555 - IC TIMER TESTER

A Project Report
Submitted in Partial fulfillment for the award of Bachelor of
Engineering in ELECTRICAL AND ELECTRONICS

Submitted to

RAJIV GANDHI PRODYOGIKI VISHWAVIDYALAYA

BHOPAL (M.P)

MINOR PROJECT REPORT

Submitted By
APURV SHARMA 0103EX051009
VISHAL MODI 0103EX051059
VIVEK PODDAR 0103EX051060

Under the Supervision of

Asst.. Prof. Amol Barve

E LEC T R IC A L & E LEC T R O N IC S E N G IN EE R IN G

LAKSHMI NARAIN COLLEGE OF TECHNOLOGY,
BHOPAL (M.P.)
 SESSION – 2005-09

LAKSHMI NARAIN COLLEGE OF TECHNOLOGY,

BHOPAL

E LEC T R IC A L & E LEC T R O N IC S E N G IN EE R IN G

CERTIFICATE

This is to certify that Apurv Sharma (0103EX051009), Vishal

Modi (0103EX051059) and Vivek Poddar (0103EX051060), have
satisfactorily completed the work embodied in this preliminary
entitled “555 IC TIMER TESTER”. It is a bonafide piece of work,
carried out under our /my guidance in the Electrical &
Electronics Engineering, Lakshmi Narain College of
Technology, Bhopal for the partial fulfillment of the Bachelor
of Engineering during the academic year 2008.

Project
Guide
Asst. Prof.
Manish Khemariya

Approved By
Dr. R.K Shrivastava
Head of Department
 Forwarded by

Dr. Gulab Singh

Principal
Lakshmi Narain College of
Technology, Bhopal
 Lakshmi Narain College of
Technology, Bhopal

E LEC T R IC A L & E LEC T R O N IC S E N G IN EE R IN G

DECLARATION

Apurv Sharma (0103EX051009) , Vishal Modi (0103EX051059)

and Vivek Poddar (0103EX051060 ), students of Bachelor of
Engineering Electrical & Electronics Engineering , Lakshmi
Narain College of Technology, Bhopal. We hereby declare that
the work presented in this Minor Project is outcome of my own
work, is bonafide, correct to the best of my knowledge and
this work has been carried out taking care of Engineering
Ethics. This work does not infringe any patented work and had
not been submitted to any University for die award of any
degree or any professional diploma.

APURV SHARMA
( 0103EX051009 )
VISHAL MODI
( 0103EX051059 )
VIVEK PODDAR (
0103EX051060 )

Date : -05-2008
 CONTENTS

1. INTRODUCTION

2. COMPONENT LIST

3. DESCRIPTION OF COMPONENTS

4. OPERATING PRINCIPLE

5. CIRCUIT DIAGRAMS

6. WORKING

7. MANUFACTURING PROCESS

8. APPLICATION OF CIRCUIT

9. PRECAUTIONS
 INTRODUCTION

This is a simple and easy to use gadget which not only testes the
IC 555 timer in its entire basic configuration but also tests the
functionally of each pin of the timer. Once a timer is declared fit
by this gadget, it will function satisfactorily in whatever mode or
configuration you may try it.

The circuit thus can be used to check:

(1) The timer IC in astable configuration.

(2) the timer IC in monostable configuration

(3) The capability of reset terminal to over ride all function and
rest the output to low.

(4) The function of the control terminal to change the ‘on’ or

‘high’ time of output wave form in astable mode of operation
and the output pulse width in monostable mode of operation.

IC 555 TIMER –

The 555 is an integrated circuit (chip) implementing a variety of

timer and multivibrator applications. The IC was designed and
invented by Hans R. Camenzind. It was designed in 1970 and
introduced in 1971 by Signetics (later acquired by Philips). The
original name was the SE555/NE555 and was called "The IC Time
Machine". It is still in wide use, thanks to its ease of use, low
price and good stability. As of 2006, 1.5 billion units are
manufactured every year.

