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LM2901V, NCV2901,
MC3302
PIN CONNECTIONS
Output 2 1 14 Output 3
Output 1 2 13 Output 4
VCC 3 12 GND
− Input 1 4 11 + Input 4
* )
1 4
+ Input 1 5
) * 10 − Input 4
− Input 2 6 9 + Input 3
*2 )
3
) *
+ Input 2 7 8 − Input 3
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
MAXIMUM RATINGS
Rating Symbol Value Unit
Power Supply Voltage VCC Vdc
LM239/LM339/LM2901, V +36 or ±18
MC3302 +30 or ±15
Input Differential Voltage Range VIDR Vdc
LM239/LM339/LM2901, V 36
MC3302 30
Input Common Mode Voltage Range VICMR −0.3 to VCC Vdc
Output Short Circuit to Ground (Note 1) ISC Continuous
Power Dissipation @ TA = 25°C PD
Plastic Package 1.0 W
Derate above 25°C 1/RqJA 8.0 mW/°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The maximum output current may be as high as 20 mA, independent of the magnitude of VCC. Output short circuits to VCC can cause excessive
heating and eventual destruction.
2. VESD rating for NCV/SC devices is: Human Body Model − 2000 V; Machine Model − 200 V.
GND
2
LM339, LM239, LM2901, LM2901V, NCV2901, MC3302
3
LM339, LM239, LM2901, LM2901V, NCV2901, MC3302
+ VCC + VCC
R3
10 k Rref
10 k
Vin − Vref
Rref VO 10 k
+ VCC +
R1 −
R2 R2 VO
Vref Vin +
1.0 M 10 k
10k R1 VCC R1
Vref [ R3 VCC R1
Rref + R1 Vref =
1.0 M Rref + R1
R3 ] R1 / / Rref / / R2
R2 [ R1 / / Rref
R1 / / Rref
VH = [VO(max) − VO(min)] Amount of Hysteresis VH
R1/ / Rref + R2
R2
VH = [(V −V ]
R2 ơ Rref / / R1 R2 + R3 O(max) O(min)
4
LM339, LM239, LM2901, LM2901V, NCV2901, MC3302
ORDERING INFORMATION
Device Package Shipping†
LM339N PDIP−14
LM339NG PDIP−14 25 Units/Rail
(Pb−Free)
LM2901D SOIC−14
LM2901DG SOIC−14 55 Units/Rail
(Pb−Free)
LM2901DR2 SOIC−14
LM2901DR2G SOIC−14
(Pb−Free) 2500 / Tape & Reel
LM2901DTBR2 TSSOP−14*
LM2901DTBR2G TSSOP−14*
LM2901N PDIP−14
LM2901NG PDIP−14 25 Units/Rail
(Pb−Free)
LM2901VD SOIC−14
LM2901VDG SOIC−14 55 Units/Tube
(Pb−Free)
LM2901VDR2 SOIC−14
LM2901VDR2G SOIC−14
(Pb−Free) 2500 / Tape & Reel
LM2901VDTBR2 TSSOP−14*
LM2901VDTBR2G TSSOP−14*
LM2901VN PDIP−14
LM2901VNG PDIP−14 25 Units/Rail
(Pb−Free)
NCV2901DR2 SOIC−14
NCV2901DR2G SOIC−14
(Pb−Free) 2500 / Tape & Reel
NCV2901DTBR2G TSSOP−14*
NCV2901CTR Bare Die 6000 / Tape & Reel
MC3302D SOIC−14
MC3302DG SOIC−14 55 Units/Tube
(Pb−Free)
MC3302DR2 SOIC−14
MC3302DR2G SOIC−14
(Pb−Free) 2500 / Tape & Reel
MC3302DTBR2 TSSOP−14*
MC3302DTBR2G TSSOP−14*
MC3302P PDIP−14
MC3302PG PDIP−14 25 Units/Rail
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
7
LM339, LM239, LM2901, LM2901V, NCV2901, MC3302
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
−A− 2. CONTROLLING DIMENSION: MILLIMETER.
14 8 3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
−B− 5. DIMENSION D DOES NOT INCLUDE
P 7 PL DAMBAR PROTRUSION. ALLOWABLE
0.25 (0.010) M B M DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
1 7 CONDITION.
G MILLIMETERS INCHES
R X 45 _ F DIM MIN MAX MIN MAX
C A 8.55 8.75 0.337 0.344
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
−T− F 0.40 1.25 0.016 0.049
K M J
SEATING D 14 PL G 1.27 BSC 0.050 BSC
PLANE J 0.19 0.25 0.008 0.009
0.25 (0.010) M T B S A S K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019
SOLDERING FOOTPRINT*
7X
7.04 14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
10