CHAPTER 1

INTRODUCTION

Due to the increasing demand for refrigeration in various fields led to

production of more electricity and consequently more release of harmful gas like
CO2 all over the world which is a contributing factor of global warming on climate
change. Thermoelectric refrigeration is a new alternative method. The
thermoelectric modules are made of semiconductor materials electrically
connected in series configuration and thermally in parallel to create cold and hot
surfaces. Although they are less efficient than the vapour compression system, they
are very light, low in cost, silent in operation, and are environmentally friendly.

The objectives of this project is to design and develop a working

thermoelectric refrigerator that utilizes the Peltier effect to refrigerate and maintain
a temperature between 5 0C to 25 0C. The design requirements are to cool the
volume to a temperature within a short time and

provide retention of at least next half an hour. And a thermosiphon cooling

system is used for cooling the hot side of TEC module. It will be used in remote
locations in the world where there is no grid electricity, and where electrical power
supply is unreliable when a solar panel charger is added for battery charging.

1
 CHAPTER 2

LITERATURE REVIEW

Review of a number of patented thermoelectric refrigerator designs, a

photovoltaic-direct/indirect thermoelectric cooling system, and research studies
from the literature are described in the following section. A simple design was
proposed by Beitner in 1978 consisting of thermoelectric modules directly
powered by an external DC source and an external thermal sink to dissipate heat to
ambient by using natural convection cooling. Reed and Hatcher in 1982 proposed
an effective way to increase the heat dissipating capability at the hot end of
thermoelectric modules by using the cooling fan. Park et al. in 1996 introduced the
new design of thermoelectric refrigerator by combining the benefits of super
insulation materials with thermoelectric system and phase change materials to
provide an environmentally benign system that was energy efficient and could
maintain relatively uniform temperature for the extended periods of time with
relatively low electrical power requirements. Gillery and

Tex in 1999 proposed the design of a thermoelectric refrigerator by

employing evaporating/condensing heat exchanger to improve heat dissipation at
hot end of thermoelectric modules.

2
 CHAPTER 3

THERMOELECTRIC MODULE BASICS

By applying a low voltage DC power to a TE module, heat will be moved

through the module from one side to the other. One module face, therefore, will be
cooled while the opposite face is simultaneously heated. It is important to note that
this phenomenon may be reversed whereby a change in the polarity (plus and
minus) of the applied DC voltage will cause heat to be moved in the opposite
direction. Consequently, a thermoelectric module may be used for both heating and
cooling thereby making it highly suitable for precise temperature control
applications. A thermoelectric module can also be used for power generation. In
this mode, a temperature differential applied across the module will generate a
current.

Fig. 3.1 A typical single stage thermoelectric module.

3
 A practical thermoelectric module generally consists of two or more
elements of n and p-type doped semiconductor material that are connected
electrically in series and thermally in parallel. These thermoelectric elements and
their electrical interconnects typically are mounted between two ceramic
substrates. The substrates hold the overall structure together mechanically and
electrically insulate the individual elements from one another and from external
mounting surfaces. Most thermoelectric modules range in size from approximately
2.5-50 mm (0.1 to 2.0 inches) square and 2.5-5mm (0.1 to 0.2 inches) in height. A
variety of different shapes, substrate materials, metallization patterns and mounting
options are available.

Fig. 3.2 Schematic of thermoelectric module operation

4
 CHAPTER 4

CLASSIFICATION OF TEM

A thermoelectric module thus uses a pair of fixed junctions into which

electrical energy is applied causing one junction to become cold while the other
becomes hot. Because thermoelectric cooling is a form of solid-state refrigeration,
it has the advantage of being compact and long lasting. It uses no moving parts
except for some fans, employs no fluids, and do not require bulky piping and
mechanical compressors used in vapour-cycle cooling systems. Such sturdiness
favour thermoelectric cooling over conventional refrigeration in certain situations.
The compact size and weight requirements, as well as portability in the design, rule
out the use of conventional refrigeration.

