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Features
5.0V ± 10% for read and write operations - Embedded Program algorithm automatically writes
Access times: and verifies bytes at specified addresses
- 55/70/90/120/150 (max.) Typical 100,000 program/erase cycles per sector
Current: 20-year data retention at 125°C
- 20 mA typical active read current - Reliable operation for the life of the system
- 30 mA typical program/erase current Compatible with JEDEC-standards
- 1 μA typical CMOS standby - Pinout and software compatible with single-power-
Flexible sector architecture supply Flash memory standard
- 8 uniform sectors of 64 Kbyte each - Superior inadvertent write protection
- Any combination of sectors can be erased Data Polling and toggle bits
- Supports full chip erase - Provides a software method of detecting completion
- Sector protection: of program or erase operations
A hardware method of protecting sectors to prevent Erase Suspend/Erase Resume
any inadvertent program or erase operations within - Suspends a sector erase operation to read data
that sector from, or program data to, a non-erasing sector, then
Embedded Erase Algorithms resumes the erase operation
- Embedded Erase algorithm will automatically erase Package options
the entire chip or any combination of designated - 32-pin P-DIP, PLCC, or TSOP(Forward type)
sectors and verify the erased sectors
General Description
The A29040 is a 5.0 volt-only Flash memory organized as The A29040 is entirely software command set compatible
524,288 bytes of 8 bits each. The 512 Kbytes of data are with the JEDEC single-power-supply Flash standard.
further divided into eight sectors of 64 Kbytes each for Commands are written to the command register using
flexible sector erase capability. The 8 bits of data appear standard microprocessor write timings. Register contents
on I/O0 - I/O7 while the addresses are input on A0 to A18. serve as input to an internal state-machine that controls
The A29040 is offered in 32-pin PLCC, TSOP, and PDIP the erase and programming circuitry. Write cycles also
packages. This device is designed to be programmed in- internally latch addresses and data needed for the
system with the standard system 5.0 volt VCC supply. programming and erase operations. Reading data out of
Additional 12.0 volt VPP is not required for in-system write the device is similar to reading from other Flash or EPROM
or erase operations. However, the A29040 can also be devices.
programmed in standard EPROM programmers. Device programming occurs by writing the proper program
The A29040 has a second toggle bit, I/O2, to indicate command sequence. This initiates the Embedded Program
whether the addressed sector is being selected for erase, algorithm - an internal algorithm that automatically times
and also offers the ability to program in the Erase Suspend the program pulse widths and verifies proper program
mode. The standard A29040 offers access times of 55, 70, margin.
90, 120, and 150 ns, allowing high-speed microprocessors Device erasure occurs by executing the proper erase
to operate without wait states. To eliminate bus contention command sequence. This initiates the Embedded Erase
the device has separate chip enable ( CE ), write enable algorithm - an internal algorithm that automatically
preprograms the array (if it is not already programmed)
( WE ) and output enable ( OE ) controls.
before executing the erase operation. During erase, the
The device requires only a single 5.0 volt power supply for device automatically times the erase pulse widths and
both read and write functions. Internally generated and verifies proper erase margin.
regulated voltages are provided for the program and erase
operations.
The host system can detect whether a program or erase The hardware sector protection feature disables operations
operation is complete by reading the I/O7 ( Data Polling) for both program and erase in any combination of the
and I/O6 (toggle) status bits. After a program or erase cycle sectors of memory. This can be achieved via programming
has been completed, the device is ready to read array data equipment.
or accept another command. The Erase Suspend feature enables the user to put erase
The sector erase architecture allows memory sectors to be on hold for any period of time to read data from, or
erased and reprogrammed without affecting the data program data to, any other sector that is not selected for
contents of other sectors. The A29040 is fully erased when erasure. True background erase can thus be achieved.
shipped from the factory. Power consumption is greatly reduced when the device is
placed in the standby mode.
