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SLOS193B − FEBRUARY 1997 − REVISED MAY 2004
D 2× Bandwidth (2 MHz) of the TL06x and D High Output Drive, Specified into 100-Ω
TL03x Operational Amplifiers Loads
D Low Supply Current . . . 290 µA/Ch Typ D Lower Noise Floor Than Earlier
D On-chip Offset Voltage Trimming for Generations of Low-Power BiFETs
Improved DC Performance
description
The TLE206x series of low-power JFET-input operational amplifiers doubles the bandwidth of the earlier
generation TL06x and TL03x BiFET families without significantly increasing power consumption. Texas
Instruments Excalibur process also delivers a lower noise floor than the TL06x and TL03x. On-chip zener
trimming of offset voltage yields precision grades for dc-coupled applications. The TL206x devices are
pin-compatible with other Texas Instruments BiFETs; they can be used to double the bandwidth of TL06x and
TL03x circuits or to reduce power consumption of TL05x, TL07x, and TL08x circuits by nearly 90%.
BiFET operational amplifiers offer the inherently-higher input impedance of the JFET-input transistors, without
sacrificing the output drive associated with bipolar amplifiers. This makes them better suited for interfacing with
high-impedance sensors or low-level ac signals. They also feature inherently better ac response than bipolar
or CMOS devices having comparable power consumption. The TLE206x family features a high-output-drive
circuit capable of driving 100-Ω loads at supplies as low as ± 5 V. This makes them uniquely suited for driving
transformer loads in modems and other applications requiring good ac characteristics, low power, and high
output drive.
Because BiFET operational amplifiers are designed for use with dual power supplies, care must be taken to
observe common-mode input voltage limits and output swing when operating from a single supply. DC biasing
of the input signal is required and loads should be terminated to a virtual ground node at mid-supply. Texas
Instruments TLE2426 integrated virtual ground generator is useful when operating BiFET amplifiers from single
supplies.
The TLE206x are fully specified at ±15 V and ± 5 V. For operation in low-voltage and/or single-supply systems,
Texas Instruments LinCMOS families of operational amplifiers (TLC- and TLV-prefixes) are recommended.
When moving from BiFET to CMOS amplifiers, particular attention should be paid to slew rate and bandwidth
requirements and output loading. The Texas Instruments TLV2432 and TLV2442 CMOS operational amplifiers
are excellent choices to consider.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
!"#$%&" ' ()##*& %' "! +),-(%&" .%&*/ Copyright 2004, Texas Instruments Incorporated
#".)(&' ("!"#$ &" '+*(!(%&"' +*# &0* &*#$' "! *%' '&#)$*&'
'&%.%#. 1%##%&2/ #".)(&" +#"(*''3 ."*' "& *(*''%#-2 (-).*
&*'&3 "! %-- +%#%$*&*#'/
1OUT
4OUT
1IN −
4IN −
1OUT
VCC +
NC
NC
NC
NC
NC
NC
NC
NC
3 2 1 20 19 3 2 1 20 19
NC NC 1IN + 4 18 4IN +
4 18
1IN − 2OUT NC 5 17 NC
3 2 1 20 19 5 17
NC 4 18 NC VCC + 6 16 VCC −
NC 6 16 NC
IN − 5 17 VCC + NC 7 15 NC
1IN+ 7 15 2IN −
NC 6 16 NC 2IN + 8 14 3IN +
NC 8 14 NC 9 10 11 12 13
IN + 7 15 OUT 9 10 11 12 13
NC 8 14 NC
2IN −
3IN −
2OUT
NC
3OUT
2IN+
NC
NC
NC
VCC −
9 10 11 12 13
VCC −
NC
NC
NC
OFFSET N2
NC 1 10 NC NC 1 10 NC
OFFSET N1 2 9 NC 1OUT 2 9 VCC+
IN− 3 8 VCC+ 1IN− 3 8 2OUT
IN+ 4 7 OUT 1IN+ 4 7 2IN−
VCC− 5 6 OFFSET N2 VCC− 5 6 2IN+
NC − No internal connection
Q9 Q13
Q32
Q1 Q3 Q5 Q7
SLOS193B − FEBRUARY 1997 − REVISED APRIL 2004
Q17
Q11 R6 20 Ω
R9
Template Release Date: 7−11−94
2.7 kΩ D1
Q28
Q10 Q30 Q37 100 Ω
Q20
4
4
C3
Q6 R3 5.3 pF Q24 Q41 OUT
2.4 kΩ Q40
C1
Q38
Q15
Q2 Q8 C2
15 pF Q21
Q12 Q26
Q22 R7
R1 R4 R2 R5 600 Ω
1.1 kΩ 55 kΩ 1.1 kΩ 60 kΩ
NOTES: A. OFFSET N1 AND OFFSET N2 are only availiable on the TLE2061x devices.
