and processes 16 channels of STM-1

Line board optical/electrical services.
l Provides the first eight channels of STM-1
optical/electrical interfaces. The OEIS1x8 board
provides the last eight channels of STM-1
optical/electrical interfaces.
OEIS1x8 STM-1×8 Optical/Electrical Provides eight channels of STM-1 optical or electrical

Interface board interfaces. It supports to access optical services and
electrical services at the same time.
LP1x8 Line Process of STM-1×8 Processes eight channels of STM-1 services.
OIS1x8 STM-1×8 Optical Interface Provides eight channels of STM-1 optical interfaces.
board
ESS1x8 Electrical Interface Switching Provides eight channels of STM-1 electrical interfaces for
of STM-1×8 the LP1x8 board.
EP3x6 6×E3/T3 Electrical Processor Processes six channels of E3/T3 electrical services.
2-13

ESE3x6 6×E3/T3 Electrical Interface l Provides six channels of E3/T3 physical electrical
Switching board interfaces.
l Implements the E3/T3 signal switching between the
working board and the protection board for the board
protection.
BIE3 STM-1e/E3/T3/FE Interface Serves for the 1:N board tributary protection of
Bridge board E3/T3/FE/STM-1 electrical signal. It distributes and
transfers electrical signals coming from working board to
the protection board.
EPE1x63 63×E1 Electrical Processor l Processes 63 channels of E1 electrical services.

l The interface can be 75 Ω or 120 Ω.
EPT1x63 63×E1 Electrical Interface Processes 63 channels of T1 electrical services.

board
EPE1Fx63 Electrical Processor of Processes 63 channels of E1/T1 electrical services, and

Framed 63×E1/T1 supports the framing function.
EIE1x63 63×E1 Electrical Interface l Provides 63 channels of E1 electrical interfaces.

board l The interface is 75 Ω.
EIT1x63 63×T1 Electrical Processor l Provides 63 channels of E1/T1 electrical interfaces.

l The E1 interface is 120 Ω, and the T1 interface is 100
Ω.
EPE1Zx63 63×E1 Electrical Processor l Processes 63 channels of E1 electrical services.

l The interface is 75 Ω or 120 Ω.
l Supports the re-timing of 63 channels.
ESE1x63 63×E1 Electrical interface l Provides 63 channels of E1 electrical interfaces.

Switching board l The E1 interface is 75 Ω.
EST1x63 63×E1/T1 Electrical interface l Provides 63 channels of E1/T1 electrical interfaces.

Switching board l The E1 interface is 120 Ω and the T1 interface is 100 Ω.
l It is only used for the E1/T1 electrical signal 1:N (N≤9)
board tributary protection.
BIE1 E1/T1 Electrical Interface Serves for the 1:N board tributary protection of E1/T1
Bridge board electrical signal. It distributes and transfers electrical
signals coming from working board to the protection boards.
OPE1Z Optical E1 Tributary board Accesses and processes eight channels of 2 M apical
services.
ESFEx8 Fast Ethernet Electrical l Provide eight channels of FE electrical interfaces.

interface Switching board l When 1:N (N≤4) protection is required, the ESFEx8
board works with the BIE3 board to switch the FE
signals between the working board and the protection
board.
2-14

TGE2B Transparent-transmission Accesses and processes two channels of transparent

Gigabit Ethernet board transmission Ethernet GE optical services.
SECx48 Enhanced Smart Ethernet l Accesses and processes a channel of GE services and
eight channels of FE services. It supports accessing
optical services and electrical services at the same
time.
The SEC board uses the ESFEx8 board to provide the
FE electrical interfaces, and it uses the OIS1x8 board
to provide the FE optical interfaces.
l Supports the 1:N(N≤4) protection of FE electrical
services.
l Supports the layer 2 switching function.
l Supports the convergence ratio of 48:1.
SECx24 Enhanced Smart Ethernet l Accesses and processes a channel of GE services and
eight channels of FE services. It supports accessing
optical services and electrical services at the same
time.
The SEC board uses the ESFEx8 board to provide the
FE electrical interfaces, and it uses the OIS1x8 board
to provide the FE optical interfaces.
services.
l Supports the convergence ratio of 24:1.
SEE Enhanced Smart Ethernet l Accesses and processes two channels of GE services
board (Type E) and eight channels of FE services. It supports
accessing optical services and electrical services at
the same time.
The SEE board uses the ESFEx8 board to provide the
FE electrical interfaces, and it uses the OEIFEx8 board
to provide the FE optical interfaces, or provides FE
optical/electrical interface at the same time.
services.
OEIFEx8 Optical/Electrical Interface Provides eight channels of FE optical/electrical interfaces.

board of Fast Ethernet It can access the optical services and electrical services
at the same time.
AP1x8 ATM Processor with 8 STM-1 Accesses and processes eight channels of ATM services.
ports
2-15

RSEB Ethernet processor with RPR l Processes two channels of GE and eight channels of
function FE services.
l The board provides two channels of GE
optical/electrical interfaces. The FE interface is
provides by OIS1x8 board or ESFEx8 board.
l Supports processing the RPR service.
MSE Ethernet processor with l Processes two channels of GE and eight channels of
MPLS function FE services. It supports accessing optical services and
electrical services at the same time.
l The board provides two channels of GE
optical/electrical interfaces. The board uses the
ESFEx8 board to provide the FE electrical interfaces,
and it uses the OIS1x8 board to provide the FE optical
interfaces.
services.
l Supports MPLS function.
TGSAx8 Eight Channels Transparent Accesses and processes eight channels of SAN and GE
SAN and GE Board services.
OA Optical Amplifier Implements the amplification of optical signals.
OADD Optical Add/Drop board for Adds/drops or multiplexes/de-multiplexes four channels of

DWDM signals DWDM signals.
OADC Optical Add/Drop board for Multiplexes/de-multiplexes four channels of CWDM signals.
CWDM signals
2.3 Software Architecture

2.3.1 Overview of Software Architecture
The system software of ZXMP S385 comprises board software, Agent and EMS, which run
on each board, NE control processor board and EMS computer respectively. It implements
the management and control of boards, NEs and the whole network.
The ZXMP S385 software adopts layered structure design with each layer implementing
specific function and providing service to the upper layer. The software structure is shown
in Figure 2-5.
2-16

Figure 2-5 Software Structure of ZXMP S385
2.3.2 Intelligent Software

ZXMP S385 can be loaded with the ASON intelligent software to implement intelligent
control of the equipment. The intelligent software is independent of the system software.
It is loaded to the NE control processor board as a software module.
The loaded intelligent software provides an independent control plane, with which
the capabilities of maintaining dynamic connection, routing and signaling processing,
automatic discovery, connection control and protection/recovery are available in the
whole optical network.
In addition, the optical network supports real-time bandwidth allocation on actual demands
for the traffic engineering of optical channels, which makes it easy to introduce various new
value-added services to the network.
2.3.3 Board Software

The board software runs in each board to manage, supervise, and control the board
operation.
Each board receives EMS commands forwarded by the Agent in the NE control processor
board, and then performs corresponding processing, gives responses and reports alarm,
performance and event information to the EMS.
The board software has the following functions: alarm, performance and event processing,
configuration management, communication management, automatic protection switching,
online software downloading, and functional circuit driving.
2.3.4 Agent Software

Agent, located on the NE control processor board of an NE, acts as a service unit that
supports the communication between an EMS and the boards in an NE. It allows the EMS
to monitor, control and manage the NE. In summary, an Agent has the following functions:
l Configure each board during initialization after the NE is powered on.
2-17

l Monitor alarms and performances of the normally-running NE, receive monitoring and
configuration commands issued by the EMS from the gateway NE in its network and
report processing results, alarms and performances via the ECC interface.
The gateway NE is connected to the EMS through the Qx interface on the system
interface board. The LCT interface of the NE control processor board can also be
used to connect the Agent to an EMS. NEs can be managed by means of command
lines.
In terms of function, Agent is composed of the following modules.
l Embedded Operating System Platform
This platform is responsible for the management of public resources. It provides a

hardware-independent execution environment for applications.
l Communication and Control Module
This module acts as an interface module supporting the information exchange

between the Agent and the other board software in an NE. It issues maintenance or
operation commands to corresponding boards from the Agent.
At the same time, this module collects status, alarm, performance and event
information of each board and reports it to the Agent.
l Equipment Management Module
This module is a critical part of Agent to implement the management of corresponding
NE, through which the Agent issues network management commands.
l Communications Module
This module supports the exchange of management information between an EMS
and an NE, and that between two NEs.
l Database Management Module
This module manages and accesses alarm, performance, event, equipment and
network information collected by Agent.
2.3.5 EMS Software

The EMS software NetNumen U31 R22, NetNumen T31 and ZXONM E300 can be used
to manage and monitor the ZXMP S385 NEs.
They provide the functions of configuration management, fault management, performance

management, maintenance management, end-to-end circuit management, security
management, system management, and report management.
Figure 2-6 illustrates the architecture of the EMS software.
2-18

Figure 2-6 Architecture of the EMS Software
l Manager
It is also called "Server". Manager acts as the server of GUI. It exchanges information
with Agent via the Qx interface. Manager provides the following functions.
à Receive requests from GUI, analyze the requests and forward related information
to Agent or send the information to Database.
à Receive processed information from the database, analyze the information and
forward it to GUI.
à Receive the information from Agent, analyze the information and then forward it
to Database or GUI.
l GUI
It is also called "Client". GUI has the following functions.
à Provide graphical user interface for users.
à Provide service interfaces for configuration management, fault management,
performance management, security management, maintenance management,
system management and online help.
à Support user security control.
l Database
Database provides the following functions.
à Support the query of information of interfaces and management functional
modules.
à Store the configuration information, alarm information, etc.
à Keep data consistency between Database and Agent.
2-19

2-20

Chapter 3
System Functions
Table of Contents
Service Functions.......................................................................................................3-1
Cross-connect Capacity .............................................................................................3-6
Optical Adding/Dropping and Multiplexing/Demultiplexing Function ............................3-6
Optical Amplification Function ....................................................................................3-6
Dispersion Management Function ..............................................................................3-7
System Control and Communication Functions ..........................................................3-7
System Power Supply Function ..................................................................................3-7
Overhead Processing.................................................................................................3-8
Timing and Synchronization Output Function .............................................................3-8
Alarm Input/Output Function.......................................................................................3-9
Proection Functions....................................................................................................3-9
3.1 Service Functions

3.1.1 Service Access Types
Table 3-1 lists the services types supported by ZXMP S385.
Table 3-1 ZXMP S385 Service Access Types
Service Type Rate
SDH services STM-1 (optical/electrical) 155.52 Mbit/s
STM-4 622.08 Mbit/s
STM-16 2.488 Gbit/s
STM-64 9.953 Gbit/s
PDH services E1 (optical/electrical) 2048 kbit/s
T1 1544 kbit/s
E3 34.368 Mbit/s
T3 44.736 Mbit/s
Ethernet services FE 10 Mbit/s or 100 Mbit/s
GE 1000 Mbit/s
ATM services ATM (STM-1) 155.52 Mbit/s
3-1

Service Type Rate
SAN services Fiber Channel (FC) 1 Gbit/s or 531.25 Mbit/s
Fiber Connection (FICON) 1 Gbit/s or 531.25 Mbit/s
Enterprise System 200 Mbit/s

Connection (ESCON)
Digital Video Broadcast- 270 Mbit/s

Asynchronous Serial
Interface (DVB-ASI)
3.1.2 Service Access Capacity

Table 3-2 lists the ZXMP S385 service access capability.
Table 3-2 Service Access Capacity of ZXMP S385
Board/Interface Type Number of Board Ports Maximum Number of Access

(channels per board) Services of the System (channels
per subrack)
STM-64 1/2 18
STM-64 (FEC) 1 14
STM-16 1/4/8 72
STM-4 2/4 56
STM-1 (optical) 4/8/16 176
STM-1 (electrical) 8/16 176
E3/T3 6 48
E1/T1 63 630
E1 (optical) 8 112
ATMSTM-1 optical 8 112
OA board 1/2 14
SEC board Eight FE optical/electrical 64 FE+8 GE (layer 2 switching)

interfaces + one GE
optical/electrical interface
(layer 2 switching)
SEE board Eight FE optical/electrical 64 FE+28 GE (layer 2 switching)

interfaces + two GE
optical/electrical interfaces
(layer 2 switching)
TGE2B board 2 GE optical interface 28 GE (transparent transmission)

(transparent transmission)
3-2

Chapter 3 System Functions
Board/Interface Type Number of Board Ports Maximum Number of Access

(channels per board) Services of the System (channels
per subrack)
RSEB board 8 FE optical/electrical interface 64 FE16 GE (layer 2 switching)

2 GE optical/electrical interface
(layer 2 switching)
OADD board 4–channel DWDM optical 56

add/drop multiplexing interfaces
OADC board 4–channel CWDM optical 56

add/drop multiplexing interfaces
• The "Maximum Number of Access Services of the System (channels per subrack)" in the table refers
to the maximum access capability of the relevant service types when 1:N protection is not configured.
3.1.3 Multi-Service Functions

As the SDH based multi-service node equipment, ZXMP S385 provides the following
multi-service functions.
l Ethernet Service Function
l ATM Service Function
l Resilient Packet Ring (RPR) Function
l SAN Function
Ethernet Service Function

Ethernet boards of ZXMP S385 support different Ethernet service types, as listed in Table
3-3.
Table 3-3 Ethernet Service Types Supported by Ethernet boards
Board Service Type
EPL EVPL EPLAN EVPLAN EPTREE EVPTREE
TGE2B √ × × × × ×
SEC √ √ √ √ × ×
SEE √ √ √ √ √ √
RSEB √ √ √ √ × ×
TGSAx8 √ × × × × ×
• “√” indicates support. “×” indicates not support.
l EPL service
Ethernet Private Line (EPL) service implements point-to-point transparent
transmission of Ethernet service. Taking TGE2B as an example, ZXMP S385
provides two channels for point-to-point transparent transmission of Ethernet service.
3-3

Each user port is bound with a certain system port, and vice versa. Thus, it can
transparently transmit gigabit Ethernet service.
l EVPL service
The difference between Ethernet Virtual Private Line (EVPL) and EPL is that EVPL
users need to share the link bandwidth. EVPL service can isolate different users’
services by using VLAN, so as to share the bandwidth.
VLAN can isolate different users’ services in a transmission network, thus satisfies
user’s requirement for data security. Optical transmission equipment at convergence
layer and access layer provide data interfaces. These data interfaces can compose
many VLANs. In this way, data service can be provided to users on the basis of the
current transmission network.
SEC board of ZXMP S385 can provide at most eight 10/100 Mbit/s Ethernet interfaces.
With the cooperation of EMS, flexible and efficient VLAN can be implemented.
l EPLAN service
Ethernet Private LAN (EPLAN) is a kind of Ethernet services from multiple points to
multiple points. Different users do not need to share SDH bandwidth. There is no
need for QoS mechanism or security mechanism. Since there are multiple nodes, it
is necessary to transfer data based on the MAC address. So the nodes have MAC
address learning function and L2 switch function.
l EVPLAN service
Ethernet Virtual Private LAN (EVPLAN) service can be implemented by MPLS or
VLAN stack (Q-in-Q) technology. From user’s point of view, EVPLAN service makes
operator’s network looks like a LAN. The difference between EVPLAN and EPLAN is
that EVPLAN users need to share the link bandwidth.
l EPTREE service
Ethernet Private Tree (EPTREE) is a point-to-multipoint service. Two or more points
are involved for service connectivity. In the topology structure, multiple point-to-point
connections converge on one Ethernet physical interface of a central node. Where
central node is the root node and other nodes are leaf nodes. Leaf node can only
communicate with root node and leaf nodes cannot intercommunicate. The root node
and the leaf nodes learn and search objects through the MAC learning.
l EVPTREE service
Ethernet Private Tree (EVPTREE) is a point-to-multipoint service. EVPTREE differs
from EPTREE in its point-to-point connection consisting of EVPL, thus implementing
the bandwidth sharing.
Ethernet services of ZXMP S385 can allocate bandwidth dynamically as per user’s
requirement. For TGE2B board, each system port can allocate bandwidth with the
minimum granularity of VC-4 and the maximum granularity of VC-4-8v.
When system port employs virtual concatenation mode to designate port capacity, LCAS
technology can be used to dynamically adjust the quantity of virtual group VC-n without
3-4

interrupting service, thus enhancing the robustness of virtual concatenation and improving
the bandwidth utilization ratio.
ATM Service Function

ZXMP S385 supports ATM service. It can converge bandwidth of ATM service.
The burst of traffic is one of the main features of data service. Generally, each data port will
not reach the full capacity, since the bandwidth convergence function of the convergence
layer can effectively use the transmission bandwidth. This function and the bandwidth
dynamic allocation function supplement each other.
The bandwidth convergence of ATM service is performed by AP1x8 board. AP1x8 board
can integrate eight channels of 155 Mbit/s ATM services. Through the ATM switch matrix,
it converges these services into one to four channels of 155 Mbit/s, or one channel of 622
Mbit/s SDH optical signal; and transmits the signal in the MAN optical network.
The ATM switch matrix supports VP/VC exchange at the ATM layer, and has the functions
of VP ring and flow control.
PRP Function
The RPR employs the space reuse protocol (SRP). SRP enables no repetitive traffic flow
in the space, so that each service can use its own line bandwidth without affecting other
services.
Briefly speaking, normally, the data is transferred in the shortest arc between the source
node and the destination node, and multiple nodes can communicate with each other
simultaneously.
Thus, many nodes can send/receive and group simultaneously, which can improve the
bandwidth utilization ratio in the ring. The improvement of bandwidth utilization ratio is
great when there are lots of nodes in the ring.
The RSEB board of ZXMP S385 supports the RPR ring with L2 switching function. The
system side of RSEB board provides two RPR SPAN ports and four EOS ports.
The RPR SPAN ports can form a bidirectional RPR ring at 155 Mbit/s to 1.25 Gbit/s, which
supports the transmitting/receiving of RPR frame specified in IEEE 802.17. The EOS port
supports the transmitting/receiving of Ethernet frame specified in IEEE 802.3.
SAN Function
TGSAx8 board supports SAN interface. It can access ESCON, FICON, FC and DVB-ASI
services. It connects with server and disk array via dedicated hub, exchange, and gateway.
It is a private network which makes high-speed and reliable access available between
server and external storage resource or between independent storage resources.
3-5

3.2 Cross-connect Capacity

ZXMP S385 has the a maximum access capacity of 180 Gbit/s. The space division
cross-connect capacity of ZXMP S385 is 240 Gbit/s (1536×1536 VC-4), and the time
division cross-connect capacity is 40 Gbit/s (256×256 VC-4).
The cross-connect capacities of different time division modules are as follows:
l The TCS32 time division module has a cross-connect capacity of 5 Gbit/s which
equals to 32×32 AU-4s.
l The TCS64 time division module has a cross-connect capacity of 2×5 Gbit/s which
equals to 2×32×32 AU-4s.
3.3 Optical Adding/Dropping and

Multiplexing/Demultiplexing Function
ZXMP S385 supports adding/dropping and multiplexing/demultiplexing function of optical
signals.
l OADD board can add/drop or multiplex/demultiplex four channels of DWDM optical
signals.
l OADC board can add/drop or multiplex/demultiplex four channels of CWDM optical
signals.
3.4 Optical Amplification Function

The ZXMP S385 equipment can implement non-regenerator long-haul transmission by
cooperation of the optical line board and the optical amplifier (OA board). The rate of
optical line boards can be STM-1, STM-4, STM-16 or STM-64. The nominal wavelength
of optical source must be 1550 nm.
The OA boards of ZXMP S385 include the Optical Booster Amplifier (OBA) and Optical
Pre-Amplifier (OPA).
Note:
To implement STM-64 non-regenerator long-haul transmission, OL64/OL64x2/OL64FEC

board must work with OA board and corresponding Dispersion Compensation Module
(DCM).
3-6

3.5 Dispersion Management Function

Dispersion and great loss of optical power limit the transmission distance when
transmitting 10 Gbit/s service via optical fiber. ZXMP S385 provides various DCMs with
different dispersion compensation ranges to solve the problem.
DCM employs advanced dispersion management technology. It compensates dispersion
of 10 Gbit/s signal as per the dispersion limit distance, thus makes the system adapted to
network. DCM module is a passive component and can be flexibly placed.
3.6 System Control and Communication Functions

