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BASIC CIRCUITS AND DIODES

Review of
Semiconductor Barrier Potential PN Junction
material Intrinsic, Doping Piecewise linear model
Intrinsic, Doping

PN Junction Junction
Biasing Capacitance
Forward & Reverse Bias Structure
The behavior of solid state devices

Depends on

 atomic theory,
 quantum mechanics, and
 electron models.
Plum pudding model

 Proposed by J.J Thomson

 Discovered the “electron”.


raisins(electrons)

‘+’vely charged
"pudding”
Rutherford model

 Proposed by Ernest Rutherford.


 Gold-foil experiment
 Invented the nucleus

 mass of the atom ≈ mass of the small nucleus.


Black Body Radiation
 Observation by Planck, the radiation from a
heated sample is emitted in discrete units of
energy, called quanta;
The Photoelectric Effect

 Einstein interpreted an important experiment that


clearly demonstrated Electrons are ejected from the
surface of a metal when exposed to light of frequency
ν in a vacuum
Atomic Spectra
 In 1885, Balmer observed hydrogen spectrum and saw
colored lines
Niels Bohr’s Model (1913)
 Electrons exist in certain stable, circular orbits about
the nucleus.
 The orbiting electron does not give off radiation
Niels Bohr’s Model(conti)

E4 hv = E4-E1
E3
E2
E1
E!

Angular momentum of the


electron
Wave Model
 Today’s atomic model the wave mechanics.
According to This, Atoms do not have planetary structure .
 In fact, the probable location of an electron is based on
how much energy the electron has.
 According to the modern atomic model, the atom has a
small nucleus(‘+’ ve) surrounded by a large region in
which there are enough electrons to make an atom
neutral.
Atomic Structure
 All Elements are made of atoms
 each has an atomic structure

 Atoms are made of nucleus (Protons (+) & Neutrons)


and electrons (-).
 electrons moves in orbits (discrete distances)
 The closer the orbit to the nucleus the less energy it
has
 Group of orbits called shell.
 Valence shell is the outmost shell.
Atomic Structure(conti….)
 Atomic Number(z) = no. of protons in the nucleus.
 Atomic Mass (A) = z + no of Neutrons(N)in the nucleus.
 The number of Protons = Number of Electrons.
Electron configuration of atoms
 Aufbau principle:- orbital's of lowest energy are filled
first.
 Hund's rule:- orbital's of the same energy are
available, one in each before they double up.
 Pauli exclusion principle:- No two electron can posses
the same 4 quantum states.
No of shell & Valence electron

 EX:- silicon = Si (Z=14)


1s2
2s2 2p6
3s2 3p6 3d10 1s2 2s2 2p6 3s2 3p6
4s2 4p6 4d10 4f14
5s2 5p6 5d10 5f14
6s2 6p6 6d10
7s2 7p6 Total shell =3
Total valence electron = 4
Find no of shell & no of valence electron for potassium(19K39.1)?

Number of shells = 4
Valence electrons = 1
IONS
 IONS are atoms or groups of atoms with a positive or negative
charge.
 Taking away an electron from an atom gives a CATION with a
positive charge
 Adding an electron to an atom gives an ANION with a
negative charge.
 Examples: Na+ Ca+2 I- O-2 (IONS)
Na Ca I O (atoms)
TECHNICAL TALK - PN JUNCTION
Energy Bands

Conduction band
Empty band

Electron energy
Bandgap forbidden gap
Outermost band
containing elelectrons Valence band
Partially full

Bandgap

Full
Bandgap
Full

nucleus

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Elements

18
Bonding Forces Between Atoms
• Nature of the material is a conductor, semiconductor
or insulator depends largely upon what happens to the
outer-shell electrons when the atoms bond themselves
together to form a solid.
• The three types of bonds are
– Metallic bonding (minor Bonding)
– Covalent bonding
– Ionic bonding
Chemical Bonds
• Chemically combining of two or more atoms
– Covalent Bonds
– Ionic Bonds
Covalent Bonds

• One or more pairs of electrons


are shared by two atoms
Ionic Bonds

• One or more electrons from 1


atom are removed and attached to
another atom, resulting in +ve
(cation) and –ve (anion) ions which
attract each other
Covalent Ionic
Compounds Compounds