B. Component values are nominal.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 V
Supply voltage, VCC − . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −19 V
Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 38 V
Input voltage range, VI (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±VCC
Input current, II (each input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 1 mA
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 80 mA
Total current into VCC+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 mA
Total current out of VCC − . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −80 mA
Duration of short-circuit current at (or below) 25°C (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . unlimited
Package thermal impedance, θJA (see Notes 4 and 5): D package (8-pin) . . . . . . . . . . . . . . . . . . . . 97.1°C/W
D package (14-pin) . . . . . . . . . . . . . . . . . . 86.2°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . 79.7°C/W
P package . . . . . . . . . . . . . . . . . . . . . . . . . . 84.6°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Package thermal impedance, θJC (see Notes 4 and 5): FK package . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.6°C/W
J package . . . . . . . . . . . . . . . . . . . . . . . . . . 15.1°C/W
JG package . . . . . . . . . . . . . . . . . . . . . . . . . 14.5°C/W
U package . . . . . . . . . . . . . . . . . . . . . . . . . . 14.7°C/W
W package . . . . . . . . . . . . . . . . . . . . . . . . . . . 10°C/W
Operating free-air temperature range, TA: C suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
I suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
M suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Case temperature for 60 seconds: FK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D, P, or PW package . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: JG, U, or W package . . . . . . . . . . . . 300°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC − .
2. Differential voltages are at IN+ with respect to IN −.
3. The output may be shorted to either supply. Temperature and /or supply voltages must be limited to ensure that the maximum
dissipation rating is not exceeded.
4. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
5. The package thermal impedance is calculated in accordance with JESD 51-7 (plastic) or MIL-STD-883 Method 1012 (ceramic).
VO = ± 2.8 V, 25°C 15 80
RL = 10 kkΩ Full range 2
VO = 0 to 2 V, 25°C 0.75 45
AVD Large-signal differential voltage amplification RL = 100 Ω V/mV
Full range 0.5
VO = 0 to − 2 V, 25°C 0.5 3
RL = 100 Ω Full range 0.25
ri Input resistance 25°C 1012 Ω
ci Input capacitance 25°C 4 pF
zo Open-loop output impedance IO = 0 25°C 280 Ω
25°C 2 pA
IIO Input offset current
Full range 3 nA
25°C 4 pA
IIB Input bias current
Full range 5 nA
25°C −11 to 13 −12 to 16 V
VICR Common-mode input voltage range
Full range −11 to 13 V
25°C 13.2 13.7
RL = 10 kΩ
Full range 13
VOM + Maximum positive peak output voltage swing V
25°C 12.5 13.2
RL = 600 Ω
Full range 12
25°C −13.2 −13.7
RL = 10 kΩ
Maximum negative peak output voltage Full range −13
VOM − swing V
25°C −12.5 −13
RL = 600 Ω
Full range −12
VO = ± 10 V, 25°C 30 230
RL = 10 kkΩ Full range 20
VO = 0 to 8 V, 25°C 25 100
AVD Large-signal differential voltage amplification RL = 600 Ω V/mV
Full range 10
VO = 0 to − 8 V, 25°C 3 25
RL = 600 Ω Full range 01
ri Input resistance 25°C 1012 Ω
ci Input capacitance 25°C 4 pF
zo Open-loop output impedance IO = 0 25°C 280 Ω
VCC ± = ± 5 V to ± 15 V, 25°C 75 93
kSVR Supply-voltage rejection ratio (∆VCC ± /∆VIO) dB
RS = 50 Ω Full range 65
25°C 280 325
ICC Supply current µA
A
Full range 350
VO = 0, No load
Supply-current change over operating
∆ICC Full range 39 µA
temperature range
† Full range is − 55°C to 125°C.