The 555 timer is one of the most popular and versatile

integrated circuits ever produced. It includes 23 transistors, 2
diodes and 16 resistors on a silicon chip installed in an 8-pin mini
dual-in-line package (DIP-8). The 556 is a 14-pin DIP that
combines two 555s on a single chip. The 558 is a 16-pin DIP that
combines four, slightly modified, 555s on a single chip (DIS &
THR are connected internally; TR is falling edge sensitive instead
of level sensitive). Also available are ultra-low power versions of
the 555 such as the 7555 and TLC555. The 7555 requires slightly
different wiring using fewer external components and less
power.

The 555 has three operating modes:

Monostable mode:

in this mode, the 555 functions as a "one-shot". Applications

include timers, missing pulse detection, bouncefree switches,
touch switches, Frequency Divider,Capacitance Measurement,
Pulse Width Modulation (PWM) etc.

Astable mode :

Free Running mode: the 555 can operate as an oscillator. Uses

include LED and lamp flashers, pulse generation, logic clocks,
tone generation, security alarms, pulse position modulation, etc.

Bistable mode:

the 555 can operate as a flip-flop, if the DIS pin is not connected
and no capacitor is used. Uses include bouncefree latched
switches, etc.

The connection of the pins is as follows:

1. GND Ground, low level
2. TR A short pulse high → low on the trigger starts the
timer
3. Q During a timing interval, the output stays at
+VCC
4. R A timing interval can be interrupted by applying a
reset pulse to
low (0V)
5. CV Control voltage allows access to the internal
voltage divider
(2/3 VCC)
6. THR The threshold at which the interval ends
(it ends if U.thr → 2/3 VCC)
7. DIS Connected to a capacitor whose discharge time
will influence
the timing interval.
8. V+, VCC The positive supply voltage which must be
between 5 and 15 V,
high level

Schematic diagram :
Real picture

COMPONENT LIST

Number Quantity
1. IC’S

IC-555 1

2. Transistors

BC548 2

3. Light emitting diodes (LED’S)

Red 1
Green 1

4. Electrolytic capacitors

10µ F/25V 2
100µ /25V 2

5. Ceramic capacitors

0.1µ 1
0.01µ 1

6. Variable resistor

Preset 1M 1

7. Carbon resistor
100K 2
10K 2
1K 2
1M 1
.33K 1
.47K 1
470K 1

8. Piezo element 1

10. 9V Battery 1

11. Switch 1

12. Miscellaneous
Icbase (8 pin) 2
Switch connector 1
Ferric chloride
Soldering wire
Soldering paste
Connecting wire

DISCRIPTION OF COMPONENTS
RESISTORS -
A Resistor is a heat-dissipating element and in the
electronic circuits it is mostly used for either controlling the
current in the circuit or developing a voltage drop across it,
which could be utilized for many applications. There are various
types of resistors, which can be classified according to a number
of factors depending upon:
(I) Material used for fabrication
(II) Wattage and physical size
(III) Intended application
(IV) Ambient temperature rating
(V) Cost
Basically the resistor can be split in to the following four parts
from the construction viewpoint.
(1) Base
(2) Resistance element
(3) Terminals
(4) Protective means.
The following characteristics are inherent in all resistors and may
be controlled by design considerations and choice of material i.e.
Temperature co–efficient of resistance, Voltage co–efficient of
resistance, high frequency characteristics, power rating,
tolerance & voltage rating of resistors. Resistors may be
classified as
(1) Fixed
(2) Semi variable
(3) Variable resistor.
In our project carbon resistors are being used.
CAPACITORS:

The fundamental relation for the capacitance between two flat

plates separated by a dielectric material is given by:-

C=0.08854KA/D
Where: -

C= capacitance in pf.
K= dielectric constant
A=Area per plate in square cm.
D=Distance between two plates in cm

Design of capacitor depends on the proper dielectric

material with particular type of application. The dielectric
material used for capacitors may be grouped in various classes
like Mica, Glass, air, ceramic, paper, Aluminum, electrolyte etc.
The value of capacitance never remains constant. It changes
with temperature, frequency and aging. The capacitance value
marked on the capacitor strictly applies only at specified
temperature and at low frequencies.
LED (Light Emitting Diodes):