Pin Configurations
DIP PLCC
A18 1 32 VCC
VCC
A12
A16
A18
A17
WE
A16 2 31 WE A15
A15 3 30 A17
4
3
2
1
32
31
30
A12 4 29 A14
A7 5 28 A13 A7 5 29 A14
A6 6 27 A8 A6 6 28 A13
A5 7 26 A9 A5 7 27 A8
A29040
A4 8 25 A11 A4 8 26 A9
A3 9 24 OE A3 9 A29040L 25 A11
A2 10 23 A10 A2 10 24 OE
A1 11 22 CE A1 11 23 A10
A0 12 21 I/O7 A0 12 22 CE
I/O0 13 20 I/O6 I/O0 13 21 I/O7
14
15
16
17
18
19
20
I/O1 14 19 I/O5
I/O2 15 18 I/O4
I/O1
I/O2
VSS
I/O3
I/O4
I/O5
I/O6
VSS 16 17 I/O3
A11 1 32 OE
A9 2 31 A10
A8 3 30 CE
A13 4 29 I/O7
A14 5 28 I/O6
A17 6 27 I/O5
WE 7 26 I/O4
VCC 8 A29040V 25 I/O3
A18 9 24 VSS
A16 10 23 I/O2
A15 11 22 I/O1
A12 12 21 I/O0
A7 13 20 A0
A6 14 19 A1
A5 15 18 A2
A4 16 17 A3
Block Diagram
I/O0 - I/O7
VCC
VSS Input/Output
Erase Voltage
Buffers
Generator
WE State
Control
Y-Decoder
STB Y-Gating
Address Latch
X-decoder
Cell Matrix
A0-A18
Pin Descriptions
CE Chip Enable
WE Write Enable
OE Output Enable
VSS Ground
Device Bus Operations execute the command. The contents of the register serve
as inputs to the internal state machine. The state machine
This section describes the requirements and use of the outputs dictate the function of the device. The appropriate
device bus operations, which are initiated through the device bus operations table lists the inputs and control
internal command register. The command register itself levels required, and the resulting output. The following
does not occupy any addressable memory location. The subsections describe each of these operations in further
register is composed of latches that store the commands, detail.
along with the address and data information needed to
Legend:
L = Logic Low = VIL, H = Logic High = VIH, VID = 12.0 ± 0.5V, X = Don't Care, DIN = Data In, DOUT = Data Out, AIN = Address In
Note: See the "Sector Protection/Unprotection" section, for more information.
Requirements for Reading Array Data "Autoselect Mode" and "Autoselect Command Sequence"
sections for more information.
To read array data from the outputs, the system must drive ICC2 in the Characteristics table represents the active
the CE and OE pins to VIL. CE is the power control and current specification for the write mode. The "AC
selects the device. OE is the output control and gates Characteristics" section contains timing specification tables
and timing diagrams for write operations.
array data to the output pins. WE should remain at VIH all
the time during read operation. The internal state machine Program and Erase Operation Status
is set for reading array data upon device power-up, or after
a hardware reset. This ensures that no spurious alteration During an erase or program operation, the system may
of the memory content occurs during the power transition. check the status of the operation by reading the status bits
No command is necessary in this mode to obtain array on I/O7 - I/O0. Standard read cycle timings and ICC read
data. Standard microprocessor read cycles that assert valid specifications apply. Refer to "Write Operation Status" for
addresses on the device address inputs produce valid data more information, and to each AC Characteristics section
on the device data outputs. The device remains enabled for for timing diagrams.
read access until the command register contents are Standby Mode
altered.
See "Reading Array Data" for more information. Refer to the When the system is not reading or writing to the device, it
AC Read Operations table for timing specifications and to can place the device in the standby mode. In this mode,
the Read Operations Timings diagram for the timing current consumption is greatly reduced, and the outputs are
waveforms, lCC1 in the DC Characteristics table represents placed in the high impedance state, independent of the OE
the active current specification for reading array data. input.
Writing Commands/Command Sequences The device enters the CMOS standby mode when the CE
pin is held at VCC ± 0.5V. (Note that this is a more restricted
To write a command or command sequence (which voltage range than VIH.) The device enters the TTL standby
includes programming data to the device and erasing
mode when CE is held at VIH. The device requires the
sectors of memory), the system must drive WE and CE to
standard access time (tCE) before it is ready to read data.
VIL, and OE to VIH. An erase operation can erase one If the device is deselected during erasure or programming,
sector, multiple sectors, or the entire device. The Sector the device draws active current until the operation is
Address Tables indicate the address range that each sector completed.
occupies. A "sector address" consists of the address inputs ICC3 in the DC Characteristics tables represents the standby
required to uniquely select a sector. See the "Command current specification.