25°C 2 pA
IIO Input offset current
Full range 20 nA
25°C 4 pA
IIB Input bias current
Full range 40 nA
25°C −11 to 13 −12 to 16 V
VICR Common-mode input voltage range
Full range −11 to 13 V
25°C 13 13.7
RL = 10 kΩ
Maximum positive peak output voltage Full range 12.5
VOM + swing V
25°C 12.5 13.2
RL = 600 Ω
Full range 12
25°C −13 −13.7
RL = 10 kΩ
Maximum negative peak output voltage Full range −12.5
VOM − swing V
25°C −12.5 −13
RL = 600 Ω
Full range −12
VO = ± 10 V, 25°C 30 230
RL = 10 kkΩ Full range 20
VO = 0 to − 8 V, 25°C 3 25
RL = 600 Ω Full range 1
ri Input resistance 25°C 1012 Ω
ci Input capacitance 25°C 4 pF
zo Open-loop output impedance IO = 0 25°C 280 Ω
2 kΩ
VCC + VCC +
− −
VO VO
VI + +
VCC − VCC −
CL RL
(see Note A) RS RS
VCC +
100 Ω
VI −
VO
+
VCC −
CL RL
(see Note A)
typical values
Typical values presented in this data sheet represent the median (50% point) of device parametric performance.
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
VIO Input offset voltage Distribution 4, 5, 6
vs Common-mode input voltage 7
IIB Input bias current
vs Free-air temperature 8
IIO Input offset current vs Free-air temperature 8
VICR Common-mode input voltage vs Free-air temperature 9
vs Output current 10, 11
VOM Maximum peak output voltage
vs Supply voltage 12, 13, 14
vs Frequency 15, 16
VO(PP) Maximum peak-to-peak output voltage
vs Load resistance 17
vs Frequency 18
AVD Large-signal differential voltage amplification
vs Free-air temperature 19
vs Elasped time 20
IOS Short-circuit output current
vs Free-air temperature 21
zo Output impedance vs Frequency 22, 23
CMRR Common-mode rejection ratio vs Frequency 24
vs Supply voltage 25, 26, 27
ICC Supply current
vs Free-air temperature 28, 29, 30
Voltage-follower small-signal pulse response vs Time 31, 32
Voltage-follower large-signal pulse response vs Time 33, 34
Noise voltage (referred to input) 0.1 to 10 Hz 35
Vn Equivalent input noise voltage vs Frequency 36
THD Total harmonic distortion vs Frequency 37, 38
vs Supply voltage 39
B1 Unity-gain bandwidth
vs Free-air temperature 40
vs Supply voltage 41
φm Phase margin vs Load capacitance 42
vs Free-air temperature 43
Phase shift vs Frequency 18
TYPICAL CHARACTERISTICS
TLE2062
TLE2061
DISTRIBUTION OF
DISTRIBUTION OF
INPUT OFFSET VOLTAGE INPUT OFFSET VOLTAGE
15
15 1836 Amplifiers Tested From 1 Wafer Lot
736 Amplifiers Tested From 3 Wafer Lots VCC ± = ± 15 V
VCC ± = ± 15 V TA = 25°C
TA = 25°C P Package
Percentage of Amplifiers − %
Percentage of Amplifiers − %
P Package
10
10
5
5
0 0
