2015-12-23

Silicon PIN Photodiode

Version 1.3

SFH 213

Features:
• Wavelength range (S10%) 400 nm to 1100 nm
• Short switching time (typ. 5 ns)
• 5 mm LED plastic package

Applications
• High speed photointerrupters
• Industrial electronics
• For control and drive circuits

Ordering Information
Type: Photocurrent Ordering Code
IP [µA]
VR = 5 V, Std. Light A, EV =
1000 lx
SFH 213 135 (≥ 100) Q62702P0930

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Maximum Ratings (TA = 25 °C)

Parameter Symbol Values Unit
Operating and storage temperature range Top; Tstg -40 ... 100 °C
Reverse voltage VR 20 V
Reverse voltage VR 50 V
(t < 2 min)
Total Power dissipation Ptot 150 mW
ESD withstand voltage VESD 2000 V
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)

Characteristics (TA = 25 °C)

Parameter Symbol Values Unit
Photocurrent (typ (min)) IP 135 (≥ 100) µA
(Ev = 1000 lx, Std. Light A, VR = 5 V, T = 2856 K)
Wavelength of max. sensitivity (typ) λS max 850 nm
Spectral range of sensitivity (typ) λ10% (typ) 400 nm
... 1100
Radiant sensitive area (typ) A 1.00 mm2
Dimensions of radiant sensitive area (typ) LxW 1x1 mm x
mm
Half angle (typ) ϕ ± 10 °
Dark current (typ (max)) IR 1 (≤ 5) nA
(VR = 20 V)
Spectral sensitivity of the chip (typ) Sλ typ 0.65 A/W
(λ = 870 nm)
Quantum yield of the chip (typ) η 0.93 Electro
(λ = 870 nm) ns
/Photon
Open-circuit voltage (typ (min)) VO 430 (≥ 350) mV
(Ev = 1000 lx, Std. Light A)
Short-circuit current (typ) ISC 125 µA
(Ev = 1000 lx, Std. Light A)
Rise and fall time (typ) tr, tf 0.005 µs
(VR = 20 V, RL = 50 Ω, λ = 850 nm)
Forward voltage (typ) VF 1.3 V
(IF = 100 mA, E = 0)
Capacitance (typ) C0 11 pF
(VR = 0 V, f = 1 MHz, E = 0)
Temperature coefficient of VO (typ) TCV -2.6 mV / K

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Parameter Symbol Values Unit

Temperature coefficient of ISC (typ) TCI 0.18 %/K
(Std. Light A)
Noise equivalent power (typ) NEP 0.028 pW /
(VR = 20 V, λ = 870 nm) Hz½
Detection limit (typ) D* 3.6e12 cm x
(VR = 20 V, λ = 870 nm) Hz½ / W

Relative Spectral Sensitivity 1) page 8 Photocurrent / Open-Circuit Voltage 1) page 8

Srel = f(λ) IP (VR = 5 V) / VO = f(EV)
OHF01034
100
S rel %

80

60

40

20

0
400 600 800 1000 nm 1200
λ

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Power Consumption Dark Current 1) page 8

Ptot = f(TA) IR = f(VR), E = 0
OHF00394
160
mW
Ptot
140

120

100

80

60

40

20

0
0 20 40 60 80 ˚C 100
TA

Capacitance 1) page 8 Dark Current 1) page 8

C = f(VR), f = 1 MHz, E = 0 IR = f(TA), VR = 20 V, E = 0

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Directional Characteristics 1) page 8

Srel = f(ϕ)

Package Outline

9.0 (0.354)
8.2 (0.323) 7.8 (0.307)
7.5 (0.295)
Area not flat
ø5.1 (0.201)
ø4.8 (0.189)

0.6 (0.024) 5.9 (0.232)

0.8 (0.031)
0.5 (0.020)

0.4 (0.016) 5.5 (0.217)

2.54 (0.100)
spacing

1.8 (0.071) 5.7 (0.224) 0.6 (0.024)

1.2 (0.047) 5.1 (0.201) 0.4 (0.016)
29 (1.142)
Chip position
27 (1.063)
Cathode (Diode)
Collector (Transistor) GEXY6260

Dimensions in mm (inch).
Package
5mm Radial (T 1 ¾), Epoxy

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Approximate Weight:
0.4 g
Note
Packing information is available on the internet (online product catalog).
Recommended Solder Pad

Dimensions in mm.

Note:
pad 1: anode

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TTW Soldering
IEC-61760-1 TTW
OHA04645
300
˚C 10 s max., max. contact time 5 s per wave

T 250 235 ˚C - 260 ˚C Continuous line: typical process

First wave Second wave Dotted line: process limits

200 ∆T < 150 K

Cooling
Preheating
ca. 3.5 K/s typical
150 ca. 2 K/s
130 ˚C
ca. 5 K/s
120 ˚C
Typical
100 100 ˚C

50

0
0 20 40 60 80 100 120 140 160 180 200 220 s 240
t
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.

Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.

*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.

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Glossary
1)
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.

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Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.

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