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1 18-11-2008 DIL © by SEMIKRON

SKD 160

Fig. 3L Power dissipation vs. output current Fig. 3R Power dissipation vs. case temperature

Fig. 6 Surge overload characteristics vs. time Fig. 9 Forward characteristics of a diode arm

Fig. 12 Transient thermal impedance vs. time

2 18-11-2008 DIL © by SEMIKRON

SKD 160
Dimensions in mm

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* The specifications of our components may not be considered as an assurance of component characteristics.
Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON
products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We
therefore strongly recommend prior consultation of our personal.

3 18-11-2008 DIL © by SEMIKRON