Definitions" section for details on erasing a sector or the
entire chip, or suspending/resuming the erase operation. Output Disable Mode
After the system writes the autoselect command sequence,
When the OE input is at VIH, output from the device is
the device enters the autoselect mode. The system can
then read autoselect codes from the internal register (which disabled. The output pins are placed in the high impedance
is separate from the memory array) on I/O7 - I/O0. Standard state.
read cycle timings apply in this mode. Refer to the
Autoselect Mode verifying sector protection, the sector address must appear
on the appropriate highest order address bits. Refer to the
The autoselect mode provides manufacturer and device corresponding Sector Address Tables. The Command
identification, and sector protection verification, through Definitions table shows the remaining address bits that are
identifier codes output on I/O7 - I/O0. This mode is primarily don't care. When all necessary bits have been set as
intended for programming equipment to automatically required, the programming equipment may then read the
match a device to be programmed with its corresponding corresponding identifier code on I/O7 - I/O0.To access the
programming algorithm. However, the autoselect codes autoselect codes in-system, the host system can issue the
can also be accessed in-system through the command autoselect command via the command register, as shown
register. in the Command Definitions table. This method does not
When using programming equipment, the autoselect mode require VID. See "Command Definitions" for details on
requires VID (11.5V to 12.5 V) on address pinA9. Address using the autoselect mode.
pins A6, A1, and AO must be as shown in Autoselect
Codes (High Voltage Method) table. In addition, when
Identifier Code on
Description A18 - A16 A15 - A10 A9 A8 - A7 A6 A5 - A2 A1 AO
I/O7 - I/O0
Manufacturer ID: AMIC X X VID X VIL X VIL VIL 37h
Device ID: A29040 X X VID X VIL X VIL VIH 86h
Cycles
Sequence First Second Third Fourth Fifth Sixth
(Note 1)
Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data
Read (Note 5) 1 RA RD
Reset (Note 6) 1 XXX F0
Manufacturer ID 4 555 AA 2AA 55 555 90 X00 37
Device ID 4 555 AA 2AA 55 555 90 X01 86
Autoselect
(Note 7) Continuation ID 4 555 AA 2AA 55 555 90 X03 7F
Legend:
X = Don't care
RA = Address of the memory location to be read.
RD = Data read from location RA during read operation.
PA = Address of the memory location to be programmed. Addresses latch on the falling edge of the WE or CE pulse,
whichever happens later.
PD = Data to be programmed at location PA. Data latches on the rising edge of WE or CE pulse, whichever happens first.
SA = Address of the sector to be verified (in autoselect mode) or erased. Address bits A18 - A16 select a unique sector.
Note:
1. See Table 1 for description of bus operations.
2. All values are in hexadecimal.
3. Except when reading array or autoselect data, all bus cycles are write operation.
4. Address bits A18 - A11 are don't cares for unlock and command cycles, unless SA or PA required.
5. No unlock or command cycles required when reading array data.
6. The Reset command is required to return to reading array data when device is in the autoselect mode, or if I/O5 goes high
(while the device is providing status data).
7. The fourth cycle of the autoselect command sequence is a read cycle.
8. The data is 00h for an unprotected sector and 01h for a protected sector. See "Autoselect Command Sequence" for more
information.
9. The system may read and program in non-erasing sectors, or enter the autoselect mode, when in the Erase Suspend
mode.
10. The Erase Resume command is valid only during the Erase Suspend mode.
11. The time between each command cycle has to be less than 50μs.
I/O6: Toggle Bit I sector and mode information. Refer to Table 5 to compare
outputs for I/O2 and I/O6.
Toggle Bit I on I/O6 indicates whether an Embedded Figure 4 shows the toggle bit algorithm in flowchart form, and
Program or Erase algorithm is in progress or complete, or the section " I/O2: Toggle Bit II" explains the algorithm. See
whether the device has entered the Erase Suspend mode. also the " I/O6: Toggle Bit I" subsection. Refer to the Toggle
Toggle Bit I may be read at any address, and is valid after Bit Timings figure for the toggle bit timing diagram. The I/O2
the rising edge of the final WE pulse in the command vs. I/O6 figure shows the differences between I/O2 and I/O6 in
sequence (prior to the program or erase operation), and graphical form.
during the sector erase time-out.