The system control and communication functions are implemented by the NE Control
Processor board (NCP/ENCP/ANCP), including:
l Sends configuration commands to boards, and collects board performance and alarm
information.
l Exchanges the EMS information between NEs via the ECC channel.
l Reports the alarm and performance information of the subnetwork where the local NE
is located to corresponding Subnetwork Management Control Center (SMCC) via the
Qx interface, and receives management and configuration commands sent from the
SMCC.
Note:
Qx interface is the communication interface between an NE and an SMCC.
l Conducts intelligent monitoring of the fan plug-in box in the NE, and the
overvoltage/undervoltage monitoring of the input voltage of the power distribution
unit.
3.7 System Power Supply Function

ZXMP S385 employs the dual power supply system to access the -48V power in the
equipment room, and processes the -48 VDC power by using the synchronous clock
interface board (SCI) and the Qx interface board (QxI).
ZXMP S385 employs the distributed power supply mode. Service boards, functional
boards, and STM-1 electrical interface switching board are directly powered by the –48
V power in the subrack. E1/T1 switching boards (ESE1x63, EST1x63), E1/T1 interface
bridge board (BIE1), E3/T3 switching board (ESE3x6), and STM-1e/E3/T3/FE interface
bridge board (BIE3) are powered in a 1+1 warm backup mode by SCI board and QxI
board.
3-7

3.8 Overhead Processing

The overhead processing function of ZXMP S385is performed by the Net Control
Processor (NCP/ENCP/ANCP), orderwire board (OW), Cross switch and Synchronous
clock board (CSA/CSE/CSF/CSCP), and optical line board.
Overhead processing functions include:
l Separates Section Overheads (SOHs) from payload data in the SDH frame structure.
l Transmits ECC control information via DCC channel.
l Utilizes E1, E2, and other idle overhead bytes to implement orderwire calls and data
services.
l Cross-connects overhead. Byte is the minimum granularity of cross-connect. The
overhead can be configured to any port as required by EMS.
3.9 Timing and Synchronization Output Function

ZXMP S385 employs the master/slave synchronization mode. The timing/synchronization
function is carried out by the cross-connect and clock board, specifically including:
l Clock source selection
ZXMP S385 can choose the external clock, the clock extracted from STM-N service
interfaces, or the internal clock as the equipment timing reference.
The working modes include fast capture, tracing, hold, and free-oscillation. If the
external timing reference is selected as the clock source, four external 2 MHz or 2
Mbit/s clock input references and 28 lines (or tributaries) timing input references can
be set.
l Clock source switching
When the clock source is lost, higher quality clock source recovers, or the current
clock source quality degrades, the clock source switching will occur. The system
clock supports the synchronous priority switching and SSM algorithm-based automatic
switching.
In the complicated networking, the SSM algorithm-based automatic switching can
optimize the timing and synchronization distribution of the network, reduce the
difficulty of synchronization planning, avoid the timing loop and ensure the optimal
network synchronization.
l Clock export
The system provides four external reference clocks for output. The interface type is 2
Mbit/s or 2MHz, which is implemented by replacing the synchronous clock interface
board (SCIB/SCIH). Each board provides two 75 Ω and two 120 Ω interfaces.
3-8

3.10 Alarm Input/Output Function

NCP/ENCP/NCPA board collects NE alarm messages and sends them to the alarm box
and column-head cabinet via SCI board and QxI board. SCI board receives external alarm
messages:
l SCI board has an external alarm Boolean variable input interface (ALARM_IN), which
can receive eight channels of external alarm Boolean variables.
l NCP board provides four channels of user alarm signal output interfaces via SCI board
and QxI board. The external alarm Boolean variable input interface (ALARM_IN) of
SCI board can output two channels of user-defined alarm signals. The column-head
cabinet alarm interface (ALARM_OUT) can output one channel of critical alarm signal
and one channel of major/minor alarm signal.
3.11 Proection Functions

3.11.1 Equipment-level Protection
3.11.1.1 Power Supply Protection
l Out-of-cabinet power protection
Two groups of -48 V power supplies access the equipment room for the ZXMP
S385. The external power supply works in the 1+1 protection mode, ensuring that
the equipment operates normally when either power supply group in the equipment
room fails.
l Board power supply protection
The service boards employ the distributed power supply mode to reduce the power
supply influence between boards to zero. All boards have overcurrent and overvoltage
protections.
l Protection for reversed polarities of power supply
Use the reverse-preventive diode and fuse for protection. The reverse-preventive
diode ensures that there is no reverse voltage in the board.
If the voltage is reversely connected by mistake, the fuse will blow out after a period
of time. Thus the power will be turned off to avoid damage to the equipment.
3.11.1.2 Cross-connect Protection and Clock Protection

ZXMP S385 provides the 1+1 protection for the cross-connect and clock board by
configuring an active and a standby cross-connect and clock boards.
In case of fault, the system will automatically switch from the active cross-connect and
clock board to the standby cross-connect and clock board.
3-9

The switching of the system bus is non-revertive. Through EMS configuration, the system
can force the service board to select the overhead bus, service bus or clock bus of one
cross-connect and clock board.
3.11.1.3 NCP Board Protection

ZXMP S385 can provide 1+1 protection for NCP/ENCP/ANCP board by installing an active
NCP/ENCP/ANCP board and a standby NCP/ENCP/ANCP board in the system.
In case of fault, the system will automatically switch between the two NCP/ENCP/ANCP
boards. Forced switching through EMS and manual switching are also supported.
3.11.1.4 1:N Protection for Tributary Board

Both the master subrack and the expansion subrack of ZXMP S385 support 1:N protection
for PDH, STM-1 (e), and FE (e) tributary services:
l E1/T1 service board can implement 1:N (N≤9) protection.
l E3/T3 service board can implement two groups of 1:N (N≤4) protection.
l FE (e) service board can implement two groups of 1:N (N≤4) protection.
l STM-1 (e) service board can implement two groups of 1:N (N≤4) protection.
3.11.1.5 EPS Protection for Data Services

When an Ethernet port (applicable to GE port and FE port) or an Ethernet board is faulty,
the EPS protection for data services can automatically switch services to another port on
another board, that is a cross-board port-level protection.
The EPS protection employs the SNCP protection mode. The cross switch and
synchronous clock board sends the services coming from the optical line board
concurrently to the two VCG ports located respectively on two boards in accordance with
the “concurrently sending and preferably receiving” principle.
Normally, only the working channel can receive the services, and the protection channel
is blocked, that is only one VCG port works. Only when a board, port link on the working
channel is faulty, services will be switched to the protection channel for proper receiving.
When a board is faulty or a port link is interrupted, EPS protection can automatically
switch services to the protection board within 50 ms. The protection enhances the service
protection capacity and meets the requirements for the high-level security networking.
The SEE board supports the EPS protection functions in the following modes: LACP, Ping
mode, non-protection mode.
EPS Protecion in LACP Mode

The ESP protection in LACP mode is used in the scenario where the working/protection
SEE boards are interconnected with two ports on one CE devices. Figure 3-1 illustrates
its configuration principle.
3-10

Figure 3-1 Configuration Principle for EPS Protection in LACP Mode
l The CE device connects to two ports on the Ethernet user side through two manually
protected Ethernet ports. On the CE device and ZXMP S385 device these two pairs
of Ethernet ports are configured to belong to one LAG and LACP protocol is enabled
at both ends.
l Services on the user ports of two SEE boards and their corresponding VCG (EOS)
port(s) are configured in the same way.
One port group consisting of a user port on the SEE board and its VCG (EOS) port
is configured to the working service in an EPS protection group. Another port group
consisting of a user port on the SEE board and its VCG (EOS) port is configured to
the protection group.
All timeslots contained in each pair of mutually protected VCG (EOS) port groups must
be configured to the same timeslot in one optical line board in accordance with the
SNCP.
Therefor, two VCG (EOS) port groups form an SNCP protection on part timslots on
one optical interface.
In the receiving direction, in accordance with the concurrently transmitting and
preferably receiving principle, the cross switch and synchronous clock board only
receives services coming from the SEE boards through the working VCG (EOS) port
group without generated alarms, and transfers them to the optical line board.
In the transmitting direction, the cross switch and synchronous clock board transfers
services coming from the optical line board to the two VCG (EOS) port groups and
then transfer them to the two SEE boards.
Therefor, services only can be received and transmitted through channels where the
working VCG (EOS) port groups without generated alarms are located.
l If the user port on the working SEE board sends LACP “link in service” packets
periodically to the CE device, the CE device takes the connection between the port
and the Ethernet as available.
The user port on the protection SEE board sends LACP “Link failure” packet to the
CE device, the CE device takes the connection between the port and the Ethernet as
failed. The flow on the CE device is only loaded to the available Ethernet link to make
that the CE device and SEE board are consistent in working and protection.
3-11

EPS Protection the Ping Mode

The ESP protection in LACP mode is used in the scenario where the working/protection
SEE boards are interconnected with two ports on twoCE devices. Both CE devices are
configured with VRRP or HSRP protocols.Figure 3-2 illustrates its configuration principle.
Figure 3-2 Configuration Principle for EPS Protection in Ping Mode
l CE1 and CE2 are active/standby devices that run the VRRP or HSRP protocols.
l An Ethernet port on CE1 is connected to an Ethernet port on the user side of the
working SEE board. An Ethernet port on CE2 is connected to an Ethernet port on the
user side of the protection SEE board.
l Ports in CE1 and CE2 and Ethernet ports for connecting to SEE boards are
configured in an VLAN. Therefore, SEE boards can monitor the VPPR or HSRP
heartbeat packets.
l The working SEE board uses the user port to PING the connected CE1. The protection
SEE board uses uses the user port to PING the connected CE12 as well.
l Services on the user ports of two SEE boards and their corresponding VCG (EOS)
port(s) are configured in the same way.All timeslots contained in each pair of mutually
protected VCG (EOS) port groups must be configured to the same timeslot in one
optical line board in accordance with SNCP.
Therefor, two VCG (EOS) port groups form an SNCP protection on part timslots on
one optical interface. One port group consisting of a user port on the SEE board and
its VCG (EOS) port is configured to the working service in an EPS protection group.
Another port group consisting of a user port on the SEE board and its VCG (EOS) port
is configured to the protection group.
In the receiving direction, in accordance with the concurrently transmitting and
preferably receiving principle, the cross switch and synchronous clock board only
receives services coming from the SEE boards through the working VCG (EOS) port
group without generated alarms, and transfers them to the optical line board.
In the transmitting direction, the cross switch and synchronous clock board transfers
services coming from the optical line board to the two VCG (EOS) port groups and
then transfer them to the two SEE boards. Therefor, services only can be received
and transmitted through channels where the working VCG (EOS) port groups without
generated alarms are located.
3-12

l The working SEE board transfers services between VCG (EOS) port group and the
user port, and the VCG (EOS) port group of the protection SEE board is blocked and
does not receive or transmit services.
ESP Protection without Protocol

The ESP protection without protocol is used in the scenario where the working/protection
SEE boards are interconnected with two CE devices.
Its principle is similar to that of EPS protection except that the working/protection
SEE board does not PING the interconnected CE device but triggers the switching in
accordance wit the port Link Down or board heartbeat exceptions.
3.11.2 Network-Level Protection

3.11.2.1 Protection Types
ZXMP S385 complies with multiple networking features recommended by ITU-T.
The protection modes include 1+1 link multiplex section protection, 1:N link multiplex
section protection, two-fiber unidirectional path protection ring, two-fiber bidirectional
multiplex section protection ring, four-fiber bidirectional multiplex section protection
ring, dual node interconnection protection (DNI), and sub-network connection protection
(SNCP).
The protection features of ZXMP S385 also include Ethernet and IP rerouting compliant
with IEEE 802.3E.
3.11.2.2 Extra Service

ZXMP S385 can use the protection channel to carry extra service when the working
channel has no fault. Extra service has lower priority than normal service on the working
channel, and has no protection.
If fault or external command triggers channel switching, normal service in the working
channel will be switched to the protection channel, and extra service in the protection
channel will be abandoned. When the fault is removed or the external command is
cancelled, the extra service will be recovered.
All the optical interfaces of ZXMP S385 optical line boards support MS protection with extra
service, including four-fiber/two-fiber ring (with or without extra service), and 1:N link (with
or without extra service).
3.11.2.3 False-Connection-Proof
Protection channel of MS protection ring is shared by spans on the ring. If the working
channel works normally, protection channel can carry extra service.
Therefore, each timeslot of protection channels can work for multiple services: service of
the same timeslot on different spans, and extra service.
3-13

Since protection channel is shared by spans, service might be incorrectly connected during
protection switching. The mechanism of false connection is as follows:
l For a ring with no extra service, if multiple nodes have fault and results in one node
to be isolated, services from the same timeslot on different spans may try to enter
the protection channel timeslot simultaneously, which results in false connection of
service.
Figure 3-3 shows an example of false connection. In normal work status, circuit
Q occupies timeslot 1 between node A and node C. Meanwhile, circuit R occupies
timeslot 1 between node A and node F, as shown in Figure 3-3 (a).
When node A is isolated, as shown in Figure 3-3 (b), the span between node A and
node F, and the span between node A and node B are broken. Therefore, both circuit
Q and circuit R try to switch to timeslot 1 of protection channel, resulting in false
connection of the service.
3-14

Figure 3-3 Example of False Connection
l For a ring with extra service, even fault of one node may cause normal service of
working channel to try to occupy protection channel timeslot which carries extra
service, thus results in false connection of the service.
ZXMP S385 can resist false connection at AU-4 level for two-fiber/four-fiber MS ring, logic
sub-network, and DNI.
3-15

ZXMP S385 identifies the nodes that switch as per the switching request, and checks the
services that are affected by the switching. In this way, it can identify the connection that
might be incorrect.
Then, it inserts AU-AIS into the timeslot that may carry the falsely connected service, so
as to prevent false connection.
In practice, false-connection-proof is implemented by EMS.
3.11.3 Logic Sub-network Protection

ZXMP S385 supports the logic subnet function.
A network can be divided into multiple logic sub-networks based on the physical layer.
These logic subnets can be managed and configured independently.
If a network is divided into logic subnets, The MS protection is carried out as per the MS
protection information of the corresponding logic sub-network. Services affected by line
faults are protected as much as possible.
3-16

Chapter 4
Technical Specifications
Table of Contents
Dimension and Weight ...............................................................................................4-1
Bearing Requirement of Equipment Room..................................................................4-8
Power Supply Specifications ......................................................................................4-8
Environmental Conditions.........................................................................................4-12
Lightning Protection Requirements...........................................................................4-13
EMC Requirements ..................................................................................................4-15
Optical Interface Specifications ................................................................................4-18
Electrical Interface Specifications .............................................................................4-21
Ethernet Interface Specifications ..............................................................................4-24
ATM Optical Interface Specifications ........................................................................4-27
Optical Interface Specifications of OA Board ............................................................4-28
SAN Interface Specifications ....................................................................................4-29
DCM Specifications ..................................................................................................4-29
Interface Jitter Specifications....................................................................................4-30
Clock Specifications .................................................................................................4-36
Ethernet Performance Specifications........................................................................4-39
RPR Performance Specifications..............................................................................4-43
ATM Characteristics .................................................................................................4-44
External Interface Standards ....................................................................................4-46
4.1 Dimension and Weight

4.1.1 Cabinet Dimensions and Weights
Table 4-1 describes dimensions and weights of ZXMP S385 cabinets.
Table 4-1 Dimensions and Weights of ZXMP S385 Cabinets
Dimensions (Height × Width × Depth) (Unit: mm) Weight (Unit: kg)
2000 × 600 × 300 59
2200 × 600 × 300 65
• The weight refers to the weight of an empty cabinet.

• If a 2600 mm-high cabinet is required on site, you can mount a top box on the top of the cabinet.
Figure 4-1 illustrates the outline dimensions of the 300 mm-deep cabinet.
4-1

Figure 4-1 Dimensions of ZTE Transmission Equipment Cabinet (300 mm Deep)
4.1.2 Dimensions and Weight of Components

The dimensions and weight of major components of ZXMP S385 are listed in Table 4-2.
4-2

Chapter 4 Technical Specifications
Table 4-2 Dimensions and Weight of Major Components of ZXMP S385
Component Dimensions (mm) Weight (kg)
Subrack (including motherboard 889.0 (height) × 482.6 (width) × 270.0 (depth) 23.0
and fan plug-in box)
Power distribution box 132.5 (height) × 482.6 (width) × 269.5 (depth) 7.0
Fan plug-in box 43.6 (height) × 436.0 (width) × 245.0 (depth) 3.0
Dustproof unit 43.6 (height) × 482.6 (width) × 250.0 (depth) 1.8
Ventilation unit 43.6 (height) × 482.6 (width) × 250.0 (depth) 2.0
Cabling area 133.0 (height) × 482.6 (width) × 250.0 (depth) 2.4
• The cabinet weight refers to the weight of an empty cabinet. The subrack height includes the height
of the cabling area.
4.1.3 Dimensions and Weight of Boards

The dimensions and weight of boards of ZXMP S385 are listed in Table 4-3.
Table 4-3 Dimensions and Weight of Boards
Board ID Board Name Dimension (mm) Weight (kg)
ANCP Advanced Network unit PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.75
Control Processor (thickness)
Front panel: none
NCP Net Control Processor PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.44
(thickness)
Front panel: none
ENCP Enhanced Net Control PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.46
Processor (thickness)
Front panel: none
OW Orderwire board PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.47

(thickness)
Front panel: none
QxI Qx Interface board PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.52
(thickness)
Front panel: none
CSA Cross_switch and PCB: 320.0 (height) ×210.0 (depth) ×2.0 1.14 (with
Synchronous_clock - (thickness) the TCS32
Type A Front panel: 345.6 (height) ×8HP (width) module)
CSE Cross_switch and PCB: 320.0 (height) ×210.0 (depth) ×2.0 1.09 (without
Synchronous_clock - (thickness) the TCS
Type E Front panel: 345.6 (height) ×8HP (width) module)
4-3

CSF Cross_switch and PCB: 320.0 (height) ×210.0 (depth) ×2.0 1.46 (with two
Synchronous_clock - (thickness) 2.5G optical
Type F Front panel: 345.6 (height) ×8HP (width) modules)
CSCP Cross_switch and PCB: 320.0 (height) ×210.0 (depth) ×2.0 1.46 (with two
Synchronous_clock - (thickness) 2.5G optical
Type C Front panel: 345.6 (height) ×8HP (width) modules)
SCIB Synchronous Clock PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.51
Interface board-type B (thickness)
Front panel: none
SCIH Synchronous Clock PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.61
Interface board-type H (thickness)
Front panel: none
OL64 Optical Line of STM-64 PCB: 320.0 (height) ×210.0 (depth) ×2.0 1.09
(thickness)
Front panel: 345.6 (height) ×8HP (width)
OL64x2 Optical Line of PCB: 320.0 (height) ×210.0 (depth) ×2.0 1.12
STM-64×2 (thickness)
OL64FEC Optical Line of STM-64 PCB: 320.0 (height) ×210.0 (depth) ×2.0 1.12
with FEC (thickness)
OL16(OL16FD) Optical Line of STM-16 PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.50
(thickness)
OL16(OL16FDA) Optical Line of STM-16 PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.50
with ASON function (thickness)
OL4x2 Optical Line of STM-4×2 PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.70
(thickness)
(thickness)
4-4

(thickness)
(thickness)
OEL1x16 STM-1x16 Optical/ PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.87 (with 8
Electrical Line board (thickness) optical/electri-
Front panel: 345.6 (height) ×8HP (width) cal modules)
OEIS1x8 STM-1x8 Optical/ PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.55 (with 8
Electrical Interface (thickness) optical/electri-
board Front panel: none cal modules)
LP1x8 Line Process of PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.68
ESS1x8 Electrical Interface PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.47
Switching of STM-1×8 (thickness)
Front panel: none
BIE3 STM-1e/E3/T3/FE PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.37

Interface Bridge board (thickness)
Front panel: none
EP3x6 6×E3/T3 Electrical PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.71
ESE3x6 6×E3/T3 Electrical PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.40
Interface Switching (thickness)
board Front panel: none
EPE1Fx63 Electrical Processor of PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.80
Framed 63×E1/T1 (thickness)
EPE1Zx63 63×E1 Electrical PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.80
(75) Processor (with 75 Ω (thickness)
interface, supporting 63 Front panel: 345.6 (height) ×8HP (width)
channel re-timing)
EPE1Zx63 63×E1 Electrical PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.80
(120) Processor (with 120 (thickness)
Ω interface, supporting Front panel: 345.6 (height) ×8HP (width)
63 channel re-timing)
4-5

