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W.1 Y.COM W . WW 00Y.CO .

TW
W WW 00Y.CO .TW W
.100 M.T W.1 Y.COM DATA SHEET .1 M
WW 00Y.CO .TW W W W WW 00Y.CO .TW
W 00 .T W.1 Y.COM W
W .1
.C O M W W.1 Y.COM W W
WW .100Y MOS W FIELD 00 .T
W.1 YEFFECT TRANSISTOR
W W .100 M.T
W O M.T W W .C O W .C OM
W
W Y .C W W 00 Y .T W W 0 0 .T
W .100 M.T W.1 Y.COM W W.1 Y.COM W
W
WW .100Y
W
WW .100Y.C M.TW
.C O
O M .TW W
W
W
W W . 100
00Y
.C O M .T
.TW
W
W
W
W W .100
100
Y .
2SK2488
C OM
.T
.TW
W . 1 O M W . O M
W
WW .100Y.C M.TW
O
WW .100Y.C SWITCHING .TW WW .100Y.C M.TW
W O M W O
W
WW .100Y.C M.TW
O
WWN-CHANNEL 00 Y.C .T
POWERW WW FET
MOS . 1 0 0Y.C M.TW
W. 1 OM W CO
W
WW .100Y.C M.TW
O
WW .100INDUSTRIAL Y.C .T W USEWW .100Y. M.T
W
O W O M W . C O
W
WW .100Y.C M.TW WW .100Y.C M.TW WW .100Y M .TW
W O W O
W
WW .100Y.C M.TW
O
WW .100Y.C M.TW WW .100Y.C M.TW
W W DESCRIPTION.C O
W WW 00Y.CO .TW W WW 00Y.CO .TW
W 00 Y .T W .1 Transistor .1 M
W.1The 2SK2488 C OMis N-Channel MOS Field W WEffect
.C OMdesigned WW 00DIMENSIONS
PACKAGE
Y .CO .TW
W . W 00 Y W W
W for.1high 00YvoltageMswitching .T W
applications.
W.1 Y.COM W
.T (in.1millimeter) M
W O
W .C O W W W 0 Y.C W
W W
. 1 00 Y
M .T W W
W . 10 0
O M .T
W .1 0
O M.T
W O WW .100Y. C
WW .100Y.C M.TW
FEATURES WW .100Y.C M.TW M
W
.TMAX.
4.7
W O 15.7 MAX. W 3.2±0.2 O
• Low
W On-Resistance O
WA)W .100Y.C M.TW WW .100Y.C 1.5 W

1.0
WWRDS (on) 0 0 Y.C .T W M.T
. 1 = 1.2 Ω (V M
GS = 10 V, I D = 5.0 W O W C O
W .CO .TW WW .100Y.C M.TW WW .100Y.
4
.TW

7.0
•W

20.0±0.2
W Low C1 iss00YCiss = 2 900 pF TYP. M
. M O W O

4.5±0.2
W
O WW .100Y.C M.TW

6.0
WWAvalanche
•WHigh
0 0 Y.C Capability .T WRatings WW .100Y.C M.TW
W. 1 OM W O
.C WW 00Y.CO .TW 1 2 3WW 0Y.C W
W W
. 1 0 Y
0MAXIMUM M
W
.TRATINGS (TA = 25W˚C) W . 1 O M W .1 0
O M.T
WW .100Y.C M.TW
ABSOLUTE W O
0Y.CV M.TW

19 MIN.
Y.C W

3.0±0.2
WtoWSource 0 0 .T W W . 1 0
Drain
W. 1 Voltage
.C OM V DSS 900
WW±30 00Y.C O
W W WW 00Y.CO .TW
to W Y W W .T
Gate W
100
Source Voltage
W.(DC) OM
.T V GSS
W .1 V
.C OM 2.2±0.2 W.1 2.8±0.1
W0.6±0.1 Y
M
.CO .TW
Drain Current W Y . C W I D W
(DC) W ±10 00 Y A .T W W
1.0±0.2
0 0
W
Drain Current W .100
(pulse)* OM
.T
ID (pulse) W±20 W.1 AY.COM 5.45W 5.45 W W.1 Y.COM W
.C
W W
.1 00Y (Tc = M TW
.˚C) W
W . 100W O M .T W 1. Gate
W .100 O M.T
Total Power Dissipation W .CO .TW
25 P 150 2. Drain
W .C
0Y.C M.TW
T1