As its name implies it is a diode, which emits light when forward

biased. Charge carrier recombination takes place when electrons
from the N-side cross the junction and recombine with the holes
on the P side. Electrons are in the higher conduction band on the
N side whereas holes are in the lower valence band on the P
side. During recombination, some of the energy is given up in
the form of heat and light. In the case of semiconductor
materials like Gallium arsenide (GaAs), Gallium phoshide (Gap)
and Gallium arsenide phoshide (GaAsP) a greater percentage of
energy is released during recombination and is given out in the
form of light. LED emits no light when junction is reverse biased.
TRANSISTOR: -

A transistor consists of two junctions formed by sandwiching

either p-type or n-type semiconductor between a pair of opposite
types. Accordingly, there are two types of transistors namely: -

(1) n-p-n transistor (2) p-n-p

transistor

(NPN) (PNP)

An n-p-n transistor is composed of two n-type semiconductors

separated by a thin section of p type. However a p-n-p transistor
is formed by two p sections separated by a thin section of n-
type. In each type of transistor the following points may be
noted.
1. There are two p-n junctions, therefore a transistor may be
regarded as combination of two diodes connected back to
back.
2. There are three terminals taken from each type of
semiconductor.
3. The middle section is a very thin layer, which is the most
important factor in the functioning of a transistor.
4. Transistor can be used as an Amplifier also.
A transistor raises the strength of a weak signal and thus
acts as an amplifier. The weak signal is applied between emitter
base junction and output is taken across the load Rc connected
in the collector circuit (in common emitter configuration). In
order to achieve faithful amplification, the input circuit should
always remain forward biased.
To do so, a dc voltage is applied in the input in addition to the
signal. This dc Voltage is known as biasing voltage and its
magnitude and polarity should be such that it always keeps the
input circuit forward biased regardless of the polarity to the
signal to be amplified.

As the input circuit has low resistance a small change in

signal voltage causes an appreciable change in emitter current.
This causes change in collector current (by a factor called
current gain of transistor) due to transistor action. The collector
current flowing through a high load resistance Rc produces a
large voltage across it. Thus a weak signal applied to the input
circuit appears in the amplified form in the collector circuit. This
is how a transistor acts as an amplifier.
Transistor may be used in different configuration like CB
(common base) & CC (common collector) according to
requirements of amplifier (impedance matching, buffer amplifier
etc.).

DIODES :

- +

Diode is a two-terminal device (except that thermionic diodes

may also have one or two ancillary terminals for a heater).
consisting of a P-N junction formed either of Ge or Si crystal. The
P and N type regions are referred to as anode and cathode
respectively. Diodes have two active electrodes between which
the signal of interest may flow, and most are used for their
unidirectional current property. The varicap diode is used as an
electrically adjustable capacitor.

The directionality of current flow most diodes exhibit is

sometimes generically called the rectifying property. The most
common function of a diode is to allow an electric current to pass
in one direction (called the forward biased condition) and to
block it in the opposite direction (the reverse biased condition).
Thus, the diode can be thought of as an electronic version of a
check valve. Real diodes do not display such a perfect on-off
directionality but have a more complex non-linear electrical
characteristic, which depends on the particular type of diode
technology. Diodes also have many other functions in which they
are not designed to operate in this on-off manner.

OPERATING PRINCIPLE

The two basic configurations in which a timer ic 555 can be used

are the astable and the monostable modes of operation.When
the DPDT switch (s2) is in position 1-1, the timer under test
automatically gets wired as a monostable multivibrator. In this
case, the microswitch (S1) can trigger the monoshot. The
denouncing circuit constituted by the two NAND gates of IC1 (N1
and N2) produces a clean rectangular pulse when the
microswitch is pressed. Resistor R3, capacitor C1 and diode D1
ensure that the trigger terminal of timer IC 555 (pin 2 the trigger
terminal) gets the desired positive to ground trigger pulse. This
differentiator circuit also ensures that the width of the trigger
pulse is less than expected monoshot output pulse.

The monoshot output pulse width is a function of the series

combination of series combination of resistor R8 and
potentiometer VR2, and capacitor C4, when DPDT switch S2 is in
position 2-2, the timer gets configured for the astable mode of
operation. The output is a pulse train with the high time period
determine by the series combination of resistor R8,
potentiometer VR2, resistor R9 and capacitor C4, whereas the
low time period is determined by resistor R9 and capacitor C4.
The reset terminal of timer IC (pin 4) should be tied to Vcc
normally. More precisely, the voltage at the pin 4 should be
greater than 0.8 volt a voltage less than resets the output
.Whether you have connected the timer in the monoshot or
astable mode of operation, the output goes low the moment you
bring the reset terminal below 0.8V.