Gases, liquids, or solids – Crystalline solids


Low melting and boiling points
Poor electrical conductors – High melting and boiling
Many soluble in nonpolar liquids but not points
in water – Conduct electricity
when melted
– Many soluble in water
but not in nonpolar
liquid
One minor type of bonding

• Metallic bonding
– Occurs between like atoms of a metal in the free state
– Valence e- are mobile (move freely among all metal atoms)
– Positive ions in a sea of electrons

• Metallic characteristics
– High mp temps, ductile, malleable, shiny
– Hard substances
– Good conductors of heat and electricity as (s) and (l)
TECHNICAL TALK - PN JUNCTION
Insulators

Insulators have tightly bound electrons in their outer shell


These electrons require a very large amount of energy to free them for conduction
Let’s apply a potential difference across the insulator above…
The force on each electron is not enough to free it from its orbit and the insulator does
not conduct
Insulators are said to have a high resistivity / resistance

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Conductors

Conductors have loosely bound electrons in their outer shell


These electrons require a small amount of energy to free them for conduction
Let’s apply a potential difference across the conductor above…
The force on each electron is enough to free it from its orbit and it can jump from
atom to atom – the conductor conducts
Conductors are said to have a low resistivity / resistance

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Semiconductors
Semiconductors have a resistivity/resistance between that of conductors and
insulators

Their electrons are not free to move but a little energy will free them for
conduction

The two most common semiconductors are silicon and germanium

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Semiconductor

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Conduction electrons and Holes
Energy
Free electron

Conduction band

Energy gap Heat


Energy
Valence band

Holes

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The Silicon, Si, Atom
Silicon has a valency of 4 i.e. 4 This picture shows the
electrons in its outer shell shared electrons
Each silicon atom shares its 4
outer electrons with 4
neighbouring atoms
These shared electrons –
bonds – are shown as
horizontal and vertical lines
between the atoms

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Silicon – the crystal lattice
If we extend this
arrangement throughout a
piece of silicon…

We have the crystal lattice


of silicon

This is how silicon looks


when it is cold

It has no free electrons – it cannot conduct electricity – therefore it behaves like an


insulator
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TECHNICAL TALK - PN JUNCTION
Electron Movement in Silicon

However, if we apply a little


heat to the silicon….

An electron may gain


enough energy to break free
of its bond…
It is then available for
conduction and is free to
travel throughout the
material

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TECHNICAL TALK - PN JUNCTION
Hole Movement in Silicon

Let’s take a closer look at


what the electron has left
behind

There is a gap in the bond –


what we call a hole

Let’s give it a little more


character…

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TECHNICAL TALK - PN JUNCTION
Hole Movement in Silicon
This hole can also move…

An electron – in a nearby
bond – may jump into this
hole…
Effectively causing the hole
to move…
Like this…

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Heating Silicon

We have seen that, in


silicon, heat releases
electrons from their
bonds…

This creates electron-hole


pairs which are then
available for conduction

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Intrinsic Conduction

Take a piece of silicon…

And apply a potential


difference across it…

This sets up an electric field


throughout the silicon –
seen here as dashed lines

When heat is applied an electron is released


and…
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Intrinsic Conduction

The electron feels a force


and moves in the electric
field

It is attracted to the positive


electrode and re-emitted by
the negative electrode

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Intrinsic Conduction

Now, let’s apply some more


heat…
Another electron breaks
free…
And moves in the electric
field.
We now have a greater
current than before…
And the silicon has less
resistance…

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Intrinsic Conduction
If more heat is applies the
process continues…

More heat…
More current…
Less resistance…
The silicon is acting as a
thermistor
Its resistance decreases with
temperature
https://www.vascak.cz/data/android/physicsatschool/templateimg.php?s=pol_pohyb_der&l=
42
en
TECHNICAL TALK - PN JUNCTION
Intrinsic Material
 No impurity
 No charge carrier At 0ºk.

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Intrinsic Material

e-

Si
h+ Si
Si Si

Si

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Extrinsic Material

 Introducing impurities:- Doping.