−4 −3 −2 −1 0 1 2 3 4 −4 −3 −2 −1 0 1 2 3 4
VIO − Input Offset Voltage − mV VIO − Input Offset Voltage − mV
Figure 4 Figure 5
ÎÎÎÎÎÎÎÎÎÎÎÎ
INPUT OFFSET VOLTAGE COMMON-MODE INPUT VOLTAGE
ÎÎÎÎÎÎÎÎÎÎÎÎ
20 2
2792 Amplifiers Tested From 2 Wafer Lots VID = 0
VCC ± = ± 15 V TA = 25°C
TA = 25°C
Percentage of Amplifiers − %
N Package
IIB − Input Bias Current − nA
15 1.5
10 1
5 0.5
VCC ± = ± 15 V
0 0
−8 −6 −4 −2 0 2 4 6 8 − 20 − 15 − 10 − 5 0 5 10 15 20
Figure 6 Figure 7
TYPICAL CHARACTERISTICS†
105 VCC + + 2
VCC ± = ± 15 V
VIC = 0
103
ÎÎ ÎÎ
VCC +
102
ÎÎ IIB
ÎÎ
IIO VCC − + 4
ÎÎÎ
ÎÎÎ
101 VCC − + 3
VIC −
100 VCC − + 2
25 45 65 85 105 125 − 75 − 50 − 25 0 25 50 75 100 125
TA − Free-Air Temperature − °C TA − Free-Air Temperature − °C
Figure 8 Figure 9
ÎÎÎÎ ÎÎÎÎ
OUTPUT CURRENT OUTPUT CURRENT
ÎÎÎÎ ÎÎÎÎ
20 − 20
VOM+ − Maximum Positive Peak Output Voltage − V
TA = 25°C TA = 25°C
18 − 18
16 − 16
14 − 14
12 VCC ± = ± 15 V − 12 VCC ± = ± 15 V
10 − 10
8 −8
6 −6
4 −4
2 VCC± = ± 5 V −2 VCC± = ± 5 V
0 0
0 − 10 − 20 − 30 − 40 − 50 − 60 0 5 10 15 20 25 30 35 40
IO − Output Current − mA IO − Output Current − mA
Figure 10 Figure 11
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS
5 5
0 0
−5 −5
− 10 − 10
VOM − VOM −
− 15 − 15
− 20 − 20
0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 18 20
| VCC ± | − Supply Voltage − V | VCC + | − Supply Voltage − V
Figure 12 Figure 13
MAXIMUM PEAK-TO-PEAK
MAXIMUM PEAK OUTPUT VOLTAGE OUTPUT VOLTAGE
vs vs
SUPPLY VOLTAGE FREQUENCY
VO(PP) − Maximum Peak-to-Peak Output Voltage − V
6 10
RL = 100 Ω VCC ± = ± 5 V
VOM +
VOM − Maximum Peak Output Voltage − V
TA = 25°C
RL = 10 kΩ
4 TA = 25°C
8
2
6
4
−2
2
−4
VOM −
−6 0
0 2 4 6 8 10 10 k 100 k 1M 10 M
| VCC ± | − Supply Voltage − V f − Frequency − Hz
Figure 14 Figure 15
TYPICAL CHARACTERISTICS†
MAXIMUM PEAK-TO-PEAK
MAXIMUM PEAK-TO-PEAK
OUTPUT VOLTAGE
OUTPUT VOLTAGE
vs
vs
ÎÎÎÎÎÎ
FREQUENCY
LOAD RESISTANCE
30
VO(PP) − Maximum Peak-to-Peak Output Voltage − V
ÎÎÎÎ ÎÎÎÎÎÎ
RL = 10 kΩ
25 TA = 25°C TA = 25°C
8
20
6
15
4
10
5 2
0 0
10 k 100 k 1M 10 M 10 100 1k 10 k
f − Frequency − Hz RL − Load Resistance − Ω
Figure 16 Figure 17
300
ÎÎÎ
80 100°
AVD 250
Phase Shift
60 120° VCC ± = ± 15 V
200
40 140°
150
20 160°
VCC ± = ± 15 V 100
RL = 10 kΩ VCC ± = ± 5 V
0 180°
CL = 100 pF 50
TA = 25°C
−20 200° 0
0.1 1 10 100 1k 10 k 100 k 1 M 10 M − 75 − 50 − 25 0 25 50 75 100 125
f − Frequency − Hz TA − Free-Air Temperature − °C
Figure 18 Figure 19
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS†
60 60 VO = 0
VID = − 100 mV
40 40
20 20