EPE1x63 63×E1 Electrical PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.81
(75) Processor (with 75 Ω (thickness)
interface) Front panel: 345.6 (height) ×8HP (width)
EPE1x63 63×E1 Electrical PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.83
(120) Processor (with 120 (thickness)
Ω interface) Front panel: 345.6 (height) ×8HP (width)
EPE1Fx63 Electrical Processor of PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.80
Framed 63×E1/T1 (thickness)
EPT1x63 63×T1 Electrical PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.81
EIE1x63 63×E1 Electrical PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.36
Interface board (with (thickness)
75 Ω interface) Front panel: none
ESE1x63 63×E1 Electrical PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.55
interface Switching (thickness)
board (with 75 Ω Front panel: none
interface)
EIT1x63 63×E1/T1 Electrical PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.35
Interface board (120 Ω (thickness)
for E1, 100 Ω for T1) Front panel: none
EST1x63 63×E1/T1 Electrical PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.54
board (120 Ω for E1, 100 Front panel: none
Ω for T1)
BIE1 E1/T1 Electrical PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.39
Interface Bridge board (thickness)
Front panel: none
OPE1Z Optical E1 Tributary PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.49
board (thickness)
TGE2B Transparent- PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.73

transmission Gigabit (thickness)
Ethernet board Front panel: 345.6 (height) ×8HP (width)
SECx48 Enhanced Smart PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.77
Ethernet (thickness)
4-6

SECx24 Enhanced Smart PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.75
Ethernet (thickness)
SEE Enhanced Smart PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.77
Ethernet board (Type (thickness)
E) Front panel: 345.6 (height) ×8HP (width)
OEIFEx8 Optical/Electrical PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.45

Interface board of Fast (thickness)
Ethernet Front panel: none
ESFEx8 Fast Ethernet Electrical PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.38
board Front panel: none
AP1x8 ATM Processor with 8 PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.85
STM-1 ports (thickness)
RSEB Ethernet processor with PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.98
RPR function (thickness)
MSE Ethernet processor with PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.87
MPLS function (thickness)
TGSAx8 Eight Channels PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.99
Transparent SAN and (thickness)
GE Board Front panel: 345.6 (height) ×8HP (width)
OIS1x8 STM-1×8 Optical PCB: 277.8 (height) ×160.0 (depth) ×2.0 0.45
Interface board (thickness)
Front panel: none
OBA Optical Booster Amplifier PCB: 320.0 (height) ×210.0 (depth) ×2.0 1.15
(thickness)
OPA Optical Pre-Amplifier PCB: 320.0 (height) ×210.0 (depth) ×2.0 1.18
(thickness)
Front panel: 345.6 (height) ×8HP/16HP (width)
OAB Single-channel Optical PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.79
Booster Amplifier (thickness)
OAB2 Dual-channel Optical PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.92
Booster Amplifier (thickness)
4-7

OADD Optical Add/Drop board PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.75
for DWDM signals (thickness)
OADC Optical Add/Drop board PCB: 320.0 (height) ×210.0 (depth) ×2.0 0.75
for CWDM signals (thickness)
• 1 HP=5.08 mm
• The subrack height includes the height of the cabling area.
• OBA/OPA/OAB/OAB2 boards provide two types of front panels: 8 HP and 16 HP.
4.2 Bearing Requirement of Equipment Room

When only ZXMP S385 is taken into consideration, the bearing of the equipment room
should be greater than 450 kg/m2.
4.3 Power Supply Specifications

4.3.1 Power Supply Range
Rated working voltage of ZXMP S385: -48 V DC
Range: -40 V DC to -57 V DC
4.3.2 Power Consumption Specifications

Power consumptions of ZXMP S385 boards are listed in Table 4-4. The equipment power
consumptions vary with equipment configurations.
Table 4-4 Power Consumptions of ZXMP S385 Boards
Board Id Board Name Maximum Power Power Consumption (W)

Consumption (W) under under 45 ºC
25 ºC
ANCP Advanced Network unit Control 20.2 22.2

Processor
NCP Net Control Processor 4.8 5.0
ENCP Enhanced Net Control Processor 9.6 10.6
OW Orderwire Board 5.3 5.4
QxI Qx Interface Board 3.9 4.1
CSA Cross_switch and Syn- 27.4 (with the TCS32 28.2 (with the TCS32
chronous_clock - Type A module) module)
4-8


25 ºC
CSE Cross_switch and Syn- 36.0 (without the TCS 37.1 (without the TCS
chronous_clock - Type E module) module)
CSF Cross_switch and Syn- 32.4 (without the TCS 33.6

chronous_clock - Type F module)
CSCP Cross_switch and Syn- 31.4 (without the TCS 32.6

chronous_clock - Type C module)
TCS32 Timeslot cross switch module of 17.3 17.8

32×32 AU4
TCS64Z Timeslot cross switch module of 17.3 17.8

2×32×32 AU4 (Type Z)
TCS128Z Timeslot Cross Switch of 128×128 26.0 30.0

AU4 - Type Z
TCS128P Timeslot cross switch module of 36.5 37.6

128×128 AU4 (Type P)
TCS256Z Timeslot Cross Switch of 256×256 32.0 36.0

AU4 - Type Z
TCS256P Timeslot Cross Switch of 256×256 60.5 62.3

AU4 - Type P
SCIB Synchronous Clock Interface Board 3.9 4.0

– type B (2 Mbit/s)
SCIH Synchronous Clock Interface 4.4 4.5

Board-type H (2 MHz)
OL64 Optical Line of STM-64 20.7 22.8
OL64x2 Optical Line of STM-64×2 31.9 35.1
OL64FEC Optical Line of STM-64 with FEC 25.0 27.3
OL16OL16FD Optical Line of STM-16 12.0 12.5
OL16OL16FDA Optical Line of STM-16 with ASON 14.5 15.0

function
4-9


25 ºC
OEL1x16 STM-1x16 Optical/ Electrical Line 18.1 19.9

Board
OEIS1x8 STM-1x8 Optical/Electrical Interface 6.4 7.0

Board
LP1x8 Line Process of STM-1×8 5.8 6.0
ESS1x8 Electrical Interface Switching of Before the switching: 0.5 Before the switching: 0.6
STM-1×8 After the switching: 8.2 After the switching: 8.4
BIE3 STM-1e/E3/T3/FE Interface Bridge 0.5 0.6

Board
EP3x6 6×E3/T3 Electrical Processor 12.5 12.9
ESE3x6 6×E3/T3 Electrical Interface Before the switching: 0.5 Before the switching: 0.6
Switching Board After the switching: 5.3 After the switching: 5.4
EPE1Fx63 Electrical Processor of Framed 12.2 13.4

63×E1/T1
EPE1Zx63 63×E1 Electrical Processor 12.2 13.4

75 (Interface: 75 Ω, 63–channel
retiming supported)
EPE1Zx63 63×E1 Electrical Processor 12.2 13.4

120 (Interface: 120 Ω, 63–channel
retiming supported)
EPE1x63 63×E1 Electrical Processor 19.0 19.6

75 (Interface: 75 Ω)
EPE1x63 63×E1 Electrical Interface Board 19.0 19.6

120 (Interface: 120 Ω)
EPE1Fx63 Electrical Processor of Framed 21.2 21.8

63×E1/T1
EPT1x63 63×E1 Electrical Interface Board 15.4 15.8
EIE1x63 63×E1 Electrical Processor 0.5 0.6

(Interface: 75 Ω)
ESE1x63 63×E1 Electrical interface Switching Before the switching: 0.5 Before the switching: 0.6
Board (Interface: 75 Ω) After the switching: 21.6 After the switching: 22.2
EIT1x63 63×E1/T1 Electrical interface 0.5 0.6

Switching Board (Interface: 120Ω
or 100 Ω)
4-10


25 ºC
EST1x63 63×E1/T1 Electrical interface Before the switching: 0.5 Before the switching: 0.6
Switching Board (Interface: 120Ω After the switching: 21.1 After the switching: 21.8
or 100 Ω)
BIE1 E1/T1 Electrical Interface Bridge 0.5 0.6

Board
OPE1Z Optical E1 Tributary Board 22.5 22.8
SECx48 Enhanced Smart Ethernet 31.1 32.0
SECx24 Enhanced Smart Ethernet 18.5 19.1
SEE Enhanced Smart Ethernet Board 31.1 32.0

(Type E)
OEIFEx8 Optical/Electrical Interface Board of 7.0 7.2

Fast Ethernet
ESFEx8 Fast Ethernet Electrical interface 0.6 0.7

Switching Board
AP1x8 ATM Processor with 8 STM-1 ports 24.1 24.9
RSEB Ethernet processor with RPR 29.4 30.3

function
OIS1x8 STM-1×8 Optical Interface Board 7.0 7.2
TGE2B Transparent-transmission Gigabit 19.1 19.7

Ethernet Board
MSEA Ethernet processor with MPLS 37.5 –

function
MSEB Ethernet processor with MPLS 35.0 –

function
TGSAx8 Eight Channels Transparent SAN 36.5 37.6

and GE Board
FAN FAN Board 4.2 4.3
OBA Optical Booster Amplifier 6.1 11.6
OPA Optical Pre-Amplifier 4.8 10.3
OAB Single-channel Optical Booster 4.8 5.3

Amplifier
OAB2 Dual-channel Optical Booster 7.9 8.7

Amplifier
4-11


25 ºC
OADD Optical Add/Drop Board for DWDM 4.0 4.1

signals
OADC Optical Add/Drop Board for CWDM 3.5 3.6

signals
• The maximum power consumptions are tested under the environmental temperatures of 25 ºC and 45 ºC. When
equipment is started up or environmental temperature is higher or lower, the power consumptions will increase.
Therefore, the power supply capacity provided by equipment should be 1.5 or 1.8 times the maximum power cons
umptions listed in the table.
• “–” indicates that the consumption is unknown.
4.4 Environmental Conditions

4.4.1 Grounding Requirements
l If separate grounding is adopted in the equipment room, the grounding resistance
should meet the following requirements:
à The ground resistance of -48 V GND: ≤ 4 Ω.
à The ground resistance of the system working ground: ≤ 1 Ω.

à The ground resistance of the lightning protection ground: ≤ 3 Ω.
l If combined grounding is employed in the equipment room, the ground resistance
should meet the following requirements:
à The ground resistance: ≤ 1 Ω.
à The voltage differences among the lightning protection ground, the system
working ground, and the -48 V GND should be less than 1 V.
4.4.2 Temperature and Humidity Requirements

The requirements of ZXMP S385 for temperature and relative humidity are shown in Table
4-5.
Table 4-5 Temperature and Humidity Requirements
Item Specification
Operating temperature Long-term operation 0 ℃ ~ +45 ℃
Short-term operation –10 ℃ ~ +55 ℃
Relative humidity 5% ~ 95%
• The temperature and humidity are measured 1.5 m above the floor and 0.4 m in front of the equipm
ent.
4-12

4.4.3 Cleanness Requirements

Cleanness requirements include requirements for dust and harmful gases in the air. The
ZXMP S385 equipment should operate in the equipment room that meets the cleanness
requirements described below:
l The equipment room should be free of explosive, conductive, magnetic-conductive or
corrosive dust.
l The density of dust particles with the diameter greater than 5µm is no more than 3×104
particles/m3.
l There should be no corrosive metal or insulation-destructive gas in the equipment,
such as SO2, H2S, NH3, NO2, and so on. The detailed information are listed in Table
4-6.
Table 4-6 Density Limit of Hazardous Gases in the Equipment
Gas Average (mg/m3) Maximum (mg/m3)
SO2 0.2 1.5
H2S 0.006 0.030
NO2 0.04 0.15
NH3 0.05 0.15
Cl2 0.01 0.30
l The equipment room should be always kept clean, with doors and windows tightly
sealed.
4.4.4 Application Environment Requirements

According the application scope of GB 4798 and ZXMP S385, the application environment
requirements are listed as follows:
l Product storage environment: 1K5, 1Z1, 1B2, 1C2, 1S3, or 1M3. The storage duration
is 180 days.
l Product transportation environment: 2K4P, 2B2, 2C2, 2S3, or 2M3. The
transportation duration is 30 days.
l Product usage environment: 3K5, 3Z2, 3Z7, 3B2, 3C2, 3S2, or 3M3. The usage
duration is 10 years.
4.5 Lightning Protection Requirements

Typical lightning protections of power supply fall into three classes, as listed in Table 4-7.
4-13

Table 4-7 Typical Lightning Protection Classes of Power Supply
Lightning Protection Parameter Position of Lightning

Class Protection Circuit
Class B (Elementary class) 40 kA (8 μs /20 μs) AC power distribution

screen (box)
Class C (Lower class) 20 kA (8 μs /20 μs) DC power supply cabinet
Class D (Lowest class) 6000 V (combined wave) -48 V power supply rectifier
ZXMP S385 must meet the following lightning protection requirements:

l The power lightning protection requirements in the central equipment room are as
follows.
à AC power cables should be led underground in the equipment room.
à Because the AC power distribution board and the DC power cabinet are in the
same equipment room, the distance between Class B and Class C lightning
protection units should meet the following decoupling distance requirements.
When the protection grounding bar is laid independently, the distance between
Class B and Class C lightning protection units should not be less than 5 m. When
the protection grounding bar and the power cords are laid in parallel, the distance
between Class B and Class C lightning protection units should not be less than
15 m.
à If the required decoupling distance cannot be satisfied due to some restrictions
in the equipment room, additional decoupling inductor should be installed before
the Class C lightning protection unit by 1.5μH/m.
à Bunched copper wires with cross section area not less than 95 mm2 which are
joined by the Main Earthing Terminal (MET) or Floor Equipotential Earthing
Terminal Board (FEB) should be used as the grounding cables of the Class
B lightning protection unit, and the grounding cables of the Class C lightning
protection unit.
Keep the length of grounding cables as short as possible.
l The lightning protection requirements of ZXMP S385 power input port and input/output
port of E1, Ethernet, alarm, and orderwire signals are listed in Table 4-8.
Table 4-8 Lightning Protection Requirements of ZXMP S385 Ports
Lightning Protection Port Specification
DC power input port 1 kV (1.2/50 µs)
Signal input/output port 1 kV (1.2/50 µs)
4-14

4.6 EMC Requirements

The requirements for electromagnetic compatibility (EMC) include two aspects:
requirements for electromagnetic susceptibility (EMS) and electromagnetic interference
(EMI).
The following three criteria should be followed to judge the test result:
l Performance A: Continuous phenomenon. Neither error nor alarm is allowed. After
electromagnetic interference, the number of error bits does not exceed the maximum
value of the normal requirement.
l Performance B: Transient phenomenon. During the course of an electromagnetic
interference, the degradation of function is allowed and the equipment can work as
expected without the operator’s intervention.
No loss of frame and synchronization is allowed, and neither pattern out-of-sync, nor
AIS alarm is allowed. The equipment shall work normally after the electromagnetic
interference.
The above does not apply to surge testing where some loss of frame alignment may
be expected. For this test, the EUT shall operate as intended following the cessation
of the exposure.
l Performance R: Resistive phenomenon. The interference imposed on the equipment
during the test can cause action of the fuse or other specified device which need to
be replaced or reset so that the equipment can work properly.
4.6.1 EMS
ESD Resistivity
The Electrical Static Discharge (ESD) resistivity indexes of ZXMP S385 are listed in Table
4-9.
Table 4-9 ESD Resistivity
Contact Discharge (kV) Air Discharge (kV) Criterion
6 8 Performance criterion B
8 15 Performance criterion R
RF Electromagnetic Field Radiation Resistivity

The indexes of the RF electromagnetic field radiation resistivity of the ZXMP S385 are
listed in Table 4-10.
Table 4-10 RF Electromagnetic Field Radiation Resistivity
Test Frequency: 80 MHz ~ 1000 MHz
Electric Field Intensity Amplitude Modulation Criterion
10 V/m 80%AM (1 kHz) Performance criterion A
4-15

Electrical Transient Burst Resistivity

The indexes of the electrical transient burst resistivity of the ZZXMP S385 are listed in
Table 4-11 and Table 4-12.
Table 4-11 Electrical Transient Burst Resistivity at DC Power Port
Generator Waveform 5/50ns
Test Voltage Repetition Frequency Criterion
±1 kV 5 kHz Performance criterion B
Table 4-12 Electrical Transient Burst Resistivity at Signal Cable and Control Cable Ports
Generator Waveform 5/50ns
Test Voltage Repetition Frequency Criterion
±1 kV 5 kHz Performance criterion B
Surge Resistivity
The surge resistivity indexes of ZXMP S385 are listed in Table 4-13, Table 4-14 and Table
4-15.
Table 4-13 Surge Resistivity of the DC Power Supply
Generator Waveform: 1.2 μs/50 μs (8 μs/20 μs); Internal Impedance: 12 Ω
Test Mode Test Voltage Criterion
Line to ground ±1 kV Performance criterion B
Line to ground ±2 kV Performance criterion R
Table 4-14 Surge Resistivity of the Outdoor Signal Cable
Generator Waveform: 10 μs/700 µs; Internal Impedance: 40 Ω
Line to line ±2 kV Performance criterion B

Line to ground
Line to line ±4 kV Performance criterion R

Line to ground
Table 4-15 Surge Resistivity of the Indoor Signal Cable
Generator Waveform: 1.2 μs/50 μs (8 μs/20 μs); Internal Impedance: 42 Ω
Line to ground ±1 kV Performance criterion B
Line to ground ±2 kV Performance criterion R
4-16

RF Field Conductivity Resistivity

The indexes of the RF field conductivity resistivity of ZXMP S385 are listed in Table 4-16.
Table 4-16 RF Field Conductivity Resistivity
Test Frequency: 0.15 MHz ~ 80 MHz
Test Intensity Amplitude Modulation Criterion
3V 80%AM (1 kHz) Performance criterion A
4.6.2 EMI
Conductive Emission Electromagnetic Interference
The indexes of conductive emission electromagnetic interference of ZXMP S385 are listed
in Table 4-17 and Table 4-18.
Table 4-17 Conductive Emission Electromagnetic Interference at the DC Power Supply

Port
Test Frequency (MHz) Voltage Threshold (dBμV)
Quasi-Peak Mean Value
0.15 ~ 0.50 79 66
0.5 ~ 30.0 73 60
Table 4-18 Conductive Emission Electromagnetic Interference at the Communication

Port
Test Frequency (MHz) Voltage Threshold (dBμV)
Quasi-Peak Mean Value
0.15 ~ 0.50 97 ~ 87 84 ~ 74
0.5 ~ 30.0 87 74
Radiated Emission Electromagnetic Interference

The indexes of radiated emission electromagnetic interference of ZXMP S385 are listed
in Table 4-19.
Table 4-19 Radiated Emission Electromagnetic Interference
Test Frequency (MHz) Quasi-Peak Wave Detection Limit (dBµV/m)
10 m 3m
30 ~ 230 40 50
230 ~ 1000 47 57
4-17

4.7 Optical Interface Specifications

4.7.1 STM-64 Optical Interface Specifications
Table 4-20 lists the specifications of ZXMP S385 STM-64 optical interfaces.
Table 4-20 STM-64 Optical Interface Specifications
Item Specification
Nominal rate 9953280 kbit/s
Transmission code NRZ scrambling code. Specification for the scramble complies with class-7
pattern synchronous scrambler specified in ITU-T G.707 Recommendation.
Optical Interface Type I-64.1/ S-64.2b/ L-64.2c1 L-64.2c2/ L-64.2P

P1I1-2D1 P1S1-2D2b P1L1-2D2
Average transmit optical -6 to -1 -1 to +2 -2 to +4 0 to +4 -5 to 0

power (dBm)
Minimum extinction ratio 6 8.2 9 9 8.2

(dB)
Receiver sensitivity -11 -14 -22 -22 -14

(dBm)
Receiver minimum -1 -1 -9 -7 -1
overload optical power
(dBm)
Allowed frequency > ±20 ppm

deviation of optical input
interface
AIS rate of the optical l Regenerator (REG): ±20 ppm

output port l Add/Drop Multiplexer (ADM) in the hold mode: ±0.37 ppm
l Add/Drop Multiplexer (ADM) in the free-oscillation mode: ±4.6 ppm
• For the specifications of receiver sensitivity and receiver overload power, the test should be carried
out under the condition of BER=1×10-12.
• 1 ppm=1×10-6

Item Specification
Transmission code NRZ scrambling code. Specification for the scramble complies with class-7
pattern synchronous scrambler specified in ITU-T G.707 Recommendation.
4-18

