International Journal of Engineering & Technology IJET-IJENS Vol:10 No:06
Effect of Differences Core and Cavity
Temperature on Injection Molded Part and
Reducing the Warpage by Taguchi Method
Z. Shayfull*1, M.F. Ghazali1, M. Azaman1, S.M. Nasir1, N.A. Faris2
1
School of Manufacturing Engineering, Universiti Malaysia Perlis, Malaysia
2
Politeknik Sultan Abdul Halim Mu’adzam Shah (POLIMAS), Malaysia
shayfull@unimap.edu.my

Abstract— Warpage is a common issue related with injection
moulding process and frequently be the main target by mould
designers to eliminate. The existence of warpage is considered a
defect and shall be minimized. Therefore many researches and
publications were made on this topic, to study the behavior of
warpage occurred at moulded parts particularly on plastic parts.
In this study, two parts of plastic products was decided as a
model. One is a thin plate and another one is a thin shell.
Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS)
thermoplastic is used as a plastic material. Taguchi Method is
applied to determine the optimum value of injection molding
parameters and Moldflow Plastic Insight software is used to
simulate the injection molding process. The temperature
differences on core and cavity plates are considered in simulation
and the experimental shows that the differences mould
temperature helps to minimize the warpage value. This finding is
definitely a good way to prevent stress on a critical point of
warped parts after assembly process.
Index Term— Injection moulding; Plastic Injection Mould;
Warpage; Taguchi Method; ANOVA
I. INTRODUCTION
THE warpage The warpage issue is one of common effects on
moulded parts after taken out from an injection molding
process. It is important issue to predict the warpage issue
before manufacturing takes place. Many researches and
publications were made on this topic, both on theoretical
simulation and on experimental results to study the behavior of
warpage occurred at moulded parts particularly on plastic
parts. Jacques [1] underwent a simulation on the thermal
warpage resulted from unequal cooling on a plate of
amorphous polymer, and it is understood that the warpage
issue comes from the bending moment due to the asymmetrical
stress distribution over the thickness of plastic parts. The
thinnest spot on moulded parts is normally the most affected
area of warpage due to its relatively small second moment of
area in bending. Warpage is also studied by Matsuoka et al. [2]
using simulation and experimental studies. It can be predicted
109006-8686 IJET-IJENS © December 2010 IJENS
125
from the temperature difference between the surfaces, the heat
distribution, shear stress, shrinkages and mechanical properties
caused by the orientation of materials. Huang and Tai [4]
examined the effects of warpage that is seen in thin shell parts
produced by injection molding using simulation software.
Taguchi method used to determine the optimum value of
injection parameters and this led to a finding that packing
pressure is the most significant factor that affects warpage and
gate locations as well as filling time have only small effects
over warpage. Taguchi method was also applied by Tang [3] in
designing a plastic injection mould to reduce warpage. The
thin plate mold was fabricated and at the same time gate
dimension and mould temperature factors were eliminated
while ANOVA was used to determine the significant factor
affected the warpage mainly. As a result, melting temperature
was found to be the most important factor that contributes to
the existence of warpage. Results acquired by Liao et al. [5]
also agrees that packing pressure is the most influential
parameter in injection moulding process. His study was done
purposely to determine the reactions of a thin walled part
according to shrinkage and warpage issues where mould
temperature, melt temperature, packing pressure and injection
speed were taken as the injection parameters [6]. From the
research, it is found that packing pressure is a big factor
contributes to the occurrence of warpage. Basic design
principles for assembly suggest that removing the fastener on
the product for to reduce costs. For that reason, a snap fit
concept is introduced to replace fasteners where it can reduce
the assembly time by eliminating the screwing process [7].
However, there is an issue identified on the snap fit concept
which is the gap around the product is uneven because of this
concept cannot close the assembled gap tightly as compared to
screwing method. The situation become worse when the snap
fit concept is to bind between warped parts. Although this
situation can be improved by adding more snap fits, but the
more snap fits in a design, the higher number of side pull and
lifter is needed and this therefore increases the cost of
fabricating mould. As far as this issue is concerned, the
IJENS
 International Journal of Engineering & Technology IJET-IJENS Vol:10 No:06 126

challenge for the manufacturing engineers nowadays is to

produce moulded parts at minimum warpage.