4.1 Thermoelectric Generator (TEG)

Thomas Seebeck in 1821 discovered that a continuously flowing current is

created when two wires of dissimilar materials are joined together at the ends
and heated at one end. This phenomenon is known as the Seebeck Effect. The
phenomenon of Seebeck effect is used by thermal devices to convert heat into
electrical energy. These thermal devices are called thermoelectric generators. By
term Seebeck effect we means that generating temperature difference between
5
 two different types of metals which are a good conductor of electric and
produce a electric current or voltage. Their efficiency level is up to 5 to 10
percentage.

Fig 4.1 schematic view of TEG

Existing technology is able to produce thermoelectric power generator with

low temperature heat sources which can be up to 2000C. Due to this low
temperature feature, it can be used for various applications such as power sensors,
small displays, LED lamps, rapid discharge of battery for smartphones and other
mobile devices. Also it can be used for heat engines and sterling engines. They are
also available in compact, lightweight appliances for charging gadgets that works
from the open fire. Mainly they are used in Africa and Asia as they don’t have
electricity everywhere except cities and towns.

The engine named combustion produce more heat waste. As thermal

generators works on the concept of generating electricity by heat waste and hence
more use of combustion engine. Only the problem persists in such situations are
output resistance and adverse thermal characteristics.

6
 Now a days the thermoelectric modules have the common problem of rapid
degradations which is basically about 5% for a 2000C temperature of hot side for
600 hours or we can say that it’s tough to find out efficient and
reliable thermoelectric generator. The problem can be solved by creating the
temperature stable at 2000C – 2500C.

4.2. Thermoelectric Cooling Modules

Later in 1834, Jean Charles Athanase Peltier a French watchmaker and

physicist found that if two dissimilar metals are joined together and an electrical
current is supplied it will produce heating and cooling at the ends and that
phenomenon is known as Peltier effect and is shown in the figure 1.1. In 1838
Lenz showed that depending on the direction of current flow in the system, heat
could be either removed from a junction to convert water into ice, or by reversing
the direction of current, absorbed or rejected at the junction is proportional to the
electrical current intensity. The constant of proportionality is known as the Peltier
coefficient.

Although Peltier effect was discovered more than 150 years ago,
thermoelectric devices have only been applied commercially during recent
decades. Lately, a dramatic increase in the application of TE solutions in
optoelectronic devices has been observed, such as diode lasers, photo detectors,
solid- state pumped lasers, charge-coupled devices (CCDs) and others. The
thermoelectric module consists of thermocouple formed by pairs of P-type and N-
type semi-conductor thermo element which are electrically connected in series
configuration and thermally connected in parallel configuration. Due to their solid
state construction the modules are considered to be highly reliable. For most
application they will provide long, trouble free service. For cooling application, an

7
electrical current supply is given to the module, heat is transferred from one side to
the other, and the result is that the module will become cooler at one side and
hotter at the other side.

Fig 4.2 schematic view of TEC

The figure 4.2 shows a particular thermoelectric module assembly. The main
advantages of using TE modules in cooling applications are, they are solid state,
have no moving parts and are miniature in size, its reliability and flexibility in
design to meet particular requirements.

8
 The figure 2.2 shows the working of thermoelectric module. When a DC
voltage is applied to the TE module, the positive and negative charge carriers in the
pellet assemblage absorb heat energy from one of the surface and reject it to the
other at the opposite side. The surface area where heat energy is absorbed gets
cooler; the opposite surface where heat energy is released gets hotter. Reversing
the polarity will result in reversed hot and cold sides.

Thermoelectric cooling, also called the Peltier effect, was discovered in

1834 by Jean Charles Athanase Peltier. Essentially, a electric charge sent through
two pieces of metal joined together with semiconductor wires and covered with
ceramic plates are the basis for thermoelectric cooling. The electric charge creates
a heat flux, transferring the heat from one side of the device to the other. As a
result, one side of the contraption gets hot while the other side gets cold. Obviously
the cold side is embedded in the wall of the wine cooler to cool the interior. The
hot side extends outside of the cooler, while fans both inside and outside move the
air around. A stack of aluminum fins creates a heat sink that efficiently dissipates
the unwanted heat.