The control terminal (pin 5) can be used to change the high time
(on time) of the output pulse train in the astable mode and the
output pulse width in the monoshot mode by applying an
external voltage. This external voltage basically changes the
reference voltage levels of the comparator inside the IC. The
level are set by three identical resistors of usually 5 kilo-ohms
inside the IC connected from Vcc to ground, at 2/3Vcc for pin 5
and 1/3 Vcc for pin 2. These levels can be changed by
connecting an external resistor between pin 5 and ground.
Resister R10 and potentiometer VR3 have been connected for
this purpose.
The pulse width in the monoshot mode is given by:

(a) 1.1*total charging resistance charging capacitance.

(b) This expression is valid when three is no external
resistor connected at pin 5. The pulse width can be reduced
by connecting an external resistor.
(c)The high and low time periods in the astable mode are:

High time period = 0.69*charging resistance*charging

capacitance
Low time period = 0.69* charging resistance*charging
capacitance.

Again the expressions sure true with no external resister at

pin5. The high time period can be made to decrease by
connecting an external resistor between pin 5&Gnd.
 CIRCUIT DESIGN

CIRCUIT DIAGRAM OF 555 IC TESTER

PCB LAYOUT :
WORKING
To test an 555 Timer :-

1. insert into the socket

2. Set the switch S2 in position 1-1.

3. Switch on the power supply by flipping switch S3 to on

position .power indicator LED (LED3) glows to indicate that
the circuit is ready to test the IC TIMER.

4. If the IC is okay, LED1 glows because the IC is wired as a

monoshot and in the absence of any trigger, its output is
low.

5. Apply the trigger pulse by momentarily pressing switch

s1 .LED1 stop glowing .This and, in turn, LED2 glows. This
confirms that the output of the monoshot has gone high.
After the predetermined time period, LED2 goes off and
LED1 again glows .Very preset VR2 and trigger the
monoshot again through switch S1. You will find that LED2
glows this time for a longer or a smaller time period
depending upon whether you increased or decreased VR2
resistance.

6. For checking the reset function of the timer, trigger the

monoshot again, and before the expected time is over,
quickly decrease the pot meter VR1 resistance to bring the
voltage at pin 4 below 0.8V .You will observe the output
going low (indicated by glowing LED1 and extinguished
LED2).

7. For checking the control function of the timer IC, set

potmeter VR1 again in the maximum resistance position.
Also set preset VR3 in the minimum position .Trigger the
monoshot using switch S1 .You will observe its output going
high for a time period that is much less than that
determined from the series combination of R8 and VR2, and
capacitor C4. In fact, for any fixed setting of this series
combination, the output pulse width can be observed to
very for different values of potmeter VR3 resistance –by
triggering the monoshot several time, once for each setting
of VR3.
 8. Now set the DPDT switch in position in position 2-2 LED1
and LED2 glow alternatively with the timing determined by
the resistance in charge and discharge paths. This means
the timer IC is okay and wired in astable mode.

9. The function of reset and control pins can be checked in

astable configuration too in the same way as discussed
above for the monoshot configuration.

P.C.B. MANUFACTURING PROCESS

It is an important process in the fabrication of electronic

equipment. The design of PCBs (Printed Circuit Boards) depends
on circuit requirements like noise immunity, working frequency
and voltage levels etc. High power PCBs requires a special
design strategy.

The fabrication process to the printed circuit board will

determine to a large extent the price and reliability of the
equipment. A common target aimed is the fabrication of small
series of highly reliable professional quality PCBs with low
investment. The target becomes especially important for
customer tailored equipments in the area of industrial
electronics.
The layout of a PCB has to incorporate all the information of the
board before one can go on the artwork preparation. This means
that a concept which clearly defines all the details of the circuit
and partly defines the final equipment, is prerequisite before the
actual lay out can start. The detailed circuit diagram is very
important for the layout designer but he must also be familiar
with the design concept and with the philosophy behind the
equipment.
BOARD TYPES:

1. Single Sided Boards

The single sided PCBs are mostly used in entertainment

electronics where manufacturing costs have to be kept at a
minimum. However in industrial electronics cost factors
cannot be neglected and single sided boards should be
used wherever a particular circuit can be accommodated on
such boards.

