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D oc ument Reference N o.: FT _001308 C learance N o.: FT DI# 4 9 4
Future Technology
Devices International
Limited
Datasheet
CleO-Camera Module
The CleO-Camera module is a camera accessory for 1.4 µm x 1.4 µm pixel with OmniBSI™
the CleO series – the smart TFT display for Arduino. technology for high performance (high
It consists of an OV5640 sensor module and Flash sensitivity, low crosstalk, low noise,
LEDs. The OV5640 sensor is a low voltage, high- improved quantum efficiency)
performance, 1/4-inch 5 megapixel CMOS image
Optical size 1/4"
sensor that provides the full functionality of a single
chip 5 megapixel (2592×1944) camera using Embedded 1.5V regulator for core power
OmniBSI™ technology in a small footprint package. On-board regulator for VDDA,VDDIO,
It is controlled through the standard Serial Camera only 3V3 supply needed
Control Bus (SCCB) interface. Support for output format: RAW RGB,
RGB565/555/444, YUV422/420,
YCbCr422 and compression
The CleO-camera module is supplied with a standard Image quality control:color saturation,
24 Pin 0.5mm pitch FFC cable. hue, gamma, sharpness(edge
enhancement), lens correction, defective
pixel cancelling and noise cancelling
Support for anti-shake
Standard SCCB interface
In built Flash light LED
24 pin 0.5mm pitch FFC cable interface
N either the whole nor any part of the information contained in, or the product described in this manual, may be adapted or
reproduced in any material or elec tronic form without the prior written c onsent of the c opyright holder. T his product and its
doc umentation are s upplied on an as- is basis and no warranty as to their s uitability for any partic ular purpos e is either made or
implied. Future T ec hnology Devic es I nternational L td will not accept any claim for damages hows oever arising as a res ult of use or
failure of this produc t. Y our statutory rights are not affected. T his produc t or any variant of it is not intended for us e in any
medical appliance, device or s ystem in whi c h the failure of the produc t might reasonably be expected to res ult in pers onal injury.
T his doc ument provides preliminary information that may be s ubject to c hange without notice. N o freedom to use patents or other
intellec tual property rights is implied by the publication of this doc ument. Future Tec hnology D evices I nternational L td, U nit 1 , 2
Seaward P lac e, C enturion Business P ark, G lasgow G 4 1 1HH U nited Kingdom. Sc otland Registered C ompany N umber: SC 136640
2 Ordering Information
Table of Contents
1 Introduction ................................................................. 1
1.1 Features ................................................................................ 1
2 Ordering Information .................................................... 2
3 Pin Out and Signal Description ...................................... 4
3.1 Module Description ................................................................ 4
3.2 Module Interface Signal Desciption ......................................... 4
4 Devices Characteristics and Ratings............................... 6
4.1 Electrical Specification ........................................................... 6
4.2 Sensor Key Specification ........................................................ 7
5 Board Schematic ........................................................... 8
6 Mechanical Dimensions ................................................. 9
7 Contact Information .................................................... 10
Appendix A – References ................................................. 11
Document References ...................................................................11
Acronyms and Abbreviations .........................................................11
Appendix B - List of Figures and Tables ............................ 12
List of Tables ................................................................................12
List of Figures ...............................................................................12
Appendix C – Revision History.......................................... 13
No Feature Reference
Designator
1 2.8V fixed voltage LDO U7
2 LED driver U16
3 24pin 0.5 mm pitch FFC connector interface to OV5640 module CN13
4 24pin 0.5 mm pitch FFC connector interface to CleO CN3
5 White LED LED5, LED6, LED7,
LED8
6 OV5640 camera module -
5 Board Schematic
6 Mechanical Dimensions
7 Contact Information
Future Technology Devices International Limited Future Technology Devices International Limited (USA)
Unit 1, 2 Seaward Place, Centurion Business Park 7130 SW Fir Loop
Glasgow G41 1HH Tigard, OR 97223-8160
United Kingdom USA
Tel: +44 (0) 141 429 2777 Tel: +1 (503) 547 0988
Fax: +44 (0) 141 429 2758 Fax: +1 (503) 547 0987
Future Technology Devices International Limited (Taiwan) Future Technology Devices International Limited (China)
2F, No. 516, Sec. 1, NeiHu Road Room 1103, No. 666 West Huaihai Road,
Taipei 114 Shanghai, 200052
Taiwan , R.O.C. C hina
Tel: +886 (0) 2 8797 1330 Tel: +86 21 62351596
Fax: +886 (0) 2 8751 9737 Fax: +86 21 62351595
Web Site
http://ftdichip.com
System and equipment manufac turers and des igners are res ponsible to ens ure that their s ys tems , and any Future T ec hno logy D evices
I nternational L td (FTDI ) devices incorporated in their sys tems , meet all applic able safety, regulatory and sys tem -level performance requirements .
All application- related information in this document (including applic ation desc riptions , s uggest ed FTDI devic es and other materials ) is provided
for referenc e only. While FTDI has taken care to ass ure it is acc urate, this information is s ubject to c ustomer confirmation, and FTDI disclaims all
liability for s ys tem des igns and for any applic ations ass istance provided by FTDI . Use of FTDI devic es in life s upport and/or s afety applic ations is
entirely at the user’s risk, and the us er agrees to defend, indemnify and hold harmless FTDI from any and all damages , claims , s uits or expense
res ulting from s uch us e. T his doc ument is s ubject to c hange without notice. N o freedom to us e patents or other intellec tual property rights is
implied by the public ation of this doc ument. N either the whole nor any part of the information c ontained in, or the produc t d esc ribed in this
doc ument, may be adapted or reproduc ed in any material or elec tronic form without the prior written c onsent of the c opyright holder. Future
Tec hnology Devices I nternational L td, U nit 1 , 2 Seaward P lac e, Centurion Business Park, Glas gow G41 1HH , U ni ted Kingdom. Scotland Registered
C ompany N umber: SC136640
Appendix A – References
Document References
Terms Description
DC Direct Current
List of Tables
List of Figures