During an Embedded Program or Erase algorithm Reading Toggle Bits I/O6, I/O2
operation, successive read cycles to any address cause Refer to Figure 4 for the following discussion. Whenever the
I/O6 to toggle. (The system may use either OE or CE to system initially begins reading toggle bit status, it must read
control the read cycles.) When the operation is complete, I/O7 - I/O0 at least twice in a row to determine whether a
I/O6 stops toggling. toggle bit is toggling. Typically, a system would note and
After an erase command sequence is written, if all sectors store the value of the toggle bit after the first read. After the
selected for erasing are protected, I/O6 toggles for second read, the system would compare the new value of the
approximately 100μs, then returns to reading array data. If toggle bit with the first. If the toggle bit is not toggling, the
not all selected sectors are protected, the Embedded Erase device has completed the program or erase operation. The
algorithm erases the unprotected sectors, and ignores the system can read array data on I/O7 - I/O0 on the following
selected sectors that are protected. read cycle.
The system can use I/O6 and I/O2 together to determine However, if after the initial two read cycles, the system
whether a sector is actively erasing or is erase-suspended. determines that the toggle bit is still toggling, the system also
When the device is actively erasing (that is, the Embedded should note whether the value of I/O5 is high (see the section
Erase algorithm is in progress), I/O6 toggles. When the on I/O5). If it is, the system should then determine again
device enters the Erase Suspend mode, I/O6 stops toggling. whether the toggle bit is toggling, since the toggle bit may
However, the system must also use I/O2 to determine which have stopped toggling just as I/O5 went high. If the toggle bit
sectors are erasing or erase-suspended. Alternatively, the is no longer toggling, the device has successfully completed
system can use I/O7 (see the subsection on " I/O7 : Data the program or erase operation. If it is still toggling, the
device did not complete the operation successfully, and the
Polling").
system must write the reset command to return to reading
If a program address falls within a protected sector, I/O6
array data.
toggles for approximately 2μs after the program command
The remaining scenario is that the system initially determines
sequence is written, then returns to reading array data.
that the toggle bit is toggling and I/O5 has not gone high. The
I/O6 also toggles during the erase-suspend-program mode,
system may continue to monitor the toggle bit and I/O5
and stops toggling once the Embedded Program algorithm
through successive read cycles, determining the status as
is complete.
described in the previous paragraph. Alternatively, it may
The Write Operation Status table shows the outputs for
choose to perform other system tasks. In this case, the
Toggle Bit I on I/O6. Refer to Figure 4 for the toggle bit
system must start at the beginning of the algorithm when it
algorithm, and to the Toggle Bit Timings figure in the "AC
returns to determine the status of the operation (top of Figure
Characteristics" section for the timing diagram. The I/O2 vs.
4).
I/O6 figure shows the differences between I/O2 and I/O6 in
graphical form. See also the subsection on " I/O2: Toggle I/O5: Exceeded Timing Limits
Bit II".
I/O5 indicates whether the program or erase time has
I/O2: Toggle Bit II exceeded a specified internal pulse count limit. Under these
conditions I/O5 produces a "1." This is a failure condition that
The "Toggle Bit II" on I/O2, when used with I/O6, indicates
indicates the program or erase cycle was not successfully
whether a particular sector is actively erasing (that is, the
completed.
Embedded Erase algorithm is in progress), or whether that
The I/O5 failure condition may appear if the system tries to
sector is erase-suspended. Toggle Bit II is valid after the
program a "1 "to a location that is previously programmed to
rising edge of the final WE pulse in the command "0." Only an erase operation can change a "0" back to a "1."
sequence. Under this condition, the device halts the operation, and
I/O2 toggles when the system reads at addresses within when the operation has exceeded the timing limits, I/O5
those sectors that have been selected for erasure. (The produces a "1."
system may use either OE or CE to control the read Under both these conditions, the system must issue the reset
cycles.) But I/O2 cannot distinguish whether the sector is command to return the device to reading array data.
actively erasing or is erase-suspended. I/O6, by comparison,
indicates whether the device is actively erasing, or is in
Erase Suspend, but cannot distinguish which sectors are
selected for erasure. Thus, both status bits are required for
Yes
No
Toggle Bit
= Toggle ?
Yes
Program/Erase
Program/Erase
Operation Not
Operation
Commplete, Write
Commplete
Reset Command
Notes :
1. Read toggle bit twice to determine whether or not it is
toggling. See text.