II. FEED SYSTEM DESIGN

A mold designer must determine the type of mold, mold
dimension, materials for cavity insert, core insert and mold
base in designing a mould [8]. For a thin plate parts (120 x 50
x 1) mm, the type of gate to be used is an edge gate (two-plate
mold). Pin point gate (three-plate mold) is used for thin shell
part (120 x 50 x 8)mm with thickness 1mm. Fig. 1 and 2 shows
the feed system used for both of parts respectively. Fig. 4. Pin point gate design for thin shell plate

Figs. 5 and 6 show the size in millimeters of the cavity and

core insert and cooling channel design. The size of cooling
channel is Ø6mm.

Fig. 1. Feed system design for thin plate (two-plate mold)

Fig. 5. Cooling channel design for thin plate

Fig. 2. Feed system design for thin shell plate (three-plate mold)

The detail dimensions in millimeters of feed system are

shown in Fig. 3 and 4.
Fig. 6. Cooling channel design for thin shell plate

III. EXPERIMENT
There are many factors affecting the injection molding
process, which may include types of plastic material used,
types of mold base material, types of cavity insert material,
types of machine, the shape of the product, the selection of
coolant runners as well as selection of the coolant liquid.
However, to make the experimentations and simulations
achievable according to the scope of research, only some
major factors are considered. Thus, the analysis is carried out
under the following assumptions:
i. Gate dimension factor is eliminated because the gating
systems design for every part is different.
ii. The temperature of the environment is assumed constant.
iii. The coolant is pure water.
iv. Only the effects of the filling, packing, and cooling
processes are discussed.
v. The layout of the cooling channels is assumed to maintain
a constant temperature everywhere in the mold. The

Fig. 3. Edge gate design for thin plate

109006-8686 IJET-IJENS © December 2010 IJENS
IJENS
 International Journal of Engineering & Technology IJET-IJENS Vol:10 No:06 127

effects due to the shape and size of the mold and product Taguchi method is used in the design of the experiments in
are neglected due to varieties of product’s shapes. this research. There are six factors identified to control the
vi. The plastic material used in all of the simulations is the injection process; cavity temperature (A), core temperature
amorphous thermoplastic PC/ABS blend, Cycoloy (B), melt temperature (C), filling time (D), packing pressure
C2950HF from GE. Its viscosity is between 102 and 104 (E), and packing time (F). Each factor consists of five levels
poise where the shear rate is in the 102-103 s-1 range. The where an orthogonal array L25 56 is chosen and all parameters
range of melt temperature is between 220 and 400oC have been identified. These three factor-level, orthogonal array
approximately. variance and parameters control factors are shown in Table II,
The basic physical and mechanical properties of PC/ABS are III and IV respectively.
shown in Table I. TABLE II
THE FIVE LEVEL OF EFFECTIVE FACTOR FOR
TABLE I EXPERIMENT VARIANCE
THE PHYSICAL PROPERTIES OF PC/ABS
Level
Factor
Specific heat, Cp (J/kgoC) 1871 1 2 3 4 5
Glass transition temperature, Tg (oC) 112 Cavity temperature, A (°C) 45 55 65 75 85
Thermal expansion coefficient, α (mm/moC) 74 Core temperature, B (°C) 45 55 65 75 85
Elastic modulus, E (MPa) 2.63 x 103 Melt temperature, C (°C) 230 245 260 290
275
Poisson's ratio, υ 0.23 Filling time, D (s) 0.1 0.2 0.3 0.4 0.5
Thermal conductivity, K (w/moC) 0.27 Packing pressure, E (MPa) 50% 60% 70% 80% 90%
Packing time, F (s) 0.6 0.7 0.8 0.9 1.0
The parts to be simulated are inclusive of both cavities
divided into 12000 pieces of triangular elements for the thin TABLE III
L25 ORTHOGONAL ARRAY VARIANCE
plate and 18192 pieces of triangular elements for thin the shell
plate. The meshes of the parts are shown Fig. 7 and 8. Trial Control Factor
Signal-to-noise (S/N) ratio is calculated according to Table No. A B C D E F
4. The deflection of the thin plates and thin shell plates 1 1 1 1 1 1 1
obtained from the experiment is used to calculate the signal-to- 2 1 2 2 2 2 2
noise (S/N) ratio to acquire the best setting of parameters 3 1 3 3 3 3 3
arrangement. From this method, the percentage of contribution 4 1 4 4 4 4 4
has been calculated to determine which of the factor will affect 5 1 5 5 5 5 5
the warpage significantly. 6 2 1 2 3 4 5
7 2 2 3 4 5 1
8 2 3 4 5 1 2
9 2 4 5 1 2 3
10 2 5 1 2 3 4
11 3 1 3 5 2 4
12 3 2 4 1 3 5
13 3 3 5 2 4 1
14 3 4 1 3 5 2
15 3 5 2 4 1 3
16 4 1 4 2 5 3
17 4 2 5 3 1 4
18 4 3 1 4 2 5
19 4 4 2 5 3 1
Fig. 7. Cooling channel design for thin plate 20 4 5 3 1 4 2
21 5 1 5 4 3 2
22 5 2 1 5 4 3
23 5 3 2 1 5 4
24 5 4 3 2 1 5
25 5 5 4 3 2 1