4.3 Project Objectives

In this proposed work, the main aim is to develop a refrigeration system with
a capacity of 40L of cooling chamber. It is necessary to design a system capable of
maintaining the temperature of the materials between 100C to 15 0C for a long
duration. Since the system has to be used in remote areas where power is scarce,
alternative sources of energy like battery or solar power has to be incorporated in
the design. Moreover the system is meant for outdoor use which makes better
insulation and radiation control mandatory. In order to meet worse scenario, even
though the system is to designed for maintaining a fixed chamber temperature

9
throughout the operational period, the design should be such that it can adaptable
for refrigerating the chamber from ambient temperature to the required
temperature.

10
 CHAPTER 5

COMPONENTS OF THERMO ELECTRIC REFRIGERATOR

1. Thermoelectric Cooler

2. Aluminium Heat sink

3. 12v DC Cooling fan

4. 220V AC fan

5. AC-DC convertor

6. Thermal grease

7. Cooling and heating cabin

8. Temperature indicator

5.1 Thermoelectric module

The 127 couples, 40 mm × 40 mm size single stage module is made of

selected high performance ingot to achieve superior cooling performance and
greater T up to 70 °C, designed for superior cooling and heating up to 100 ºC
requirement.

When coupled with an appropriate heat sink and power source, TEC1 Peltier
Modules are suitable for the following applications…

 Liquid Component Cooling – Ideal for performance PC applications,

TEC1 Peltier Modules are tested to cool CPUs and GPUs to extreme
temperatures when used in conjunction with 12v PSU rails and optimized
CPU heat sinks.

11
 Food and Beverage Refrigeration – Precision temperature management
allows for use in temperature sensitive food and beverage refrigeration
applications requiring exacting cooling (or heating).
 Commercial Portable Cooling – Approved for use in commercial transport,
TEC1 Peltier Modules can be applied to manage DTmax temperatures of up
to 68˚C.
 Temperature Stabilization – Stabilize volatile temperatures with ease and
superior energy efficiency when paired with a precision Peltier control
module.
 Precision Temperature Control – For research laboratories, universities, or
any precision temperature control situation with a range of up to 68˚C, TEC1
Peltiers provide unparalleled control.
 Medical and Photonic Systems – Trusted in thousands of medical and
photonic systems applications, TEC1 Peltier Modules offer premier
precision temperature control - even in extreme temperature differentials -
few coolers can match.

Fig 5.1 Thermoelectric module

12
5.2 Heat sink(Hot side)

A heat sink is a passive heat exchanger that transfers the heat generated by
an electronic or a mechanical device to a fluid medium. Size 120x60x40mm.

A heat sink is designed to maximize its surface area in contact with the
cooling medium surrounding it, such as the air. Air velocity, choice of material,
protrusion design and surface treatment are factors that affect the performance of a
heat sink. Heat sink attachment methods and thermal interface materials also affect
the die temperature of the integrated circuit. Thermal adhesive or thermal
grease improve the heat sink's performance by filling air gaps between the heat
sink and the heat spreader on the device. A heat sink is usually made out of copper
or aluminium. Copper is used because it has many desirable properties for
thermally efficient and durable heat exchangers. First and foremost, copper is an
excellent conductor of heat. This means that copper's high thermal conductivity
allows heat to pass through it quickly. Aluminium heat sinks are used as a low-
cost, lightweight alternative to copper heat sinks, and have a lower thermal
conductivity than copper.

Fig 5.2 Heat sink(Hot side)

13
5.3 Heat sink(Cold side)

Fig 5.3 Heat sink(Cold side)

A fan-cooled heat sink on the processor of a personal computer. To the right

is a smaller heat sink cooling another integrated circuit of the motherboard.

A heat sink is a passive heat exchanger that transfers the heat generated by
an electronic or a mechanical device to a fluid medium, often air or a liquid
coolant, where it is dissipated away from the device, thereby allowing regulation of
the device's temperature at optimal levels. In computers, heat sinks are used to
cool central processing units or graphics processors. Heat sinks are used with high-
power semiconductor devices such as power transistors and optoelectronics such as
lasers and light emitting diodes (LEDs), where the heat dissipation ability of the
component itself is insufficient to moderate its temperature. Size 120x60x40mm

14
 Fig 5.4 Heat sink(Cold side)

5.4 DC Cooling fan

2 set of 12v DC supply fan is used at the back side of heat sink. This will
dissipate heat from sink. 3*3 inch Brushless Fan. Generally used in system, panel
box etc to keep the system cool. Specifications. Size: 3 × 3-inch (80 x 80 x
25mm); DC: 12V 0.20A. Speed: 3000 RPM; Blades : 7 blade cooling fan. Very
low noice; Material: hard plastic. Color: black. Image shown is a representation
only.

