1. Consider a 3-m-high, 6-m-wide, and 0.

3-m-thick brick wall whose thermal conductivity is k =

0.8 W/m·K. On a certain day, the temperatures of the inner and the outer surfaces of the wall
are measured to be 14°C and 2°C, respectively. Determine the rate of heat loss through the
wall on that day.

2. A 1.0 m × 1.5 m double-pane window consists of two 4-mm-thick layers of glass (k = 0.78
W/m·K) that are separated by a 5-mm air gap (kair = 0.025 W/m·K). The heat flow through the
air gap is assumed to be by conduction. The inside and outside air temperatures are 20°C and
220°C, respectively, and the inside and outside heat transfer coefficients are 40 and 20
W/m2·K. Determine (a) the daily rate of heat loss through the window in steady operation
and (b) the temperature difference across the largest thermal resistance.

3. Consider a 1.2-m-high and 2-m-wide glass window whose thickness is 6 mm and thermal
conductivity is k = 0.78 W/m·K. Determine the steady rate of heat transfer through this glass
window and the temperature of its inner surface for a day during which the room is
maintained at 24°C while the temperature of the outdoors is 25°C. Take the convection heat
transfer coefficients on the inner and outer surfaces of the window to be h1 = 10 W/m2·K and
h2 = 25 W/m2·K and disregard any heat transfer by radiation.

4. A 4-m-high and 6-m-wide wall consists of a long 18-cm × 30-cm cross section of horizontal
bricks (k = 0.72 W/m·K) separated by 3-cm-thick plaster layers (k = 0.22 W/m·K). There are
also 2-cm-thick plaster layers on each side of the wall, and a 2-cmthick rigid foam (k = 0.026
W/m·K) on the inner side of the wall. The indoor and the outdoor temperatures are 22°C and
24°C, and the convection heat transfer coefficients on the inner and the outer sides are h1 =
10 W/m2·K and h2 = 20 W/m2·K, respectively. Assuming one-dimensional heat transfer and
disregarding radiation, determine the rate of heat transfer through the wall.

5. A 50-m-long section of a steam pipe whose outer diameter is 10

cm passes through an open space at 15°C. The average
temperature of the outer surface of the pipe is measured to be
150°C. If the combined heat transfer coefficient on the outer
surface of the pipe is 20 W/m2·K, determine (a) the rate of heat
loss from the steam pipe; (b) the annual cost of this energy lost if
steam is generated in a natural gas furnace that has an efficiency
of 75 percent and the price of natural gas is $0.52/therm (1 therm
= 105,500 kJ); and (c) the thickness of fiberglass insulation (k =
0.035 W/m·K) needed in order to save 90 percent of the heat lost.
Assume the pipe temperature to remain constant at 150°C.

6. Consider a very long rectangular fin attached to a flat surface such

that the temperature at the end of the fin is essentially that of the
surrounding air, i.e. 20°C. Its width is 5.0 cm; thickness is 1.0 mm;
thermal conductivity is 200 W/m·K; and base temperature is 40°C.
The heat transfer coefficient is 20 W/m2·K. Estimate the fin
temperature at a distance of 5.0 cm from the base and the rate
of heat loss from the entire fin.
7. A 40-W power transistor is to be cooled by attaching it to one of the commercially available
heat sinks shown in Table (i.e., Combined natural convection and radiation thermal resistance
of various heat sinks). Select a heat sink that will allow the case temperature of the transistor
not to exceed 90°C in the ambient air at 20°C.

8. A 0.3-cm-thick, 12-cm-high, and 18-cm-long circuit board houses 80 closely spaced logic chips
on one side, each dissipating 0.04 W. The board is impregnated with copper fillings and has
an effective thermal conductivity of 30 W/m·K. All the heat generated in the chips is
conducted across the circuit board and is dissipated from the back side of the board to a
medium at 40°C, with a heat transfer coefficient of 40 W/m2·K. (a) Determine the
temperatures on the two sides of the circuit board. (b) Now a 0.2-cm-thick, 12-cm-high, and
18-cmlong aluminum plate (k = 237 W/m·K) with 864 2-cm-long aluminum pin fins of diameter
0.25 cm is attached to the back side of the circuit board with a 0.02-cm-thick epoxy adhesive
(k = 1.8 W/m·K). Determine the new temperatures on the two sides of the circuit board.