Total Power WW Dissipation 00Y(TA = 25M˚C) PT2 WW 3.0 .10W


3. Source 100Y
W . M .TW
.1 W O
W O WW ˚C00Y.CO .TW 4.
WW .100Y.C M.TW
Fin (Drain)
WW .100Y.C M.TW Tch
Channel Temperature W150 .1 M
Storage Temperature W W . C O
W Tstg –55 W to W
W
+150 ˚C 0Y.C
O
W MP-88
W WW 00Y.CO .TW
W 00 Y .T .10 .T .1 M
Single Avalanche Current** W.1 Y.COM WIAS 10 WWA . C OM WW 00Y.CO .TW
W W 00 Y .T W Drain W
W
Single Avalanche Energy**
W .100 O M.T EAS 294 W.1 Y.COM W
mJ W W.1 Y.COM
W .C W W W 00 .T
* PW ≤ 10 µs, W Duty Cycle
W
Y
.10≤01 % OM.T
W
W .100 O M.T W W.1 Y.COM
.CVGS = 20 WW .100Y .C W Body W
** Starting Tch =W 25W ˚C, RG = 25
.100
YΩ,
M.T
WV→0
W O M.T Diode W .100 OM.T
W O .C W Y .C
WW .100Y.C M.TW WW .100YGate M .TW W .100 M
W W .C O W W Y .C O
W W W W
0 Y .CO
W 00 Y .T W W 0 0 .T .1 0
W.1 Y.COM W W W.1 Y.COM W WW
W W
W
W .100 O M.T
W
W .100 OM
.T
Source
C W .C W
WW .100Y. M.T
W W .100
Y
M.T
W O W C O
WW .100Y.C M.TW WW .100Y.
W O W
WW .100Y.C M.TW WW
W O
WW .100Y.C M.TW
W O
WW .100Y.C
W
WW

Document No. D10284EJ1V0DS00 (1st edition)


Date Published August 1995 P
Printed in Japan
© 1995
W.1 Y.COM W . WW 00Y.CO .TW
W WW 00Y.CO .TW W
.100 M.T W.1 Y.COM W .1 M
WW 00Y.CO .TW W W WW 00Y.CO .TW 2SK2488
W . 1 0 0 M .T . 1 M
W. 1 OM W O W O
WW .100Y.C M.TW WW .100Y.C M.TW WW .100Y.C M.TW
W O W O
W
WW .100Y .CO .TWCHARACTERISTICS
ELECTRICAL WW .100(T YA.C= 25 ˚C) .T W WW .100Y.C M.TW
OM M WW 00Y.CO .TW
W W Y .C W W W W
0 Y .CO .TW W
W 00 .T
CHARACTERISTIC 0
W.1 Y.COM W
SYMBOL MIN. TYP. MAX. UNIT .1 TESTM CONDITIONS
W W.1 Y.COM W W W WW 00Y.CO .TW
W 0 to Source
0Drain .T On-ResistanceW R 0
1 0 DS (on) .T 1.0 1.2 Ω .1 V = 10 V, M GS I = 5.0 A
D

OM Cutoff Voltage WWV.


W.1 GateY.toCSource .C OM W W Y .CO W
W .TW Y W W 0
.1V0 = 10 V,OI M = .1TmA
W . 1 00 M
W
W . 100 2.5
GS (off)

O M .T 3.5 V
W
DS

C
D

W O
.CTransfer WW | y .|100Y.C3.5 M.TW WW Y. W
WW .Forward1 00Y M .TW
Admittance fs S
W . 1 0 20 V, IO=M5.0.TA
V 0= DS D

WDrain Leakage O Current W O µAW V = VY.C


WW .100Y.C M.TW WWI .100Y.C M.TW 100
DSS
W .100
DS , V = 0 TW
DSS
.GS

W O W CO ±100 W
nA W V = ±30YV, .C OM
Gate to Source
WW .100Y. C Leakage Current
.TW W W
I GSS

1 00Y
.
M .TW W .100
GS V =0
M .TW
DS

W Capacitance O M C W . O W
pF WV = 10 V .C O
WW .100Y.C M.TW
Input 2 900
Y.C 00Y .TW
iss DS