VCC ± = ± 15 V
0 TA = 25°C 0
VO = 0
− 20 − 20
VID = 100 mV
− 40 − 40
− 60 VID = 100 mV − 60
− 80 − 80
0 10 20 30 40 50 60 − 75 − 50 − 25 0 25 50 75 100 125
t − Elapsed Time − s TA − Free-Air Temperature − °C
Figure 20 Figure 21
ÁÁ
TA = 25°C 30 TA = 25°C
ÁÁ
100
AVD = 100
z o − Output Impedance − Ω
ÎÎÎÎ
25
zo − Output Impedance − Ω
10 AVD = 10
AVD = 10
20
ÎÎÎÎ
1
15
AVD = 100
ÎÎÎÎ
ÁÁ ÎÎÎÎ
AVD = 1
0.1
10
ÁÁ 0.01 ÎÎÎÎ
AVD = 1
5
0.001 0
100 1k 10 k 100 k 1M 10 M
10 100 1k 10 k 100 k 1M
f − Frequency − Hz f − Frequency − Hz
Figure 22 Figure 23
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS†
TLE2061
COMMON-MODE REJECTION RATIO SUPPLY CURRENT
vs vs
FREQUENCY SUPPLY VOLTAGE
100 340
TA = 25°C VO = 0
CMRR − Common-Mode Rejection Ratio − dB
No Load
ÎÎÎÎÎ
80 320
ÎÎÎÎÎ
I CC − Supply Current − µ A
VCC ± = ± 5 V TA = 125°C
60 300
TA = 25°C
40 280
20 260
TA = − 55°C
0 240
10 100 1k 10 k 100 k 1M 10 M 0 2 4 6 8 10 12 14 16 18 20
f − Frequency − Hz | VCC ± | − Supply Voltage − V
Figure 24 Figure 25
TLE2062 TLE2064
SUPPLY CURRENT SUPPLY CURRENT
vs vs
SUPPLY VOLTAGE SUPPLY VOLTAGE
700 1.4
VO = 0 VO = 0
No Load No Load
675 1.35
I CC − Supply Current − mA
650 1.3
xA
CC − Supply Current − µ A
TA = 125°C TA = 125°C
625 1.25
600 1.2
TA = 25°C
TA = 25°C
575 1.15
IICC
550 1.1
TA = − 55°C
TA = − 55°C
525 1.05
500 1
0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 18 20
|VCC ±| − Supply Voltage − V | VCC ± | − Supply Voltage − V
Figure 26 Figure 27
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS†
TLE2061 TLE2062
SUPPLY CURRENT SUPPLY CURRENT
vs vs
FREE-AIR TEMPERATURE FREE-AIR TEMPERATURE
340
700
VO = 0
VO = 0
No Load
675 No Load
ÎÎÎÎÎ
320
ÎÎÎÎÎ
I CC − Supply Current − µ A
650
xAA
VCC ± = ± 15 V
CC − Supply Current − µ
300 625 VCC ± = ± 15 V
600
280
575
VCC ± = ± 5 V
IICC
550
260 VCC ± = ± 5 V
525
240 500
−75 −50 −25 0 25 50 75 100 125 − 75 − 50 − 25 0 25 50 75 100 125
TA − Free-Air Temperature − °C TA − Free-Air Temperature − °C
Figure 28 Figure 29
TLE2064
SUPPLY CURRENT VOLTAGE-FOLLOWER
vs SMALL-SIGNAL
FREE-AIR TEMPERATURE PULSE RESPONSE
1.4 100
VO = 0
No Load
1.35
I CC − Supply Current − mA
VO − Output Voltage − mV
1.3 50
ÎÎÎÎÎ
1.25
VCC± = ±15 V
1.2 0
1.15
ÎÎÎÎÎ
VCC ± = ± 5 V
1.1
ÎÎÎÎÎ
− 50 RL = 10 kΩ
VCC ± = ± 5 V CL = 100 pF
1.05 TA = 25°C
See Figure 1
1 − 100
− 75 − 50 − 25 0 25 50 75 100 125 0 0.5 1 1.5 2 2.5
TA − Free-Air Temperature − °C t − Time − µs
Figure 30 Figure 31
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS
VOLTAGE-FOLLOWER
VOLTAGE-FOLLOWER
LARGE-SIGNAL
