A

PROJECT REPORT
ON

ELECTRONIC TIMER WITH

AUDIO ALARM

SUBMITTED TO

KURUKSHETRA UNIVERSITY
KURUKSHETRA

In the partial fulfillment of requirement of degree of

BACHELOR OF SCIENCE IN ELECTRONICS
(Session2005-06)

Under Guidance of : Submitted by:

MS. NITIKA DALAL PRIYANK KUMAR
(Lecturer of Electronic Deptt.) B.Sc-II Electronics
G.N.Kh. College Univ. Roll No. 360477
Roll No. 1407

Department of Electronics
GURU NANAK KHALSA COLLEGE
YAMUNA NAGAR -135001
 CONTENTS

 CERTIFICATE

 ACKNOWLEDGEMENT

 INTRODUCTION
 PREFERENCE OF CIRCUIT CHOSEN AND CHOICE OF
COMPONENETS

 PIN CONFIGURATION

 PCB PRITNED CIRCUIT BOARD FABRICATION

 SOLDERING

 CIRCUIT DESCRIPTION

 WORKING

 PRECAUTIONS

 REFERENCES

 P.C.B LAYOUT

 WORKING

 REFERENCES
 ACKNOWLEDGEMENT

First of all I am thankful to our H.O.D. Mr. Narender Kumar and Mr. Bal
Krishan (Co-ordinator) for their valuable guidance and having extended all
facilities in making this project a grand success.

I am hereby indebted to my project guide Ms. Nitika Dalal (lecturer

in Electronics) who guided us throughout the execution of this project.

I also record deep indebtedness to Mr. Satwant Anand and Mr.

Kamal for their special attention and guidance.

At last but not the least, I acknowledge my sincere thanks to all the
staff members of the Electronics Deptt. Who helped a lot in the execution of
the project.

AMIT KUMAR
B.Sc.-IInd (Elect)
G.N.Kh. College, YNR
 CERTIFICATE

This is to certified that the project entitled “AUDIO AMPLIFIER “ has

been completed by SHEKHAR student of B.Sc-II (Electronics) under my
guidance and supervision.

This work for the project is the candidate’s own efforts, this project would
be beneficial for the incoming students for practical knowledge. It is his
work under my guidance.

Ms. Nitika Dalal Mr. Narender Kumar

Lecturer. H.O.D. Electronics Deptt.
Deptt. Of Electronics Guru Nanak Khalsa College
Guru Nanak Khalsa College Yamuna Nagar
Yamuna Nagar

Prof. Bal Krishan

Co –ordinator
Deptt. Of electronics
Guru Nanak Khalsa College
Yamuna Nagar
 INTRODUCTION
Amplifier is a device by which we increase the applied signal.

It may be current voltage as power amplifier with no distortion. So as

make it more useful. A practical amplifier always consist of a no. of

inputs that amplifier a weak signal until sufficient power is available

to separate a loud speaker as other output devices.

The first few stage in this amplifier have the function of voltage

amplifications. However, the last stage is designed to provided

maximum power. The stage signal is known as power signal.

Therefore signal amplifier amplify electric signal that have frequency

range corrosive to the range of human bearing is 20Hz to 20KHz.

The figure next show the block diagram of a audio amplifier.

The easily stage build up the voltage level of thee input signal which

the build up power to a sufficient level of operation to operate loud

speaker.
PREFERENCE OF CKT. CHOSEN AND CHOICE OF
COMPONENTS

COMPONENTS:

The Hi-Fi audio amplifier can be fabricated using individual

components like diodes transistors, but the use of IC’s normally increase the

reliability of the circuit and reduce its cost drastically.

A number of IC’s like CA-30204, BEL-700 & LA 4440 etc can be

sued to design audio amplifier. But out of these IC’s chose only the LA

444C, because of it’s low cost and easily availability.

CHOICE OF RESISTOR’S

As carbon composition resistance are very cheap and available to

wide range, these are very cheap and available in wider range. Therefore

carbon composition resistance are used its fabricate almost all electronic

gadgets.

CHOICE OF CAPACITOR

Capacitor are chosen according to there values whereas the low value

capcitor’s up to C.1F of required . We have used paper capacitor’s and on

other where places where high value capacitor are required for example

100F, 1000F, 22001F, 220F, 4.7F, we use electrolytic capacitor’s of

good quality. We should take lots of care in choosing electrolytic capacitor’s

if these are any leakage in capacitor’s then circuit will not work satisfactory.

