(Cu-MIM)

Corporate Presentation

Indo-MIM Confidential
 Contents

• Copper MIM (Cu MIM) Material specification

• Potential Applications for Copper MIM parts

• Copper MIM parts examples

Indo-MIM Confidential
 Copper MIM materials
Following Copper material offered by INDO-MIM
MIM Cu :

Chemical Composition:

Material Designation Nominal Chemical Composition, % - Copper

Cu

MIM-Cu 99.8 Minimum

100.0 Maximum

Other Elements: 0.2% max, excluding silver.

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 MIM Cu
Material Properties:
TYPICAL VALUES
Tensile Properties
Density Thermal Ultimate Yield Strength Elongation
Conductivity Strength (0.2%) (in 25mm)
(at 25 °c)
g/cm3 W/(m-K) MPa MPa %
8.75 360 207 69 30

Coefficient of Thermal Expansion (CTE):

From 20 °F TO: Average CTE (X 10-6/ °C)
38 °C 15.7
66 °C 16.0
93 °C 16.4
121 °C 16.7
149 °C 16.9

In accordance with ASTM E228 & using a push rod dilatometer.

 MIM Cu
Microstructure:
Sintered

Magnification : 200X

Microstructure reveals homogenous microstructure with little to no evidence of

oxides or contaminants with uniformly distributed porosity.

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 Other Copper alloy grades through MIM
Cu [ Ni Sn Fe Cr Mn Si O C Other

> -- -- -- -- -- -- -- -- -- --

Cu999
< Bal. -- -- 0.1 -- -- -- 0.05 -- --

> -- -- 7.0 -- -- -- -- -- -- --

CuSn8
< Bal. 9.0 -- -- -- -- -- -- 0.2

> -- 8.5 5.5 -- -- -- -- -- -- --

CuNi9Sn6
< Bal. 9.5 6.5 -- -- -- -- -- -- 0.3

> -- 14.5 7.5 -- -- -- -- -- -- --

CuNi15Sn8
< Bal. 15.5 8.5 -- -- -- -- -- -- 0.3

Tailor-made grades with specific requirement of chemical composition are feasible

through MIM.
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 Potential Applications for Copper MIM Parts

• Mainly the parts for thermal management application like Heat Sinks for
LED & High power chips, specifically for IGBT.

• Copper parts are therefore the markets Parts for Electro technology, E-
mobility, and renewable energy.

• Connector, leads for electrical applications.

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Copper MIM Parts

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 Copper MIM Parts

*Development of Copper MIM Powders for Thermal Management Applications.

R. Zauner, R. Nagel), E. Neubauer, K. Portschy1, P.A Davies, M.A.Kearns.
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 Copper MIM Parts
Comparison of Copper Materials for Heat Sink Applications

MIM Wrought Cast Cast

C11000 C81100 C83400
Density
(g/cm3) 8.5 8.9 8.9 8.7

Thermal 320-330 380-390 340-350 180-190

Conductivity
(W/Mk)
Net-Shape Excellent Difficult to Difficult to Good
Capability Machine Cast

*Metal Injection Molding Of Heat Sinks, Number 4, Volume 10.

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 Cold Plate MIM Part for IGBT Application

Cold Plates used in the IGBT system which helps the heat to dissipate have been
developed using MIM Technology in Copper material.
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Complexity Simplified

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