Fig. 8. Cooling channel design for thin shell plate

109006-8686 IJET-IJENS © December 2010 IJENS

IJENS
 International Journal of Engineering & Technology IJET-IJENS Vol:10 No:06 128

TABLE IV TABLE V
THE COMBINATION PARAMETERS FOR THE CONTROL SUMMARY OF THE RESULTS FOR
FACTORS THIN PLATE
Trial Control Factor
No. A B C D E F
Trial Control Factor Thin Plate
1 45 45 230 0.1 50% 0.6
No. Max,
2 45 55 245 0.2 60% 0.7 A B C D E F z S/N
3 45 65 260 0.3 70% 0.8 1 45 45 230 0.1 50% 0.6 0.0073 42.7327
4 45 75 275 0.4 80% 0.9 2 45 55 245 0.2 60% 0.7 0.0076 42.3807
5 45 85 290 0.5 90% 1.0 3 45 65 260 0.3 70% 0.8 0.0066 43.6051
6 55 45 245 0.3 80% 1.0 4 45 75 275 0.4 80% 0.9 0.0060 44.4370
7 55 55 260 0.4 90% 0.6 5 45 85 290 0.5 90% 1.0 0.0057 44.8812
8 55 65 275 0.5 50% 0.7 6 55 45 245 0.3 80% 1.0 0.0053 45.5129
9 55 75 290 0.1 60% 0.8 7 55 55 260 0.4 90% 0.6 0.0061 44.2946
10 55 85 230 0.2 70% 0.9 8 55 65 275 0.5 50% 0.7 0.0081 41.8310
11 65 45 260 0.5 60% 0.9 9 55 75 290 0.1 60% 0.8 0.0065 43.7366
12 65 55 275 0.1 70% 1.0 10 55 85 230 0.2 70% 0.9 0.0059 44.5842
13 65 65 290 0.2 80% 0.6 11 65 45 260 0.5 60% 0.9 0.0070 43.0980
14 65 75 230 0.3 90% 0.7 12 65 55 275 0.1 70% 1.0 0.0059 44.5842
15 65 85 245 0.4 50% 0.8 13 65 65 290 0.2 80% 0.6 0.0066 43.6051
16 75 45 260 0.2 90% 0.8 14 65 75 230 0.3 90% 0.7 0.0061 44.2946
17 75 55 275 0.3 50% 0.9 15 65 85 245 0.4 50% 0.8 0.0078 42.1610
18 75 65 230 0.4 60% 1.0 16 75 45 275 0.2 90% 0.8 0.0089 41.0122
19 75 75 245 0.5 70% 0.6 17 75 55 290 0.3 50% 0.9 0.0073 42.7335
20 75 85 260 0.1 80% 0.7 18 75 65 230 0.4 60% 1.0 0.0075 42.4949
21 85 45 290 0.4 70% 0.7 19 75 75 245 0.5 70% 0.6 0.0079 42.0482
22 85 55 230 0.5 80% 0.8 20 75 85 260 0.1 80% 0.7 0.0069 43.2239
23 85 65 245 0.1 90% 0.9 21 85 45 290 0.4 70% 0.7 0.0064 43.8722
24 85 75 260 0.2 50% 1.0 22 85 55 230 0.5 80% 0.8 0.0068 43.3536
25 85 85 275 0.3 60% 0.6 23 85 65 245 0.1 90% 0.9 0.0091 40.8197
24 85 75 260 0.2 50% 1.0 0.0067 43.4775
The warpage data obtained from the simulation process are 25 85 85 275 0.3 60% 0.6 0.0067 43.4775
also analyzed using Analysis of Variance (ANOVA) and the TABLE VI
level of confidence is set at 0.05. The results are used by SUMMARY OF THE RESULTS FOR THIN SHELL PLATE
comparing it with the results obtained from the SN ratio
Trial Control Factor Thin Shell Plate
method. In addition, the interaction effect of factors is Max,
No.
identified and the contribution of each factor to the total effect A B C D E F z S/N
is to be calculated. From this method, the percentage of 1 45 45 230 0.1 50% 0.6 0.0073 42.7327
contribution has been calculated to determine which of the 2 45 55 245 0.2 60% 0.7 0.0076 42.3807
factor will affect the warpage most significantly. 3 45 65 260 0.3 70% 0.8 0.0066 43.6051
4 45 75 275 0.4 80% 0.9 0.0060 44.4370
5 45 85 290 0.5 90% 1.0 0.0057 44.8812
IV. RESULT AND DISCUSSION
6 55 45 245 0.3 80% 1.0 0.0053 45.5129
In determining the S/N ratio, the smaller the better quality
7 55 55 260 0.4 90% 0.6 0.0061 44.2946
characteristic has been targeted.
8 55 65 275 0.5 50% 0.7 0.0081 41.8310
9 55 75 290 0.1 60% 0.8 0.0065 43.7366
10 55 85 230 0.2 70% 0.9 0.0059 44.5842
11 65 45 260 0.5 60% 0.9 0.0070 43.0980
12 65 55 275 0.1 70% 1.0 0.0059 44.5842
13 65 65 290 0.2 80% 0.6 0.0066 43.6051
MSD is the mean square deviation, represents the 14 65 75 230 0.3 90% 0.7 0.0061 44.2946
observation and is the number of tests in one trial. Table 5 15 65 85 245 0.4 50% 0.8 0.0078 42.1610
and 6 show the S/N for the thin plate and thin shell plate 16 75 45 275 0.2 90% 0.8 0.0089 41.0122
obtained from the experiment. 17 75 55 290 0.3 50% 0.9 0.0073 42.7335
18 75 65 230 0.4 60% 1.0 0.0075 42.4949
19 75 75 245 0.5 70% 0.6 0.0079 42.0482
20 75 85 260 0.1 80% 0.7 0.0069 43.2239
21 85 45 290 0.4 70% 0.7 0.0064 43.8722
22 85 55 230 0.5 80% 0.8 0.0068 43.3536
23 85 65 245 0.1 90% 0.9 0.0091 40.8197
24 85 75 260 0.2 50% 1.0 0.0067 43.4775
25 85 85 275 0.3 60% 0.6 0.0067 43.4775
109006-8686 IJET-IJENS © December 2010 IJENS
IJENS
 International Journal of Engineering & Technology IJET-IJENS Vol:10 No:06 129