SMALL-SIGNAL
PULSE RESPONSE
PULSE RESPONSE
4
100
3
VO − Output Voltage − mV
50
VO − Output Voltage − V
2
1
0
0
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC ± = ± 15 V VCC ± = ± 5 V
− 50 RL = 10 kΩ
ÎÎÎÎÎ
RL = 10 kΩ
CL = 100 pF −1 CL = 100 pF
ÎÎÎÎÎ
TA = 25°C TA = 25°C
See Figure 1 See Figure 1
− 100 −2
3 0 5 10 15
0 0.5 1 1.5 2 2.5 3
t − Time − µs t − Time − µs
Figure 32 Figure 33
5
Noise Voltage − V
0 0
−5
− 0.5
− 10
− 15 −1
0 10 20 30 40 0 1 2 3 4 5 6 7 8 9 10
t − Time − µs t − Time − µs
Figure 34 Figure 35
TYPICAL CHARACTERISTICS
ÎÎÎÎÎ
100 0.3
Vn − Equivalent Input Noise Voltage − nV/ Hz
ÎÎÎÎÎ
VCC ± = ± 5 V AVD = 2
RS = 20 Ω VO(PP) = 2 V
ÎÎÎÎÎ
0.2
60
VCC ± = ± 5 V
40
0.1
20
Source Signal
0 0
1 10 100 1k 10 k 10 100 1k 10 k 100 k
f − Frequency − Hz f − Frequency − Hz
Figure 36 Figure 37
TA = 25°C
B1 − Unity-Gain Bandwidth − MHz
0.5 TA = 25°C
See Figure 3
0.4 2
0.3
VCC ± = ± 5 V
0.2 1.5
Source Signal
0.1
0 1
10 100 1k 10 k 100 k 0 2 4 6 8 10 12 14 16 18 20
f − Frequency − Hz | VCC ± | − Supply Voltage − V
Figure 38 Figure 39
TYPICAL CHARACTERISTICS†
φ m − Phase Margin
2
59°
VCC ± = ± 5 V
ÁÁ
58°
1.5
ÁÁ 57°
RL = 10 kΩ 56°
CL = 100 pF
See Figure 3
55°
1
0 2 4 6 8 10 12 14 16 18 20
− 75 − 50 − 25 0 25 50 75 100 125
TA − Free-Air Temperature − °C | VCC ± | − Supply Voltage − V
Figure 40 Figure 41
PHASE MARGIN
PHASE MARGIN vs
vs FREE-AIR TEMPERATURE
LOAD CAPACITANCE 66°
60°
RL = 10 kΩ
VCC ± = ± 15 V CL = 100 pF
RL = 10 kΩ 64° See Figure 3
50° TA = 25°C
See Figure 3
φ m − Phase Margin
62°
φ m − Phase Margin
40°
VCC ± = ± 15 V
60°
ÁÁ ÁÁ
30°
ÁÁ ÁÁ
VCC ± = ± 5 V
20° 58°
10° 56°
0° 54°
0 200 400 600 800 1000 − 75 − 50 − 25 0 25 50 75 100 125
CL − Load Capacitance − pF TA − Free-Air Temperature − °C
Figure 42 Figure 43
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
APPLICATION INFORMATION
input characteristics
The TLE206x, TLE206xA, and TLE206xB are specified with a minimum and a maximum input voltage that if
exceeded at either input could cause the device to malfunction. Because of the extremely high input impedance
and resulting low bias current requirements, the TLE206x, TLE206xA, and TLE206xB are well suited for
low-level signal processing. However, leakage currents on printed-circuit boards and sockets can easily exceed
bias current requirements and cause degradation in system performance. It is good practice to include guard
rings around inputs (see Figure 44). These guards should be driven from a low-impedance source at the same
voltage level as the common-mode input.