15
 Fig 5.5 DC Cooling fan

5.5 AC fan
220V Ac fan of size 120x120x28mm used to extract heat from hot side of
TEC. This will speed up the heat dissipation. The AC cooling fan has become an
essential component in nearly all modern electronics products. These fans supply
the apparatus with cool air and create efficient air flow over the device so that it
may operate correctly and at its full ability. Computer and electronics AC fans
function in the same capacity as any regular household fan. The main purpose of
these fans is to ensure that acceptable temperatures are maintained in an electronic
device. The blades spin at different rates proportionately to the required amount
of cooling. Together the device and fan

16
 Fig 5.6 AC Fan

5.6 AC-DC convertor

We were using 3 TEC of each with 6amp, so we adopt a AC-DC convertor
of 12V 40A with multi output.

17
 Fig 5.7 AC-DC convertor

Electric power is transported on wires either as a direct current (DC) flowing

in one direction at a non-oscillating constant voltage, or as an alternating current
(AC) flowing backwards and forwards due to an oscillating voltage. AC is the
dominant method of transporting power because it offers several advantages over
DC, including lower distribution costs and simple way of converting between
voltage levels thanks to the invention of the transformer. AC power that is sent at
high voltage over long distances and then converted down to a lower voltage is a
more efficient and safer source of power in homes. Depending on the location,
high voltage can range from 4kV (kilo-volts) up to 765kV. As a reminder, AC
mains in homes range from 110V to 250V, depending on which part of the world
you live it. In the U.S., the typical AC main line is 120V.

Converters steer an alternating current, as its voltage also alternates, into

reactive impedance elements, such as inductors (L) and capacitors (C), where it is
stored and integrated. This process separates the power associated with the positive
and negative potentials. Filters are used to smooth out the energy stored, resulting
in creation of a DC source for other circuits. This circuit can take many forms but

18
always comprises of the same essential elements, and may have one or more stages
of conversion. The converter depicted in figure 1 is called a ‘forward converter”,
which is a higher efficiency than a slightly simpler architecture; a ‘flyback
converter’. Although not discuss in detail, a flyback converter differs from a
forward converter in that its operation depends upon energy stored in the airgap of
the transformer in the circuit. Apart from this difference, they can utilize the same
essential blocks.

5.7 Thermal grease

Thermal grease is a kind of thermally conductive compound which is

commonly used as an interface between heat sinks. The main role of thermal
grease is to eliminate air gaps or spaces from the interface area in order to
maximize heat transfer. Thermal grease is an example of a thermal interface
material.

Thermal grease consists of a polymerizable liquid matrix and large volume

fractions of electrically insulating, but thermally conductive filler. Typical matrix
materials are epoxies, silicones, urethanes, and acrylates; solvent-based systems,
hot-melt adhesives, and pressure-sensitive adhesive tapes are also
available. Aluminum oxide, boron nitride, zinc oxide, and increasingly aluminum
nitride are used as fillers for these types of adhesives. The filler loading can be as
high as 70–80% by mass, and raises the thermal conductivity of the base matrix
from 0.17–0.3 W/(m·K) (watts per meter-kelvin) up to about 2 W/(m·K).[1]

Silver thermal compounds may have a conductivity of 3 to 8 W/(m·K) or more.

However, metal-based thermal grease can be electrically conductive and
capacitive; if some flows onto the circuits, it can cause malfunctioning and
damage.