The data in Table V and VI are also analyzed using

Analysis of Variance (ANOVA) where the relative percentage
contribution of all factors is determined by comparing the
relative variance. The ANOVA will then compute the degrees
of freedom, variance, F-ratio, sums of squares, pure sum of
square and percentage contribution. The examples of
calculations are shown below and the results of S/N ratio for
both Thin Plate and Thin Shell Plate are listed in Table 7 and Fig. 9. S/N response for cavity temperature
8.

Fig. 10. S/N response for core temperature

TABLE VII
THE RESPONSE TABLE OF S/N RATIO FOR THIN PLATE

Level A B C D E F
Fig. 11. S/N response for melt temperature
1 43.607 43.246 43.492 43.019 42.587 43.232

2 43.992 43.469 42.585 43.012 43.038 43.120

3 43.549 42.471 43.540 43.925 43.739 42.774

4 42.303 43.599 43.068 43.452 44.027 43.134

5 43.000 43.666 43.766 43.042 43.060 44.190

1.689 1.195 1.181 0.913 1.440 1.416

Fig. 12. S/N response for filling time

TABLE VIII
THE RESPONSE TABLE OF S/N RATIO FOR THIN SHELL PLATE

Level A B C D E F

1 12.954 14.953 15.760 13.334 14.737 9.669

2 13.748 13.951 16.481 12.994 13.169 10.408

3 14.953 12.090 12.262 14.195 11.692 14.197

4 10.782 11.589 10.485 11.348 15.603 15.289

Fig. 13. S/N response for packing pressure
5 13.352 13.206 10.801 13.919 10.588 16.225

4.171 3.364 5.996 2.847 5.015 6.556

Fig. 9 – 14 show S/N response diagram constructed for thin

plate based on data from Table 7.