Item Specification
Optical Interface Type I-16 S-16.1 L-16.1 L-16.2 L-16.2U L-16.2P
Average transmit -5 to 0 -5 to 0 -2 to +3 -2 to +3 -2 to +3 -2 to +3
optical power (dBm)
Minimum extinction 8.2 8.2 8.2 8.2 8.2 8.2

ratio (dB)
Receiver sensitivity -18 -18 -27 -28 -28 -28

(dBm)
Receiver minimum -3 0 -9 -9 -9 -9
overload optical
power (dBm)

deviation of optical
input interface
AIS rate of optical Within ±20 ppm

output interface
• For receiver sensitivity and receiver overload power indices, the tests are carried out under the con
dition that BER=1×10-10.
• 1 ppm=1×10-6

Item Specification
Transmission code pattern NRZ scrambling code. Specification for the scramble complies
with class-7 synchronous scrambler specified in ITU-T G.707
Recommendation.
Optical Interface Type S-4.1 L-4.1 L-4.2
Average transmit optical -15 to -8 -3 to +2 -3 to +2

power (dBm)
Minimum extinction ratio 8.2 10.0 10.0

(dB)
Receiver sensitivity (dBm) -28 -28 -28
Receiver minimum -8 -8 -8
overload optical power
(dBm)
4-19

Item Specification

deviation of optical input
interface
AIS rate of optical output Within ±20 ppm

interface
• 1 ppm=1×10-6

Item Specification
Transmission code pattern NRZ plus scramble. Specification for the scramble is in
accordance with the requirement for the Class-7 synchronous
scrambler specified in ITU-T G.707 Recommendation.
Average transmit optical power -15 to -8 -5 to 0 -5 to 0

(dBm)
Minimum extinction ratio (dB) 8.2 10.0 10.0
Receiver minimum overload -8 -10 -10

optical power (dBm)
Allowed frequency deviation of > ±20 ppm

optical input interface
AIS rate of optical output interface Within ±20 ppm
• 1 ppm=1×10-6
4.7.5 E1 Optical Interface Specifications

Table 4-24 describes the E1 optical interface specifications of ZXMP S385.
4-20

Table 4-24 E1 Optical Interface Specifications
Item Specification
Nominal bit rate (kbit/s) 2048
Rate deviation ±50 ppm
Code pattern NRZ (The coding modes are Pseudo random code or 2 M
framing format.)
Average transmit optical power -15 to -8

(dBm)
Minimum extinction ratio (dB) 8.2
Receiver sensitivity (dBm) -23
Minimum overload optical power of -8

the receiver (dBm)
• The receiver sensitivity and receiver overload must be tested when BER=1×10-10.
• 1 ppm=1×10-6
4.8 Electrical Interface Specifications

4.8.1 E1/T1 Electrical Interface Specifications
l Table 4-25 lists the specifications of T1 electrical interfaces.
Table 4-25 T1 Electrical Interface Specifications
Item Specification
Nominal bit rate 1544 kbit/s
Code pattern AMI and B8ZS
Allowed attenuation at the input port 0 dB to 6 dB, 772 kHz

(square root regular attenuation)
Allowable frequency offset at the input > ±32 ppm

port
Bit ratio tolerance at the output port Less than ±32 ppm
Anti-interference capability of the input When an interference signal is added to the input port, no bit error is
port generated (The interference signal has the same nominal frequency,
tolerance, waveform and code pattern as the main signals but different
sources. The ratio of main signals to interference signals is 18 dB)
Output port waveform Complies with the template recommended by ITU-T G.703
• 1 ppm=1×10-6
l Table 4-26 lists the specifications of E1 electrical interfaces.
4-21

Table 4-26 E1 Electrical Interface Specifications
Item Specification
Code pattern AMI and HDB3
Allowed attenuation at the input port 0 dB to 6 dB, 1,024 kHz

(square root regular attenuation)
Allowable frequency offset at the input > ±50 ppm

port
Bit ratio tolerance at the output port Less than ±50 ppm
Reflection attenuation at Input port Test frequency range: 51.2 kHz to 102.4 kHz Reflection attenuation:
the input/output ports ≥12 dB
Test frequency range: 102.4 kHz to 2048 kHz Reflection attenuation:

≥18 dB
Test frequency range: 2048 kHz to 3072 kHz Reflection attenuation:

≥14 dB
Output Test frequency range: 51 kHz to 102 kHz Reflection attenuation:

port ≥6 dB
Test frequency range: 102 kHz to 3072 kHz Reflection attenuation:

≥8 dB
Anti-interference capability of the When an interference signal is added to the input port, no bit error is
input port generated (The interference signal has the same nominal frequency,
• 1 ppm=1×10-6
4.8.2 E3/T3 Electrical Interface Specifications

l Table 4-27 lists the specifications of E3 electrical interfaces.
Table 4-27 E3 Electrical Interface Specifications
Item Specification
Code pattern HDB3
Allowed attenuation at the 0 dB to 12 dB, 17184 kHz

input port (square root regular
attenuation)
4-22

Item Specification
Allowable frequency offset at > ±20 ppm

the input port
Bit ratio tolerance at the output Less than ±20 ppm

port
Reflection Input port Test frequency range: 860 kHz to 1720 kHz Reflection attenuation: ≥12 dB
attenuation at
Test frequency range: 1720 kHz to 34368 kHz Reflection attenuation: ≥18 dB
the input/output
ports
Output port Test frequency range: 1720 kHz to 51550 kHz Reflection attenuation: ≥6 dB
Anti-interference capability of When an interference signal is added to the input port, no bit error is generated
the input port (The interference signal has the same nominal frequency, tolerance, waveform and
code pattern as the main signals but different sources. The ratio of main signals to
interference signals is 18 dB)
• 1 ppm=1×10-6
l Table 4-28 lists the specifications of T3 electrical interfaces.
Table 4-28 T3 Electrical Interface Specifications
Item Specification
Code pattern B3ZS
Allowed attenuation at the 0 dB to 12 dB, 22,368 kHz

input port (square root regular
attenuation)
Allowable frequency offset at > ±20 ppm

the input port
Bit ratio tolerance at the output Less than ±20 ppm

port
Reflection Input port Test frequency range: 860 kHz to 1720 kHz Reflection attenuation: ≥12 dB
attenuation at
the input/output
Test frequency range: 34368 kHz to 51550 Reflection attenuation: ≥14 dB
ports
kHz
Output port Test frequency range: 1720 kHz to 51550 kHz Reflection attenuation: ≥6 dB
4-23

Item Specification
Anti-interference capability of When an interference signal is added to the input port, no bit error is generated
the input port (The interference signal has the same nominal frequency, tolerance, waveform
and code pattern as the main signals but different sources. The ratio of main
signals to interference signals is 18 dB)
• 1 ppm=1×10-6
4.8.3 STM-1 Electrical Interface Specifications

Table 4-29 lists the specifications of STM-1 electrical interfaces.
Table 4-29 STM-1 Electrical Interface Specifications
Item Specification
Code pattern CMI
Allowable attenuation at 0 dB to 12.7 dB, 78 MHz

output port (square-root
attenuation)
Allowablem frequency offset > ±20 ppm

at the input port
Bit ratio tolerance at the Less than ±20 ppm

output port
Reflection attenuation at the Test frequency range: 8 MHz to Reflection attenuation: ≥15 dB
input/output ports 240 MHz
Anti-interference capability When an interference signal is added to the input port, no bit error is
of the input port generated (The interference signal has the same nominal frequency,
• 1 ppm=1×10-6
4.9 Ethernet Interface Specifications

4.9.1 FE Interface Specifications
The ZXMP S385 equipment supports Fast Ethernet (FE) interfaces of 10 Mbit/s and 100
Mbit/s.
l 10 Mbit/s Ethernet interface
4-24

The 10 Mbit/s Ethernet interface complies with the IEEE 802.3 standard. Its physical
interface employs the Manchester coding. It uses the 10Base-T cable.
l 100 Mbit/s Ethernet interface
The 100 Mbit/s Ethernet interface complies with the IEEE 802.3u standard. Two kinds
of transmission medium can be used: 100Base-TX (twisted pair cable) and 100Base-FX
(optical fiber). Table 4-30 lists the specifications of 100 Mbit/s Ethernet optical interfaces.
Table 4-30 Specifications of 100 Mbit/s Ethernet Optical Interfaces
Item Specification
100Base-FX 100Base-FX single 100Base-FX single mode

multiple mode mode and middle distance
Transmission Distance 2 15 40
(km)
Average transmit optical -8 to -15 -8 to -15 -5 to 0

power (dBm)
Minimum extinction ratio 8.2 8.2 10.0

(dB)
Receiver overload power -8 -8 -10

(dBm)
4.9.2 GE Interface Specifications

The 1000 Mbit/s Ethernet (GE) optical/electrical interface of ZXMP S385 complies with the
IEEE 802.3 standard.
l 1000 Mbit/s Ethernet electrical interface employs the RJ-45 and Category 5
unshielded (UTP) twisted pair. The maximum transmission distance is 100 m.
l 1000 Mbit/s Ethernet physical optical interface supports the 1000Base-SX and
1000Base-LX.
à Table 4-31 lists the specifications of 1000 Base-SX interface.
Table 4-31 specifications of 1000Base-SX Interface
Item Specifications
62.5 μm MMF 50 μm MMF
Module width@850 nm 160 200 400 500

(transmit with the minimum
load) (MHz·km)
Transmission distance (m) 2 to 220 2 to 275 2 to 500 2 to 550
4-25

Item Specifications
62.5 μm MMF 50 μm MMF
Wavelength range of optical 770 to 860

transmitter (nm)
Maximum mean optical Equals to the smaller one of the mean optical launched
launched power (dBm) power and the class-1 security limit specified in
IEEE803.2.
Minimum mean optical -9.5

launched power (dBm)
Maximum mean optical -30

launched power when powering
off the transmitter (max)
Extinction ratio (dB) 9

receiver (nm)
Maximum mean optical 0

received power (dBm)
Minimum return loss (dB) 12
Enhanced receiver sensitivity -12.5 -13.5

(dBm)
• Note: MMF means multiple mode fiber.
à Table 4-32 lists the specifications of 1000Base-LX interface.
Table 4-32 Specifications of 1000Base-LX Interface
Item Specifications
62.5 μm 50 μm MMF 10 μm
MMF SMF
Module width@1300 nm (transmit 500 400 500 N/A

with the minimum load) (MHz·km)
Transmission distance (m) 2 to 550 2 to 550 2 to 550 2 to 5000

transmitter (nm)
Maximum mean optical launched -3

power (dBm)
Minimum mean optical launched -11.5 -11.5 -11.0

power (dBm)
4-26

Item Specifications
62.5 μm 50 μm MMF 10 μm
MMF SMF
Maximum mean optical launched -30

power when powering off the
transmitter (max)
Extinction ratio (dB) 9

receiver (nm)
Maximum mean optical received -3

power (dBm)
Minimum return loss (dB) 12
Enhanced receiver sensitivity -14.4

(dBm)
• MMF means multiple mode fiber. SMF means single mode fiber.
• N/A means not applicable, since there is no standard.
4.10 ATM Optical Interface Specifications

Table 4-33 lists the specifications of ZXMP S385 ATM optical interfaces.
Table 4-33 ATM Optical Interface Specifications
Item Specification
Average transmit optical power (dBm) -8 to -15 -5 to 0 -5 to 0
Minimum extinction ratio (dB) 8.2 10 10
Receiver overload power (dBm) -8 -10 -10
Allowed frequency deviation of optical > ±20 ppm

input interface
AIS rate of the optical output port Within ±20 ppm
• 1 ppm=1×10-6
4-27

4.11 Optical Interface Specifications of OA Board

The OBA and OPA boards of ZXMP S385 respectively implement amplification for output
power and pre-amplification for optical power.
l According to the maximum optical output power, the OBA boards are classified
into OBA12, OBA14, OBA17 and OBA19. The number after “OBA” in board name
indicates the standard optical output power. For example, OBA12 indicates that the
standard optical output power is 12 dBm.
l According to the minimum receive sensitivity, the OPA boards are classified into
OPA32 and OPA38. The number after “OPA” in board name indicates the receive
sensitivity. For example, OPA32 indicates that the minimum receive sensitivity is -32
dBm.
Table 4-34 lists the specifications of the ZXMP S385 OBA board optical interfaces. Table
4-35 lists the specifications of the OPA board optical interfaces.
Table 4-34 Optical Interface Specifications of OBA Board
Performance OBA12 OBA14 OBA17 OBA19 Remarks
Operating wavelength (nm) 1530 to 1562 1530 to 1562 1530 to 1562 1530 to 1562 -
Range of optical input power (dBm) -12 to +4 -12 to +4 -6 to +4 -6 to +4 -
Standard optical output power 12.5 14.5 17.5 19.5 Initial life
(dBm) value
Adjustment range of optical output 3 3 3 3 Only

power (dB) downward
adjustment is
allowed
Noise coefficient @Pin=0 dBm 5.0 5.0 4.8 5.0 -

(typical value) (dB) @Pout=12 @Pout=14 @Pout=17 @Pout=19
dBm dBm dBm dBm
Table 4-35 Optical Interface Specifications of OPA Board
Performance OPA32 OPA38
Operating wavelength (nm) 1550.12 1550.12
Filter -20dB bandwidth (nm) 1.2 1.2
Optical input power (dBm) -32 to -15 -38 to -20
Optical output power (dBm) -9 -12
Adjustment range of output ±3 ±3

power (dB)
Noise coefficient (dB) 4.5 @ Pin=-32 dBm, Pout=-9 4.5 @ Pin=-38 dBm, Pout=-12
dBm dBm
4-28

4.12 SAN Interface Specifications

Table 4-36 lists the specifications of SAN interfaces.
Table 4-36 SAN Interface Specifications
Item Specification
Physical interface (FC-0) 100-SM-LC-L 100-M5-SN-I 100-M6-SN-I
Data rate (MB/s) 100 100 100
Nominal signal rate (MBaud) 10625 10625 10625
Rate tolerance (ppm) ±100 ±100 ±100
Transmission distance (m) 2 to 10000 0.5 to 500 0.5 to 300
Fiber type (μm) SMF 50 (MMF) 62.5 (MMF)
Minimum transmit central wavelength - 770 770

(nm)
Maximum transmit central wavelength - 860 860

(nm)
Minimum average transmit optical power -9.5 -10.0 -10.0

(dBm)
Minimum optical modulation range in - 0.156 0.156

transmit direction (mW)
Maximum rise and descend time of in 320 300 300

transmit direction (20% to 80%) (ps)
Relative intensity noise (dB/Hz) -116 -116 -116
Minimum extinction ratio (dB) 9 9 9
Maximum average receive optical power -3 0 0

(dBm)
Minimum optical modulation range in 0.015 0.031 0.031

receive direction (mW)
Minimum return loss (dB) 12 12 12
• MMF means multiple mode fiber. SMF means single mode fiber.
• 1 ppm=1×10-6
• "-" means no specification.
• The specifications comply with the ANSI INCITS 352-2002 standard.
4.13 DCM Specifications

Table 4-37 lists the specifications of Dispersion Compensation Modules (DCMs) of ZXMP
S385.
4-29

Table 4-37 Specifications of DCM Modules
Item DCM-20 DCM-40 DCM-60 DCM-80
Dispersion compensation -329±15 -680±21 -1020±31 -1360±41

range (ps/nm)
Insertion loss (typical value) ≤4.13.2 ≤5.14.4 ≤7.06.0 ≤8.97.7

(dB)
Polarization Module ≤0.50.4 ≤1.00.4 ≤1.20.5 ≤1.30.6

Dispersion (PMD), order
2 (typical value) (ps)
PMD cost (dB) - ≤0.1 ≤0.1 ≤0.1
4.14 Interface Jitter Specifications

4.14.1 Jitter and Wander Tolerance of PDH Input Interfaces
The jitter and wander tolerance of ZXMP S385 PDH input interface is shown in Figure 4-2,
and it meets the requirements listed in Table 4-38.
Figure 4-2 Jitter and Wander Tolerance of PDH Input Interface
Table 4-38 Jitter and Wander Tolerance of PDH Input Interface
Interface UIp-p Frequency (Hz) Pseudo-

Rate random
A0 A1 A2 A3 f10 f9 f8 f1 f2 f3 f4
(kbit/s) Signal
1544 18 5 0.1 – 1.2× – – 10 120 6k 40k –

10-5
2048 36.9 1.5 0.2 18 4.88× 0.01 1.66 20 2.4k 18k 100k 215-1
10-3 7
34368 618.6 1.5 0.15 – – – – 100 1k 10k 800k 223-1
44736 18 5 0.1 – 1.2× – – 10 600 30k 400k –

10-5
4-30

4.14.2 Jitter and Wander Tolerance of SDH Input Interfaces

The capability of STM-N input interface to bear jitter and wander is specified and tested
using the digital test signal of sine-modulated phase.
l The jitter and wander tolerance of the ZXMP S385 SDH terminal multiplexer input
interface is shown in Figure 4-3, and it satisfies the requirements listed in Table 4-39
and Table 4-40.
Figure 4-3 Jitter and Wander Tolerance of STM-N Terminal Multiplexer Input
Interface
Table 4-39 Jitter and Wander Tolerance (UIP-P) of SDH Terminal Multiplexer Input Interface
STM Interface A0 (18 μs) A1 (2 μs) A2 (0.25 μs) A3 A4
STM-1 2800 311 39 1.5 0.15
STM-4 11200 1244 156 1.5 0.15
STM-16 44790 4977 622 1.5 0.15
STM-64 - - 2490 1.5 0.15
Table 4-40 Jitter and Wander Tolerance (Frequency: Hz) of SDH Terminal Multiplexer Input Interface
STM f0 f12 f11 f10 f9 f8 f1 f2 f3

f4
Interface
STM-1 1.2×10-5 1.78×10-4 1.6×10-3 1.56×10-2 0.125 19.3 500 6.5 k 65 k 1.3
M
STM-4 1.2×10-5 1.78×10-4 1.6×10-3 1.56×10-2 0.125 9.65 100 25 k 250

5M
0 k
STM-16 1.2×10-5 1.78×10-4 1.6×10-3 1.56×10-2 0.125 12.1 500 100 1M

20M
0 k
STM-64 1.2×10-5 1.78×10-4 1.6×10-3 1.56×10-2 0.125 6.05 10k 400 4M

80M
k
4-31

l The jitter and wander tolerance of the ZXMP S385 SDH regenerator input interface is
shown in Figure 4-4, and it satisfies the requirements listed in Table 4-41.
Figure 4-4 Jitter and Wander Tolerance of the STM-N SDH Regenerator Input
Interface
Table 4-41 Jitter and Wander Tolerance of STM-16 and STM-64 Regenerators Input
Interfaces
Item f1 (kHz) f2 (kHz) A1 (UIP-P) A2 (UIP-P)
STM-16 A 1000 100 0.15 1.5
B 12 1.2 0.15 1.5
STM-64 A 4000 400 0.15 1.5
B – – – –
4.14.3 STM-N Interface Inherent Output Jitter and Network Interface

Output Jitter of SDH Equipment
l STM-N interface inherent output jitter of SDH equipment is defined as the jitter at the
STM-N output interface of the equipment when there is no input jitter. For the ADM
and TM equipment of ZXMP S385, the STM-N interface inherent output jitter satisfies
the requirements listed in Table 4-42.
Table 4-42 STM-N Interface Inherent Output Jitter Specifications of SDH Equipment
STM Interface Test Filter Peak-peak Jitter (UI)
STM-1 500 Hz ~ 1.3 MHz 0.3
65 kHz ~ 1.3 MHz 0.1
STM-4 1 kHz ~ 5 MHz 0.3
250 kHz ~ 5 MHz 0.1
STM-16 5 kHz ~ 20 MHz 0.5
1 MHz ~ 20 MHz 0.1
4-32

STM Interface Test Filter Peak-peak Jitter (UI)
STM-64 20 KHz ~ 80 MHz. 0.5
4 MHz ~ 80 MHz. 0.1
• Due to the randomness of jitter, the test value might exceed the specifications. It is acceptable
as long as over 99% test values satisfy the specifications during the test (about 1 to 2 minutes).
l The STM-N network interface output jitter of SDH equipment is defined as the output
jitter value measured at the output interface of any STM-N level in the SDH network.
For ADM and TM equipment of ZXMP S385, the STM-N network interface output jitter
satisfies the requirements listed in Table 4-43.
Table 4-43 STM-N Network Interface Output Jitter Specifications of SDH Equipment
STM f1 (Hz) f3 (Hz) F4 (MHz) B1 (UIp-p) B2 (UIp-p)