19
 Fig 5.8 Thermal grease

5.8 Cooling and heating cabin

Heating and cooling cabin with size of 30x60x60cm of each were designed
Plywood used as cabin

20
 Fig 5.9 Cooling and heating cabin

5.9Air flow duct

To avoid heat loss to the walls here we used thermocol as heat insulator

21
 Fig 5.10 Air flow duct

Fig 5.11Assembly of TEC system

5.10 Temperature sensor

Thermistors are thermally sensitive resistors whose prime function is to

exhibit a large, predictable and precise change in electrical resistance when
subjected to a corresponding change in body temperature.

22
 Negative Temperature Coefficient (NTC) thermistors exhibit a decrease in
electrical resistance when subjected to an increase in body temperature and
Positive Temperature Coefficient (PTC) thermistors exhibit an increase in
electrical resistance when subjected to an increase in body temperature.

Figure 5.11 Temperature sensor

23
 CHAPTER 6

PARAMETERS OF A THERMOELECTRIC MODULE

Once it is decided that thermoelectric cooler is to be considered for cooling
system, the next step is to select the thermoelectric module or cooler that can
satisfy a particular set of requirements. Modules are available in great variety of
sizes, shapes, operating currents, operating voltages and ranges of heat pumping
capacity. The minimum specifications for finding an appropriate TEC by the
designer must be based on the following parameters.

Fig. 6.1 Cutaway of Thermoelectric Module

 Cold side temperature (Tc )

 Hot side temperature (Th )
 Operating temperature difference, which is the temperature difference
between Th and Tc .

24
  Amount of heat to be absorbed at the TEC’s cold surface. This can also be
termed as heat load. It is represented as (Qc) and the unit is Watts.
 Operating current (I) and operating voltage (V) of the TEC.

6.1 Cold side temperature

If the object to be cooled is in direct contact with the cold surface of the
TEC, the required temperature can be considered the temperature of the cold side
of TEC (Tc).Here in this project the object is air inside the car, which has to be
cooled when passed through a cluster of four Aluminum heat sinks. It is discussed
in detail in the next chapter. The aim is to cool the air flowing through the heat
sinks. When this type of system is employed the cold side temperature of the TEC
is needed to be several time colder than the ultimate desired temperature of the air.

6.2 Hot side temperature

The hot side temperature (Th) is mainly based on the two factors. First
parameter is the temperature of the ambient air in environment to which the heat is
been rejected. Second factor is the efficiency of the heat sink that is between the
hot side of TEC and the ambient.

6.3 Temperature difference

The two temperatures Tc and Th and the difference between them ΔT is a

very important factor. ΔT has to be accurately determined if the cooling system is
expected to be operating as desired. The following equation shows the actual ΔT.

ΔT = Th -Tc

Actual ΔT is not same as the system ΔT. Actual ΔT is the difference between the
hot and cold side of the TEC. On the other hand system ΔT is the temperature
25
difference between the ambient temperature and temperature of the load to be
cooled.

6.4 Cooling Load

The most difficult and important factor to be accurately calculated for a TEC
is the amount of heat to be removed or absorbed (Qc) by the cold side of the TEC.
In this project Qc was calculated by finding the product of mass flow rate of air,
specific heat of air and temperature difference. Here the temperature difference
system ΔT in the difference between the inlet temperature and outlet temperature
of the cooling system. The mathematical equation for Qc is as shown below.

Qc = m CpΔT

6.5 Thermoelectric Assembly - Heat Sinks

Thermoelectric Assemblies (TEAs) are cooling or heating systems attached

to the hot side of the TEC to transfer heat by air, liquid or conduction. TEAs which
dissipate heat from the hot side use heat exchangers. TEC requires heat exchangers
or heat sinks and will be damaged if operated without one. The two ΔT s, actual
ΔT and system ΔT depend on the heat sinks fitted at the hot sides or cold sides of
TEC. The thermal resistances of the heat sinks could vary the ΔT across the TEC
for a set ambient temperature and cooling load temperature. Therefore the thermal
resistance of the heat sinks could increase the current flowing through the TEC.
The three basic types of heat sinks are: forced convective, natural convective and
liquid cooled, where liquid cooled is the most effective. The typical allowances for
ΔT at the hot side heat sink of a TEC are

 10 to 15 °C for a forced air cooling system with fins - Forced convection

 20 to 40 °C for cooling using free convection - Natural convection.