PIN CONFIGURATION OF THE I.C. LA 4440

Pin arrangement is given below:

Pin No. Connection Voltage

1 Negative feedback (NF1) 1.0V
2 I/P for channel 0.0v
3 Preamplifier ground 0.0v
4 Audio muting input (+ve) -
5 Coupling capacitor 12.0v
6 Input for channel 2 0.0v
7 Negative feedback (Nf2) 1.3v
8 Power amplifier GND2 0.0v
9 Boots trop operation par channel2 11.21v
10 Audio output channel 2 6.8v
11 Power supply (+ve) 12.0v
12 Audio output channel 6.8v
13 Boots trop operation for channel1 11.21v
14 Power amplifier GND2 0.0v
 PCB PRINTED CIRCUIT BOARD FABRICATION:

Before PCB’s invention, components were connected by wires and therefore the

whole circuit become very complicated. After invention of PCB it is very easy to make

any circuit.

S No. Apparatus Required Steps

1 Copper plate Cleaning of plates
2 Graph paper P.C.B. layout on graph paper
3 Drill Drilling
4 Paint Paining
5 Brush Etching
6 Sand paper Removal of point and washing

1. CLEANING OF PLATE

To start with the cleaning, first of all copper plate is washed with

alcohol or any other organic solution so as to remove grease, or dust

or oxide from plate surface.

2. P.C.B layout on graph paper:

After cleaning the plate place all the components on graph paper in

pattern as shown fig. By taking care of distance make as P.C.B. layout of

given circuit on a graph paper and makes dots on every point where ever

connection is to be mode. In process of making a P.C.B. layout take care that

component should be fixed on the obonite side up and not on copper dad

side up.
3. DRILLING

After making a P.C.B. layout pri a graph paper on a copper side up

and mark point with a marker with the help small hammer. After making

paints take a drill of the diameter of 0.8 mm and made holes on marked

points. During drilling, core that not much pressure is put on the driller or it

will be take care the holes are insymmetry corners PCB should be drilled so

that to fix the PCB care must be take that no copper line passes near these

holes.

4. PAINTING

One who has a good hard at drawing make a better join holes with

lines according to a pattern (If necessary the pattern may be copied on the

copper side of the PCB with a care paper / using the brush and paint avoid

too narrow or 100 with lines. Then plate should be left to drill up. In case

there is shorting of liens or lack of uniformity then cutting can be a with a

blade after the paint had dried up. Enamel paint or PCB paint should be

used.

5. ETCHING

Standard Fecl3 solution as etching can be used. The reaction of Fecl3

with copper as shown by equation below
Fecl3 +Cu Fecl+ CuCl3
 The solution react with copper of that portion which is not painted. No
copper of that portion is etched away. To increase the etching rate more Fecl 3
can be put in the solution. The plate should be in the solution not more or for
time. It should be checked every day.
6. REMOVAL OF PAINT AND WASHING

The etched plate is carefully taken out of the solution and

washed by fresh water. The paint is now removed using sand paper or
thinner. Then take a pin and open all the holes because paint may
entered into the holes.
7 SOLDERING
Soldering is the process of joining two metals with and of third
metal. The metals to joined are not brought into molten state but third
metal is melted which makes molecular bond between or with two
joining metals. Soldering may used for (I) Scaling (ii) Electrical
Conductivity. Mainly in electronics we use second process. The third
metal where is melted to join two metal is known is solder. It is
normally a composition of Sn or Pb with proper ratio of 67.33 metals
at minimum temp.
Solder used for making electrical conduction joints are of two
types.
1. Solid Solder wire
2. Flux filled solder wire
A good solder wire of commercially available Sn or Pb ration 70 :30
(Sn Pb).
A good solder wire have quality of being melted at lower temp. and
solidifies as soon as heating source is removed. The purpose of flux is
to remove air bubbles present in molten solution and joining metal.
The flux should melt at very low temp or flux left should be
removable.
While soldering the PCB we must take the solder spreads side
of terminal equally and give a silver shinning appearance whenever
two wires are to be joined make a loop at the end of wire and fill the
solder in the small loop mode. Such solder filled loop should be
joined for an electrical joint before soldering care must take be that
points to be joined must be cleaned either with of sand paper or with a
proper etchant. While soldering care must taken that these must not
any dry soldering because it cause disturbance in the working of the
circuit.
While soldering obey the risks given below:
1. For soldering transistor leads a 25 watt soldering iron with a
pencil tip is required.
2. For soldering ICs pin a very low 10 watts soldering wire should
be used.
3. For soldering ICs, IC base socket should be used.
4. To remove air gaps we must use flux . But flux should not be
too much.
5. Soldering time should be as minimum as possible.
6. Soldering wire should be of good quality.
7. Silver shining must appear after soldering.
 Circuit Description:

In this ckt we have used a IC LA 4440 . It has 14 pins. Input is applied

at pin no. 2 and 6 through two capacitor if each a variable resistance of 10 kr

is connected at pin no. 6 Pin no. 1 connected is a 56r resistance and a 100f

capacitor pin no. 3.8 c 14 are grounded electrolytic capacitor of 220f are

connected to pin no. 7 are connected to 56 r resistance 120 f capacitor pin

no. 10 a connected to 1000f capacitor and 1r resistance which gives us a

output. We apply 12 V DC through pin no. 11. Pin no. 12 also give us and it

is connected through a capacitor of 100f and a is resistance pin no 9 and 13

are used for boosts trop operation through a cape of 100f and 1 f and a

2200f capacitor is also used to reduce . Two silicones diode of 5402 are

used at he supply fo 12 y to rectify the input.

 WORKING

The working of the audio amplifier using IC LA 444C is discussed

below:

The audio input which is to be amplified is feel to terminal no. 6 of IC

through a volume control of 10K variable resistance. The capacitor allows

the audio I/P to pin no. 6 . The treble circuit which consist of variable

resistance of 10K decides. The amount of high frequency component of I/P

by passed to ground and work more or less like a tone controller. The loss

control circuit decides. The amount of low frequency component of I/P. The

variable resistance of 10K and a capacitor of 1000f lose connected to boost

up the bass control. Thus according to our desire . We can control bass of

amplifier.

The IC is operated through a regulated DC power supply of +12v as

operating voltage are fed to terminal no. 2 and 6. The voltage at pin no. 6 is

fed through a resistance of 56 ohm. The DC power supply voltage very up to

12 Volt. This requires 1amp ralin power transformers

A DC coupling capacitor is necessary to connect at pin no. 5 to by

pass high frequency component to ground. Thus it is known as by pass

capacitor. The electrolyte capacitor (220f) between terminal 5 of IC R

round acts as a ripple filter. Pin no. 3.8 and 14 of the IC are grounded

because it is necessary to ground then at a common terminal of chassis on

ground line. If it is not done. Possibility of noise increase at a with audio and

can cause hum no. at p.

A 1 ohm resistance and C.1 f capacitor terminal 12 and ground

provides high frequency roll of along with the feed back to terminal 7 of IC

through 100f ceramic capacitor. The 220f electrolytic capacitor from o/p

terminal 1 to 9 of along with he 10 ohm resistor from supply terminal

provide boot strapping for supply.

The stereo amplifier produces the amplified o/p which is available a t

pin no. 12 and which is fed to 42 speaker through a capacitor of 1000f . For

the over all stability of the o/p st feed back is provided from pin no. It to pin

no. 7 through a capacitor of 100f.

 PRECAUTIONS:

While assembling this amplifier of audio range the following precautions

must be taken in knowledge as:

1. Use IC socket and fix IC in it so that if any damage to IC occurs a

new IC can be easily change.

2. Ist of all check the first pin of IC and then put it is IC socket in

particular direction. If it is fixed reverse it may cause damage to the

IC.

3. Check the polarity of the capacitor is capacitor’s are electrolyte then

put those capacitor’s in a direction according to the circuit.

4. After soldering the components on P.C.B. Check the connections once

again carefully.

5. As the o/p signal of amplifier is large, thus it consume a lot of power

to operate it. Thus using dry cells in these amplifier is not suitable, sue

only battery eliminators.

6. The transformer used in battery eliminated should be less than one

amp. Rating.

7. The pins of IC which are grounded should be grounded at same

paints. Thus it reduce fun noise.

8. Make the circuit diagram on P.C.B correctly other wise I damage due

to wrong connections.

9. Heat sink must be used in power amplifier circuits. If the any working

if I.C. then it well be not get heated up immediate because of heat sink

provided on IC.

10. Soldering should be done carefully and really and safety and clearly.

Otherwise dry soldering may be sent in the circuit.

 REFERENCES

 Integrating Electronic by Milman Halkis

 Electronic for you

 Project manual