WWOutput 0 .T W W . 1 M
1 0 M W O
W. Capacitance .CO .TW
C
WW 00Y.CO400 .TW
oss pF
WW .100Y.C M.TW
V =0 GS

WW 0 0 Y W . 1 M
Reverse.1Transfer Capacitance
WW Delay .CO .TW
M C
WW 00Y.CO .TW
rss 70 pF
W W MHz 00Y.CO .TW
f = 1W
Y W
WTurn-On
W
0
.10 TimeOM t d (on)
W.1 Y.C 35 M
O ns I = 5.0
D
W WA.1 Y.COM W
. C W W W 0
W W
Rise Time 00Y
. 1 M .TW t W r
W . 100 30 OM.T ns V = 10 V.10
GS
W O M.T
W O .C W Y. C
WW Delay
Turn-Off Y.C
00Time .TW t WW .100Y160
d (off)
M .TW ns VW= 150 V .100
DD
M .TW
. 1 M W O W .C O
Fall WW 00Y.CO .TW t
WTime f WW .10032 Y.C .TW ns R W = 10
G
WΩ
.1 00Y M.T
W
. 1 M W O M W C O
W
WW Charge
Total Gate .CO .TW Q WW .1090 0Y.C M.TWnC I = 10 WAW .100Y. .TW
00Y
G D

. 1 M W O W O M
W Charge O WW .C
WW .100Y.C M.TW
Gate to Source Q GS
WW .11600Y.C M.TW nC V = 450DD V
. 1 00Y M.T
W
Gate to Drain W O W O V = 10 V W
W .C O
WW .100Y.C M.TW WW .100Y.C M.TW Y .TW
Charge Q 40 nC
W 100
GD GS

W1.0 O W . O M
WW 00Y.CO .TW
I = 10 A, V W .C
WW .100Y.C M.TW
Body Diode Forward Voltage V V =0
00Y .TW
F (S-D) F GS

W W .1 M
. 1 M t O ns W O
Reverse Recovery Time
WW 00Y.CO .TW
rr

W WW 990
0 0 Y.C .T W
I = 10 A, V =W
F
W
GS0
1 0 0Y.C M.TW
W .1 Mµ di/dt = 50 A/µs . O
Reverse Recovery Charge
W.1 OM Q rr 7.0
W O C W
WW .100Y.C M.TW
WW .100Y.C M.TW WW .100Y.C M.TW
W W .C O
W WW 00Y.CO .TW W WW 00Y.CO .TW
Y W
Test Circuit 1 W
W
00
Avalanche.1Capability O M.T Test Circuit 2WSwitching W .1 Time
.C OM W W.1 Y.COM W
WW .100Y. C W
M.T
W W
W .100
Y
O M.T
W
W .100 OM
.T
W O Y. C W Y .C W
W
WD.U.T. .C
00Y L M.TW WW D.U.T. .100 M .TW W .100 M.T
. 1 W O W .C O
R = 25 Ω WW
G
.CO .TW WW .100Y.CR VM.TW L
V GS
WW90 % .100Y .TW
W .1 00Y M W O GS V
W O M
WW .100Y.C M.TW
GS (on)

W CO WPG. R =W10WΩ .100Y.C


R G Wave Form 10 %
VY. TW
0
PG 50 ΩWW 0 .T V .
1 0 DD G DD
M W O
V = 20 - 0 V
GS
W W. . C OM WW 00Y.CO I.TW 90 % WW D
0 Y.C .T
Y W W 0
W
W .100 O MV.T W .1
.C O M 90 %
W W.1 Y.COM
WBVW .100Y.C M WW .100Y I M.0T10W
I
TW
GS W10 % .100
D

M.T
0 .
DSS %
W O W D
O W W .C O
WW V .100Y.C M.TWt WW .100Y.C M.tTW t t Y
Wave Form
W .100
I AS
M
W .CO
I DS t
D
W C O W W .C O d (on) r

W
d (off)

Y
f

V DD
W Y . W W 0 0 Y .Tt W W .1 0 0
W 00 .T W.1 Y.COM W
t
W.1 Y.COt =M1 us W WW
on off

W W W
WStarting T .100
W ch M.T
Duty Cycle
O
≤1% W
W .100 OM
.T
C W . C W
WW .100Y. M.T
W W .100
Y
M.T
W O W C O
Test Circuit 3 Gate Charge
WW .100Y.C M.TW WW .100Y.
W O W
WW .100Y.C M.TW WW
D.U.T.
I = 2 mA G WR
WW 00Y.CO .TW
W.1 Y.COM
L

W W 00
PG. 50 Ω V DD
W W.1
W

The application circuits and their parameters are for references only and are not intended for use in actual design-in's.