26
  2 to 5 °C for cooling using liquid heat exchangers - Liquid cooled.

There are several different types of heat exchangers available in the market.
As far this project is concerned a forced convection type of heat sink was be used
based on the ΔT. The main heat sink parameter for the selection process is its
thermal resistance. Heat sink resistance can be termed as the measure of the
capability of the sink to dissipate the applied heat. The equation is as follows.

R = (Th-TΔ )/Qh

R is the thermal resistance (in oC /W or K/W) and Th, the hot side
temperature and T∞ ambient temperature respectively. Qh is the heat load into the
heat sink which is the sum of TEC power Pe and heat absorbed.

Q h=Qc+Pe

The goal of a heat sink design is to lessen the thermal resistance. It can be
attained through exposed surface area of the heat sink. It may also require forced
air or liquid cooling.

6.6 Supply and Temperature Control

Power supply and temperature control are two added items that must be
considered wisely for a successful TE system. TEC is a direct current device. The
quality of the DC current is important. Current and voltage of a TEC can be
determined by the charts provided by the manufacturer. TEC’s power is the
product of required voltage and current. (P = IV).

Temperature control is generally categorized into two groups. One is open loop or
manual and the other is closed loop or automatic. For cooling systems normally
cold side is used as basis of control. The controlled temperature is compared to the

27
ambient temperature. An on-off or a control using thermostat is the simplest and
easiest techniques to control the temperature of a TEC.

28
 CHAPTER 7
EXPERIMENTAL ANALYSIS
7.1 Cooling load calculation
The amount of heat removed or the cooling power was determined before
selection of the TEC. Qc which is the amount of heat absorbed was calculated
using the equation
(Qc = m CpΔT )

Mass flow rate (m) of air is the product of density of air (p) and volume flow
rate (Q ). Density of air at 30 °C was taken as1.164 kg / m3. Q was obtained by
multiplying velocity of air pass through the rectangular duct of heat sinks and the
cross section area of a heat sink. It is denoted by the equation (Q =V × A ).
Velocity of the air passing through the duct was measured using an anemometer
and resulted in a reading of5m /s. Cross sectional area of the rectangular duct (W
×H) was calculated as 0.0054128m2 and the volume flow rate was 0.02706m3 / s .
Specific heat of air (C ) at 30 °C was taken as1007 J / kgK.

29
 Table 7.1 Temperature variance – cooling process

Sl. no Time Cooling cabin Temperature

0
min C

1 0 33.2
2 5 31.4
3 10 30.8
4 15 29.2
5 20 28.0
6 25 27.4
7 30 26.9
8 35 26.6
9 40 26.4
10 45 26.4

Temperature
35

30

25

20

15 Temperature

10

0
0 5 10 15 20 25 30 35 40 45

Graph 7.1 time vs Cooling temperature

30
Calculation

All calculations used in the project ,related to cooling load , selection of heat
sinks, selection of fans, pressure drop calculations, surface area needed to cool the
air etc. are mentioned below-

Cooling load-

Qc the amount heat load to be absorbed by the cold junction has to be

calculated before the selection of TECs.

𝑄𝑐 = 𝑚𝐶𝑝 ∆𝑇

𝑚 = Mass of air Kg/s

𝐶𝑝 = Specific Heat of air in KJ/kgK
∆𝑇= Temperature difference in K
𝑚 = 𝑃𝑞̇
P = Specific weight = 1.164 Kg/m3(at 300C)

𝑞̇ = V x A= Velocity x Area

Area = 0.1 x 0.06

= 0.006 m2

𝑞 = 2.5 × 0.006 = 0.015 𝑚3 /𝑠

𝑘𝑔
𝑚 = 1.164 × 0.015 = 0.01746
𝑠

31
 ∆𝑇 = 33.2 − 26.4 = 6.8 𝐾

𝑄𝑐 = 0.01746 × 1007 × 6.8

𝑄𝑐 = 𝟏𝟏𝟗. 𝟓 𝑲𝑱/𝒔

𝑸𝒉 was calculated by adding the electrical power input and the cooling load.