2. Double Sided Boards

Double-sided PCBs can be made with or without plated

through holes. The production of boards with plated
through holes is fairly expensive. Therefore plated through
 hole boards are only chosen where the circuit complexities
and density of components does not leave any other choice.

CHRONOLOGY

The following steps have been followed in carrying out the

project.

1. Study the books on the relevant topic.

2. Understand the working of the circuit.

3. Prepare the circuit diagram.

4. Prepare the list of components along with their
specification.

5. Estimate the cost and procure them after carrying out

market survey.

6. Plan and prepare PCB for mounting all the components.

7. Fix the components on the PCB and solder them.

8. Test the circuit for the desired performance.

9. Trace and rectify faults if any.

10. Give good finish to the unit.

11. Prepare the project report.

DESIGN SPECIFICATION

(I) STEPS TAKEN WHILE PREPARING CIRCUIT

(A) PCB DESIGNING

The main purpose of printed circuit is in the routing of electric

currents and signal through a thin copper layer that is bounded
firmly to an insulating base material sometimes called the
substrate. This base is manufactured with an integrally bounded
layers of thin copper foil which has to be partly etched or
removed to arrive at a pre-designed pattern to suit the circuit
connections or other applications as required.
The term printed circuit board is derived from the original
method where a printed pattern is used as the mask over
wanted areas of copper. The PCB provides an ideal baseboard
upon which to assemble and hold firmly most of the small
components.
From the constructor’s point of view, the main attraction of using
PCB is its role as the mechanical support for small components.
There is less need for complicated and time consuming metal
work of chassis contraception except perhaps in providing the
final enclosure. Most straight forward circuit designs can be
easily converted in to printed wiring layer the thought required
to carry out the inversion cab footed high light an possible error
that would otherwise be missed in conventional point to point
wiring .The finished project is usually neater and truly a work of
art.
Actual size PCB layout for the circuit shown is drawn on the
copper board. The board is then immersed in FeCl3 solution for
12 hours. In this process only the exposed copper portion is
etched out by the solution.
Now the petrol washes out the paint and the copper layout on
PCB is rubbed with a smooth sand paper slowly and lightly such
that only the oxide layers over the Cu are removed. Now the
holes are drilled at the respective places according to
component layout as shown in figure.

(B) LAYOUT DESIGN:

When designing the layout one should observe the minimum size
(component body length and weight). Before starting to design
the layout we need all the required components in hand so that
an accurate assessment of space can be made. Other space
considerations might also be included from case to case of
mounted components over the printed circuit board or to access
path of present components.

It might be necessary to turn some components around to a

different angular position so that terminals are closer to the
connections of the components. The scale can be checked by
positioning the components on the squared paper. If any
connection crosses, then one can reroute to avoid such
condition.

All common or earth lines should ideally be connected to a

common line routed around the perimeter of the layout. This will
act as the ground plane. If possible try to route the outer supply
line to the ground plane. If possible try to route the other supply
lines around the opposite edge of the layout through the center.
The first set is tearing the circuit to eliminate the crossover
without altering the circuit detail in any way.
Plan the layout looking at the topside to this board. First this
should be translated inversely, later for the etching pattern large
areas are recommended to maintain good copper adhesion. It is
important to bear in mind always that copper track width must
be according to the recommended minimum dimensions and
allowance must be made for increased width where termination
holes are needed. From this aspect, it can become little tricky to
negotiate the route to connect small transistors.