2
W.1 Y.COM W . WW 00Y.CO .TW
W WW 00Y.CO .TW W
.100 M.T W.1 Y.COM W .1 M
WW 00Y.CO .TW W W WW 00Y.CO .TW 2SK2488
W . 1 0 0 M .T . 1 M
W. 1 OM W O W O
WW .100Y.C M.TW WW .100Y.C M.TW WW .100Y.C M.TW
W O
W O
WW .100Y(T
W .CAO= 25 .˚C) WW .100Y.C M.TW
WW .100Y.C TYPICAL .T W CHARACTERISTICS M T W
W W .C OM
W WW 00Y.CO .TW W WW 00Y.CO .TW
W 00 Y .T W .1
W.1 Y.COM DERATING FACTOR OF .1
WFORWARD C OM
BIAS
WW TOTAL OM DISSIPATION vs.
CPOWER
.TEMPERATURE
W W 00 .T W
SAFE OPERATING W W
AREA
1 0 0 Y .
M .T W W . 1 0 0
CASE Y
M .TW
W. 1 O M W . O W W .C O
WW .100Y.C M.TW
210 W
WW .100Y.C M.TW W 1 00Y M.T
dT - Percentage of Rated Power - %

W O W . O
W O WW .100Y. C

PT - Total Power Dissipation - W


WW .100Y.C M.TW
100
WW .100Y.C M.TW 180
M .TW
W O W O
W
WW .100Y.C80 M.TW
O
WW .100Y.C M.TW 150 WW .100Y.C M.TW
W W . C O
W WW 00Y.CO .TW W WW 00Y.CO .TW
W 00 Y .T W 120
.1 M
W.1 Y60.COM W W W.1 Y.COM W WW 00Y.CO .TW
W W 00 .T W
W .100 40 OM.T W.1 Y.COM W
90
W .C W W.1 Y.COM W W
WW .100Y W W .100 M.T
W 00 .T
W O M.T W .C O 60
W W.1 Y.COM W
WW .10200Y.C M.TW WW .100Y M.T
W W .100 M.T
W O W O 30
W W .C O
WW .100Y.C M.TW WW .100Y.C M.TW W .100
Y
M.T
W
20 O40 60 80 100 120 W W O W C O
. 120 .140
W 0 .C 40W 60 800Y TW160
WW .100Y.C M.TW W 140 160 00Y .TW 0 20 W 100
.1 M W . 10 O M
W O W O T -W .C- ˚C .TW
WW .100Y.C M.TW
T - Case Temperature - ˚C
WW .100Y.C M.TW W Case Temperature00Y
C C

.1 OM
W .C O WW 00Y.CO .TW W WW vs. 0 Y.C W
W W
. 1 0 Y
0FORWARD M
BIAS
W
.TSAFE OPERATING AREAW.1 W
O M
DRAIN CURRENT
DRAIN TO SOURCE W .1 VOLTAGEOM.T
0
W
WW100 .100Y.C M.TW
O
WW .100Y.C M.TW WW .100Y.C M.TW
WW 00Y.CPulsed O
W W Y .C O
W
PW
W WW 00Y.CO .TW W 1 .TW
W . 1 00 M .TI = 10
0 WW
. 1 O M W .
.C OM
W O .C W
WW .100Y.eCd M.TW .TWV = 20 V W W.100Y OM.TW
D(pulse)
µs
W 1 00Y GS
ID - Drain Current - A

