ABSOLUTE MAXIMUM RATINGS (TA = 25 °C Unless Otherwise Noted)
PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS Gate-Source Voltage VGS ±20 V TA = 25 °C 0.9 Continuous Drain Current ID TA = 70 °C 0.5 1 A Pulsed Drain Current IDM 5.4 Avalanche Current IAS 3.8 Avalanche Energy L = 1mH EAS 7.2 mJ TA = 25 °C 1.3 Power Dissipation PD W TA = 70 °C 0.5 Operating Junction & Storage Temperature Range TJ, TSTG -55 to 150 °C
THERMAL RESISTANCE RATINGS
THERMAL RESISTANCE SYMBOL TYPICAL MAXIMUM UNITS Junction-to-Ambient RqJA 95 °C / W 1 Pulse width limited by maximum junction temperature.
Ver 1.0 1 2012/7/4
PF610BL N-Channel Enhancement Mode MOSFET
ELECTRICAL CHARACTERISTICS (TJ = 25 °C, Unless Otherwise Noted)
LIMITS PARAMETER SYMBOL TEST CONDITIONS UNIT MIN TYP MAX STATIC Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250mA 100 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250mA 1 1.8 3 Gate-Body Leakage IGSS VDS = 0V, VGS = ±20V ±100 nA VDS = 80V, VGS = 0V 1 Zero Gate Voltage Drain Current IDSS mA VDS = 80V, VGS = 0V , TJ = 125 °C 10 On-State Drain Current1 ID(ON) VDS = 5V, VGS = 10V 5.4 A Drain-Source On-State VGS = 4.5V, ID = 0.5A 0.52 0.9 RDS(ON) Ω Resistance1 VGS = 10V, ID = 0.9A 0.48 0.7 Forward Transconductance1 gfs VDS = 5V, ID = 0.9A 2 S DYNAMIC Input Capacitance Ciss 246 Output Capacitance Coss VGS = 0V, VDS = 25V, f = 1MHz 65 pF Reverse Transfer Capacitance Crss 20 Gate Resistance Rg VGS = 0V, VDS = 0V, f = 1MHz 2.1 Ω 2 Qg Total Gate Charge 7.2 2 VDS = 0.5V(BR)DSS Gate-Source Charge Qgs 1 nC ID = 0.9A, VGS = 10V 2 Qgd Gate-Drain Charge 3 2 td(on) Turn-On Delay Time 8 Rise Time 2 tr VDS = 50V, ID @ 0.9A, VGS = 10V, 11 nS Turn-Off Delay Time 2 td(off) RGS = 4.7Ω 26 Fall Time2 tf 13.5 SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS (TJ = 25 °C) Continuous Current IS 0.9 A 1 VSD IF = 0.9A, VGS = 0V Forward Voltage 1.2 V Reverse Recovery Time trr 32 nS IF = 2 A, dl/dt = 100A / μS Reverse Recovery Charge Qrr 35 nC 1 Pulse test : Pulse Width 300 msec, Duty Cycle 2%. 2 Independent of operating temperature.