There are basically two ways of copper interconnection patterns

under side the board. The first is the removal of only the amount
of copper necessary to isolate the junctions of the components
to oneanother. The second is to make the interconnection
pattern looking more like conventional point wiring by routing
uniform width of copper from component to component.
(C) ETCHING PROCESS:

Etching process requires the use of chemicals. acid resistant

dishes and running water supply. Ferric chloride is mostly used
solution but other etching materials such as ammonium per
sulphate can be used. Nitric acid can be used but in general it is
not used due to poisonous fumes.
The pattern prepared is glued to the copper surface of the board
using a latex type of adhesive that can be cubed after use. The
pattern is laid firmly on the copper using a very sharp knife to
cut round the pattern carefully to remove the paper
corresponding to the required copper pattern areas. Then apply
the resistant solution, which can be a kind of ink solution for the
purpose of maintaining smooth clean outlines as far as possible.
While the board is drying, test all the components.
Before going to next stage, check the whole pattern and cross
check with the circuit diagram. Check for any free metal on
the copper. The etching bath should be in a glass or enamel
disc. If using crystal of ferric- chloride these should be
thoroughly dissolved in water to the proportion suggested.
There should be 0.5 lt. of water for 125 gm of crystal.
To prevent particles of copper hindering further etching, agitate
the solutions carefully by gently twisting or rocking the tray.
The board should not be left in the bath a moment longer than is
needed to remove just the right amount of copper. Inspite of
there being a resistive coating there is no protection against
etching away through exposed copper edges. This leads to over
etching. Have running water ready so that etched board can be
removed properly and rinsed. This will halt etching immediately.

Drilling is one of those operations that calls for great care. For
most purposes a 0.5mm drill is used. Drill all holes with this size
first those that need to be larger can be easily drilled again with
the appropriate larger size.

(D) COMPONENT ASSEMBLY: -

From the greatest variety of electronic components available,

which runs into thousands of different types it is often a
perplexing task to know which is right for a given job.
There could be damage such as hairline crack on PCB. If there
are, then they can be repaired by soldering a short link of bare
copper wire over the affected part.

The most popular method of holding all the items is to bring the
wires far apart after they have been inserted in the appropriate
holes. This will hold the component in position ready for
soldering.

Some components will be considerably larger .So it is best to

start mounting the smallest first and progressing through to the
largest. Before starting, be certain that no further drilling is likely
to be necessary because access may be impossible later.

Next will probably be the resistor, small signal diodes or other

similar size components. Some capacitors are also very small but
it would be best to fit these afterwards. When fitting each group
of components mark off each one on the circuit as it is fitted so
that if we have to leave the job we know where to recommence.

Although transistors and integrated circuits are small items there

are good reasons for leaving the soldering of these until the last
step. The main point is that these components are very sensitive
to heat and if subjected to prolonged application of the soldering
iron, they could be internally damaged.

All the components before mounting are rubbed with sand paper
so that oxide layer is removed from the tips. Now they are
mounted according to the component layout.
(E) SOLDERING: -

This is the operation of joining the components with PCB after

this operation the circuit will be ready to use to avoid any
damage or fault during this operation following care must be
taken.

1. A longer duration contact between soldering iron bit &

components lead can exceed the temperature rating of device &
cause partial or total damage of the device. Hence before
soldering we must carefully read the maximum soldering
temperature & soldering time for device.

2. The wattage of soldering iron should be selected as minimum

as permissible for that soldering place.

3 .To protect the devices by leakage current of iron its bit should
be earthed properly.

4. We should select the soldering wire with proper ratio of Pb &

Tn to provide the suitable melting temperature.

5. Proper amount of good quality flux must be applied on the

soldering point to avoid dry soldering.
 APPLICATION OF CIRCUIT

The circuit thus can be used to check:

a. The timer IC in astable configuration.

b. The timer IC in monostable configuration

c. The capability of reset terminal to override all function

and rest the output to low.

d. The function of the control terminal to change the ‘on’ or

‘high’ time of output wave form in astable mode of
operation and the output pulse width in monostable
mode of operation.

This operates on a 9v battery which makes the gadget

portable you can
construct easily on any general purpose PCB along with
the 8 pin socket.
PRECAUTIONS :

1. The soldering iron being used for soldering of

semiconductors should be of low voltage.

2. While soldering semiconductors heat sinks should be used.

3. While soldering solder should not spread over the entire

circuit and solder tip should be sharp and smooth.

4. While mounting components their values should be visible.

5. Semiconductors and other polarized components should be

mounted with correct polarity.

6. Time should be carefully observed while etching process

takes place on the PCB.