. ID - Drain Current - A
M
WW 00Y.CO .TW 108 VV WW
20
10 W it
WW .10Li0mYI.C M.TW 1 1 ms W
O
. 1 0 0Y.C M.TW
n)
D(DC)
W .1 O M 6V W O
W OP
WW .100Y.C M.TW WW .100Y.C M.TW
(o
0
WW R .100Y.C owM
DS
er .T 00
W 1 m
s
W W .C O Dis ms
W WW 00Y.C10O .TW W WW 00Y.CO .TW
Y W
.100 W.1 Y.COM W
s
1W M.Tpatioi .1 O M
W C O W W .C W W
WW .100Y. M.T imite
W
n
L W .100
Y
M.T
W
W .100 OM
.T
W O W C O W .C W
T W = 25W˚C 00Y
.C C
.TW d WW .100Y. M .TW W .100
Y
M.T
Single PulseW.1 O M W O W .C O
1
WW 10.100Y.C 100M.TW 1000 W
W 00Y
.C .TW WW 30 W.1 40
00Y M .TW
1
W . 1 0
O M 10 20 O
WVW
W
0
- Drain to0Source
O
Y.CVoltage .-TVW DS WW .100Y.C V M- .Drain TWto Source Voltage
DS
WW- V .100Y.C M.TW
W W. 1
.C OM
W WW 00Y.CO .TW W WW 00Y.CO .T
W 00 Y .T W .1 M
W.1 CHARACTERISTICS. C OM W W.1 Y.COM W WW 00Y.CO .T
FORWARD TRANSFERW Y W W 00 .T W
100
W
W .100 O M.T W.1 Y.COM W W W.1 Y.COM
.C W
T = –25 ˚C W W W .100
Pulsed
25W 00Y VM=.T
W 100 .T
A
. M M
˚C
75 ˚C WW
. 1
.C O 10 V DS
W W Y .C O
W W W W
0 Y.CO
W 00 Y .T W W 0 0 .T .1 0
125 ˚C
W.1 Y.COM W W.1 Y.COM W WW
ID - Drain Current - A

10 W
W W
W
W .100 O M.T
W
W .100 OM
.T
C W .C W
WW .100Y. M .TW W .100
Y
M.T
W O W C O
1.0
WW .100Y.C M.TW WW .100Y.
W O W
WW .100Y.C M.TW WW
W O
0.1
WW .100Y.C M.TW
W O
WW .100Y.C
0 10 W
WW
5 15
VGS - Gate to Source Voltage - V

3
W.1 Y.COM W . WW 00Y.CO .TW
W WW 00Y.CO .TW W
.100 M.T W.1 Y.COM W .1 M
WW 00Y.CO .TW W W WW 00Y.CO .TW 2SK2488
W . 1 0 0 M .T . 1 M
W. 1 OM W O W O
WW .100Y.C M.TW WW .100Y.C M.TW WW .100Y.C M.TW
W O W O
W
WW .100Y.C M.TW
O
WW .TRANSIENT 00 Y.C THERMAL .T WRESISTANCEW vs.WPULSE WIDTH
. 1 0 0Y.C M.TW
1 M
W W .C O
W
1 000 WW 00Y.CO .TW W WW 00Y.CO .TW
W 00 Y .T W .1 M
W.1 Y.COM W W W.1 Y.COM W WW 00Y.CO .TW

rth(t) - Transient Thermal Resistance - ˚C/W


W W 0 0 .T W .1
W 00 .T 100 W.1 Y.COM W OM
W.1 Y.COM W W W WW R = 41.7
0 Y .C(˚C/W) W th(ch-a)

W W
. 1 00 M .T W
W . 100 O M .T W .10 O M.T
W O WW .100Y. C
WW .100Y.C M.TW10 WW .100Y.C M.TW M .TW
W O W O
W
WW .100Y.C M.TW
O
WW .100Y.C M.TW WW .100Y.C M.TW
RWW O
W W Y .C O 1
W W WW 00Y.CO .TW W 1 0 0 Y.C
= 0.83 (˚C/W)
.TW
th(ch-c)

W . 1 00 M .T W . 1 O M W . O M
W
WW .100Y.C M0.1.TW
O
WW .100Y.C M.TW WW .100Y.C M.TW
W W .C O
W WW 00Y.CO .TW W WW 00Y.CO .TW
W 00 Y .T W .1 M
W.1 Y.COM W W W.1 Y.COM W WW 00Y.CO .TW
W W 00 .T W .1
W
W .100 0.01 .T
O M W W.1 Y.COM W W WPulse Y .C OM
W
.C W Single 0
WW .100Y M .TW W
W . 100 O M .T T = 25W ˚C.1
0
O M.T
W O Y.C WW .100Y. C c