 Aim:- generating carriers.
 Acceptors.
amphoteric.
 Donors.
 N-type= Intrinsic + Donor.
 P-type = Intrinsic + Acceptor.

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The Phosphorus Atom
Phosphorus is number 15
in the periodic table

It has 15 protons and 15


electrons – 5 of these
electrons are in its outer shell

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Doping – Making n-type Silicon
Relying on heat or light for
conduction does not make
for reliable electronics

Suppose we remove a silicon


atom from the crystal
lattice…

and replace it with a


phosphorus atom

We now have an electron that is not bonded – it is thus free for conduction
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Doping – Making n-type Silicon
Let’s remove another silicon
atom…
and replace it with a
phosphorus atom
As more electrons are
available for conduction we
have increased the
conductivity of the material

Phosphorus is called the If we now apply a potential difference across the


dopant silicon…
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Extrinsic Conduction – n-type Silicon

A current will flow


Note:
The negative
electrons move
towards the positive
terminal

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N-type Silicon From now on
n-type will be
shown like this.

 This type of silicon is called n-type


 This is because the majority charge
carriers are negative electrons
 A small number of minority charge carriers – holes – will exist due to
electrons-hole pairs being created in the silicon atoms due to heat
 The silicon is still electrically neutral as the number of protons is equal to
the number of electrons

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The Boron Atom
Boron is number 5 in the
periodic table

It has 5 protons and 5


electrons – 3 of these
electrons are in its outer
shell
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Doping – Making p-type Silicon
As before, we remove a
silicon atom from the crystal
lattice…

This time we replace it with


a boron atom

Notice we have a hole in a


bond – this hole is thus free
for conduction

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Doping – Making p-type Silicon
Let’s remove another silicon
atom…
and replace it with another
boron atom
As more holes are available for
conduction we have increased
the conductivity of the material

Boron is the dopant in this If we now apply a potential difference across the
case silicon…
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Extrinsic Conduction – p-type silicon

A current will flow –


this time carried by
positive holes
Note:
The positive holes move
towards the negative
terminal

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P-type Silicon From now on
p-type will be
shown like this.

 This type of silicon is called p-type


 This is because the majority charge carriers are positive holes
 A small number of minority charge carriers – electrons – will exist due to
electrons-hole pairs being created in the silicon atoms due to heat
 The silicon is still electrically neutral as the number of protons is equal to the
number of electrons

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Extrinsic Material

Si Si Si Si

Si Si e-
h+
Si Si Si

Si Si Si
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Carriers Concentrations

 To know the Electrical properties.


 no of charge carriers per cm .
3

 each impurity atom one majority carrier.


 the distribution of carriers over the available energy
states.
The Fermi Level

 Electrons in solids obey Fermi-Dirac statistics.


1
f (E)  ( E E f )
1 e kT

 At T<0K (2) When, E>Ef


(1) When, E<Ef 1
1 f (E)  0
f (E)  1
1 0 1 
The Fermi Level

f(E)
1
T=0ºK
T1>T
2 >0ºK
1

1/2

E
Ef

1 1 1
f (E f )  ( E f E f )  
1 e kT 11 2
The Fermi Level

E
f(Ec) f(Ec)

Ec

Ef
[1-f(Ec)]
Ev

f(E) Intrinsic
p-type
n-type
1 1/2 0
Electron and Hole Concentrations at Equilibrium

