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Keywords: electroplating, failure analysis, hydrogen damage, hydrogen embrittlement, hydrogen induced cracking
B.V. Krishna, Materials Science & Technology Division, Thapar Centre for Industrial Research and Development, Thapar Technology
Campus, P.O. Box 68, Bhadson Road, Patiala 147 001, Punjab, India. Contact e-mail: vamsi23@yahoo.com.
ated from the subsurface of the screw. The transition the interior. The changes in the fracture mode were
from brittle to somewhat ductile is observed in ster- from brittle at both surfaces to ductile in the center
eomicrographs of the sample (Fig. 2b). (Fig. 3). The fracture apparently nucleated near the
subsurface of the screw as evidenced by the “lip”
The scanning electron microscopy (SEM) of the
seen in Fig. 3b. This type of nucleation is typical
fracture surface showed that fractures on both the
for H2-induced cracking/blistering in electroplated
ID and OD of the screw differed from fractures at
Fig. 4 SEM micrographs of the fracture surface near ID Fig. 6 SEM micrographs of the fracture surface showing (a)
showing the transition from intergranular fracture to brittle intergranular fracture near OD/ID, (b) dimple
microvoid coalescence. fracture surface in the center
Fig. 7 Optical micrographs of the cup portion showing (a) Fig. 8 Optical micrographs of failed portion showing (a)
tempered martensite in the case region, (a) tempered tempered martensite in the case region, (a) tempered
martensite and some ferrite (light) in the core martensite and some ferrite (light) in the core
Table 1 Hardness and Case Depth of the coating acts as a barrier to effusion of hydrogen, a
Screw in Various Regions high temperature baking is required to remove the
hydrogen. The high hardness in the threaded region
Specified Cup Portion Failed Portion
accentuated the failure probability by hydrogen
Case 600-750 HV 709 HV 594
induced cracking/blistering. Since the strength of
Core 310-370 HV 455 HV 350
the threaded region was high, a small bend (5°)
Case depth, 0.15-0.20 0.25 0.27
mm during room temperature testing resulted in cracking
of the screws.
• Microelectronic Failure Analysis Desk Reference 2002 Supplement (Book and CD-ROM)
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