𝑸𝒉 = 𝑄𝑐 + 𝑃𝑒

𝑃𝑒 = 3 x 57.4= 172.2KJ/s

Coefficient of Performance

𝑄𝑐
𝐶𝑂𝑃 =
𝑃𝑒

119.5
𝐶𝑂𝑃 = = 0.69
172.2

7.2 Heat load calculation

The amount of heat removed or the cooling power was determined before
selection of the TEC. Qc which is the amount of heat absorbed was calculated
using the equation
(Qh = m CpΔT )

Mass flow rate (m) of air is the product of density of air (p) and volume flow
rate (Q ). Density of air at 30 °C was taken as1.164 kg / m3. Q was obtained by
multiplying velocity of air pass through the rectangular duct of heat sinks and the
cross section area of a heat sink. It is denoted by the equation (Q =V × A ).
Velocity of the air passing through the duct was measured using an anemometer
and resulted in a reading of5m /s. Cross sectional area of the rectangular duct (W
×H) was calculated as 0.0054128m2 and the volume flow rate was 0.02706m3 / s .
Specific heat of air (C ) at 30 °C was taken as1007 J / kgK
32
 Table 7.2 Temperature variance – Heating process

Sl. no Time Heating cabin Temperature

0
min C

1 0 33.4
2 5 35.4
3 10 39.5
4 15 43.5
5 20 44.8
6 25 47.4
7 30 49.6
8 35 51.8
9 40 52.3
10 45 52.3

Temperature
60

50

40

30
Temperature

20

10

0
0 5 10 15 20 25 30 35 40 45

Graph 7.2 time vs Heating temperature

33
Calculation

All calculations used in the project ,related to cooling load , selection of heat
sinks, selection of fans, pressure drop calculations, surface area needed to cool the
air etc. are mentioned below-

Cooling load-

Qc the amount heat load to be absorbed by the cold junction has to be

calculated before the selection of TECs.

𝑄𝑐 = 𝑚𝐶𝑝 ∆𝑇

𝑚 = Mass of air Kg/s

𝐶𝑝 = Specific Heat of air in KJ/kgK
∆𝑇= Temperature difference in K
𝑚 = 𝑃𝑞̇
P = Specific weight = 1.164 Kg/m3(at 300C)

𝑞̇ = V x A= Velocity x Area

Area = 0.1 x 0.06

= 0.006 m2

𝑞 = 2.5 × 0.006 = 0.015 𝑚3 /𝑠

34
 𝑘𝑔
𝑚 = 1.164 × 0.015 = 0.01746
𝑠

∆𝑇 = 52.3 − 33.2 = 19.1𝐾

𝑄𝑐 = 0.01746 × 1007 × 19.1

𝑄𝑐 = 𝟑𝟑𝟓. 𝟖 𝑲𝑱/𝒔

𝑸𝒉 was calculated by adding the electrical power input and the cooling load.

𝑸𝒉 = 𝑄𝑐 + 𝑃𝑒

𝑃𝑒 = 3 x 57.4= 172.2KJ/s

Coefficient of Performance

𝑄𝑐
𝐶𝑂𝑃 =
𝑃𝑒

335.8
𝐶𝑂𝑃 = = 1.95
172.2

35
 CHAPTER 8

CONCLUSION

A Thermoelectric Air cooling & heating system was designed and built

which can be used for personal cooling & heating. Four TECs were used for

achieving the cooling with a DC power supply through external power supply

(dimmer stat). It had been shown from testing results that the cooling system is

capable of cooling & heating the air when re circulating the air with the help of

blower.TEC cooling designed was able to cool an ambient air temperature

from33.2°C to 26.4°C. Cooling stabilizes within ten minutes once the blower is

turned ON (with a velocity of 2.5 m/s). The system can attain a temperature

difference of set target which was 6°C. TEC designed was able to heat an ambient

air temperature from33.5°C to 52.3°C. . With a single TEC, one hot side and a cold

side heat sink a smaller personal TEC cooler which gives comfort can be fabricated

and can be installed on roof for individual cooling by changing the airflow and

some mechanical or electronics section modification, the TEC air cooling for car

can be used for heating applications too.

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REFERENCES

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