E
Electrons
N(E)f(E)
EC

Ef

EV
N(E)[1-f(E)]
Holes

Intrinsic
p-type
n-type
Optical Absorption
Luminescence

Photoluminescence
 Fluorescence: emission stops in about 10-8 s.
 Ex : fluorescence lamp
 Phosphorescence: If emission stops in about seconds or
even minutes.
 Ex : phosphors
Electroluminescence
 By using electrical energy generating photon emission.
 Ex: LEDs.
Effects of Heat and Light
• In conductors currents flows due to free electrons in the
interatomic spaces.
• As the temperature increases the vibration in the lattice will
increase due to which collision of free electrons with atoms
increase.
• This will lead to reduction of magnitude of current.
• Conductors will have positive temperature coefficient
• https://www.vascak.cz/data/android/physicsatschool/templ
ateimg.php?s=mf_vnitrni_energie&l=en
Effects of Heat and Light
• In semiconductor as the temperature increases more
charge carriers are generated because of which current
will increase.
• So Semiconductors will have negative temperature
coefficient
• https://www.vascak.cz/data/android/physicsatschool/t
emplateimg.php?s=pol_generace&l=en
Carrier Charge Density
• Intrinsic Semiconductor: Pure semiconductor.
• Number of atoms per cubic centimeter is 5 *1022,
• Electron density ni=1.5*1010/cm3
• This means 1.5*1010 electrons have released one
electron and consequently 1.5*1010 holes have been
created.
• So the hole density is same as the electron density
(pi=ni)
Doped Semiconductor
• If an n-type material has a density of n free electrons
per cubic centimeter.
• By law of mass action n*p=ni2
• n=ND+p
• p=Np+n
• ND+p=Np+n
Semiconductor Conductivity
Charge Carrier Velocity
• Electrons have greater mobility than holes.
• The mobility constants determine the electrons and
hole velocities under the influence of an electric field.
• Electron velocity vn=-μnε
• Hole velocity vp=-μpε
Mobile Charge Carriers in Semiconductors
• Three primary types of carrier action occur inside a semiconductor:

– Drift: charged particle motion under the influence of an


electric field.

– Diffusion: particle motion due to concentration gradient


or temperature gradient.

– Recombination-generation (R-G)

EE130/230M Spring 2013 Lecture 4, Slide 70


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Diffusion of carriers

Diffusion Process
 Carriers in semiconductor diffuse in a carrier gradient by random thermal motion and scattering from the
lattice and impurities.

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Diffusion of carriers
Drift and diffusion
 Minority current flow is primarily diffusion.
 Majority .current flow is primarily drift.
 The hole drift and diffusion current densities are in the same direction.
 The electron drift and diffusion current densities are in the opposite direction

J ( x)  J n ( x )  J p ( x )
72
Electrons as Moving Particles
In vacuum In semiconductor

F = (-q)E = moa F = (-q)E = mn*a


where mn* is the
conductivity effective mass
Conductivity Effective Mass, m*
Under the influence of an electric field (E-field), an electron or a hole is accelerated:

a
q  electrons
mn*

a *
q  holes
mp

Electron and hole conductivity effective masses


Si Ge GaAs
mn*/mo 0.26 0.12 0.068
mp*/mo 0.39 0.30 0.50
mo = 9.110-31 kg
Carrier Scattering
• Mobile electrons and atoms in the Si lattice are always in random thermal
motion.
– Electrons make frequent collisions with the vibrating atoms
“lattice scattering” or “phonon scattering” – increases with increasing T

• Other scattering mechanisms:


– deflection by ionized impurity atoms
– deflection due to Coulombic force between carriers
“carrier-carrier scattering” – only significant at high carrier concentrations

• The net current in any direction is zero, if no E-field is applied.


3 2
1
electron
4
5
Thermal Velocity, vth

3 1 * 2
Average electron kinetic energy  kT  mn vth
2 2

3kT 3  0.026 eV  (1.6 10 19 J/eV)


vth  
*
mn 0.26  9.1 10 31 kg
 2.3 10 m/s  2.3  10 cm/s
5 7
Carrier Drift
• When an electric field (e.g. due to an externally applied voltage) exists within a
semiconductor, mobile charge-carriers will be accelerated by the electrostatic force:

2
3 1
4 electron
5

E
Electrons drift in the direction opposite to the E-field  net current
Because of scattering, electrons in a semiconductor do not undergo constant acceleration.
However, they can be viewed as quasi-classical particles moving at a constant average drift
velocity vdn
Carrier Mobility, m

For electrons: |vdn| ≡ mnE


mn  [qtmn / mn*] is the electron mobility

Similarly, for holes: |vdp|= mpE


mp  [qtmp / mp*] is the hole mobility
Electron and hole mobilities for intrinsic semiconductors @ 300K
Si Ge GaAs InAs
mn (cm2/Vs) 1400 3900 8500 30,000
mp (cm2/Vs) 470 1900 400 500
Example: Drift Velocity Calculation
a) Find the hole drift velocity in an intrinsic Si sample for E = 103 V/cm.
b) What is the average hole scattering time?