2. Recheck toggle bit because it may stop toggling as I/O5
changes to "1". See text.
Notes:
1. I/O7 and I/O2 require a valid address when reading status information. Refer to the appropriate subsection for further
details.
2. I/O5 switches to “1” when an Embedded Program or Embedded Erase operation has exceeded the maximum timing
limits. See “I/O5: Exceeded Timing Limits” for more information.
20ns 20ns
+0.8V
-0.5V
-2.0V
20ns
20ns
VCC+2.0V
VCC+0.5V
2.0V
20ns 20ns
DC Characteristics
TTL/NMOS Compatible
Parameter
Parameter Description Test Description Min. Typ. Max. Unit
Symbol
ILI Input Load Current VIN = VSS to VCC. VCC = VCC Max ±1.0 μA
ILIT A9 Input Load Current VCC = VCC Max, A9 = 12.5V 100 μA
ILO Output Leakage Current VOUT = VSS to VCC. VCC = VCC Max ±1.0 μA
ICC1 VCC Active Read Current
CE = VIL, OE = VIH 20 30 mA
(Notes 1, 2)
ICC2 VCC Active Write (Program/Erase) 30 40 mA
CE = VIL, OE =VIH
Current (Notes 2, 3, 4)
ICC3 VCC Standby Current (Note 2) CE = VIH 0.4 1.0 mA
VIL Input Low Level -0.5 0.8 V
VIH Input High Level 2.0 VCC+0.5 V
VID Voltage for Autoselect VCC = 5.25 V 10.5 12.5 V
and Sector Protect
VOL Output Low Voltage IOL = 12mA, VCC = VCC Min 0.45 V
VOH Output High Voltage IOH = -2.5 mA, VCC = VCC Min 2.4 V
CMOS Compatible
Parameter
Parameter Description Test Description Min. Typ. Max. Unit
Symbol
ILI Input Load Current VIN = VSS to VCC, VCC = VCC Max ±1.0 μA
ILIT A9 Input Load Current VCC = VCC Max, A9 = 12.5V 100 μA
ILO Output Leakage Current VOUT = VSS to VCC, VCC = VCC Max ±1.0 μA
ICC1 VCC Active Read Current 20 30 mA
CE = VIL, OE = VIH
(Notes 1,2)
ICC2 VCC Active Program/Erase Current 30 40 mA
CE = VIL, OE = VIH
(Notes 2,3,4)
ICC3 VCC Standby Current (Notes 2, 5) CE = VCC ± 0.5 V 1 5 μA
VIL Input Low Level -0.5 0.8 V
VIH Input High Level 0.7 x VCC VCC+0.3 V
VID Voltage for Autoselect and Sector
VCC = 5.25 V 10.5 12.5 V
Protect
VOL Output Low Voltage IOL = 12.0 mA, VCC = VCC Min 0.45 V
VOH1 IOH = -2.5 mA, VCC = VCC Min 0.85 x VCC V
Output High Voltage
VOH2 IOH = -100 μA. VCC = VCC Min VCC-0.4 V
AC Characteristics
Read Only Operations
Notes:
1. Output driver disable time.
2. Not 100% tested.
tRC
tACC
CE
tDF
tOE
OE
tOEH
WE tCE tOH
High-Z High-Z
Output Output Valid
0V
AC Characteristics
Erase and Program Operations
Notes:
1. Not 100% tested.
2. See the "Erase and Programming Performance" section for more information.
Program Command Sequence (last two cycles) Read Status Data (last two cycles)
tWC tAS
~
~
Addresses 555h PA PA PA
~ ~
~
tAH
~
CE
tCH
tGHWL
~
~
OE
tWP ~ tWHWH1
~
WE
tCS tWPH
tDS
tDH
~
~
tVCS
~
~
VCC
Note : PA = program addrss, PD = program data, Dout is the true data at the program address.
