LIGA Process

 LIGA process is one of the Fabrication Techniques for MEMS

 The technique was first developed at the Karisruhe Nuclear
Research Centre in Germany.
 LIGA process is radically different from silicon based micro
manufacturing.
 The major difference is that LIGA can produce
microstructures that have high aspect ratio.
 There is no restriction on using silicon or silicon compounds
as substrate.
 Nickel is a common material for LIGA products.
 It is easier to be produced in large volumes.

The main characteristics of LIGA-structures are:

 large layout freedom in the mask geometry

 high aspect ratios
 parallel side walls with flank angle very close to 90°
 smooth side walls suitable for optical micro mirrors
 lateral precision in the few micrometre range over distances
of several centimetres
 structural details on side walls in the 30 nm range possible
 different side wall angles via double exposure is possible
 There are two main LIGA-fabrication technologies
 X-Ray LIGA, which uses X-rays produced by
a synchrotron to create high-aspect ratio structures,
and
 UV LIGA, a more accessible method which
uses ultraviolet light to create structures with
relatively low aspect ratios.

LIGA Process consists of three major steps

1. lithography,
2. electroplating
3. molding

Electroplating is a process that uses an

electric current to reduce dissolved metal cations so that they
form a thin coherent metal coating on an electrode.
Lithography, is a process used in microfabrication to pattern
parts of a thin film or the bulk of a substrate (also called a wafer).
Molding is the process of manufacturing by shaping liquid or
pliable raw material using a rigid frame called a mold or matrix.
Diagram of LIGA Process

The LIGA process involves the following step

1. A vey thick resist PMMA is deposited on to primary

substrate.
2. The PMMA is exposed to columnated X-ray and is
developed.
3. Metal is electro deposited on to the primary substrate.
4. The PMMA is removed or striped, resulting in free standing
metal structure.
5. Plastic injection molding takes place.
Working

In lithography process an x-ray photoresist typically pmma

bonded to an electrically conductive substrate it is exposed to
parallel beams of high energy x-ray from synchrotron radiation
source through a mask partly covered with strong x-ray absorbing
material

In electroplating chemical removal of exposed photoresist result

in a 3 dimensional structure which can be filled by a electro
deposition of metal

The resist is chemically stripped away to produce a metallic mold

insert. The mold insert can be used to produce parts in polymer or
ceramics through injection molding

Advantages of the X-ray lithography

1. High intensity
2. Excellent parallelism
3. Simple to use
4. No diffraction effect

Disadvantages of the X-ray lithography

1. High Cost and expensive to produce
2. X-ray mask is very difficult to make
3. Very expensive facility is required
4. Thin lens