Fig. 14. S/N response for packing time

109006-8686 IJET-IJENS © December 2010 IJENS

IJENS
 International Journal of Engineering & Technology IJET-IJENS Vol:10 No:06 130

From the S/N ratio response in Table 7 and Table 8, it is

Fig. 15 – 20 show S/N response diagram constructed for thin
shell plate based on data from Table 8.
identified that the best combination of parameters can be
identified by selecting the highest value of each factor. Table 9
shows the summary of best parameters setting for thin plate
and thin shell plate. The result can also be observed from S/N
response diagram in Figs. 9–14 for thin plate and Figs. 15-20
for thin shell plate.

TABLE IX
BEST SETTING OF COMBINATION PARAMETERS

Fig. 15. S/N response for cavity temperature

Thin Thin shell
Factor
plate plate
Cavity temperature, (°C) 55 65
Core temperature, (°C) 85 45
Melt temperature, (°C) 290 245
Filling time, (s) 0.3 0.3
Packing pressure, (MPa) 80% 80%
Packing time, (s) 1.0 1.0

Besides, the difference between levels in Table 8 and 9 also

Fig. 16. S/N response for core temperature
Fig. 17. S/N response for melt temperature
shows which factor is more significant that give effects on
warpage for thin plate as well as thin shell plate. The most
significant factor that has an effect on warpage for thin plate
are cavity temperature (A) followed by packing pressure (E),
packing time (F), core temperature (B), melting temperature
(C) and filling time (D). On the other hand, for thin shell plate,
the most significant factors are packing time (F) followed by
melt temperature (C), packing pressure (E), cavity temperature
(A), core temperature (B) and filling time (D).
The data in Table 5 and 6 is also analyzed using Analysis of
Variance (ANOVA). The ANOVA computes the quantities
such as sums of squares, degrees of freedom, variance and
percentage contribution. The examples of calculations for
these quantities are shown below and the results for thin plate
and thin shell plate are summarized in Table 10 and Table 11
respectively.

Fig. 18. S/N response for filling time

Total sum of squares,

Fig. 19. S/N response for packing pressure

Fig. 20. S/N response for packing time

109006-8686 IJET-IJENS © December 2010 IJENS

IJENS
 International Journal of Engineering & Technology IJET-IJENS Vol:10 No:06 131

TABLE XI
ANOVA TABLE FOR THIN SHELL PLATE

Source f S V F P(%)
Cavity
temperature, (°C) 4 0.03177 0.0079425 - 9.63
Core
temperature, (°C) 4 0.00468 0.00117 - 1.42
Melt
temperature, (°C) 4 0.08632 0.02158 - 26.16

Filling time, (s) 4 0.02566 0.006415 - 7.78

Packing
pressure, (MPa) 4 0.05375 0.0134375 - 16.29

Packing time, (s) 4 0.12780 0.03195 - 38.73

Pooled error 0 0
For error,
Total 24 0.32998 100

The last column in Table X and XI show the percentage of

contribution for each factor. For thin plate, cavity temperature
contributes the most which is 24.59% followed by packing
Variance for factor A, pressure 19.54%, melt temperature 16.06%, packing time
15.4%, core temperature 14.78% and filling time 9.63%. It
proves that packing pressure, melt temperature, cavity
temperature, packing time and core temperature are the
significant factor where filling time does not have much effect
on warpage issue. For thin shell plate, packing time contributes
the most which is 38.73% followed by melt temperature
Variance for error,
26.16%, packing pressure 16.29%, cavity temperature 9.63%,
filling time 7.78% and core temperature 1.42%. This explains
that all factors except filling time and core temperature give
F-ratio for factor A, significant effects on warpage defects.