Interface
STM-1 500 65 k 1.3 1.5 0.15

optical
interface
STM-1 500 65 k 1.3 1.5 0.075

electrical
interface
STM-4 1k 250 k 5 1.5 0.15

optical
interface
STM-16 5k 1M 20 1.5 0.15

optical
interface
STM-64 20 k 4M 80 1.5 0.15

optical
interface
• Due to the randomness of jitter, the test value might exceed the specifications. It is acceptable
as long as over 99% test values satisfy the specifications during the test (about 1 to 2 minutes).
l For REG equipment, when the test filter employs a 12 kHz high-pass filter, the root
mean square caused by jitter should be no more than 0.01 UI.
4.14.4 Mapping Jitter of PDH Tributaries

ZXMP S385 The mapping jitter of the PDH tributary interface satisfies the requirements
4-33

Table 4-44 Mapping Jitter of PDH Tributary Interface
G.703 Tolerance High-Pass Filter, 20 dB/10 Octaves Mapping Jitter of Maximum

Interface (ppm) Peak Value
(kbit/s)
f1 (Hz) f3 (Hz) f4 (Hz) f1 ~ f4 f3 ~ f4
1544 ±22 10 8k 40 k 0.7 –
2048 ±50 20 18 k 100 k To be 0.075

determined
34368 ±20 100 10 k 800 k To be 0.075

determined
44736 ±20 10 30 k 400 k 0.4 0.1
4.14.5 Combined Jitter

In SDH system, generally there are both mapping jitter and pointer adjustment jitter. The
combined jitter of these two jitters is called the combined jitter. The combined jitter of ZXMP
S385 got from various test sequences should satisfy the specifications listed in Table 4-45,
Table 4-46, and Table 4-47.
Table 4-45 E1/E3 Combined Jitter Specifications
PDH In- Bit Rate High-Pass Filter 20 dB/10 Maximum Peak-Peak Value Combined Jitter UIp-p
terface Toler- Octaves
(kbit/s) ance
f1 (Hz) f3 (Hz) f4 (Hz) UIp-p (f1 ~ f4) UIp-p (f3 ~ f4)
(ppm)
2048 ±50 20 18 k 100 k 0.4 0.4 0.4 – 0.075 0.075 0.075 –
34368 ±20 100 10 k 800 k 0.4 0.4 0.4 0.75 0.075 0.075 0.075 0.075
Test sequence a b c d a b c d
Table 4-46 T1 Combined Jitter Specifications
PDH Bit High-Pass Filter 20 Maximum Peak-Peak Value Combined Jitter UIp-p
Inter- Rate dB/10 Octaves
face Toler-
f1 f3 (Hz) f4 UIp-p (f1 ~ f4) UIp-p (f3 ~
(kbit/s) ance
(Hz) (Hz) f4)
(ppm)
1544 ±32 10 8k 40 k 1.3 1.3 1.9 1.9 To be de-

termined
Test sequence e h, h, h, pe- –

periodic periodic riodic
and and and can-
regular added celled
4-34

Table 4-47 T3 Combined Jitter Specifications
PDH Bit High-Pass Maximum Peak-Peak Value Combined Jitter UIp-p

Inter- Rate Filter 20
face Toler- dB/10
(kbit/s) ance Octaves
(ppm)
f1 f3 f4 ( UIp-p (f1 ~ f4) UIp-p (f3 ~
( ( Hz) f4)
H- H-
z) z)
44736 ±20 10 30 40 0 1 1 1.3 1.3 1 1.3 1.3 To be de-

k 0k . . termined
7 3
Test sequence e f h, h, h, h, h, h, -
peri- peri- peri- peri- peri- peri-
odic odic odic odic odic odic
and and and and and and
reg- reg- can- reg- add- can-
u- u- cel- ular ed cel-
lar ( lar ( led ( led
87-3 87-3 87-3
co- co- code
de de pat-
pat- pat- tern)
tern) tern)
4.14.6 Jitter Transfer Characteristic of the Regenerator

The jitter transfer characteristic of the ZXMP S385 SDH regenerator is shown in Figure
4-5. The jitter transfer characteristics specifications of the regenerator are listed in Table
4-48.
Figure 4-5 Jitter Transfer Characteristic Specifications of the Regenerator
4-35

Table 4-48 Jitter Transfer Characteristic Specifications of the Regenerator
STM-N fc (kHz) P (dB)
STM-1 A 130 0.1
B 30 0.1
STM-4 A 500 0.1
B 30 0.1
STM-16 A 2000 0.1
B 30 0.1
STM-64 A 8000 0.1
B 120 0.1
4.15 Clock Specifications

Timing Principles
The component closest to the SDH network synchronization performance is the clock unit.
ITU-T Recommendations specify three types of clocks:
l ITU-T G.811 specifies the primary reference clock.
l ITU-T G.812 specifies slave clocks at different levels.
l ITU-T G.813 specifies the slave clock of SDH equipment.
All the timings of SDH system should conform to the primary reference clock (PRC)
described in G.811.
Output Jitter
When there is no input jitter, the inherent jitter of the 2 MHz or 2 Mbit/s clock output interface
in ZXMP S385 should not exceed 0.05 UIP-P. The test is conducted at the time interval of
60 s, using a single pole bandpass filter with 20 Hz and 100 kHz turnover frequencies.
Permissible Input Interface Attenuation/Frequency Deviation and Others

The specifications of permissible input interface attenuation/frequency deviation of the
ZXMP S385 clock are listed in Table 4-49.
Table 4-49 Specifications of Permissible Input Interface Attenuation/Frequency

Deviation and Others
Item Specification
Permissible input The attenuation characteristic introduced by the input interface signal
interface attenuation complies with the frequency square root rule. When using cables with
attenuation range of 0 dB ~ 6 dB, no bit error or clock lock loss occurs in
the equipment.
4-36

Item Specification
Permissible input ±4.6 ppm

interface frequency
deviation
Signal bit rate tolerance of ±4.6 ppm

the output interface
Output interface Conforms to the relevant templates specified in ITU-T G.703

waveform
• 1 ppm=1×10-6
Switching of Timing Reference Sources

ZXMP S385 is equipped with more than one external timing reference input. When the
selected timing reference fails, the SDH equipment can automatically switch to another
timing reference input using the S1 byte.
Note:
For 2 Mbit/s external timing source, the timing reference failure refers to the signal loss of
synchronous clock input interface; for the timing recovery through STM-N line signals, the
timing reference failure refers to the loss of STM-N signals that bear timing signals, or the
AIS occurrence.
Long-term Phase Variation in Locked Mode

The long-term phase variation in the locked mode is generally expressed by the Maximum
Time Interval Error (MTIE) and Time Deviation (TDEV).
ZXMP S385 satisfies the requirements listed in Table 4-50, Table 4-51, and Table 4-52.
Table 4-50 Wander Limit at Constant Temperature (MTIE)
MTIE Limit Observation Interval
40 ns 0.1 s<τ≤1 s
40 τ0.1 ns 1 s<τ≤100 s
25.25 τ0.2 ns 100 s<τ≤1000 s
Table 4-51 Wander Limit under Temperature Impact (MTIE)
Additional Permissible MTIE Value Observation Interval
0.5 τ ns 0.1 s<τ≤100 s
50 τ ns τ>100 s
4-37

Table 4-52 Wander Limit at Constant Temperature (TDEV)
TDEV Limit Observation Interval
3.2 ns 0.1 s<τ≤25 s
0.64 τ0.5 ns 25 s<τ≤100 s
6.4 ns 100 s<τ≤1000 s
Clock Accuracy in Hold Mode

Once all the timing references are lost, the SDH Equipment Clock (SEC) will enter the hold
mode after transient phase variation. SEC will use the last frequency information saved
before the timing reference signal is lost as its timing reference.
At the same time, the oscillation frequency of the oscillator will slowly wander, but can still
ensure that SEC frequency only has very small frequency deviation from the reference
frequency in a long time. thus, the slip impairment will stay within the permissible
specification.
This mode can be used to deal with external clock interruption faults lasting for several
days.
When SEC loses its reference source and enters the hold mode, the phase error ΔT
between the SEC output signal and SEC input signal should not exceed the following limit
when observation time S is greater than 15 s:
ΔT (S) = [(a1+a2)S+0.5bS2+c] ns
l a1=50 ns/s, denoting the initial frequency deviation of 5×10-8.
l a2=2000 ns/s, denoting the frequency deviation of 2×10-6, which is caused by the
temperature change when the clock enters the hold mode. If there is no temperature
change, there will be no a2S in the phase error ΔT.
l b=1.16×10-4 ns/s2. It is caused by aging, corresponding to 1×10-8/day frequency
wander.
l c=120 ns, including any additional phase deviation that might be generated during the
transition period when entering the hold mode.
ZXMP S385 satisfies the above requirements.
Frequency Accuracy of the Internal Oscillator in Free-Oscillation Mode

The internal oscillator of the SEC works in the free-oscillation mode when the SEC loses
all of the timing references and their memories or the SEC has no hold mode at all. Its
output frequency accuracy must be within a certain accuracy range.
For a reference that conforms to the G.811, the SEC output frequency accuracy should be
no greater than 4.6 ppm for SDH terminal equipment working in the free-oscillation mode,
and no greater than 20 ppm for REG equipment.
ZXMP S385 satisfies all these specifications.
4-38

4.16 Ethernet Performance Specifications

4.16.1 Transparent Transmission Performance Specifications
Packet Loss Ratio
Packet loss ratio refers to the proportion of the data packets that cannot be transferred
under the condition of continual payload. There is no specific criterion for packet loss
ratio.
However, it should be as low as possible and close to 0 under certain conditions.
Note:
The port flow control function must be disabled when the packet loss ratio test is conducted.
Burst Interval
Burst interval refers to the time interval between the frame bursts of the Ethernet port at the
user side. It is generally defined as the minimum frame interval between Ethernet frames.
Table 4-53 lists the minimum frame interval between Ethernet frames of ZXMP S385.
Table 4-53 Minimum Frame Interval between ZXMP S385 Ethernet Frames
Ethernet Rate (Mbit/s) Minimum Frame Interval (ms)
10 9.6
100 0.96
1000 0.096
Maximum and Minimum Frame Lengths

The frame length ranges that can be processed by the ZXMP S385 Ethernet boards are
Table 4-54 Frame Length Ranges that can be Processed by the Ethernet
Boards/Multi-Service Boards
Ethernet Board/Multi-Service Frame Length Range with Frame Length Range with
Board Jumbo Function Disabled Jumbo Function Enabled
(Byte) (Byte)
SEC 64 to 1522 64 to 9600
SEE 64 to 1522 64 to 9600
RSEB 64 to 1522 64 to 1600
TGE2B 64 to 1518 64 to 9600
4-39

(Byte) (Byte)
TGSAx8 64 to 1522 64 to 9600
Board Throughput
The board throughput refers to the maximum transfer rate of the Ethernet board port
without packet loss. Transfer rate refers to the detected rate of correct transmission frame
between user port and SDH link under a certain payload.
For ZXMP S385, when the GE port of TGE2B, SEC, SEE or TGSAx8 board is configured
with the mapping bandwidth of 8×VC-4, the port throughput can reach 7×VC-4.
Note:
The port flow control function must be disabled when the port throughput test is conducted.
Delay
For a store-and-forward node, delay refers to the time interval from receiving the last bit to
sending the first bit by the detected node.
For a forward-by-bit node, delay refers to the time interval from receiving the first bit to
sending the first bit by the detected node. There is no specific criterion for delay. However,
shorter delay is better under certain conditions.
4.16.2 Specifications of L2 Switching

Packet Loss Ratio
Packet loss ratio refers to the proportion of the data packets that cannot be transferred
under the condition of continual payload. There is no specific criterion for packet loss
ratio.
However, it should be as low as possible and close to 0 under certain conditions.
Note:
The port flow control function must be disabled when the packet loss ratio test is conducted.
4-40

Burst Interval
Burst interval refers to the time interval between the frame bursts of the Ethernet port at
the user side. Burst interval is generally defined as the minimum frame interval between
Ethernet frames. Table 4-55 lists the minimum frame interval between Ethernet frames of
ZXMP S385.
10 9.6
100 0.96
1000 0.096
Delay
For a store-and-forward node, delay refers to the time interval from receiving the last bit to
sending the first bit by the detected node.
For a forward-by-bit node, delay refers to the time interval from receiving the first bit to
sending the first bit by the detected node. There is no specific criterion for delay. However,
shorter delay is better under certain conditions.
Maximum and Minimum Frame Lengths

The frame length ranges that can be processed by the ZXMP S385 Ethernet boards are
Boards/Multi-Service Boards
(Byte) (Byte)
SEC 64 to 1522 64 to 9600
SEE 64 to 1522 64 to 9600
RSEB 64 to 1522 64 to 1600
TGE2B 64 to 1518 64 to 9600
TGSAx8 64 to 1522 64 to 9600
Board Throughput
The board throughput refers to the maximum transfer rate of the Ethernet board port
without packet loss. Transfer rate refers to the detected rate of correct transmission frame
between user port and SDH link under a certain payload.
For ZXMP S385, when the GE port of TGE2B, SEC, SEE or TGSAx8 board is configured
with the mapping bandwidth of 8×VC-4, the port throughput can reach 7×VC-4.
4-41

Note:
The port flow control function must be disabled when the port throughput test is conducted.
Security Filtering Characteristics

The security filtering characteristics include static MAC address setting and MAC address
filtering.
l Static MAC address setting
The static address setting is to manually add a MAC address and the corresponding
port information into the MAC address list. Only the receiving port that is set can
receive the data flow normally without packet loss.
Through the EMS configuration, the ZXMP S385 enhanced smart Ethernet boards
including SEE, RSEB, and SEC support this function.
l MAC address filtering

MAC address filtering is to manually add a MAC address, and filter the frames that
use this MAC address as the source/destination address. The port that is set cannot
receive any data flow.
including SEE, RSEB, and SEC support this function.
Congestion Control
Congestion control refers to the mechanism used to avoid loss of frame by requesting the
external data source to decrease the sending rate to prevent the port from being congested.
ZXMP S385 uses QoS and flow control to deal with congestion. QoS emphasizes the
normal operation of standard services to maximize the bandwidth utilization.
The services exceeding the flow standard are processed by the packet discard method
when the flow requirement cannot be satisfied. The flow control handles the congestion
by temporarily stopping the transmission of the transmitting end to ensure that the flow is
not discarded.
including SEE, RSEB, and SEC support these two functions.
Number of VLANs Supported

The SEC board of ZXMP S385 supports 1022 VLANs. The SEE board of ZXMP S385
supports 4094 VLANs. The range of VLAN ID is 1 to 4094.
4-42

Convergence Ratio Specifications

Convergence means that services of multiple system interfaces occupy one user interface
bandwidth.
The ZXMP S385 enhanced smart Ethernet board (SEC) can achieve the convergence
ratio of 48:1.
Layer-2 VPN Characteristics

The ZXMP S385 SEE and SEC boards support the layer-2 VPN function via the Stacked
VLAN (Q-in-Q) mode.
4.17 RPR Performance Specifications

Burst Interval
Burst interval refers to the time interval between the frame bursts of the Ethernet port at
the user side. Burst interval is generally defined as the minimum frame interval between
Ethernet frames. Table 4-57 lists the minimum frame interval between Ethernet frames of
ZXMP S385.
10 9.6
100 0.96
1000 0.096
RPR Loop Protection Switching Time

The RPR loop protection switching includes two modes: wrapping and steering. For ZXMP
S385, the protection switching time in both modes should be less than 50 ms.
Address Buffering Capability

The address buffering capability refers to the number of MAC addresses that one
port/module/node can buffer. The buffered MAC address can prevent the abandon or
flooding of received frames during the transition.
The ZXMP S385 RPR ring network can buffer no less than 64 k addresses.
RPR Ring Network Bandwidth

The RSEB board of ZXMP S385 supports the RPR ring bandwidth ranging from 155 Mbit/s
to 1.25 Gbit/s.
RPR Service Characteristics

l Service Amount
4-43

The total number of type-A and type-C services supported by the RSEB board of
ZXMP S385 is 1000. And the number of type-B services supported is eight.
Table 4-58 compares different RPR service types.
Table 4-58 Comparisons of RPR Service Types
RPR Throughput Delay Jitter Loss of Frame

Service
Type
A0 Constant rate, with Extremely low, Extremely low, Extremely low

guarantee with guarantee with guarantee
mechanism mechanism
A1 Variable rate, with Low Variable Low

guarantee
B Can be over No requirement No requirement Medium

configured; has
higher priority than
C
C No guarantee; No requirement No requirement High, depends

depends on the on the network
network situation situation
l Service bandwidth range

ZXMP S385 supports the service bandwidth ranging from 20 kbit/s to 1000 Mbit/s.
l Service rate limit granularity
ZXMP S385 supports the service rate limit granularity of 20 kbit/s.
4.18 ATM Characteristics

Range of VPI/VCI Value
ATM services can be transmitted or received normally only when the VP/VC connection is
within the value range.
l For user-to-network interface (UNI), the range of VPI value is 0 ~ 255.
l For network-to-network interface (NNI), the range of VPI value is 0 ~ 4095, and the
range of VCI value is 1 ~ 16383.
The AP1x8 board of ZXMP S385 meets the value range requirements above.
Transmission Priority of ATM Cells

The ATM service has four types:
l Constant bit rate service (CBR)
l Real-time variable bit rate service (rt-VBR)
4-44

l Non-real-time variable bit rate service (nrt-VBR)

l Unspecified bit rate service (UBR)
The transfer priorities of ATM services are: CBR > rt-VBR > nrt-VBR > UBR. When the
transmission flow of ATM services exceeds the maximum cell flow traffic of the ATM
equipment, the ATM equipment will discard cells according to the priority of services once
the congestion occurs.
The AP1x8 board of ZXMP S385 meets the priority requirements above.
VP-Ring Protection
The VP-Ring protection adopts the principle of concurrent transmitting and preferred
receiving with alarm supervision.
The standby VP connection of the receive direction will be selected when alarms are found,
such as VP Alarm Indication Signal (VP-AIS), Loss Of Signal (LOS), Loss Of Frame (LOF),
Out Of Frame (OOF), Line Alarm Indication Signal (LAIS), Loss of Cell Delineation (LCD),
Loss Of Continuity (LOC), Out of Cell Delineation (OCD), and Loss Of Pointer (LOP).
When the alarms disappear and no alarm appear after the switching restore time, the
previous active VP connection will recover automatically.
The AP1x8 board of ZXMP S385 supports enabling and restoring the VP-Ring protection.
Note:
It is suggested to set the ATM service type to CBR for the VP-Ring protection test.
Protection between Layers

The AP1x8 board provided by ZXMP S385 can support the protection of SDH layer and
ATM layer. The protection of ATM layer refers to VP protection.
When the network fails, the SDH layer protection will be enabled first. If the SDH layer
protection fails after the protection switching delay of ATM layer, the ATM layer protection
will be enabled.
Once the service recovers, the ATM service will return to the working connection channel
from protection connection after switching restore time.
The delay of this protection ranges from 0 s to 10 s. The switching restore time is from 1
ms to 30 ms.
The AP1x8 board of ZXMP S385 can enable and restore the protection between layers.
4-45

Note:
l It is suggested to set the ATM service type to CBR for testing the protection between
layers.
l The switching restore time of protection between layers refers to the restore time of
ATM layer protection.
ATM Transmission Performance

The ATM transmission performance represents the transmission quality of ATM cells.
The cell transmission quality involves cell transfer delay (CTD), cell delay variation (CDV),
cell loss ratio (CLR), cell error ratio (CER), cell mis-insertion ratio (CMR), and bit error ratio
(BER).
To guarantee the transmission quality of ATM services, the requirements of parameters
specified above are different for ATM services of different types (CBR, rt-VBR, nrt-VBR,
and UBR).
AP1x8 board of ZXMP S385 supports ATM service types of CBR, rt-VBR, nrt-VBR, or UBR.
And the cell transmission quality of these services can be supervised by data network
analyzers.
4.19 External Interface Standards

The external interfaces refer to interfaces that connect ZXMP S385 with other external
equipment (such as digital distribution frame). The ZXMP S385 external interfaces comply
with the ITU-T, IEEE, and IETF standards, as illustrated in Table 4-59.
Table 4-59 External Interface Standards of ZXMP S385
Interface Types Standard Description
Optical interface ITU-T G.691 Optical interfaces for single-channel SDH systems with
(155 Mbit/s, 622 Mbit/s, 2.5 optical amplifiers and STM-64 system
Gbit/s and 10 Gbit/s)
ITU-T G.692 Optical interfaces for multi-channel systems with optical
amplifiers
ITU-T G.707 Network node interface for the synchronous digital hierarchy
(SDH)
ITU-T G.825 The control of jitter and wander within digital networks which
are based on the synchronous digital hierarchy (SDH)
ITU-T G.957 Optical interfaces for the SDH equipment and systems
4-46