~
~
Addresses 2AAh SA VA VA
~ ~
~
555h for chip erase
tAH
~
CE
tGHWL
~
~
tCH
OE
tWP
~
~
WE
tWPH
tWHWH2
tCS
tDS
tDH
In
~
~
VCC
tRC
~
~
Addresses VA VA VA
~ ~
~
tACC
~
CE tCE
tCH
tOE ~
~
OE
tOEH tDF
~
~
WE
tOH
High-Z
Valid Data
~
~
High-Z
I/O0 - I/O6 Valid Data
~
~
Note : VA = Valid Address. Illustation shows first status cycle after command sequence, last status read cycle, and array data
read cycle.
tRC
~
~
Addresses VA VA VA VA
~ ~
~
tACC
~
CE tCE
tCH
tOE
OE
~
~
tOEH tDF
~
~
WE
tOH
~
~
I/O6 , I/O2 Valid Status Valid Status Valid Status Valid Status
Note: VA = Valid Address; not required for I/O6. Illustration shows first two status cycle after command sequence, last status
read cycle, and array data read cycle.
Enter
Erase Enter Erase Erase
Embedded
Suspend Suspend Program Resume
Erasing
~
~
~
~
~
~
~
~
~
~
WE
Erase Erase Erase
Erase Suspend Erase Suspend Erase
Suspend
Read Read Complete
Program
~
~
~
~
~
~
~
~
I/O6
~
~
~
~
~
~
~
~
~
~
~
~
I/O2
Note : Both I/O6 and I/O2 toggle with OE or CE. See the text on I/O6 and I/O2 in the section "Write Operation Statue" for
more information.
AC Characteristics
Erase and Program Operations
Alternate CE Controlled Writes
Notes:
3. Not 100% tested.
4. See the "Erase and Programming Performance" section for more information.
PA for program
555 for program SA for sector erase
2AA for erase 555 for chip erase
Data Polling
~
~
Addresses PA
~
~
tWC tAS
tWH tAH
~
~
WE
tGHEL
~
~
OE
tCP tWHWH1 or 2
tCPH tBUSY ~
~
CE
tWS
tDS
tDH
~
~
tRH
A0 for program PD for program
55 for erase 30 for sector erase
10 for chip erase
Note :
1. PA = Program Address, PD = Program Data, SA = Sector Address, I/O7 = Complement of Data Input, DOUT = Array Data.
2. Figure indicates the last two bus cycles of the command sequence.
Notes:
1. Typical program and erase times assume the following conditions: 25°C, 5.0V VCC, 100,000 cycles. Additionally,
programming typically assumes checkerboard pattern.
2. Under worst case conditions of 90°C, VCC = 4.5V (4.75V for -55), 100,000 cycles.
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes
program faster than the maximum byte program time listed. If the maximum byte program time given is exceeded, only
then does the device set I/O5 = 1. See the section on I/O5 for further information.
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the four-bus-cycle command sequence for programming. See
Table 4 for further information on command definitions.
6. The device has a guaranteed minimum erase and program cycle endurance of 100,000 cycles.
Latch-up Characteristics
Includes all pins except VCC. Test conditions: VCC = 5.0V, one pin at time.
Notes:
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0MHz
Notes:
3. Sampled, not 100% tested.
4. Test conditions TA = 25°C, f = 1.0MHz
Data Retention
150°C 10 Years
Minimum Pattern Data Retention Time
125°C 20 Years
Test Conditions
Table 6. Test Specifications
5.0 V
2.7 KΩ
Device
Under
Test
Ordering Information
Package Information
32 17
E
1 16
E1
C
A1
A2
A
Base Plane
L
Seating Plane
B
θ EA
e
B1
B - 0.018 - - 0.457 -
B1 - 0.050 - - 1.270 -
C - 0.010 - - 0.254 -
D 1.645 1.650 1.655 41.783 41.91 42.037
E 0.537 0.542 0.547 13.64 13.767 13.894
E1 0.590 0.600 0.610 14.986 15.240 15.494
EA 0.630 0.650 0.670 16.002 16.510 17.018
e - 0.100 - - 2.540 -
L 0.120 0.130 0.140 3.048 3.302 3.556
θ 0° - 15° 0° - 15°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
Package Information
HD
D
13 5
14 4
HE
1
E
32
20 30
21 29
A2
L
c
e b
A1
b1 GE
y
D
GD θ
Notes:
1. Dimensions D and E do not include resin fins.
2. Dimensions GD & GE are for PC Board surface mount pad pitch
design reference only.
Package Information
A2
A
E
c
A1
θ
L
LE
HD
Detail "A"
Detail "A"
y
D
S b
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.