VI +
VO VI +
+
− VO
VO
−
VI −
R2
R1 R3
R4
R3 + R2
Where
R4 R1
IN − −
OUT
IN + + N2
N1
100 kΩ
5 kΩ
VCC −
APPLICATION INFORMATION
macromodel information
Macromodel information provided was derived using Microsim Parts, the model generation software used
with Microsim PSpice . The Boyle macromodel (see Note 5) and the subcircuit in Figure 46 were generated
using the TLE206x typical electrical and operating characteristics at 25°C. Using this information, output
simulations of the following key parameters can be generated to a tolerance of 20% (in most cases).
D Maximum positive output voltage swing D Unity-gain frequency
D Maximum negative output voltage swing D Common-mode rejection ratio
D Slew rate D Phase margin
D Quiescent power dissipation D DC output resistance
D Input bias current D AC output resistance
D Open-loop voltage amplification D Short-circuit output current limit
NOTE 5: G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, “Macromodeling of Integrated Circuit Operational Amplifiers”, IEEE Journal
of Solid-State Circuits, SC-9, 353 (1974).
99
din
3 egnd +
VCC +
9 92
fb
+ − 90 91
rss iss
ro2 + dip + −
vb
rp hlim vip vin
+ −
2 10 − − +
IN − vc r2
j1 j2 − C2
dp 6 7
IN+ 53 +
1 11 vlim
12 dc gcm ga
−
C1 8
www.ti.com 18-Sep-2010
PACKAGING INFORMATION
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Addendum-Page 2
PACKAGE OPTION ADDENDUM
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Addendum-Page 3
PACKAGE OPTION ADDENDUM
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PACKAGE OPTION ADDENDUM
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Addendum-Page 6
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2010
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 7
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2010
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLE2061, TLE2061A, TLE2061AM, TLE2061B, TLE2061BM, TLE2061M, TLE2062, TLE2062A, TLE2062AM, TLE2062B,
TLE2062BM, TLE2062M, TLE2064, TLE2064A, TLE2064AM, TLE2064B, TLE2064BM, TLE2064M :
• Catalog: TLE2061A, TLE2061B, TLE2061, TLE2062A, TLE2062B, TLE2062, TLE2064A, TLE2064B, TLE2064
• Military: TLE2061M, TLE2061AM, TLE2061BM, TLE2062M, TLE2062AM, TLE2062BM, TLE2064M, TLE2064AM, TLE2064BM
Addendum-Page 8
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Dec-2010
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Dec-2010
Pack Materials-Page 2
MECHANICAL DATA
0.400 (10,16)
0.355 (9,00)
8 5
0.280 (7,11)
0.245 (6,22)
1 4
0.065 (1,65)
0.045 (1,14)
0.023 (0,58)
0°–15°
0.015 (0,38)
0.100 (2,54) 0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
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