Electrical Interface (155 Mbit/s) ITU-T G.703 Physical/electrical characteristics of hierarchical digital
interfaces
ITU-T G.707 Network node interface for the synchronous digital hierarchy
(SDH)
Electrical interface ITU-T G.703 Physical/electrical characteristics of hierarchical digital

(1.544 Mbit/s, 2.048 Mbit/s, interfaces
34.368 Mbit/s and 44.736
ITU-T G.704 Synchronous frame structures used at 1544, 2048, 6312,
Mbit/s)
8448 and 44736 kbit/s hierarchical levels
GB 7611-87 Parameters of digital interface for PCM systems over

telecommunication network
2.048 MHz network clock ITU-T G.703 Physical/electrical characteristics of hierarchical digital
synchronization interface interfaces
User Data Path Interface (64 ITU-T G.703 Physical/electrical characteristics of hierarchical digital
kbit/s) interfaces
Orderwire interface - The frequency ranges from 300 Hz to 3400 Hz. The
modulation method is PCM, and the bit rate is 64 kbit/s.
Ethernet Interfaces IETF RFC2615 PPP over SONET/SDH
IETF RFC1661 The Point-to-Point Protocol (PPP)
IETF RFC 1662 PPP in HDLC-like Framing
IETF RFC 1990 The PPP Multilink Protocol (MP)
IEEE 802.3ad/D2.0 Link Aggregation Function
IEEE Std International Standards for Ethernet

802.3-2000
IEEE 802.2/3 LAN Protocol Standards

(1998)
IEEE 802.17 Resilient Packet Ring (RPR) Access Method and Physical
Layer Specifications
IEEE 802.1d IEEE Standard for Local and Metropolitan Area Networks:
Media Access Control (MAC) Bridges
IEEE 802.1q Virtual Bridged Local Area Networks
IEEE 802.1w Media Access Control (MAC) Bridges-Amendment 2 - Rapid

Reconfiguration
4-47

IEEE 802.3 Carrier Sense Multiple Access with Collision Detection

(CSMA/CD) Access Method and Physical Layer
Specifications
F1 Interface of Local Terminal ITU-T V.24 List of definitions for interchange circuits between data
terminal equipment (DTE) and data circuit-terminating
equipment (DCE)
ITU-T V.28 Electrical characteristics for unbalanced double-current

interchange circuits
4-48

Chapter 5
Configuration and
Networking
Table of Contents
Subrack and Board Configurations .............................................................................5-1
Typical NE Configurations ..........................................................................................5-4
Networking Modes......................................................................................................5-9
Networking Application of Multi-Service Node Equipment.........................................5-15
Application Example.................................................................................................5-25
5.1 Subrack and Board Configurations

5.1.1 Board Description
ZXMP S385 boards can be classified into two categories:
l Functional boards: Network Control Processor (NCP/ENCP/ANCP), Cross switch
and Synchronous clock (CSA/CSE/CSF/CSCP), orderwire board (OW), Qx interface
board (QxI), synchronous clock interface board (SCI), optical amplifier (OA) and
optical add/drop board (OAD).
l Service boards: Service board types and their corresponding boards are listed in Table
5-1.
Table 5-1 Classifications of the ZXMP S385 Service Boards
Service Board Type Board ID
Optical line board OL64x2, OL64, OL64FEC, OL16x8, OL16x4, OL16, OL4x2, OL4x4,
OL1x8, OL1x4
Electrical processor EPE1x63 (75), EPE1x63 (120), EP3x6, EPT1x63, EPE1Fx63,

EPE1Zx63 (75), EPE1Zx63 (120), LP1x8
Optical tributary board OPE1Z
Optical/Electrical Line OEL1x16

Board
Data processor TGE2B, SEE, RSEB, SEC, AP1x8, TGSAx8
5-1

Service Board Type Board ID
Service interface OIS1x8, OEIFEx8, OEIS1x8, ESE3x6, EIE1x63, EIT1x63, ESS1x8,

board/ ESE1x63, EST1x63, BIE3, BIE1
Interface bridge board/
Interface switching
board
Service boards and service interface boards (or interface switching boards) work together
to implement electrical tributary service without 1:N protection and to process part of the
Ethernet service.
while services with protection are implemented by collaboration of service board, interface
bridge board and interface switching board.
The available electrical and Ethernet services and their corresponding board
configurations are listed in Table 5-2.
Table 5-2 Board Configurations for the ZXMP S385 Electrical Service and Ethernet
Service
Services Boards Needed
Board Type Board ID
E1 electrical service Electrical processor EPE1x63, EPE1Fx63 or EPE1Zx63
Interface board EIE1x63 or EIT1x63
T1 electrical service Electrical processor EPT1x63 or EPE1Fx63
Interface board EIT1x63
E3/T3 electrical service Electrical processor EP3x6
Interface board ESE3x6
E1 electrical service with 1:N Electrical processor EPE1x63, EPE1Fx63 or EPE1Zx63

protection
Interface switching ESE1x63 or EST1x63
board
Interface bridge board BIE1
T1 electrical service with 1:N Electrical processor EPT1x63 or EPE1Fx63

protection
Interface switching EST1x63
board
E3/T3 electrical service with 1:N Data processor EP3x6

protection
Interface switching ESE3x6
board
5-2

Chapter 5 Configuration and Networking
Services Boards Needed
Board Type Board ID
FE electrical service with 1:N Data processor SEE or SEC

protection
Interface switching ESFEx8
board
Ethernet FE, GE optical services Data processor SEE or SEC
Interface board OIS1x8 or OEIFEx8
Ethernet RPR service Data processor RSEB (with two GE optical interfaces)
Interface board ESFEx8, OIS1x8
ATM service Service processor AP1x8 (with eight 155 Mbit/s optical
interfaces)
SAN service Service processor TGSAx8
5.1.2 Board Configuration Description

In the ZXMP S385 system, the components are divided into two categories: mandatory
components and optional components.
l Mandatory components
à Motherboard: It is the carrier for all boards.
à Cross-Connect and Clock board It is the core board for system service and is
mandatory. The standard configuration requires two boards which back up each
other. CSF board (V3.00) or CSCP board must be used to support the ASON
function.
à NE Control Processor board: As the system nerve center, it is mandatory. One
board must be configured. Two ANCPs must be configured in the case of 1+1
protection. To support the ASON function, ANCP board must be configured.
à QxI board and SCI board: QxI board and SCI board provide an NE with 1+1
power supply protection.
l Optional components
à Service board: Different service boards are configured to provide specific
services. The number of slots and their mechanical sizes restrict the number of
service boards to be configured.
à Orderwire board (OW): provides the orderwire phone and part of overhead
services. One OW board is configured as required.
5-3

5.2 Typical NE Configurations

ZXMP S385 employs the modular design. It can perform the TM, ADM, and REG functions
in the same hardware system. The boards can perform the functions of different systems
such as TM, ADM and REG by only modifying the EMS configuration, without changing
the hardware.
Multiple TMs, REGs and ADMs can be implemented in the same subrack.
Figure 5-1 shows the system equipment types and their applications in the network.
Figure 5-1 Applications of ZXMP S385 in the Network
5.2.1 Terminal Multiplexer (TM)

The TM equipment consists of optical line boards, tributary boards, and the corresponding
functional boards. The SDH overhead is terminated at the optical line board side and is
not transmitted any more.
TM Equipment Configuration
l Judge the TM equipment level according to the rate of the aggregate optical direction.
l For the TM equipment at STM-64 level, one OL64x2/OL64/OL64FEC board must
be configured. Other service boards can also be configured according to the
requirements.
l For the TM equipment at STM-16 level, one OL16/OL16x4/OL16x8 board must
be configured. Other service boards can also be configured according to the
requirements.
l For the TM equipment at STM-4 level, one OL4x2/OL4x4 board must be configured.
Other service boards can also be configured according to the requirements.
l For the TM equipment at STM-1 level, one OL1x8/OL1x4 board must be configured.
l Configure interface boards, interface bridge boards, and interface switching boards
according to the requirements.
l All the TM equipment must be configured with corresponding functional boards:
NCP/ENCP/ANCP, CSA/CSE/CSF/CSCP, QxI, SCI.
l Configure OW, OA, or OAD boards as required.
5-4

Typical TM Equipment Configuration Example

ZXMP S385 equipment supports TM configuration at STM-64, STM-16, STM-4 or STM-1
level. The typical configuration example of TM equipment at STM-16 level is shown
in Figure 5-2. These configurations can implement the 1:5 E1 protection, orderwire
processing.
Figure 5-2 Typical TM Equipment Configurations
Note:
The board ID of the EPE1x63 board described in the diagram is EPE1x63 (75).
5.2.2 Add/Drop Multiplexer (ADM)

The ADM equipment consists of two or more optical line boards at the same rate, tributary
boards, and the corresponding functional boards. The SDH section overhead is dropped
at the receiving side of one optical direction, and is added again at the transmitting side of
the same optical direction.
5-5

ADM Equipment Configuration

l Judge the ADM equipment level according to the rate of the aggregate optical
direction.
l For the ADM equipment at STM-64 level, configure at least two OL64/OL64FEC
boards or one OL64x2 board. Other service boards can also be configured according
to the requirements.
l For the ADM equipment at STM-16 level, configure at least two OL16x8/OL16x4 board
or two OL16 borads. Other service boards can also be configured according to the
requirements.
l For the ADM equipment at STM-4 level, configure at least one OL4x2/OL4x4 board.
l For the ADM equipment at STM-1 level, configure at least one OL1x4/OL1x8 board.
l Configure interface boards, interface bridge boards and interface switching boards
according to the requirements.
l All the ADM equipment must be configured with corresponding functional boards:
NCP/ENCP/ANCP, CSA/CSE/CSF/CSCP, QxI, and SCI.
l Configure OW, OA, or OAD boards as required.
Typical ADM Equipment Configuration Example

The typical configuration example of ADM equipment at STM-64 level is shown in Figure
5-3. These configurations can implement the 1:5 E1 protection, and orderwire processing.
5-6

Figure 5-3 Typical ADM Equipment Configurations
Note:
5.2.3 Regenerator (REG)

ZXMP S385 supports REG at STM-64 and STM-16 levels. The REG equipment consists of
optical line boards and the corresponding functional boards. The REG equipment receives
the optical line signal, regenerates the signal and transmits it to the next optical fiber line.
REG Equipment Configuration

l All the REG equipment must be configured with NCP/ENCP/ANCP, QxI, SCI and
CSA/CSE/CSF/CSCP.
l Configure OW boards as required.
l For the REG equipment at STM-64 level, configure two OL64/OL64FEC boards at
least.
5-7

Note:
The OL64x2 board does not support the REG networking function.
l For the REG equipment at STM-16 level, configure two OL16 boards at least.
Note:
The OL16x8/OL16x4 board does not support the REG networking function.
Typical REG Equipment Configuration Example

The typical configuration example of REG equipment at STM-64 level is shown in Figure
5-4.
Figure 5-4 Typical REG Equipment Configurations
5-8

Note:
5.3 Networking Modes

5.3.1 Point-to-Point Networking
The aggregate rate in the point-to-point network can be STM-1, STM-4, STM-16 and
STM-64.
Dual TM configuration can be in the 1+1 protection or non-protection mode. The single
TM configuration is in the non-protection mode.
l When the 1+1 protection mode is configured, two aggregation boards form mutual
protection. This mode enhances the reliability of service transmission, but it lowers
the service access capability.
l In the case of non protection mode, the service access capability is improved at the
price of deterioration of service transmission reliability.
The point-to-point networking is suitable for large capacity inter-office trunk and inter-office
expansion. Figure 5-5 shows the point-to-point networking mode.
Figure 5-5 Point-to-Point Networking of ZXMP S385
5-9

5.3.2 Chain Network

When ZXMP S385 is used in a chain network, the aggregate rate can be STM-1, STM-4,
STM-16 and STM-64.
The chain network is composed of the TM equipment and the ADM equipment.Figure 5-6
shows the chain networks consisting of ZXMP S385.
Figure 5-6 Chain Networking of ZXMP S385
A 4-fiber chain can be configured with channel protection or MS protection. A 2-fiber chain
can be configured with MS protection.
Dual TMs or dual ADMs can form a 1+1 protection chain, while the a single TM or a single
ADM forms a chain network with no protection.
l Under the 1+1 protection mode, two aggregate boards protect each other. This mode
enhances the reliability of service transmission, but it lowers the service access
capability.
l Under the non-protection mode, the networking of dual-ADM and dual-TM can
improve the service access capabilities. However, it reduces the reliability of service
transmission.
The chain network is applicable to the toll backbone network, the telecommunication
networks whose traffic is distributed in chain type, and the chain branch network at the
ring network side.
5-10

5.3.3 Ring Network

Line interfaces of the ring network feature self-closure. The tributary services between NEs
can be transmitted from end to end in two directions (east and west). This kind of network
topology has a strong adaptability and self-healing capability, applicable to large-capacity
optical networks.
There are two types of self-healing ring structures: path protection ring and MS protection
ring. From the view of the abstract functional structure, the path protection ring and MS
protection ring respectively belongs to the sub-network connection protection and path
protection.
The ZXMP S385 equipment can form a 2-fiber/4-fiber bidirectional MS protection ring, or
a 2-fiber unidirectional path switching ring at STM-4/STM-16/STM-64 level.
Figure 5-7 shows a ring network consisting of ZXMP S385.
Figure 5-7 Ring Networking of ZXMP S385
2-fiber unidirectional path switching ring

The ZXMP S385 can constitute a 2-fiber unidirectional path switching ring at STM-1,
STM-4, STM-16, and STM-64 levels. Figure 5-8 illustrates the single point configuration.
5-11

Figure 5-8 Configuration of 2-Fiber Unidirectional Path Switching Ring of ZXMP S385
As shown in Figure 5-8, the working path and the protection path are positioned in two
optical transmission aggregates in opposite directions. Their timeslots are configured in
the EMS.
l Advantages of the path protection ring: It features the fast and flexible protection
switching and capability to provide switching at various capacity levels. The switching
is determined locally and is independent of the network topology. It is applicable to
various complex network topologies and is not confined to the ring topology.
Therefore, it is more applicable to dynamic network environments, such as cellular
telecommunication network.
l Disadvantages of the path protection ring: All the tributary signals are in the structure
of concurrent transmitting and priority receiving. That means all the tributary signals
are transmitted to the receiving node in two directions along the whole ring.
Therefore, the total add/drop traffic of all NEs (traffic of the ring) should be less than
or equal to the system capacity of ADM equipment.
l The unidirectional path switching ring is applicable to the access network, trunk
network, and toll network, where the traffic is centralized and the capacity is relatively
small.
2-fiber/4-fiber bidirectional MS switching ring (shared ring)

ZXMP S385 can form a 2-fiber/4-fiber bidirectional MS switching ring at
STM-4/STM-16/STM-64 level. In a 2-fiber bidirectional MS switching ring, each NE
should have two aggregate boards; and in a 4-fiber bidirectional MS switching ring, each
NE should have four optical directions.
Take four-fiber bidirectional MS switching ring as an example. Normally, services are

transmitted from node A to node D through node B and node C, as shown in Figure 5-9.
When faults occur between node B and node C, the protection ring executes the ring
switching, and the service route is shown in Figure 5-10.
5-12

Figure 5-9 Four-fiber Bidirectional MS Switching Ring (Normal)
Figure 5-10 Four-fiber Bidirectional MS Switching Ring (Switching)
l When configuring the ZXMP S385 equipment to 2-fiber/4-fiber bidirectional MS

switching ring, the user can choose whether to carry extra service or not.
l The 2-fiber/4-fiber bidirectional MS switching ring is capable of transmitting large
amount of traffic.
5-13

The maximum capacity of a 2-fiber bidirectional MS protection ring can reach up to

(K/2)×STM-N, where “K” is the number of nodes in the ring and “STM-N” is the highest
rate of the ring; and with extra service. A 4-fiber bidirectional MS protection ring at
STM-N level has the maximum capacity of K×STM-N.
l Advantages of the MS protection ring: large transmission capacity and flexible
switching.
l Disadvantages of the MS switching ring: fault response/recovery time is relatively long
due to the APS protocol to be processed.
l The 2-fiber/4-fiber bidirectional MS switching rings are applicable to the large-capacity
transmission at STM-16/STM-64 level, for trunk network or toll network with dispersed
traffic.
5.3.4 DNI Networking

The Dual Node Interconnection (DNI) networking for the ZXMP S385 is illustrated in Figure
5-11.
Figure 5-11 DNI networking of ZXMP S385
Actually, the DNI network can be looked as a networking mode of two interconnected ring
networks. The interconnected ring networks can provide inter-ring service protection.
These two ring networks can be of the same protection type, such as interconnected path
rings, or of different protection types, such as a path ring interconnected with a MS ring.
The rate of the ZXMP S385 DNI networking is determined by the rate of the ring networks.
The DNI network generally works at the rate of STM-16 or STM-64.
The DNI networking provides protections for multiple paths and key nodes. It is applicable
to the local transmission backbone network.
5.3.5 Hybrid Networking

The ZXMP S385 equipment can work together with other SDH-based transmission
equipment of ZTE for hybrid networking, such as ZXONE 5800, ZXMP S330, ZXMP S325,
ZXMP S200 and ZXMP S150. For example, Figure 5-12 illustrates a hybrid network
composed of ZXMP S385 and the ZXMP S330 equipment.
5-14

Figure 5-12 Hybrid Networking of ZXMP S385 2-Fiber Ring with ZXMP S330 Ring
The hybrid networking can provide service and orderwire interconnection. The two ring
networks can be configured in the same protection mode, such as interconnected path
rings, or in different protection modes, such as a path ring interconnected with an MS ring.
Within the network in which SDH NEs (ZXONE 5800, ZXMP S330, ZXMP S325,
ZXMP S200 and ZXMP S150) and WDM NEs (ZXWM M900, ZXMP M800, ZXMP
M600) compatibly exist, connect interface Qx of SDH NEs with that of WDM NEs by
cross-connection cables, to implement the remote monitoring for WDM NEs.
5.4 Networking Application of Multi-Service Node

Equipment
5.4.1 Ethernet Private Line (EPL)
When ZXMP S385 is equipped with the TGE2B, SEE, RSEB, SEC, and TGSAx8 boards,
it possesses both the functions of traditional SDH equipment and the Ethernet data
processing function of multi-service node equipment.
It can provide the Ethernet Private Line (EPL) service, and provide corresponding flow
monitoring, CoS and QoS capability as needed.
EPL service has two accessing points through which the Ethernet MAC frames are
transparently transported point to point. Each subscriber’s service is carried by the
private SDH channel in EPL, so different subscribers have no need to share bandwidth
one another.
Thus, EPL has the same bandwidth guarantee and security performance as SDH. Besides,
it is a point-to-point transmission mode, so L2 switching and MAC address learning are not
needed.
5-15

Figure 5-13 shows a typical networking of EPL.