V. CONCLUSION
There are many plastic products produced by injection
Percentage contribution (P) for factor A,
molding and some factors must be determined in order to
design a mould such as feed system, cooling channel position,
gate size. These factors have effects on the quality of product
produced and by the help of simulation technology, it reduces
time taken to test moulds by simulating it in software as
compared to traditional trial and error concept which also
TABLE X requires higher costs. In addition, Taguchi method helps to
ANOVA TABLE FOR THIN PLATE simplify the experiment in identifying the best setting
parameters to produce parts with minimum defects.
Source f S V F P(%) Previous studies used fixed temperature value for mold
Cavity temperature (cavity temperature and core temperature). For
temperature,(°C) 4 5.418 x 10-6 1.354 x 10-6 - 24.59
Core
instance, Tang [3] and Huang and Tai [4] maintained same
temperature, (°C) 4 3.258 x 10-6 8.145 x 10-6 - 14.78 temperature for cavity and core temperature in simulation and
Melt experimental of warpage on thin plate and thin shell plate. In
temperature, (°C) 4 3.538 x 10-6 0.8845 x 10-6 - 16.06 contrast, this research focuses the effect of difference value of
Filling time, (s) 4 2.122 x 10-6 0.5305 x 10-6 - 9.63 temperature on core and cavity on thin plate and thin shell
Packing plate.
pressure, (MPa) 4 4.306 x 10-6 1.077 x 10-6 - 19.54 The conclusions of the research are as follows.
Packing time, (s) 4 3.394 x 10-6 0.8485 x 10-6 - 15.4
Pooled error 0 0 100

Total 24 22.038x10-6

109006-8686 IJET-IJENS © December 2010 IJENS

IJENS
 International Journal of Engineering & Technology IJET-IJENS Vol:10 No:06 132

1. Cavity temperature is the most significant which is 24.59%

followed respectively by packing pressure 19.54%, melt
temperature 16.06%, packing time 15.4%, core temperature
14.78% and filling time 9.63%. The mold temperature
(cavity and core temperature) has shown a large contribution
rate of 39.37%, which must not be neglected.
2. For thin shell part, the most effective factor contributes to
warpage is packing time 38.73% followed by melt
temperature 26.16%, packing pressure 16.29%, cavity
temperature 9.63%, filling time 7.78% and core temperature
1.42%. The mold temperature (cavity and core temperature)
has also shown a contribution rate of 11.05%, which is
significant.
3. Taguchi orthogonal array can effectively reduce the number
of trials in mold testing. The effective factors can be
determined using ANOVA.
i. For thin plate, results show that cavity temperature,
packing pressure, melt temperature, packing time and
core temperature are the significant factors while filling
time is insignificant.
ii. Result for thin shell plate shows that packing time, melt
temperature, packing pressure and cavity temperature
are the significant factors while filling time while core
temperature is trivial.
4. The influence of all factors that contributes to warpage has
been characterized believed to be helpful in determining
more precise process conditions in determining injection
molding parameters.

REFERENCES
[1] M.St. Jacques, An analysis of thermal warpage in injection
molded at parts due to unbalanced cooling, Polym. Eng. Sci. 22
(1982) 241-245.
[2] T. Matsuoka, J. Takabatake, A. Koiwai, Y. Inoue, S. Yamamoto,
H.Takahashi, Integrated simulation to predict warpage of
injection molded parts, Polym. Eng. Sci. 31 (1991) 1043.
[3] Huang MC, Tai CC. The effective factors in the warpage problem
of an injectionmolded part with a thin shell feature. Journal of
Material Processing Technology 110 (2001) 1-9.
[4] S.H. Tang, Y.J. Tan, S.M.Sapuan, S.Sulaiman, N. Ismail, R.
Samin, The use of Taguchi method in the design of platis
injection mould for reducing warpage, Journal of Material
Processing Technology 182 (2007) 418-426.
[5] Liao SJ, Chang DY, Chen HJ, Tsou LS, Ho JR, Yau HT, et al.
Optimal process conditions of shrinkage and warpage of thin-
wall parts. Polym Eng Sci 2004;44(5):917–28.
[6] Think Thin, Asian Plastics News, July/August 1996, pp. 12-14.
[7] G. Boothroyd, P. Dewhurst, W. Knight, ‘Product Design for
Manufacture and Assembly’, 2nd Edition, Marcel Dekker Inc.,
2002.
[8] David O. Kazmer, Injection Mould Design Engineering, Hanser
Publisher, Munich, 2007, p 67.

109006-8686 IJET-IJENS © December 2010 IJENS

IJENS