WW .100Y.C 10 µM.T100
0.001
Wµ WW10 m.100100 M 1.
TW 10 M .TW
1m m 100 W1 000 O
W O W
WW PW.-1Pulse .CO .TW WW .100Y.C M.TW
WW .100Y.C M.TW 00YWidth - M
WW 00Y.CO .TW
s
W W Y .C O
W W WW 00Y.CO .TW W
W 00 .T 1 M .1 OM
W.1 TRANSFER
FORWARD .C OM ADMITTANCE vs. WW. Y.C ODRAIN TOW SOURCE ON-STATE W W WRESISTANCE
0 Y .Cvs. W
W
W DRAIN.CURRENT00Y .TW W .100 M T SOURCE VOLTAGE
.TO .10 M.T
RDS(on) - Drain to Source On-State Resistance - Ω
1 GATE O
O M W O W .C
100 WW .C .TW VPulsed
W 00Y
.C .TW WW .10Pulsed 0Y .TW
W 00Y = 20 V W M
| yfs | - Forward Transfer Admittance - S

. 1 M W . 1 O M DS
W O
W
WW .100Y.C M.TW
O
WW .100Y.C M.TIW = 10 A WW .100Y.C M.TW D

W W .C O
W WW 00Y.CO .TW52 AA W WW 00Y.CO .TW
WT = –25 ˚C 00 Y .T W .1 M
W˚C.1 Y.COM W W.1 1.0Y.COM W WW 00Y.CO .TW
A
10 25
W W W 00 .T W
W.1 Y.COM W
75 ˚C 00
W 125 .T
˚C .1
W .C OM W W.1 Y.COM W W
W W
.1 00Y M .TW W
W . 100 O M .T W
W .100 O M.T
W O .C WW .100Y. C
1 WW .100Y.C M.TW WW .0.5 1 00Y M .TW M .TW
W O W O
W
WW .100Y.C M.TW
O
WW .100Y.C M.TW WW .100Y.C M.TW
W W . C O
W WW 00Y.CO .TW W WW 00Y.CO .TW
Y W
0.1
W
W .100 O M.T W.1 Y.COM W W W.1 Y.COM W
.C W W 30 .100
0.1 W1.0 W
. 1 0010 Y
M
W
.T100 W 0 .100
W
10 .T
O M 20
W O M.T
W O W .C
WW Current
ID - Drain - A .C
00Y .TW WW .100VY.-CGate toMSource .TW Voltage - V W W.100Y OM.T GS

.1 M W O
W
WW ON-STATE .CO .TW WW GATE .C
0YSOURCE .TW VOLTAGE vs. WW .100Y.C M.T
DRAIN TO SOURCE 00Y . 1 0TO MCUTOFF
.1
W CURRENT O M W
WCHANNEL .CO .TW WW 00Y.CO
RDS(on) - Drain to Source On-State Resistance - Ω

RESISTANCE vs. DRAIN C TEMPERATURE


W Y . W W 0 0 Y W 1
W 00 .T W.1 Y.COM W V = 10 V WW. 0Y.COM
W.1 VYPulsed OM
VGS(off) - Gate to Source Cutoff Voltage - V

W .C W W W
DS

W .100
= 10 V
M.T
W4
W .10 0
O M.T GS I = 1 mA
W .10 D

W O C W
WW .100Y.C M.TW WW .100Y. M .TW W
W O 3 WW
W .C O
1.0 WW .100Y.C M.TW . 1 00Y M.T
W
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4
W.1 Y.COM W . WW 00Y.CO .TW
W WW 00Y.CO .TW W
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5
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6
W.1 Y.COM W . WW 00Y.CO .TW
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WW .100Y.C REFERENCE .T W WW .100Y.C M.TW WW .100Y.C M.TW
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NEC semiconductor device control TEI-1202
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7
W.1 Y.COM W . WW 00Y.CO .TW
W WW 00Y.CO .TW W
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WW 00Y.CO .TW W W WW 00Y.CO .TW 2SK2488
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WW .100Y.C M.TW WW .100Y.C M.TW WW .100Y.C M.TW
W O W O
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WW .100Y .CO .TW
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