The Ethernet service between user X and user Y is transparently transmitted through
MSTP equipment A and J, as well as the passing-by sites such as B, C, D, E, F, G and H.
Figure 5-13 A Typical Networking of EPL
5.4.2 Ethernet Virtual Private Line (EVPL)

When ZXMP S385 is equipped with the SEE, RSEB, and SEC boards, it possesses both
the functions of traditional SDH equipment and the Ethernet data processing function of
multi-service node equipment.
It can provide the Ethernet Virtual Private Line (EVPL) service, and provide corresponding
flow monitoring, CoS and QoS capability as needed.
The difference between EVPL and EPL is that EVPL users need to share the link
bandwidth. Therefore, EVPL need to use VLAN ID and other mechanisms to distinguish
the data from different subscribers.
5-16

If the service varies with the subscriber, QoS mechanism is adopted then. Because the
subscribers’ services are only separated logically, as another point-to-point transmission
mode, EVPL has the security performance lower than EPL.
Figure 5-14 shows a typical networking of EVPL.
FE1 and FE2 are the service belonging to user 1, FE3 and FE4 both are the service
belonging to user 2. The services of the user 1 and user 2 are isolated when passing
by the sites A, B, C, D, E, F, G, H and J.
Figure 5-14 A Typical Networking of EVPL
5.4.3 Ethernet Private LAN (EPLAN)

It can provide the Ethernet Private LAN (EPLAN) service, and provide corresponding flow
monitoring, CoS and QoS capability as needed.
5-17

EPLAN, as a point to multi-point transmission mode, can guarantee the bandwidth and
isolate the service perfectly, so the subscribers have no need to share the SDH bandwidth.
Meanwhile, EPLAN has no need to adopt QoS and security mechanism.
Because multi points are involved in an EPLAN networking, the data is transferred based
on MAC address, so the functions of MAC address learning and L2 switch are needed.
Figure 5-15 shows a typical networking of EPLAN.
The services of two branches Z and Y of the user pass through the SDH network formed by
the timeslots, then converge at the central node X. Moreover, the bandwidth is exclusive
from each branch to the central.
Figure 5-15 A Typical Networking of EPLAN
5-18

5.4.4 Ethernet Virtual Private LAN (EVPLAN)

It can provide the Ethernet Virtual Private LAN (EVPLAN) service, and provide
corresponding flow monitoring, CoS and QoS capability as needed.
EVPLAN can be achieved through the VLAN stack (Q-in-Q) technology. The difference
between EPLAN and EVPLAN is that the user of EVPLAN should share the bandwidth.
EVPLAN has special attributes of bandwidth, protection, and usability. It also has the
capabilities of MAC address learning and data frame transferring.
Figure 5-16 shows a typical networking of EVPLAN.
The services FE3 and FE5 of user 1 converge as the service FE1 at site M through site A
and site J.
The services FE4 and FE6 of user 2 converge as the service FE2 at site M through site
A and site J. The services of user 1 and user 2 are isolated by VLAN ID in the SDH
transmission channel.
5-19

Figure 5-16 A Typical Networking of EVPLAN
5.4.5 Ethernet Private Tree (EPTREE)

When ZXMP S385 is equipped with the SEE board, it can provide the Ethernet Private Tree
(EPTREE) service, and provide corresponding flow monitoring, CoS and QoS capability
as needed.
EPTREE is a point-to-multipoint service. Two or more points are involved for service
connectivity. In the topology structure, multiple point-to-point connections converge on
one Ethernet physical interface of a central node.
Where central node is the root node and other nodes are leaf nodes. Leaf node can only
communicate with root node and leaf nodes cannot intercommunicate. The root node and
the leaf nodes learn and search objects through the MAC learning.
Figure 5-17 shows a typical networking of EPTREE.
5-20

The FE services of user X and user Y converge at site D. The FE service of user
X is transparently transferred through site A and site D. The FE service of user Y is
transparently transferred through sites J, H, G, F, E, and D.
Figure 5-17 A Typical Networking of EPTREE
5.4.6 Ethernet Virtual Private Tree (EVPTREE)

When ZXMP S385 is equipped with the SEE board, it can provide the Ethernet Private Tree
(EVPTREE) service, and provide corresponding flow monitoring, CoS and QoS capability
as needed.
EVPTREE is a point-to-multipoint service. EVPTREE differs from EPTREE in its

opint-to-point connection consisting of EVPL, thus implementing the bandwidth sharing.
Figure 5-18 shows a typical networking of EVPTREE.
FE1 and FE3 are services of user X. FE2 and FE4 are services of user Y. FE services of
user X and user Y converge at site D.
5-21

FE1 service and FE3 service implement the bandwidth sharing when passing through the
sites A, B, C, and D. FE2 service and FE4 service of user Y implement the bandwidth
sharing when passing through the sites J, H, G, F, E and D.
Figure 5-18 A Typical Networking of EVPTREE
5.4.7 RPR Service Networking

Configured with RSEB board, ZXMP S385 can perform the mapping from Ethernet service
to Resilient Packet Ring (RPR) and complete the unique function of RPR.
In addition, it can make use of the path bandwidth resource of SDH/MSTP ring network,
to offer the dual-ring topology required by RPR and realize the ring connection of RPR
nodes.
The system side of RSEB board provides two RPR SPAN ports and four EOS ports. The
RPR SPAN port can connect one 155 Mbit/s traffic to a bidirectional RPR ring of 1.25
Gbit/s. The EOS port is used for RPR service cross-ring or interworking with EOS board
such as SEE and SEC.
Taking the RSEB board as example, Figure 5-19 shows an application of RPR ring network.
5-22

Figure 5-19 Application of RPR Ring Network
RPR is a dual-ring structure which is similar to the topology of SDH bidirectional MS ring.
It is composed of two ringlets with opposite directions. The ringlet with clockwise direction
is called ringlet 0, and that with counter-clockwise direction is called ringlet 1.
When configuring the RSEB board to be a RPR ring, it is necessary to connect the SPAN1
port with the neighbored SPAN2 port in the RPR ring, as shown in Figure 5-19.
5.4.8 ATM Service Application

Configured with AP1x8 board, ZXMP S385 has the ATM data process function of MAN
equipment.
The AP1x8 board offers eight 155 Mbit/s optical interfaces at the ATM side for ATM service
accessing, and it can perform local switching at VP/VC level via its switching module.
At the system side, the AP1x8 board offers one 622 Mbit/s system interface that can enable
long-haul transmission of ATM service over the SDH optical network after configuration in
the EMS.
Figure 5-20 shows a typical networking application using AP1x8 boards.
5-23

Figure 5-20 Networking Application via AP1x8 Boards
l ATM service access

In Figure 5-20, a single node accesses ATM service in the method of 8:1 bandwidth
convergence with the rate of 155 Mbit/s.
According to the ring network rate, ATM service data can share one VC-4 or each
occupies a VC-4 path. In addition, the ring network can access ATM backbone switch
or higher-order SDH ring network via a certain node.
l Requirement of AP1x8 board configuration

Configure the AP1x8 board at each node that accesses ATM service, so as to
implement the bandwidth convergence function and improve the bandwidth utilization
ratio. The other nodes in the ring network do not need such configuration.
l ATM service protection
ATM service supports the SDH-layer protection and ATM-layer protection, among
which the ATM-layer protection refers to VP or VC protection and is performed by
AP1x8 board.
In case of network fault, SDH-layer protection is first started. If the ATM-layer
protection switching delay has passed and the SDH-layer protection is still invalid,
the ATM-layer protection is started.
After the service recovers, ATM service will return from the protection path to the
previous working path after the switching recovery time passed.
5-24

5.5 Application Example

5.5.1 Service Requirements
Assume that an optical transmission project needs to use 10 Gbit/s SDH optical
transmission equipment for communications among sites A, B, C, and D. Figure 5-21
shows the physical locations of these sites.
Figure 5-21 Site Locations
Service Requirements among the sites:

l Between site A and site B: two STM-1 optical signal services.
l Between site A and site C: two STM-1 optical signal services, and a transparent
transmission Ethernet electrical service with the rate less than 1000 Mbit/s.
l Between site A and site D: two STM-1 optical signal services, and ATM service.
l Between site B and site D: fifty 2 M services.
l Orderwire telephone is available among the sites.
5.5.2 Networking Analysis

l Determine the equipment and rate
The network aggregate rate is 10 Gbit/s. It is recommended to install the ZTE ZXMP
S385 at the rate of STM-64 at sites A, B, C, and D.
l Determine the network topology
Determine the network topology according to the site and service distributions. Use
the ring network as much as possible if the route allows or the cables and fibers are
enough, because the ring network has good self-healing capability.
For complex site distribution, a hybrid networking mode with multiple network
topological structures can be used.
5-25

In this example, it is recommend to use the ring network according to the sites
geographical locations and service distributions.
l Determine the protection mode
Configure the ring network to be an STM-64 multiplex section protection ring to
improve the system reliability.
l Determine the EMS and access NE
Select to install the EMS according to the equipment type. The selected EMS should
be able to ensure unified management of different kinds of devices in the network as
much as possible.
The access NE refers to the NE that accesses the EMS computer. Usually the access
NE is placed at the site where the service traffic is relatively centralized.
Decide whether the connection between the EMS and access NE is local or remote.
In the case of a remote EMS, determine the type of the communication network.
This example uses the NetNumen T31 as the EMS. The access NE is placed at site
A where the traffic is the heaviest. The connection between the EMS and the access
NE is local.
l Determine the clock source and network head NE

Determine the clock source according to the user requirements. The clock sources
include the external clock, line clock, and internal clock. The network head NE refers
to the NE configured as the clock source.
The network synchronization clock is obtained from this NE. Usually, configure the
network head NE and the access NE to be the same NE in order to make the daily
equipment maintenance easy.
In this example, NE A is set as the network head NE, and the clock source type is
internal clock.
Figure 5-22 shows the system networking diagram got from the above analysis.
5-26

Figure 5-22 Networking Diagram
5.5.3 Configurations
5.5.3.1 Board Configuration
Pay attention to the following points when configuring boards for NEs:
l Functional boards and functional interface boards: They include the MB, ENCP, OW,
CSF, QxI, and SCI boards. These functional boards are mandatory. Configure two
CSF boards to improve the system stability.
Note:
This manual only gives one selectable NE control processor, and one cross-connect
and clock board. The user should select the reasonable board type according to the
actual networking situations.
l Service boards and service interface boards: Select optical/electrical line boards and
interface boards according to the service rate and amount. And select optical module
model according to the actual transmission distance.
Table 5-3 lists the board configurations of the sites (NEs).
Table 5-3 Board Configurations of the Sites (NEs)
Board Type Configured Quantity
Site A Site B Site C Site D
MB 1 1 1 1
5-27

Board Type Configured Quantity
Site A Site B Site C Site D
ENCP 1 1 1 1
OW 1 1 1 1
CSF 2 2 2 2
QxI 1 1 1 1
SCI 1 1 1 1
OL64 2 2 2 2
OL1x8 3 1 1 1
EIE1x63 - 1 - 1
EPE1x63 (75) - 1 - 1
TGE2B 1 - 1 -
Ap1x8 1 - - 1
• According to the site distances, the OL64 board can select S-64.2b as its optical module, and the
OL1x8 board can select L-1.1 as its optical module.
Note:
This manual only gives one selectable optical module. The user should select the
reasonable optical module according to the actual networking situations.
5.5.3.2 Structural Part Configuration

l Cabinet configuration
ZXMP S385 provides three kinds of cabinets of height 2000 mm, 2200 mm, and
2600 mm respectively. Choose one of them according to the equipment room
circumstances and the service requirements. In this case, it is assumed that each
site is configured with a ZXMP S385 cabinet 2200 mm high.
l Equipment component configuration
The equipment components include the power distribution box, cabling area, subrack,
fan plug-in box, and dustproof unit. The number of equipment components varies with
cabinets. Each 2200 mm cabinet is configured with one of power distribution box,
subrack, cabling area, fan plug-in box, and dustproof unit respectively.
5.5.3.3 Fiber Pigtail and Cable Configurations

l Fiber pigtail
5-28

The types of the ZXMP S385 optical interface connectors are all LC/PC. Configure
the fiber pigtail as LC/PC-FC/PC if the optical interface connector type for the service
to be connected is FC/PC; configure the fiber pigtail as LC/PC-SC/PC if the optical
interface connector type for the service to be connected is SC/PC.
Each optical interface is configured with two fiber pigtails, and the total number is
subject to the actual project requirements.
l 2 M cable
The EIE1 board of ZXMP S385 provides 63 channels of 2 M signals, and the interface
is 75 Ω. Therefore, use the 75 Ω unbalanced micro coaxial cable.
l Ethernet cable
An Ethernet cable is used to connect an NE and the EMS. Use the cross-connect
Ethernet cable if the EMS and the access NE connect directly; use the standard
Ethernet cable if the EMS and the access NE connect via a HUB.
l External power cord and grounding cable
External power cords include two groups of -48 V power cord and -48 V GND power
cord. One group connects to the air switch and the other connects to the -48 V GND
binding post of the power distribution box.
The grounding cables include the system working ground cable (GND) and the
lightning protection ground cable (PGND). They connect to the corresponding
grounding busbars in the equipment room.
Note:
Refer to the Unitrans ZXMP S385 SDH Based Multi-Service Node Equipment Installation
Manual for the detailed specifications of the fiber pigtails and cables. The lengths of these
cables are subject to the project survey data.
5.5.3.4 Networking Configuration

Networking configurations are implemented by the NetNumen T31 EMS. Based on the
online status of an NE, there are two kinds of typical flows:
l Create the NE as online
Create an online NE → Select the access NE → Install boards → Connect the NE
→ Configure the MS protection → Configure services → Configure overheads →
Configure clock sources → Configure orderwire → Extract the NCP time
l Create the NE as offline
Create an offline NE → Select the access NE → Install boards → Connect the NE
→ Configure the MS protection → Configure services → Configure overheads →
Configure clock sources → Configure orderwire
5-29

After the above configurations, modify the offline NE to be online, download the NE
database, and finally extract the NCP time.
Note:
Refer to related operation manuals of NetNumen T31 for detailed instructions of network
configuration and service configuration.
5.5.4 Application Features

This networking example employs the ring network topology, and the protection method is
the two-fiber bidirectional multiplex section protection ring.
When any site in the ring network fails or the fiber is broken, the service will not be affected
and the transmission will continue by switching to the protection mode due to the network
self-healing function and the warm backup functions of the critical boards.
The multiplex section protection ring enables the repetitive use of timeslots in the ring.
The maximum service capacity of the ring network can reach as much as K/2×STM-N (K
refers to the number of nodes in the ring network, STM-N is the maximum rate of the ring
network). Thus the maximum service capacity of this networking example is 2×STM-64.
This networking mode is applicable to the transmission backbone networks with scattered
nodes (sites) and high service reliability requirement.
5-30

Appendix A
Standards and
Recommendations
The physical interfaces, network management, and information models of the ZXMP S385
comply with the following standards and recommendations:
The SDH recommendations specified by ITU-T and other organizations that ZXMP S385
complies with are listed in Table A-1.
Table A-1 Standards and Recommendations Followed by ZXMP S385
Standard Description
IEEE 802.17 Resilient Packet Ring (RPR) Access Method and Physical Layer Specifications
IEEE 802.1d (1998) IEEE Standard for Local and Metropolitan Area Networks: Media Access
Control (MAC) Bridges
IEEE 802.1q (1998) Virtual Bridged Local Area Networks
IEEE 802.1w (2001) Media Access Control (MAC) Bridges-Amendment 2 - Rapid Reconfiguration
IEEE 802.3 (2000) Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access
Method and Physical Layer Specifications
IEEE Std 802.3-2000 International Standards for Ethernet
IEEE802.2/3 (1998) LAN Protocol Standards
IEEE802.3ad/D2.0 Link Aggregation Function
IETF RFC 1662 (1994) PPP in HDLC-like Framing
IETF RFC 1990 (1996) The PPP Multilink Protocol (MP)
IETF RFC1661 The Point-to-Point Protocol (PPP)
IETF RFC2615 PPP over SONET/SDH
ISO10172 Information processing system - Open systems Interconnection - Telecom and

information switching network/transport protocol interworking specification
ISO10589 Information processing system - System inter-domain telecom and

information exchange - Intermediate system for use in conjunction with
connectionless-mode network service (ISO8473) - Intermediate system routing
exchange protocol
ISO7498 Information processing system - open systems interconnection - management

framework
A-1

ISO8073/AD2 Information processing systems - open system interconnection - connection

oriented transport protocol specification/addendum 2: class four operation
over connectionless network service
ISO8348 Information processing system - data communication network definition
ISO8473 Protocols for information processing system - connectionless network service

digital communications
ISO8571.1 Information processing system-Open systems interconnection-File Transfer,

Access and Management-Part 1: General introduction
ISO8571.2 Information processing system - Open systems interconnection - File Transfer,

Access and Management - Part 2: Virtual file storage definition

Access and Management-Part 3: File service definition

Access and Management-Part 4: File protocol specification
ISO8648 Information processing system—Open system interconnection—Internal

Organization of the Network Layer
ISO8802.2 Information processing system - Local area network - Part 2: logic link control
ISO8802.3 Information technology - Local and metropolitan area networks - Part 3: Carrier
sense multiple access with collision detection (CSMA/CD) access method and
physical layer specifications
ISO9542 Information processing system - Intersystem communication and information

exchange - End system for use in conjunction with the connectionless-mode
network service (ISO 8473) - Intermediate System Routing Exchange protocol
ISO9545-1 Information processing system - Open systems interconnection - Common

management information service definition
ISO9546-1 Information processing system - Open systems interconnection - Common

management information protocol specification
ITU-T G.652 Characteristics of a single-mode optical fiber cable
ITU-T G.653 Characteristics of a dispersion-shifted single-mode optical fiber cable
ITU-T G.655 Characteristics of a non-zero dispersion shifted single-mode optical fiber cable
ITU-T G.661 Definition and test methods for the relevant generic parameters of optical fiber
amplifier devices
ITU-T G.663 Application related aspects of optical fiber amplifier devices and subsystems
ITU-T G.691 Optical interfaces for single-channel STM-64 and other SDH systems with
optical amplifiers
ITU-T G.692 Optical interfaces for multi-channel systems with optical amplifiers
A-2

Appendix A Standards and Recommendations
ITU-T G.703 Physical/electrical characteristics of hierarchical digital interfaces
ITU-T G.704 Synchronous frame structures used at 1544, 6312, 2048, 8448, and
44736kbit/s hierarchical levels
ITU-T G.7041/Y.1303 Generic framing procedure (GFP)
ITU-T G.7042 Link capacity adjustment scheme (LCAS) for virtual concatenated signals
ITU-T G.706 Frame alignment and CRC procedures relating to basic frame structures
defined in G.704
ITU-T G.707 Network node interface for the synchronous digital hierarchy (SDH)
ITU-T G.707(2000) Network node interface for the synchronous digital hierarchy
ITU-T G.773 Protocol suites for Q-interfaces for management for transmission systems
ITU-T G.774 SDH network element information model
ITU-T G.774.01 SDH performance monitoring for the network element view
ITU-T G.774.02 SDH - Configuration of the payload structure for the network element view
ITU-T G.774.03 SDH - Management of multiplex-section protection for the network element
view
ITU-T G.774.04 SDH management of the subnet connection protection for the network element
view
ITU-T G.780 Vocabulary of terms for synchronous digital hierarchy (SDH) networks and
equipment
ITU-T G.783 Characteristics of synchronous digital hierarchy (SDH) equipment functional

blocks
ITU-T G.784 Synchronous Digital Hierarchy (SDH) Management
ITU-T G.803 Architecture of transport networks based on SDH
ITU-T G.805 Generic functional architecture of transport networks
ITU-T G.810 Definitions and terminology for synchronization networks
ITU-T G.811 Timing characteristics of primary reference clocks
ITU-T G.812 Timing requirements of slave clocks suitable for use as node clocks in
synchronization networks
ITU-T G.813 Timing characteristics of SDH equipment slave clocks (SEC)
ITU-T G.823 The control of jitter and wander within digital networks which are based on
2048 kbit/s hierarchy
ITU-T G.825 The control of jitter and wander within digital networks which are based on the
synchronous digital hierarchy (SDH)
ITU-T G.826 Error performance parameters and objectives for international, constant bit rate
digital paths at or above the primary rate
A-3

ITU-T G.831 Management capabilities of transport networks based on the synchronous

digital hierarchy (SDH).
ITU-T G.832 Transport of SDH elements on PDH networks - Frame and multiplexing
structures
ITU-T G.841 Types and characteristics of SDH network protection architectures
ITU-T G.842 Interworking of SDH network protection architectures
ITU-T G.957 Optical interfaces for the SDH equipment and systems
ITU-T G.958 Digital line systems based on the synchronous digital hierarchy for use on
optical fiber cables
ITU-T K.41 Resistibility of internal interfaces of telecommunication centers to surge voltage
ITU-T M.20 Maintenance philosophy for telecommunication networks
ITU-T M.2100 Performance limits for bringing-into-service and maintenance of international

PDH paths, sections and transmission systems
ITU-T M.2101 Performance limits and objectives for bringing-into-service and maintenance
of international SDH paths and multiplex sections
ITU-T M.2120 PDH path, section and transmission system and SDH path and multiplex
section fault detection and localization procedures
ITU-T M.3010 Principles for a Telecommunications management network (TMN)
ITU-T M.3400 TMN management functions
ITU-T Q.921 ISDN user-network interface - Data link layer specification
ITU-T T.50 International reference alphabet (IRA) (Formerly international alphabet No. 5
or IA5) - Information technology - 7-bit coded character set for information
interchange
ITU-T V.11 Electrical characteristics for balanced double-current interchange circuits often
used in conjunction with integrated circuit equipment in data field
ITU-T V.24 List of definitions for interchange circuits between data terminal equipment
(DTE) and data circuit-terminating equipment (DCE)
ITU-T V.28 Electrical characteristics for unbalanced double-current interchange circuits
ITU-T X.208 (ISO 8824) Specification of Abstract Syntax Notation One (ASN.1)
ITU-T X.209 (ISO 8825) Specification of Basic Encoding Rules for Abstract Syntax Notation One
(ASN.1)
ITU-T X.21 Interface between Data Terminal Equipment and Data Circuit-terminating
Equipment for synchronous operation on public data networks
ITU-T X.214 (ISO 8072) Information technology—open systems interconnection—transport service

definition
ITU-T X.215 (ISO 8326) ITU-T application - Open Systems Interconnection - Session service definition
A-4