Solution:
a) vdp = mpE

qt m p m*p m p
b) mp  *
 t mp 
m p q
Mobility Dependence on Temperature

1 1 1
 
m m phonon mim purity
Hole Drift Current Density, Jp,drift

vdp Dt A = volume from which all holes cross plane in time Dt


p vdp Dt A = number of holes crossing plane in time Dt
q p vdp Dt A = hole charge crossing plane in time Dt
q p vdp A = hole charge crossing plane per unit time = hole current
 Hole drift current per unit area Jp,drift = q p vdp
Conductivity and Resistivity
• In a semiconductor, both electrons and holes conduct current:
J p ,drift  qpm p E J n,drift  qn(mn E )
J drift  J p ,drift  J n,drift  qpm p E  qnmn E
J drift  (qpm p  qnmn ) E  E

• The conductivity of a semiconductor is   qpm p  qnmn


– Unit: mho/cm

1
• The resistivity of a semiconductor is 
– Unit: ohm-cm 
Resistivity Dependence on Doping

For n-type material:


1

qnm n

For p-type material:


1
p-type 
qpm p
n-type
Note: This plot (for Si) does not apply
to compensated material (doped
with both acceptors and donors).
Electrical Resistance
I V
+ _

W
t
uniformly doped semiconductor

V L
Resistance R  [Unit: ohms]
I Wt
where  is the resistivity
Example: Resistance Calculation
What is the resistivity of a Si sample doped with 1016/cm3 Boron?
Answer:

1 1
 
qnm n  qpm p qpm p

 (1.6 10 19 16
)(10 )( 450 ) 1
 1.4   cm
Example: Dopant Compensation
Consider the same Si sample doped with 1016/cm3 Boron, and additionally doped with
1017/cm3 Arsenic. What is its resistivity?
Answer:

1 1
 
qnm n  qpm p qnm n

 (1.6 10 19
)(9 10 )(600 )
16
1
 0.12   cm
Summary
• Electrons and holes can be considered as quasi-classical particles with
effective mass m*
• In the presence of an electric field E, carriers move with average drift
velocity vd = mE , m is the carrier mobility
– Mobility decreases w/ increasing total concentration of ionized dopants
– Mobility is dependent on temperature
• decreases w/ increasing T if lattice scattering is dominant
• decreases w/ decreasing T if impurity scattering is dominant

• The conductivity () hence the resistivity () of a semiconductor is


dependent on its mobile charge carrier concentrations and mobilities

  qpm p  qnmn   1
TECHNICAL TALK - PN JUNCTION
Semiconductor Diode
Pn-junction Diode
 The term diode indicates two-electrode device.
 The two sides of the junction are provided with connecting terminals.
 A diode is a one-way device, offering a low resistance when forward biased and behaving almost as an
insulator when reverse biased.
 Symbols of PN Junction diode

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TECHNICAL TALK - PN JUNCTION
The p-n Junction
Suppose we join a piece of p-type silicon to a piece of n-type silicon

We get what is called a p-n junction


Remember – both pieces are electrically neutral
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pn junction diode
equilibrium
‘-’ ve Ion

‘+’ ve Ion

Ec Ec
Ef
Ef
Ev Ev
p-type n-type
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TECHNICAL TALK - PN JUNCTION
The p-n Junction
When initially joined electrons
from the
n-type migrate into the p-type
– less electron density there

When an electron fills a hole


– both the electron and hole
disappear as the gap in the
bond is filled

This leaves a region with no free charge carriers – the depletion layer – this layer acts as
an insulator
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The p-n Junction 0.6 V

As the p-type has gained


electrons – it is left with an
overall negative charge…

As the n-type has lost


electrons – it is left with an
overall positive charge…

Therefore there is a voltage across the junction – the junction voltage – for silicon this is
approximately 0.6 V
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pn junction diode