Appendix A Standards and Recommendations
ITU-T X.216 (ISO 8822) ITU-T application - Open Systems Interconnection - Presentation service
definition
ITU-T X.217 (ISO 8649) ITU-T application - Open Systems Interconnection - Service definition for the
Association Control Service Element
ITU-T X.219 (ISO IS 9072-1) Remote Operations: Model, notation and service definition
ITU-T X.21bit Use on public data networks of Data Terminal Equipment (DTE) which is
designed for interfacing to synchronous V-Series modems
ITU-T X.224 (ISO 8073) Protocols and specifications for information processing system -
interconnecting of open systems - connection orientated transmitting
ITU-T X.225 (ISO 8327) Information technology - Open Systems Interconnection - Connection-oriented
Session protocol: Protocol specification
ITU-T X.226 (ISO 8823) Information technology - Open Systems Interconnection - Connection-oriented
Presentation protocol: Protocol specification
ITU-T X.229 (ISO IS 9072-2) Remote operation: Protocol specification
ITU-T X.233 Information technology - Protocol for providing the connectionless-mode

network service: Protocol specification
ITU-T X.25 (ISO 8208) X.25 interface between Data Terminal Equipment (DTE) and Data
Circuit-terminating Equipment (DCE)
ITU-T X.27 Electrical characteristics for balanced double-current interchange circuits often
used in conjunction with integrated circuit equipment in the data communication
field
ITU-T X.511 (ISO9594-3) Information technology - Open systems interconnection - The directory:
Abstract service definition
ITU-T X.519 (ISO9594) Information technology - Open systems interconnection - The directory:
Protocol specifications
ITU-T X.622 Information technology - Protocol for providing the connectionless-mode

network service: Provision of the underlying service by an X.25 Subnetwork
ITU-T X.710 (ISO 9595) Management information service definition: Public management information
service definition
ITU-T X.710 (ISO 9596-1) Management information service definition: Public management information
protocol
A-5

A-6

Figures
Figure 1-1 ZXMP S385 Application in the Network.................................................... 1-2
Figure 2-1 The Relationships of the Platforms........................................................... 2-1
Figure 2-2 ZXMP S385 Cabinet Structure and Configuration (Two Subracks) ........... 2-3
Figure 2-3 Subrack Structure .................................................................................... 2-4
Figure 2-4 Diagram of Boards in a Subrack .............................................................. 2-5
Figure 2-5 Software Structure of ZXMP S385 ......................................................... 2-17
Figure 2-6 Architecture of the EMS Software .......................................................... 2-19
Figure 3-1 Configuration Principle for EPS Protection in LACP Mode...................... 3-11
Figure 3-2 Configuration Principle for EPS Protection in Ping Mode........................ 3-12
Figure 3-3 Example of False Connection ................................................................ 3-15
Figure 4-1 Dimensions of ZTE Transmission Equipment Cabinet (300 mm
Deep) ..................................................................................................... 4-2
Figure 4-2 Jitter and Wander Tolerance of PDH Input Interface............................... 4-30
Figure 4-3 Jitter and Wander Tolerance of STM-N Terminal Multiplexer Input
Interface ............................................................................................... 4-31
Figure 4-4 Jitter and Wander Tolerance of the STM-N SDH Regenerator Input
Interface ............................................................................................... 4-32
Figure 4-5 Jitter Transfer Characteristic Specifications of the Regenerator.............. 4-35
Figure 5-1 Applications of ZXMP S385 in the Network .............................................. 5-4
Figure 5-2 Typical TM Equipment Configurations ...................................................... 5-5
Figure 5-3 Typical ADM Equipment Configurations ................................................... 5-7
Figure 5-4 Typical REG Equipment Configurations ................................................... 5-8
Figure 5-5 Point-to-Point Networking of ZXMP S385................................................. 5-9
Figure 5-6 Chain Networking of ZXMP S385........................................................... 5-10
Figure 5-7 Ring Networking of ZXMP S385............................................................. 5-11
Figure 5-8 Configuration of 2-Fiber Unidirectional Path Switching Ring of ZXMP
S385 ..................................................................................................... 5-12
Figure 5-9 Four-fiber Bidirectional MS Switching Ring (Normal) .............................. 5-13
Figure 5-10 Four-fiber Bidirectional MS Switching Ring (Switching) ........................ 5-13
Figure 5-11 DNI networking of ZXMP S385............................................................. 5-14
Figure 5-12 Hybrid Networking of ZXMP S385 2-Fiber Ring with ZXMP S330
Ring...................................................................................................... 5-15
Figure 5-13 A Typical Networking of EPL ................................................................ 5-16
I
Figure 5-14 A Typical Networking of EVPL.............................................................. 5-17

Figure 5-15 A Typical Networking of EPLAN ........................................................... 5-18
Figure 5-16 A Typical Networking of EVPLAN......................................................... 5-20
Figure 5-17 A Typical Networking of EPTREE......................................................... 5-21
Figure 5-18 A Typical Networking of EVPTREE ...................................................... 5-22
Figure 5-19 Application of RPR Ring Network......................................................... 5-23
Figure 5-20 Networking Application via AP1x8 Boards............................................ 5-24
Figure 5-21 Site Locations ...................................................................................... 5-25
Figure 5-22 Networking Diagram ............................................................................ 5-27
II
Tables
Table 2-1 Platform Functions .................................................................................... 2-1
Table 2-2 Brief Descriptions of Subrack Parts .......................................................... 2-4
Table 2-3 Available Slots for Functional Boards of ZXMP S385................................. 2-6
Table 2-4 Available Slots for Optical/Electrical Line Boards and Service Boards of
ZXMP S385 ............................................................................................. 2-6
Table 2-5 Available Slots for E3/T3 Service Boards of ZXMP S385 ........................... 2-8
Table 2-6 Available Slots for E1/T1 Service Boards of ZXMP S385 .......................... 2-8
Table 2-7 Available Slots for Ethernet Service Boards of ZXMP S385 ....................... 2-9
Table 2-8 Description of SEE Board Software/Hardware Configuration .................. 2-11
Table 2-9 ZXMP S385 Board List ............................................................................ 2-11
Table 3-1 ZXMP S385 Service Access Types............................................................ 3-1
Table 3-2 Service Access Capacity of ZXMP S385 .................................................. 3-2
Table 3-3 Ethernet Service Types Supported by Ethernet boards.............................. 3-3
Table 4-1 Dimensions and Weights of ZXMP S385 Cabinets ................................... 4-1
Table 4-2 Dimensions and Weight of Major Components of ZXMP S385 .................. 4-3
Table 4-3 Dimensions and Weight of Boards............................................................. 4-3
Table 4-4 Power Consumptions of ZXMP S385 Boards............................................. 4-8
Table 4-5 Temperature and Humidity Requirements................................................ 4-12
Table 4-6 Density Limit of Hazardous Gases in the Equipment ............................... 4-13
Table 4-7 Typical Lightning Protection Classes of Power Supply ............................. 4-14
Table 4-8 Lightning Protection Requirements of ZXMP S385 Ports ........................ 4-14
Table 4-9 ESD Resistivity........................................................................................ 4-15
Table 4-10 RF Electromagnetic Field Radiation Resistivity ...................................... 4-15
Table 4-11 Electrical Transient Burst Resistivity at DC Power Port .......................... 4-16
Table 4-12 Electrical Transient Burst Resistivity at Signal Cable and Control Cable
Ports ...................................................................................................... 4-16
Table 4-13 Surge Resistivity of the DC Power Supply ............................................. 4-16
Table 4-14 Surge Resistivity of the Outdoor Signal Cable ....................................... 4-16
Table 4-15 Surge Resistivity of the Indoor Signal Cable ......................................... 4-16
Table 4-16 RF Field Conductivity Resistivity............................................................ 4-17
Table 4-17 Conductive Emission Electromagnetic Interference at the DC Power
Supply Port ............................................................................................ 4-17
III
Table 4-18 Conductive Emission Electromagnetic Interference at the

Communication Port............................................................................... 4-17
Table 4-19 Radiated Emission Electromagnetic Interference................................... 4-17
Table 4-20 STM-64 Optical Interface Specifications ................................................ 4-18
Table 4-21 STM-16 Optical Interface Specifications ................................................ 4-18
Table 4-22 STM-4 Optical Interface Specifications .................................................. 4-19
Table 4-23 STM-1 Optical Interface Specifications .................................................. 4-20
Table 4-24 E1 Optical Interface Specifications ........................................................ 4-21
Table 4-25 T1 Electrical Interface Specifications ..................................................... 4-21
Table 4-26 E1 Electrical Interface Specifications ..................................................... 4-22
Table 4-27 E3 Electrical Interface Specifications ..................................................... 4-22
Table 4-28 T3 Electrical Interface Specifications ..................................................... 4-23
Table 4-29 STM-1 Electrical Interface Specifications............................................... 4-24
Table 4-30 Specifications of 100 Mbit/s Ethernet Optical Interfaces......................... 4-25
Table 4-31 specifications of 1000Base-SX Interface................................................ 4-25
Table 4-32 Specifications of 1000Base-LX Interface ............................................... 4-26
Table 4-33 ATM Optical Interface Specifications...................................................... 4-27
Table 4-34 Optical Interface Specifications of OBA Board ....................................... 4-28
Table 4-35 Optical Interface Specifications of OPA Board ....................................... 4-28
Table 4-36 SAN Interface Specifications ................................................................. 4-29
Table 4-37 Specifications of DCM Modules ............................................................. 4-30
Table 4-38 Jitter and Wander Tolerance of PDH Input Interface .............................. 4-30
Table 4-39 Jitter and Wander Tolerance (UIP-P) of SDH Terminal Multiplexer Input
Interface ................................................................................................ 4-31
Table 4-40 Jitter and Wander Tolerance (Frequency: Hz) of SDH Terminal
Multiplexer Input Interface ..................................................................... 4-31
Table 4-41 Jitter and Wander Tolerance of STM-16 and STM-64 Regenerators
Input Interfaces ...................................................................................... 4-32
Table 4-42 STM-N Interface Inherent Output Jitter Specifications of SDH
Equipment ............................................................................................. 4-32
Table 4-43 STM-N Network Interface Output Jitter Specifications of SDH
Equipment ............................................................................................. 4-33
Table 4-44 Mapping Jitter of PDH Tributary Interface .............................................. 4-34
Table 4-45 E1/E3 Combined Jitter Specifications .................................................... 4-34
Table 4-46 T1 Combined Jitter Specifications.......................................................... 4-34
Table 4-47 T3 Combined Jitter Specifications.......................................................... 4-35
Table 4-48 Jitter Transfer Characteristic Specifications of the Regenerator ............. 4-36
IV
Tables
Table 4-49 Specifications of Permissible Input Interface Attenuation/Frequency

Deviation and Others ............................................................................. 4-36
Table 4-50 Wander Limit at Constant Temperature (MTIE) ...................................... 4-37
Table 4-51 Wander Limit under Temperature Impact (MTIE) ................................... 4-37
Table 4-52 Wander Limit at Constant Temperature (TDEV) ..................................... 4-38
Table 4-53 Minimum Frame Interval between ZXMP S385 Ethernet Frames ........... 4-39
Boards/Multi-Service Boards .................................................................. 4-39
Boards/Multi-Service Boards .................................................................. 4-41
Table 4-58 Comparisons of RPR Service Types...................................................... 4-44
Table 4-59 External Interface Standards of ZXMP S385.......................................... 4-46
Table 5-1 Classifications of the ZXMP S385 Service Boards ..................................... 5-1
Table 5-2 Board Configurations for the ZXMP S385 Electrical Service and Ethernet
Service..................................................................................................... 5-2
Table 5-3 Board Configurations of the Sites (NEs) .................................................. 5-27
Table A-1 Standards and Recommendations Followed by ZXMP S385.....................A-1
V
Tables

Glossary
ADM
- Add/Drop Multiplexer
AIS
- Alarm Indication Signal
AMI
- AlternateMark Inversion
APS
- Automatic Protection Switching
ASON
- Automatically Switched Optical Network
ATM
- Asynchronous Transfer Mode
AU-AIS
- Administrative Unit - Alarm Indication Signal
B8ZS
- Bipolar with 8-Zero Substitution
BER
- Bit Error Rate
CBR
- Constant Bit Rate
CDV
- Cell Delay Variation
CE
- Customer Edge
CER
- Cell Error Ratio
CLR
- Cell Loss Ratio
CMI
- Code Mark Inversion
CMR
- Cell Misinsertion Ratio
CSMA/CD
- Carrier Sense Multiple Access/Collision Detect
VII
CTD
- Cell Transfer Delay
CWDM
- Coarse Wavelength Division Multiplexing
CoS
- Class of Service
DCC
- Data Communications Channel
DCE
- Data Circuit-terminating Equipment
DCM
- Dispersion Compensation Module
DNI
- Dual Node Interconnection
DTE
- Data Terminal Equipment
DVB-ASI
- Digital Video Broadcast-Asynchronous Serial Interface
DWDM
- Dense Wavelength Division Multiplexing
ECC
- Embedded Control Channel
EMI
- Electromagnetic Interference
EMS
- Electromagnetic Susceptibility
EOS
- Ethernet Over SDH
EPL
- Ethernet Private Line
EPLAN
- Ethernet Private LAN
EPS
- Ethernet Protection Switching
EPTREE
- Ethernet Private Tree
ESCON
- Enterprise System Connection
VIII
Glossary
ETS
- European Telecommunication Standard
EUT
- Equipment Under Test
EVPL
- Ethernet Virtual Private Line
EVPLAN
- Ethernet Virtual Private LAN
EVPTREE
- Ethernet Virtual Private Tree
FC
- Fiber Channel
FE
- Fast Ethernet
FICON
- Fiber Connection
GE
- Gigabit Ethernet
GFP
- Generic Framing Procedure
GUI
- Graphical User Interface
HDB3
- High Density Bipolar of order 3
HDLC
- High-level Data Link Control
HSRP
- Hot Standby Router Protocol
IEC
- International Electrotechnical Commission
IEEE
- Institute of Electrical and Electronics Engineers
IETF
- Internet Engineering Task Force
IP
- Internet Protocol
IRA
- International Reference Alphabet
IX
ITU-T
- International Telecommunication Union - Telecommunication Standardization
Sector
L2
- Layer 2
LACP
- Link Aggregation Control Protocol
LAG
- Link Aggregation Group
LAIS
- Line Alarm Indication Signal
LAN
- Local Area Network
LCAS
- Link Capacity Adjustment Scheme
LCD
- Loss Of Cell Delineation
LOC
- Loss Of Connectivity
LOF
- Loss Of Frame
LOP
- Loss Of Pointer
LOS
- Loss Of Signal
MAC
- Medium Access Control
MMF
- Multi-Mode Fiber
MPLS
- Multi Protocol Label Switching
MSTP
- Multi-Service Transport Platform
MTIE
- Maximal Time Interval Error
NRZ
- Non-Return to Zero
OCD
- Out of Cell Delineation
X
Glossary
OOF
- Out Of Frame
PCM
- Pulse Code Modulation
PDH
- Plesiochronous Digital Hierarchy
POS
- Packet Over SDH
PPP
- Point to Point Protocol
PRC
- Primary Reference Clock
Q-in-Q
- VLAN Tag in VLAN Tag
QoS
- Quality of Service
REG
- REGenerator
RPR
- Resilient Packet Ring
SAN
- Storage Area Network
SDH
- Synchronous Digital Hierarchy
SEC
- SDH Equipment Clock
SMCC
- Sub-network Management Control Center
SMF
- Single Mode Fiber
SNCP
- Sub-Network Connection Protection
SOH
- Section Overhead
SONET
- Synchronous Optical NETwork
SPAN
- Span
XI
SRP
- Spatial Reuse Protocol
SSM
- Synchronization Status Message
STM-N
- Synchronous Transport Module, level NN=1, 4, 16, 64
TDEV
- Time Deviation
TM
- Terminal Multiplexer
TMN
- Telecommunications Management Network
UBR
- Unspecified Bit Rate
UNI
- User Network Interface
UTP
- Unshielded Twisted Pair
VC
- Virtual Channel
VCG
- Virtual Container Group
VCI
- Virtual Channel Identifier
VLAN
- Virtual Local Area Network
VP
- Virtual Path
VPI
- Virtual Path Identifier
VPN
- Virtual Private Network
VRRP
- Virtual Router Redundancy Protocol
nrt-VBR
- non-real time Variable Bit Rate
rt-VBR
- real-time Variable Bit Rate
XII

ZXMP S385: SDH Based Multi-Service Node Equipment

Încărcat de

Informații document

Titlu original

Drepturi de autor

Formate disponibile

Partajați acest document

Partajați sau inserați document

Opțiuni de partajare

Vi se pare util acest document?

Este necorespunzător acest conținut?

Drepturi de autor:

Formate disponibile

ZXMP S385: SDH Based Multi-Service Node Equipment

Încărcat de

Drepturi de autor:

Formate disponibile

ZXMP S385

SDH Based Multi-Service Node Equipment

Revision No. Revision Date Revision Reason

R1.0 2012-01-06 First edition

Serial Number: SJ-20120110092612-001

Publishing Date: 2012-01-06(R1.0)

Chapter 2 Product Architecture ................................................................ 2-1

Chapter 3 System Functions ..................................................................... 3-1

Chapter 4 Technical Specifications .......................................................... 4-1

Chapter 5 Configuration and Networking ................................................ 5-1

Appendix A Standards and Recommendations ..................................... A-1

What Is in This Manual

It describes the equipment hardware, including cabinet, power distribution box,

It describes the equipment installation procedures, including installation preparation,

Note: Provides additional information about a certain topic.

1.1 Product Position

SJ-20120110092612-001|2012-01-06(R1.0) ZTE Proprietary and Confidential

Figure 1-1 ZXMP S385 Application in the Network

1.2 Product Features

SJ-20120110092612-001|2012-01-06(R1.0) ZTE Proprietary and Confidential

Multiple Protection Mechanisms

Timing and Synchronization Processing Capacity

Multiple EMS Systems

l The EMS systems provide the functions of configuration management, fault

SJ-20120110092612-001|2012-01-06(R1.0) ZTE Proprietary and Confidential

This page intentionally left blank.

SJ-20120110092612-001|2012-01-06(R1.0) ZTE Proprietary and Confidential

2.1 Logical Structure

Figure 2-1 The Relationships of the Platforms

Table 2-1 Platform Functions

SJ-20120110092612-001|2012-01-06(R1.0) ZTE Proprietary and Confidential

2.2 Hardware Structure

SJ-20120110092612-001|2012-01-06(R1.0) ZTE Proprietary and Confidential

1. Cabinet 4. Subrack 7. Subrack

2.2.1 Subrack Structure

SJ-20120110092612-001|2012-01-06(R1.0) ZTE Proprietary and Confidential

Figure 2-3 Subrack Structure

1. Top cable outlet 3. Board area 5. Fan plug-in box

Table 2-2 Brief Descriptions of Subrack Parts

Name Position in Subrack Brief Description

Decora- In the upper-layer of It is flexibly removable, with the function of decoration,

SJ-20120110092612-001|2012-01-06(R1.0) ZTE Proprietary and Confidential

Name Position in Subrack Brief Description

2.2.2 Board Slots in a Subrack

Figure 2-4 Diagram of Boards in a Subrack

SJ-20120110092612-001|2012-01-06(R1.0) ZTE Proprietary and Confidential

Available Slots for Functional Boards

Table 2-3 Available Slots for Functional Boards of ZXMP S385

Board ID Available Slots Remark

ANCP, ENCP, NCP 18, 19 The slot 18 and slot 19 must be

OBA/OPA 1 to 7, 10 to 16 l OBA is the Optical Booster Amplifier

Available Slots for Service Boards

Board ID Available Slots Remark

OL64FEC, OL4x4, OL4x2, 1 to 7, 10 to 16 –

SJ-20120110092612-001|2012-01-06(R1.0) ZTE Proprietary and Confidential

Board ID Available Slots Remark

OEL1x16 1 to 7, 10 to 16 When configured in slot 1, 6, 7, 10, 11, and 16,

OEIS1x8 62 to 65, 68 to 71 Cooperates with OEL1x16 board.

LP1x8 1 to 5, 12 to 16 à LP1x8 board in slot 1 and slot 16 can only

à Supports two groups of 1:N(N≤4) protec-

à The board does not support ECC, over-

ESS1x8 62 to 65, 68 to 71 Should be inserted in the slot of the upper-layer

BIE3 61, 72 à Only serves for 1:N (N≤4) protection.