Ec
Ec
Ef Ef
Ev
p-type Ev
93
n-type
TECHNICAL TALK - PN JUNCTION
pn junction diode

qV0
Ec qV0
Ec
Efp Efn
Ev
p-type Ev
n-type 94
TECHNICAL TALK - PN JUNCTION
The Forward Biased P-N Junction
Take a p-n junction
Apply a voltage across
it with the
p-type postitive
n-type negative
Close the switch
The voltage sets up an
electric field
throughout the The junction is said to be forward –
junction biased
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TECHNICAL TALK - PN JUNCTION
The Forward Biased P-N Junction
Negative electrons in the
n-type feel a repulsive
force which pushes them
into the depletion layer

Positive holes in the p-


type also experience a
repulsive force which
pushes them into the
depletion layer Therefore, the depletion layer is eliminated and a current
flows through the p-n junction
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The Forward Biased P-N Junction
At the junction electrons
fill holes
Both disappear as they
are no longer free for
conduction

They are replenished by


the external cell and
current flows

This continues as long as the external voltage is greater than


the junction voltage i.e. 0.6 V
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The Forward Biased P-N Junction
If we apply a higher
voltage…
The electrons feel a
greater force and move
faster

The current will be


greater and will look
like
this….
The arrow shows the
The p-n junction is called a DIODE and is direction in which it
represented by the symbol… conducts current
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pn junction diode

Forward bias

+ + + + +
+ + + + +
+ + +
+ + + + + + +
+ + +
+ + + + + +
+ + + + +
++
+ + + + + +

99
PN Junction Forward Biased Characteristics
TECHNICAL TALK - PN JUNCTION
The Reverse Biased P-N Junction
Take a p-n junction
Apply a voltage across
it with the
p-type negative
n-type positive
Close the switch
The voltage sets up an
electric field
throughout the
junction The junction is said to be reverse – biased

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TECHNICAL TALK - PN JUNCTION
The Reverse Biased P-N Junction
Negative electrons in the
n-type feel an attractive
force which pulls them
away from the depletion
layer

Positive holes in the p-


type also experience an
attractive force which
pulls them away from the
depletion layer
Thus, the depletion layer ( INSULATOR ) is widened and no
current flows through the
p-n junction 102
TECHNICAL TALK - PN JUNCTION
pn junction diode
Reverse bias

+ + + + +
+ + + + +
+ + +
+ + + + + + +
+ + +
+ + + + + +
+ + + + +
++
+ + + + + +

103
Reverse Bias Current
Junction Temperature Effects
• When the temperature of the semiconductor material
is raised, increasing numbers of electrons break away
from their atoms.
• This will generate additional minority charge carriers
causing Io to increase as the junction temperature
rises.
• Io(T2)=Io(T1)(2T2-T1/10)
Reverse Bias Current variation with Temperature
TECHNICAL TALK - PN JUNCTION
The Semiconductor Diode
• The semiconductor diode is a p-n junction
• In reverse bias it does not conduct

 In forward bias it conducts as long as the


external voltage is greater than the junction
voltage
 A diode should always have a protective resistor
in series as it can be damaged by a large current

107
TECHNICAL TALK - PN JUNCTION
The Semiconductor Diode
• The silver line drawn on one side of the diode
represents the line in its symbol
• This side should be connected to the negative terminal
for the diode to be forward biased
• Diodes are used to change alternating current to direct
current
• Diodes are also used to prevent damage in a circuit by
connecting a battery or power supply the wrong way
around

108
Ideal Current-Voltage Relationship

Current ID equation of a pn junction diode:

IS = the reverse-bias saturation current (for silicon 10-15 to 10-13 A)


VT = the thermal voltage (0.026 V at room temperature)
n = the emission coefficient (1 ≤ n ≤ 2)
PN Junction Currents and Voltages
• Shockley Equation
• ID=Io[e(VD-nVT)-1]
• VT=KT/q
• Junction Voltage
• VD=(nVT)ln(ID/Io)
Forward Resistance and Reverse Resistance
• Forward Resistance RF=VF/IF
• Reverse Resistance RR=VR/IR
• Dynamic Resistance rd=ΔVF/ΔIF
• Dynamic Resistance (Thumb of Rule) r’d=26mV/ΔIF
Ideal Current-Voltage Relationship
Example
Determine the current in a pn junction diode.
Consider a pn junction at T = 300 K in which IS = 1.4 x 10-14 A and n = 1.
Find the diode current for vD = +0.75 V and vD = -0.75 V.

Very small current


PN Junction Diode
 The basic PN junction diode circuit symbol, and conventional current direction and
voltage polarity.

 The graphs shows the ideal I-V characteristics


of a PN junction diode.
 The diode current is an exponential function
of diode voltage in the forward-bias region.
 The current is very nearly zero in the reverse-
bias region.
PN Junction Diode
● Temperature Effects
 Both IS and VT are functions of temperature.
 The diode characteristics vary with temperature.
 For silicon diodes, the change is
approximately 2 mV/oC.
•Forward-biased PN junction
characteristics versus
temperature.
•The required diode voltage,
V to produce a given current
decreases with an increase in
temperature. V2
V1
Analysis of PN Junction Diode in a Circuit
CIRCUIT REPRESENTATION OF DIODE – Ideal
Model

VD = - VS

Reverse-bias

I-V characteristics of ideal model

Forward-bias
EXAMPLE: Determine the diode voltage and current
in the circuit using ideal model for a silicon diode.
Also determine the power dissipated in the diode.
CIRCUIT REPRESENTATION OF DIODE – Piecewise
Linear Model

VD = - VS

Reverse-bias

I-V characteristics of constant voltage


Forward-bias model
EXAMPLE: Determine the diode voltage and current
in the circuit (using constant voltage model) for a
silicon diode. Also determine the power dissipated in
the diode. Consider the cut-in voltage V = 0.65 V.
CIRCUIT REPRESENTATION OF DIODE – Piecewise
Linear Model

VD = - VS

Reverse-bias

I-V characteristics of piecewise model


Forward-bias
EXAMPLE: Determine the diode voltage and current in
the circuit using piecewise linear model for a silicon
diode. Also determine the power dissipated in the
diode. Consider the cut-in voltage V = 0.65 V and the
diode DC forward resistance, rf = 15 Ω.
Why do you need to use these models?
Diode Circuits: Direct Approach

Question
Determine the diode voltage and current for
the circuit.
Consider IS = 10-13 A.
VPS = IDR + VD
ITERATION METHOD
5 = (2 x103) (10-3) [e ( VD / 0.026) – 1 ] + VD
VD = 0.619 V

And ID = 2.19 mA
IDEAL MODEL PIECEWISE PIECEWISE DIRECT
LINEAR MODEL 1 LINEAR MODEL 2 APPROACH

Diode voltage VD 0V 0.65 V 0.652 V 0.619 V

Diode current ID 2.5 mA 2.175 mA 2.159 mA 2.19 mA


DC Load Line

• A linear line equation


• ID versus VD
• Obtain the equation using KVL
The value of ID

Use KVL: VD
2ID + VD – 5 = 0
ID = -VD + 5 = - VD + 2.5
2 2
EXAMPLE
A diode circuit and its load line are as shown in the figure below

Design the circuit when the diode is operating in forward bias condition.
Determine the diode current ID and diode forward resistance rf in the circuit using a
piecewise linear model. Consider the cut-in voltage of the diode, Vγ = 0.65V.
IDR + VD – 5 = 0 at VD = 0.7V
ID = -VD/R + 5/ R ID = (5 – 0.7) / 2 = 2.15 mA
5/ R = 2.5 mA
R = 2 kΩ Now, VD = Vγ + ID rf
0.7 = 0.65 + 2.15 rf
rf = 0.05 / 2.15 mA = 23. 3 Ω
Diode AC Models
• The depletion region of a pn-junction is a layer
depleted of charge carriers situated between to blocks
of low-resistance material.
• The depletion layer capacitance may be calculated
from the equation for a parallel plate capacitor if the
junction dimensions are known.
• Typically Cpn=4 pF
Diode AC Model
• In forward biased junction if the applied voltage is
suddenly reversed, forward current IF ceases
immediately, leaving some majority carriers in the
depletion region.
• These carriers have to go back out of the depletion
region. i.e when a forward biased junction is suddenly
reversed, there is a reverse current. This is similar to
capacitor discharge and is given as Cd=τIF/VF
AC Equivalent Circuits (Reverse Biased and Forward Biased)
Reverse Recovery Time

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